LED packaging structure
By using white glue to form a reflective layer in the LED packaging structure, the light path is changed and the beam angle is increased, which solves the problem of insufficient light efficiency of traditional bracket LEDs and achieves greater light coverage and improved light efficiency.
Patent Information
- Application Number
- CN202423030374.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-09
AI Technical Summary
Traditional bracket LED products have limited beam angles during packaging, resulting in poor luminous efficacy, and the design cost is high when meeting luminous efficacy requirements.
A reflective layer is formed using white glue, which alters the light path, causing some light to be reflected through the reflective layer and increasing the beam angle. Furthermore, the reflectivity and viscosity are improved by combining highly thermally conductive A/B silicone, titanium dioxide, silicon, and zirconium dioxide, resulting in a tightly adhered reflective layer.
Increasing the beam angle improves illumination uniformity, reduces shadows and dark areas, enhances visual comfort and safety, reduces energy consumption, and extends LED chip lifespan.
Smart Images
Figure CN223666709U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic packaging technical field, concretely relates to a LED packaging structure. BACKGROUND
[0002] With the continuous progress of LED technology and the continuous expansion of application field, the market puts forward higher requirements for LED products, especially in the light efficiency aspect.
[0003] The traditional support LED product although performs well in the indoor application scene, but has encountered the bottleneck in the pursuit of higher light efficiency, specifically, the traditional support LED product when packaging, through directly using the encapsulation glue to package the LED chip, thereby encapsulating the LED chip in the pad, however the LED chip of this LED packaging structure is limited in the irradiation angle when emitting light, the support installed on the pad, when the support is inclined outward to the side of the pad at a small amplitude, the light beam angle irradiated by the LED chip is limited, thereby leading to the light efficiency of the LED chip is poor, however when the support is designed to meet the light efficiency demand, the design cost is higher, therefore, in order to meet the demand of the market to high light efficiency, developing a new type of LED packaging structure becomes the urgent matter. SUMMARY
[0004] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a LED packaging structure capable of expanding the light beam angle and improving the light efficiency of the LED chip.
[0005] To solve the above problems, the utility model provides the following technical scheme:
[0006] A LED packaging structure comprises:
[0007] a pad;
[0008] a support installed on the pad and forming a packaging cavity with the pad;
[0009] an LED chip installed in the packaging cavity, light rays of the LED chip being emitted outward from a cavity opening of the packaging cavity;
[0010] a metal wire electrically connected to the LED chip;
[0011] white glue coated on the periphery of the packaging cavity and forming a reflection layer;
[0012] encapsulation glue filled in the packaging cavity and sealing the LED chip and the white glue;
[0013] Part of the light rays of the LED chip are reflected by the reflection layer and increase the light beam angle of the light rays emitted outward.
[0014] In an embodiment, the light beam angle ranges from 100 to 150 degrees.
[0015] In an embodiment, the reflective layer is in abutment with the support and the encapsulating glue.
[0016] In an embodiment, the reflective layer is spaced apart from the LED chip.
[0017] In an embodiment, the spacing distance between the reflective layer and the LED chip is between 1 / 2 and 1 / 5 of the length of the LED chip.
[0018] In an embodiment, the white glue comprises A / B silicon glue, which comprises at least one of titanium dioxide, silicon dioxide and zirconium dioxide.
[0019] In an embodiment, one end of the metal wire is connected to the soldering pad, and the other end of the metal wire is connected to the LED chip through the reflective layer and the encapsulating cavity.
[0020] In an embodiment, the height of the reflective layer is lower than the height of the encapsulating glue, and the height of the encapsulating glue is lower than or equal to the height of the support.
[0021] In an embodiment, the LED packaging structure further comprises a protective layer coated on the top surface of the LED chip.
[0022] In an embodiment, the LED packaging structure further comprises a fluorescent layer coated on the outside of the protective layer.
