LED packaging structure

Abstract

The utility model relates to the technical field of LEDs, in particular to an LED packaging structure which comprises a frame base body, and a plurality of LED chip frame units are arranged on the frame base body. The LED chip frame unit comprises a bonding wire leading-out support and an LED chip bearing support. The bonding wire leading-out support is electrically connected with the LED chip bearing support through a bonding wire. The LED chip frame unit is wrapped with epoxy resin, the bonding wire leading-out support comprises an extension portion which extends towards the lower portion of the LED chip bearing support and exceeds the position under the LED chip, and grooves are formed in the upper surface and the lower surface of the extension portion. The beneficial effects of the utility model are that the LED packaging structure increases the area of the leading-out end of the bonding wire through the extension part and the groove on the extension part, and reduces the occurrence of unstable connection conditions such as loosening and falling of the bonding wire.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of LED especially relates to a LED packaging structure. BACKGROUND

[0002] With the continuous development of the field of automobile, smart home and communication, innovative products with high reliability are emerging, which drives the continuous innovation and improvement of the surrounding supporting products, and the application requirements of plug-in LED are higher and higher, and the assembly industry is more and more demanding. In the process of LED packaging, the lead frame plays a crucial role, which not only provides electrical connection for the chip, but also serves as a bearing and support structure, affecting the performance and reliability of the entire LED device. The common LED lead frame on the market has some shortcomings in practical application:

[0003] (I) bonding wire connection stability problem

[0004] The LED chip realizes electrical connection with the lead frame through the bonding wire, and the area of the support connected by the one end of the bonding wire is relatively small. When the initial welding and the long-term use of the finished product are affected by certain external force, temperature change and other factors, the connection between the bonding wire and the support is prone to looseness, falling off and other phenomena, which affects the normal work of the LED device and reduces the reliability and service life of the product.

[0005] (II) high temperature welding process adaptability problem

[0006] With the emergence of some special application scenarios, such as automobile headlamp, high temperature industrial lighting and other fields, higher temperature requirements are put forward for the welding process of LED device. In the process of high temperature welding, the bonding force between the existing lead frame and epoxy resin glue is insufficient, which is prone to delamination and delamination under the action of thermal stress, resulting in the integrity of the packaging structure being destroyed, affecting the heat dissipation, electrical performance and overall stability of the LED, and unable to meet the use environment of such high temperature welding process.

[0007] Therefore, in order to improve the performance and reliability of LED device, it is urgent to provide an LED packaging structure with a new lead frame to solve the above problems. Utility model content

[0008] The technical problem to be solved by the utility model is to provide an LED packaging structure to solve the problems of insufficient bonding wire connection stability of the existing LED lead frame and weak bonding force with epoxy resin glue in high temperature welding process environment.

[0009] In order to solve the above technical problems, the utility model adopts the technical scheme: provide a kind of LED packaging structure, including frame base body, multiple LED chip frame units are equipped on the frame base body;The LED chip frame unit includes bonding wire lead-out support and LED chip bearing support, and the bonding wire lead-out support is electrically connected with LED chip bearing support by bonding wire;Epoxy resin is wrapped on the LED chip frame unit, and the bonding wire lead-out support includes the extension portion that extends more than the LED chip directly below to the LED chip bearing support below, and the upper and lower surfaces of the extension portion are equipped with recess.

[0010] Further, in the above-mentioned LED packaging structure, the vertical section of the extension portion is rectangular.

[0011] Further, in the above-mentioned LED packaging structure, the thickness of the extension portion is 0.79mm, and the upper and lower surfaces of the extension portion are respectively equipped with a cuboid recess, and the recess depth is 0.13mm, and the width is 0.32mm.

[0012] Further, in the above-mentioned LED packaging structure, the horizontal distance of the farthest side of the bonding wire lead-out support and the LED chip bearing support away from each other is 3.2±0.1mm.

[0013] Further, in the above-mentioned LED packaging structure, the upper and lower surfaces of the LED chip bearing area of the LED chip bearing support are equipped with a circular recess.

[0014] Further, in the above-mentioned LED packaging structure, the surface of the bonding wire lead-out support and the LED chip bearing support is equipped with a silane coupling agent coating.

[0015] Further, in the above-mentioned LED packaging structure, the bonding wire lead-out support and the LED chip bearing support are respectively connected with the frame base body by pin, and the adjacent pins are connected by support transverse muscle.

[0016] Further, in the above-mentioned LED packaging structure, the surface of the pin is equipped with a tin layer.

[0017] Further, in the above-mentioned LED packaging structure, 20 LED chip frame units are equipped on the frame base body.

