Thin RFID high-frequency antenna

By setting a PVC adhesive layer between the substrate layer and the coil layer of the RFID high-frequency antenna, and using an etching groove to contact the PVC layer, the problem of poor adhesion between the RFID tag antenna and the PVC ticket card is solved, achieving a firm bond and high peel strength for the ultra-thin antenna.

CN223651646UActive Publication Date: 2025-12-09JIANGSU KERUITAN ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202423161183.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-20
Publication Date
2025-12-09
Estimated Expiration
2034-12-20

AI Technical Summary

Technical Problem

The existing RFID tag antennas are not firmly bonded to PVC tickets during secondary processing, failing to meet the requirements for sealing and peel strength.

Method used

By using a PVC adhesive layer that contacts the PVC layer through an etching tank, and combining the substrate layer and coil layer, an ultra-thin RFID high-frequency antenna is formed, increasing the bonding strength.

Benefits of technology

It achieves a firm bond between the RFID high-frequency antenna and the PVC ticket, improves peel strength and sealing performance, and is suitable for secondary processing of PVC tickets.

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Abstract

The utility model belongs to the technical field of RFID tag antennas, and particularly relates to a thin RFID high-frequency antenna. The antenna comprises a PVC layer and an antenna layer. The antenna layer is arranged between the two PVC layers and comprises a base material layer; the coil layer covers the upper surface and the lower surface of the base material layer, and an etching groove is formed in the coil layer through etching; the PVC glue layer is arranged between the coil layer and the base material layer, and the PVC glue layer is in contact bonding with the PVC layer through the etching groove. The utility model is used for solving the problem that the secondary processing bonding of the RFID tag antenna and the PVC ticket card is not firm and the strength is not high. The PVC glue layer is arranged between the coil layer and the base material layer, the PVC glue layer is in contact with the PVC layer on the outer side through the etching groove in the laminating process, and the purpose that the base material layer, the coil layer and the PVC layer on the outer side are firmly bonded together through the PVC glue layer is achieved.
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Description

Technical Field

[0001] This utility model belongs to the field of RFID tag antenna technology, specifically relating to a thin RFID high-frequency antenna. Background Technology

[0002] RFID tag antennas have two main functions. First, they receive radio frequency signals from the reader and convert the radio frequency energy into electrical energy through electromagnetic induction or radiation, providing the power required for the tag chip to operate. Second, they transmit the information processed by the tag chip back to the reader in the form of radio frequency signals, enabling bidirectional data transmission.

[0003] Currently, the substrate and adhesive for RFID tag antennas are mainly a PET substrate layer and a high-strength industrial adhesive like GT906. This production method cannot achieve bonding through lamination for the secondary processing of PVC tickets. Moreover, even after bonding, it cannot meet the requirements for the sealing of PVC tickets and the peel strength between the ticket and the RFID antenna after bonding. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the existing technology and provide a thin RFID high-frequency antenna to solve the problem of poor adhesion and low strength between RFID tag antenna and PVC ticket card during secondary processing.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A thin RFID high-frequency antenna, comprising:

[0006] PVC layer;

[0007] An antenna layer, disposed between the two PVC layers, comprising:

[0008] Substrate layer;

[0009] A coil layer covers the upper and lower surfaces of the substrate layer, and etch grooves are formed on the coil layer by etching.

[0010] A PVC adhesive layer is disposed between the coil layer and the substrate layer for bonding the coil layer and the substrate layer. The PVC adhesive layer contacts and bonds with the PVC layer through the etching groove.

[0011] Compared with existing technologies, the above technical solutions have the following beneficial effects:

[0012] By setting a PVC adhesive layer between the coil layer and the substrate layer, the PVC adhesive layer contacts the outer PVC layer through the etching groove during the lamination process. This achieves the purpose of firmly bonding the substrate layer, the coil layer and the outer PVC layer together through the PVC adhesive layer, without the need to apply more glue. This forms an ultra-thin RFID high-frequency antenna and a ticket with high peel strength when bonded to the PVC layer.

[0013] Based on the above technical solution, the embodiments of this application can be further improved as follows:

[0014] In one embodiment, a laminate is further included, disposed between the PVC layer and the coil layer, wherein the side of the laminate closest to the coil layer contacts and is bonded to the PVC adhesive layer through the etching groove.

[0015] In one embodiment, the side of the laminated film adjacent to the PVC layer is coated with PVC adhesive.

[0016] In one embodiment, a protective layer is further provided on the outer side of the PVC layer, and the side of the protective layer close to the PVC layer is coated with PVC adhesive.

[0017] In one embodiment, the substrate layer is a PET substrate layer or a PI substrate layer.

[0018] In one embodiment, the thickness of the substrate layer is 15-25 μm.

[0019] In one embodiment, the coil layer is an aluminum foil layer or a copper foil layer.

[0020] In one embodiment, the thickness of the coil layer is 7-10 μm.