[0023] The beneficial effects of the present application are: the reflective layer formed by the white glue is optimized and designed, which can effectively change the light path, make part of the light of the LED chip reflect through the reflective layer, thereby increase the light beam angle of the light emitted outward, through increasing the light beam angle, the light emitted by the LED can cover a larger area, thereby improving the uniformity of illumination, effectively reducing the shadow and dark area in the illumination area, and ensuring that the entire illuminated surface is fully illuminated. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 FIG. 1 is a structural schematic diagram of one embodiment of the LED packaging structure of the present application;
[0025] Figure 2 FIG. 2 is a partial enlarged view of position A in FIG. 1; Figure 1
[0026] Figure 3 FIG. 3 is an irradiation schematic diagram of one embodiment of the LED packaging structure of the present application.
[0027] Reference Signs:
[0028] 100, LED packaging structure; 110, solder pad; 111, support; 11a, packaging cavity; 112, LED chip; 113, metal wire; 114, reflecting layer; 115, packaging glue; 11b, light beam angle; 116, protective layer; 117, fluorescent layer. DETAILED DESCRIPTION
[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.
[0030] In addition, the terms "first", "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0031] In the conventional support LED product, the LED chip is directly packaged by using the packaging glue to encapsulate the LED chip in the solder pad. However, the illumination angle of the LED chip of this LED packaging structure is limited by the support installed on the solder pad. When the support is inclined outward at a small amplitude towards the side of the solder pad, the light beam angle of the LED chip is limited, resulting in poor light efficiency of the LED chip. However, when the support is designed to meet the light efficiency requirement, the design cost is high. Therefore, in order to meet the market demand for high light efficiency, it is urgent to develop a new type of LED packaging structure.
[0032] Therefore, please refer to Figures 1-3As shown, the embodiment provides an LED packaging structure 100, which comprises a solder pad 110, a bracket 111, an LED chip 112, a metal wire 113, white glue and encapsulation glue 115; wherein the solder pad 110 as a basic component is made of metal material (such as copper or silver-plated copper) with good conductivity and soldering performance, not only provides a mounting platform for the bracket 111, but also ensures the smooth transmission of current to the LED chip 112 as an electrical connection point, the bracket 111 is mounted on the solder pad 110 and forms a packaging cavity 11a with the solder pad 110, which is used to accommodate the LED chip 112, the LED chip 112 is mounted in the packaging cavity 11a, and the light rays thereof are emitted outward from the cavity opening of the packaging cavity 11a, the metal wire 113 is used for electrical connection of the LED chip 112, and ensures that the current can be accurately delivered to the LED chip 112 to realize the light emitting function. The white glue is coated on the peripheral side of the packaging cavity 11a and forms a reflection layer 114, and the encapsulation glue 115 is filled in the packaging cavity 11a and seals the LED chip 112 and the white glue; wherein part of the light rays of the LED chip 112 are reflected by the reflection layer 114, and the reflection layer 114 can change the light ray path of the light rays irradiated thereon and increase the light beam angle 11b of the light rays emitted outward.
[0033] According to the above scheme, it can be understood that the reflection layer 114 formed by the white glue is optimized and designed, which can effectively change the light ray path, so that part of the light rays of the LED chip 112 are reflected by the reflection layer 114, thereby increasing the light beam angle 11b of the light rays emitted outward. By increasing the light beam angle 11b, the light emitted by the LED can cover a larger area, thereby improving the uniformity of illumination and effectively reducing the shadow and dark area in the illumination area, and ensuring that the entire illuminated surface is fully illuminated.
[0034] Preferably, the light beam angle 11b is in the range of 100° to 150°. The composition of the white glue includes high-thermal-conductivity A / B silicone glue, titanium dioxide is added to increase the concentration and reflectivity, silicon dioxide is added to improve the viscosity, which is conducive to better filling effect, and zirconium dioxide is added to improve the thermal conductivity.
[0035] The white glue with this special formula not only enhances the light reflection efficiency, improves the light output angle and intensity, but also helps heat dissipation through its good thermal conductivity, prolonging the service life of the LED chip 112.
[0036] Preferably, the angle range of the light beam angle 11b is between 100-150°; setting this range significantly improves the uniformity of illumination, enabling the light emitted by the LED to cover a larger area, reducing shadows and dark areas within the illumination area, and improving visual comfort and safety. Secondly, the larger light beam angle 11b enhances the flexibility of optical design, allowing the lamp design to be adjusted according to specific application requirements, optimizing light distribution. In addition, through the effective reflection of the reflective layer 114, part of the light that would otherwise be absorbed or scattered by the packaging material is reused, increasing the effective light output, improving energy efficiency, and reducing energy consumption.