[0018] The LED packaging structure of the utility model has the advantages that the area of the bonding wire leading-out end is increased through the extension and the groove thereon, so that the bonding wire has a more stable adhesion basis when connected to the bonding wire leading-out support, can bear greater external force and temperature change influence, effectively reduces the occurrence of unstable connection conditions such as bonding wire loosening and falling off, greatly improves the reliability of electrical connection between the LED chip and the lead frame, and further prolongs the service life of the LED device. BRIEF DESCRIPTION OF DRAWINGS

[0019] Fig. 1 It is a structure schematic view of the LED packaging structure of the embodiment of the utility model;

[0020] Fig. 2 It is a structure schematic view of the LED chip frame unit part of the LED packaging structure of the embodiment of the utility model;

[0021] Label explanation:

[0022] 1, LED chip frame unit;

[0023] 11, bonding wire leading-out support; 111, extension; 112, cuboid groove;

[0024] 12, LED chip bearing support; 13, bonding wire; 14, pin; 15, support cross rib. PREFERRED EMBODIMENT

[0025] To explain the technical content, the purposes and effects achieved by the utility model in detail, the following will be explained in combination with the embodiment and the drawings.

[0026] Please refer to Figs. 1-2The utility model provides a kind of LED packaging structure, including frame base body, multiple LED chip frame units 1 are equipped on the frame base body;The LED chip frame unit 1 includes bonding wire lead-out support 11 and LED chip bearing support 12, the bonding wire lead-out support 11 is electrically connected with LED chip bearing support 12 by bonding wire 13;Epoxy resin is wrapped on the LED chip frame unit 1, the bonding wire lead-out support 11 includes the extension 111 extending beyond LED chip directly below to LED chip bearing support 12 below, and the upper and lower surfaces of the extension 111 are provided with recess.

[0027] The utility model has the advantages that: the LED packaging structure of the utility model increases the area of the bonding wire lead-out end through the extension 111 and the recess thereon, so that the bonding wire has a more stable adhesion basis when connected to the support, can withstand greater external force and temperature changes, effectively reduces the occurrence of unstable connection conditions such as bonding wire loosening and falling off, greatly improves the reliability of electrical connection between the LED chip and the lead frame, and further prolongs the service life of the LED device. In a high-temperature welding process environment, due to the increased area of the bonding wire lead-out end and the increased bonding force between the bonding wire connecting support and the epoxy resin glue, the entire packaging structure can still maintain good integrity under thermal stress, avoiding problems such as delamination and delamination. This not only ensures the normal operation of the LED device in a high-temperature environment, but also ensures that its heat dissipation performance, electrical performance, etc. are not affected, and can better meet the needs of harsh temperature application scenarios such as automobile headlamps, high-temperature industrial lighting, etc.

[0028] Further, in the above-mentioned LED packaging structure, the vertical cross-section of the extension 111 is rectangular.

[0029] Further, in the above-mentioned LED packaging structure, the thickness of the extension 111 is 0.79 mm, and the upper and lower surfaces of the extension 111 are respectively provided with one cuboid recess 112, the recess depth is 0.13 mm, and the width is 0.32 mm.

[0030] Further, in the above-mentioned LED packaging structure, the horizontal distance of the farthest side of the bonding wire lead-out support 11 and the LED chip bearing support 12 away from each other is 3.2±0.1 mm.

[0031] Further, in the above-mentioned LED packaging structure, the upper and lower surfaces of the LED chip bearing area of the LED chip bearing support 12 are provided with a circular recess.

[0032] From the above description, the LED chip bearing area of the present application can be made of copper-silver alloy with flat and good heat conduction performance, providing a stable placement plane for the LED chip. The surface is finely polished, which helps the chip to dissipate heat better and adhere well to the subsequent packaging material, ensuring the timely heat dissipation effect and stable electrical performance of the chip during operation.

[0033] The LED chip bearing area is designed with round dot type pits (arc-shaped grooves) on the front and back surfaces. Such a structure can further increase the contact area and friction between the support and epoxy resin glue, thereby significantly enhancing the bonding strength of the support and epoxy resin glue.

[0034] Further, in the above-described LED packaging structure, the surfaces of the wire bonding lead-out support 11 and the LED chip bearing support 12 are provided with a silane coupling agent coating.

[0035] From the above description, the use of silane coupling agent pre-coating in the support functional area further enhances the bonding strength of the epoxy resin and the support.

[0036] Further, in the above-described LED packaging structure, the wire bonding lead-out support 11 and the LED chip bearing support 12 are connected to the frame base through pins 14, and the adjacent pins 14 are connected through support cross ribs 15.

[0037] Further, in the above-described LED packaging structure, the surface of the pin 14 is provided with a tin layer.

[0038] From the above description, the surface of the pin 14 is treated with tin plating, etc., to enhance the firmness and conductivity of soldering.