[0021] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0022] 1. Solved the problem of applying and promoting ultra-thin RFID antennas in PVC ticket products;

[0023] 2. This solves the problem of poor adhesion between conventional RFID high-frequency antennas and PVC cards. Attached Figure Description

[0024] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0026] Figure label:

[0027] 1. PVC layer; 2. Antenna layer; 3. Laminated film; 4. Etching tank; 5. Protective layer;

[0028] 201. Substrate layer; 202. Coil layer; 203. PVC adhesive layer. Detailed Implementation

[0029] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0030] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0031] In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly defined.

[0033] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] Example

[0035] like Figure 1As shown, the present invention provides a thin RFID high-frequency antenna, which includes two PVC layers 1 and an antenna layer 2. The PVC layer 1 is usually made of rigid PVC material and serves as the outermost shell of the ticket.

[0036] The antenna layer 2 is disposed between the two PVC layers 1;

[0037] The antenna layer 2 includes: a substrate layer 201, a coil layer 202 and a PVC adhesive layer 203. The coil layer 202 can be two layers, with the two coil layers 202 covering the upper and lower surfaces of the substrate layer 201. An etching groove 4 is formed on the coil layer 202 by etching.

[0038] A PVC adhesive layer 203 is disposed between the coil layer 202 and the substrate layer 201 for bonding the coil layer 202 and the substrate layer 201. The PVC adhesive layer 203 also contacts and bonds to the PVC layer 1 through the etching groove 4.

[0039] By setting a PVC adhesive layer 203 between the coil layer 202 and the substrate layer 201, the PVC adhesive layer 203 contacts the outer PVC layer 1 through the etching groove 4 during the lamination process. This achieves the purpose of firmly bonding the substrate layer 201, the coil layer 202 and the outer PVC layer 1 together through the PVC adhesive layer 203, without the need to apply more glue. This forms an ultra-thin RFID high-frequency antenna and a ticket with high peel strength when bonded to the PVC layer 1.

[0040] To ensure better lamination and bonding, a lamination film 3 is also included, which is disposed between the PVC layer 1 and the coil layer 202. The lamination film 3 is a flexible lamination film 3. During the lamination process, it is squeezed by pressure. The side of the lamination film 3 closest to the coil layer 202 contacts and bonds with the PVC adhesive layer 203 through the etching groove 4. As a buffer layer between the PVC layer 1 and the outermost coil layer 202 of the antenna layer 2, the lamination film 3 not only plays a buffering role, but also firmly fixes the PVC layer 1 and the antenna layer 2.

[0041] To ensure a strong bond between the laminate 3 and the PVC layer 1, the side of the laminate 3 closest to the PVC layer 1 is coated with PVC adhesive.

[0042] To improve the service life of the PVC layer, a protective layer 5 is provided on the outer side of the PVC layer. The side of the protective layer 5 close to the PVC layer 1 is coated with PVC adhesive so as to bond firmly to the PVC layer 1. The protective layer 5 can be similar to the laminate 3, both of which are film structures made of PVC material.

[0043] In this embodiment, the substrate layer 201 is a PET substrate layer 201 or a PI substrate layer 201, which gives the antenna good mechanical properties and flexibility. The ring layer is an aluminum foil layer or a copper foil layer. By using copper foil or aluminum foil with good conductivity, the antenna loss can be effectively reduced.

[0044] The substrate layer 201 has a thickness of 15-25 μm, and the coil layer 202 has a thickness of 7-10 μm, thus forming a relatively thin high-frequency antenna.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A thin RFID high-frequency antenna, characterized in that, include: PVC layer; An antenna layer, disposed between the two PVC layers, comprising: Substrate layer; A coil layer covers the upper and lower surfaces of the substrate layer, and etch grooves are formed on the coil layer by etching. A PVC adhesive layer is disposed between the coil layer and the substrate layer for bonding the coil layer and the substrate layer. The PVC adhesive layer contacts and bonds with the PVC layer through the etching groove.

2. The thin RFID high-frequency antenna according to claim 1, characterized in that, It also includes a laminated film disposed between the PVC layer and the coil layer, wherein the side of the laminated film closest to the coil layer is bonded to the PVC adhesive layer through the etching groove.

3. The thin RFID high-frequency antenna according to claim 2, characterized in that, The side of the laminated film closest to the PVC layer is coated with PVC adhesive.

4. The thin RFID high-frequency antenna according to claim 1, characterized in that, A protective layer is also provided on the outer side of the PVC layer, and the side of the protective layer close to the PVC layer is coated with PVC adhesive.

5. The thin RFID high-frequency antenna according to claim 1, characterized in that, The substrate layer is a PET substrate layer or a PI substrate layer.

6. The thin RFID high-frequency antenna according to claim 5, characterized in that, The thickness of the substrate layer is 15-25 μm.

7. The thin RFID high-frequency antenna according to claim 1, characterized in that, The coil layer is an aluminum foil layer or a copper foil layer.

8. The thin RFID high-frequency antenna according to claim 7, characterized in that, The thickness of the coil layer is 7-10 μm.