[0037] Preferably, the reflective layer 114 is in contact with at least the support 111 and the encapsulation glue 115, and the reflective layer 114 is formed by white glue coated on the side of the packaging cavity 11a. The white glue not only has high reflectivity, but also has good adhesion and thermal conductivity. The reflective layer 114 is tightly attached to the inner wall of the support 111 and extends to the position in contact with the encapsulation glue 115, ensuring the continuity and integrity of the reflective layer 114 in the entire packaging cavity 11a. The tight fit between the reflective layer 114 and the inner wall of the support 111 is achieved through a high-precision coating process, ensuring that the white glue can uniformly cover the inner surface of the support 111, avoiding any gaps or irregular surfaces that may affect light reflection. Further, it ensures the maximum utilization of light and reduces the loss of light in the packaging cavity 11a, improving the light output efficiency.
[0038] Optionally, the white glue is filled in the position where the plastic of the support 111 and the bottom metal pad 110 meet by high-precision glue spraying equipment. The filling of white glue can form a reflective layer 114 at the corner of the support 111, thereby producing a bevel reflection effect.
[0039] Preferably, the reflective layer 114 is spaced apart from the LED chip 112; this spacing effectively prevents the reflective layer 114 from directly contacting the surface of the LED chip 112, reducing the risk of thermal stress damage due to high temperature or physical contact, and prolonging the service life of the LED chip 112. Further, the spacing between the reflective layer 114 and the LED chip 112 also helps to dissipate heat, reducing the operating temperature of the LED chip 112 and further improving the reliability and performance stability of the product.
[0040] Preferably, the interval distance L2 between the reflective layer 114 and the LED chip 112 is between 1 / 2 and 1 / 5 of the length L1 of the LED chip 112; the advantage of this setting is that it avoids the situation that the interval distance L2 between the reflective layer 114 and the LED chip 112 is too close, which results in poor effect of the interval, affecting the ability of high temperature resistance and preventing physical contact damage, and at the same time, it avoids the situation that the interval distance L2 between the reflective layer 114 and the LED chip 112 is too far, which results in that the reflective layer 114 cannot meet the need of expanding the light beam angle 11b to a certain angle, so that the use effect of the LED packaging structure 100 is maintained at a high level.
[0041] Preferably, the white glue includes A / B silicone, and the A / B silicone includes at least one of titanium dioxide, silicon dioxide and zirconium dioxide; optionally, the three components of titanium dioxide, silicon dioxide and zirconium dioxide are added to the high-thermal-conductivity A / B silicone in a weight ratio, the titanium dioxide is added to the high-thermal-conductivity A / B silicone in a weight ratio, which is used to increase the concentration and reflectivity of the white glue; the silicon dioxide is added to the high-thermal-conductivity A / B silicone in a weight ratio, which is used to increase the viscosity of the white glue; the zirconium dioxide is added to the high-thermal-conductivity A / B silicone in a weight ratio, which is used to improve the thermal conductivity of the white glue; optionally, the adding proportion of the titanium dioxide is 10-20% of the weight of the high-thermal-conductivity A / B silicone, the adding proportion of the silicon dioxide is 5-15% of the weight of the high-thermal-conductivity A / B silicone, and the adding proportion of the zirconium dioxide is 5-10% of the weight of the high-thermal-conductivity A / B silicone.
[0042] Preferably, one end of the metal wire 113 is connected to the solder pad 110, and the other end of the metal wire 113 passes through the reflective layer 114 and the packaging cavity 11a and is connected to the LED chip 112; it can be understood that the metal wire 113 is usually made of a material with good electrical conductivity and heat resistance (such as gold, copper or aluminum), and the metal wire 113 in the embodiment is made of gold wire, one end of which is firmly welded on the solder pad 110 to provide stable current input, and the other end of the metal wire 113 is cleverly connected to the electrode of the LED chip 112 through the reflective layer 114 and the packaging cavity 11a; the design that the metal wire 113 passes through the reflective layer 114 and the packaging cavity 11a avoids additional lead paths, simplifies the internal structure, reduces the space occupation, makes the whole package more compact, and the installation of the metal wire 113 will not damage the functions of the reflective layer 114 and the packaging cavity 11a.