[0039] Further, in the above-described LED packaging structure, the frame base is provided with 20 LED chip frame units 1.

[0040] Embodiment one

[0041] Please refer to Figs. 1-2 An LED packaging structure includes a frame base, and a plurality of LED chip frame units 1 are provided on the frame base. The LED chip frame unit 1 includes a wire bonding lead-out support 11 and an LED chip bearing support 12, and the wire bonding lead-out support 11 is electrically connected to the LED chip bearing support 12 through a wire bonding 13. The LED chip frame unit 1 is wrapped with epoxy resin, and the wire bonding lead-out support 11 includes an extension 111 extending below the LED chip bearing support 12 beyond the LED chip directly below. The upper and lower surfaces of the extension 111 are provided with grooves.

[0042] The LED packaging structure of the embodiment increases the area of the end support of the bonding wire on the basis of the traditional bonding wire connection support. The end support is designed as a rectangular shape extending inward, and the area is increased by more than 50% compared with the traditional support. The extension part 111 of the increased support is further provided with two upper and lower grooves, and the positive and negative surfaces of the increased part and the chip bearing area heat dissipation part are designed as dot type pits. Such a structure can further increase the contact area and friction force of the support and the epoxy resin glue, thereby significantly enhancing the bonding force of the support and the epoxy resin glue.

[0043] The bonding wire lead-out support 11 and the LED chip bearing support 12 are connected with the frame base through the pins 14, and the adjacent pins 14 are connected through the support cross ribs 15. The surface of the pin 14 is provided with a tin layer.

[0044] The thickness of the extension part of the LED packaging structure is 0.79mm, and the upper and lower surfaces of the extension part are respectively provided with a cuboid groove, and the groove depth is 0.13mm and the width is 0.32mm. The horizontal distance of the farthest side of the bonding wire lead-out support and the LED chip bearing support away from each other is 3.2±0.1mm.

[0045] The LED packaging structure adopts the standard step 7.62mm commonly used in the LED lead frame, and makes the total length 152.4±0.1mm of the 20 continuous lead frames (namely one can make 20 products), which can match the existing automatic packaging equipment, and there is no need to purchase a die bonding machine, a wire bonding machine and a glue sealing machine.

[0046] In the actual production and manufacturing process of the LED packaging structure, a high-precision die integrated stamping mode is adopted according to the design drawing, and the surface is polished to make the flatness reach the specified standard.

[0047] Thirdly, a multi-layer plating process is carried out according to the requirements of the client use scene to achieve the requirements of preventing rust and easy welding.

[0048] Fourthly, the silane coupling agent is pre-coated in the support cross rib above the functional area part, and the bonding degree of the epoxy resin and the support is further enhanced.

[0049] Finally, the whole lead frame is comprehensively quality detected, including appearance size inspection, electrical conductivity test, and epoxy resin glue bonding force, to ensure that the finished product meets the design standard and use requirements.

[0050] The above merely describes the embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent transformation or direct or indirect application in the related technical field based on the content of the present application specification and drawings is also included in the patent protection scope of the present application.

Claims

1. An LED package structure, characterized in that, The frame base is provided with a plurality of LED chip frame units; the LED chip frame unit comprises a bonding wire leading support and an LED chip bearing support, and the bonding wire leading support is electrically connected with the LED chip bearing support through a bonding wire; the LED chip frame unit is wrapped with epoxy resin; the bonding wire leading support comprises an extension part extending below the LED chip bearing support beyond the position directly below the LED chip; and the upper and lower surfaces of the extension part are provided with grooves.

2. The LED package structure of claim 1, wherein, The vertical section of the extension part is rectangular.

3. The LED package structure of claim 2, wherein, The thickness of the extension part is 0.79 mm; the upper and lower surfaces of the extension part are respectively provided with a cuboid groove; the groove depth is 0.13 mm; and the groove width is 0.32 mm.

4. The LED package structure of claim 1, wherein, The horizontal distance between the farthest side surfaces of the bonding wire leading support and the LED chip bearing support away from each other is 3.2±0.1 mm.

5. The LED package structure of claim 1, wherein, The upper and lower surfaces of the LED chip bearing area of the LED chip bearing support are provided with circular-arc grooves.

6. The LED package structure of claim 1, wherein, The surfaces of the bonding wire leading support and the LED chip bearing support are provided with a silane coupling agent coating.

7. The LED package structure of claim 1, wherein, The bonding wire leading support and the LED chip bearing support are respectively connected with the frame base through pins, and the adjacent pins are connected through support cross ribs.

8. The LED package structure of claim 7, wherein, The surfaces of the pins are provided with a tin layer.

9. The LED package structure of claim 1, wherein, The frame base is provided with 20 LED chip frame units.

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