[0043] Preferably, the height L3 of the reflective layer 114 is lower than the height L4 of the encapsulation glue 115, and the height L4 of the encapsulation glue 115 is lower than or equal to the height L5 of the support 111; the advantage of the structure is that the height L3 of the reflective layer 114 is lower than the height L4 of the encapsulation glue 115, which ensures that the encapsulation glue 115 can completely cover and seal the reflective layer 114, prevents moisture or other external pollutants from entering the inside of the encapsulation cavity 11a, enhances the air tightness and waterproof performance of the product, and the height L4 of the encapsulation glue 115 is lower than or equal to the height L5 of the support 111, which not only makes the entire encapsulation structure more compact and beautiful, but also avoids installation problems or appearance defects caused by the overflow of the encapsulation glue 115 during the encapsulation process. In addition, this design helps to optimize the heat conduction path, improves the heat dissipation efficiency, and prolongs the service life of the LED chip 112.
[0044] Optionally, the height of the encapsulation glue 115 in the embodiment is flush with the height of the support 111.
[0045] Preferably, the LED encapsulation structure 100 further comprises a protective layer 116 coated on the top surface of the LED chip 112; and the LED encapsulation structure 100 further comprises a fluorescent layer 117 coated on the outer side of the protective layer 116; it can be understood that the color of the light of the LED chip 112 can be adjusted by the fluorescent glue, different fluorescent glues can be used to change the color of the LED chip 112, and before applying the fluorescent glue, the protective liquid is applied first. In the embodiment, the protective liquid is coated on the top surface of the LED chip 112 to form an anti-skid layer, and the protective layer 116 can provide better protection for the LED chip 112 and improve the air tightness of the support 111.
[0046] In summary, the LED encapsulation structure provided by the application is optimized by the reflective layer formed by the white glue, which can effectively change the light path, make part of the light of the LED chip reflect through the reflective layer, increase the beam angle of the light emitted outward, cover a larger area by increasing the beam angle, improve the uniformity of the illumination, and effectively reduce the shadow and dark area in the illumination area, and ensure that the entire illuminated surface is fully illuminated.
[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the application, and not to limit them; although the application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions described in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the application.
Claims
1. An LED package structure, characterized in that, The LED packaging structure comprises: a pad; a support installed on the pad and forming a packaging cavity with the pad; an LED chip installed in the packaging cavity, light rays of the LED chip being emitted outwards from a cavity opening of the packaging cavity; a metal wire electrically connected to the LED chip; white glue coated on a peripheral side of the packaging cavity and forming a reflective layer; packaging glue filled in the packaging cavity and sealing the LED chip and the white glue; wherein part of the light rays of the LED chip are reflected by the reflective layer and the beam angle of the light rays emitted outwards is increased.
2. The LED package structure of claim 1, wherein: The beam angle ranges between 100-150°.
3. The LED package structure of claim 1, wherein: The reflective layer is in abutment with at least the support and the packaging glue.
4. The LED package structure of claim 1, wherein: The reflective layer is spaced apart from the LED chip.
5. The LED package structure of claim 4, wherein: The spacing distance between the reflective layer and the LED chip is between 1 / 2-1 / 5 of the length of the LED chip.
6. The LED package structure of claim 1, wherein: The white glue comprises A / B silicon glue, the A / B silicon glue comprising at least one of titanium dioxide, silicon dioxide and zirconium dioxide.
7. The LED package structure of claim 1, wherein: One end of the metal wire is connected to the pad and the other end of the metal wire is connected to the LED chip through the reflective layer and the packaging cavity.
8. The LED package structure of claim 1, wherein: The height of the reflective layer is lower than the height of the packaging glue, and the height of the packaging glue is lower than or equal to the height of the support.
9. The LED package structure of claim 1, wherein: The LED packaging structure further comprises a protective layer coated on the top surface of the LED chip.
10. The LED package structure of claim 9, wherein: The LED packaging structure further comprises a fluorescent layer coated on the outer side of the protective layer.