Electrolyte circulating flow rotating cathode electroplating device

Abstract

The utility model discloses a rotating cathode electroplating device with circularly flowing electrolyte. The rotating cathode electroplating device comprises a rotating cathode roller and an electrolyte circulating system, the electrolyte circulating system comprises an electrolytic tank, a liquid separation plate, a liquid separation tank, an overflow tank and a liquid pump; the rotating cathode roller is suspended in the electrolytic tank, and the annular anode surrounds the cathode roller and is arranged on the inner wall of the electrolytic tank; the liquid separation tank is positioned below the electrolytic tank and is isolated by a liquid separation plate, and the liquid separation plate comprises a plurality of overflow holes which are through up and down; the overflow tank is positioned on the side edge of the electrolytic tank and is communicated with the electrolytic tank through an overflow plate; the liquid pump is arranged between the liquid separation tank and the overflow tank and is used for pumping the electrolyte in the overflow tank into the liquid separation tank through the liquid conveying pipe; and one end, extending into the overflow pool, of the infusion tube is a funnel-shaped interface. According to the invention, equipment components and an assembling relation thereof are improved, and a corresponding compact device structure is formed, so that the problems that an electroplated layer is not uniform, a plating solution needs to be conveyed through a long conveying pipeline, and the occupied space of the equipment device is large in the existing experimental electroplating technology are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating equipment technical field especially a kind of rotary cathode electroplating device of electrolyte circulation flow. BACKGROUND

[0002] For electroplating process, it is usually necessary to make electrolyte flow to facilitate the diffusion of substances in electrolyte, that is, to enhance the mass transfer process. Most of the prior art uses fixed cathode to promote the flow of electrolyte around the cathode by aeration or stirring; however, purified compressed air is needed when aeration stirring is used, and compressed air inevitably contains impurities such as water and oil, which adversely affect the quality of the plating layer. Stirring has a significant effect on eliminating concentration polarization and increasing current density, but it has the defects of low efficiency and difficulty in controlling directional flow of liquid; some documents disclose a method of controlling electrolyte flow by pump valve driving, but this method requires a series of components, which occupies a large space.

[0003] Furthermore, compared with the electroplating process of static or fixed cathode, the electroplating process of rotating cathode (i.e. rotary cathode electroplating) can generate a strong relative flow field on the surface of the cathode by its high-speed rotation, thereby driving the circulation of electrolyte, with high efficiency of liquid flow control and compact space. In view of these advantages, the existing electrolytic copper foil production device usually uses a horizontally rotating cathode roller as the cathode, matched with a ship-shaped electroplating tank; but both the horizontally rotating cathode roller and the ship-shaped electroplating tank are difficult to manufacture, increasing the process difficulty. Therefore, it is necessary to develop a new rotary cathode electroplating device with higher integration. SUMMARY

[0004] The utility model aims at providing a rotary cathode electroplating device of electrolyte circulation flow to solve the problems raised in the above background.

[0005] In order to achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] A rotary cathode electroplating device of electrolyte circulation flow, comprising a rotating cathode roller and an electrolyte circulation system; the electrolyte circulation system comprises an electrolytic cell, a distribution plate, a distribution tank, an overflow tank and a liquid pump; the rotating cathode roller is suspended in the electrolytic cell;

[0007] The distribution tank is located below the electrolytic cell and is isolated by the distribution plate, which comprises a plurality of distribution holes penetrating up and down; the overflow tank is located at the side of the electrolytic cell and is connected to the electrolytic cell through an overflow hole; the liquid pump is arranged between the distribution tank and the overflow tank, for pumping the electrolyte in the overflow tank into the distribution tank through a liquid delivery tube; the end of the liquid delivery tube inserted into the overflow tank is a funnel-shaped interface.

[0008] Optionally, the annular anode is arranged around the rotating cathode roller and is arranged on one side of the inner wall of the electrolytic cell.

[0009] Optionally, a metering liquid inlet valve is arranged between the liquid pump and the liquid distribution tank.

[0010] Optionally, the liquid pump is any one of a peristaltic pump, a metering pump or a magnetic pump.

[0011] Optionally, when the flow rate of the electrolyte is ≤0.5 L / min, preferably a peristaltic pump or a metering pump is used; when the flow rate of the electrolyte is ≥10 L / min, preferably a magnetic pump is used.

[0012] Optionally, the diameter of the liquid distribution hole is 2-10 mm, and further preferably 4-7 mm.

[0013] Optionally, a heating tube is further included, which is suspended in the overflow tank and used for heating the circulating electrolyte.

[0014] Optionally, the heating tube is any one of an L-shaped heating tube, a disc-shaped heating tube or a ring-shaped heating tube.

[0015] Optionally, a heating controller is further included, which is connected with the heating tube and used for adjusting the power of the heating tube and the temperature of the plating solution.

[0016] Optionally, an overflow plate including an overflow hole is arranged between the electrolytic cell and the overflow tank, and the overflow hole is higher than the upper edge of the overflow tank.

[0017] Optionally, the rotating cathode roller includes a cathode roller main body, an upper insulating annular cover, an annular silica gel pad and a lower insulating bottom cover, the cathode roller main body is divided into an upper threaded cylindrical connecting part and a lower hollow main cylinder, the upper insulating annular cover and the annular silica gel pad are used for covering the upper threaded cylindrical connecting part of the cathode roller main body to prevent copper from being deposited on the upper annular surface of the main cylinder, and the lower insulating bottom cover has a threaded protruding part used for shielding the lower bottom surface of the lower hollow main cylinder.

[0018] The utility model discloses a cathode roller which is vertically rotated by self-positioning and provides electrolyte circulating power by matching with a liquid pump, generates a strong relative flow field on the surface of the cathode by high-speed rotation of the cathode roller, and drives the electrolyte to circulate, which is beneficial to further improving the uniformity of electroplating. The utility model also eliminates the problem of stirring by a traditional stirring paddle, reduces additional stirring accessories, and saves equipment space. Meanwhile, the utility model adopts a circulating structure of an overflow tank, a liquid distribution tank and an electrolytic cell, which reduces the length of the conveying pipeline compared with a traditional split structure, saves equipment space, minimizes the uneven distribution of the electrolyte, and improves the quality of the plating layer. The utility model adopts a funnel-shaped liquid conveying interface, which is beneficial to filling the liquid pump with the electrolyte and avoids the burning of the motor caused by idling. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings described below only constitute some of the embodiments of the present application, and all other embodiments obtained by those of ordinary skill in the art without creative effort based on these drawings also belong to the protection scope of the present application.

[0020] Figure 1 A sectional view schematic diagram of the rotating cathode electroplating device is provided in the present application.

[0021] Figure 2 A Figure 1 A top view schematic diagram of the rotating cathode electroplating device is shown in the present application.

[0022] Figure 3 A Figure 1 A sectional structure schematic diagram of the rotating cathode roller AA' direction is shown in the present application.

[0023] Figure 4 A structure schematic diagram of the liquid distribution plate is provided in the present application.

[0024] The marks in the drawings are described as follows: 11, electrolytic cell; 12, overflow plate; 13, liquid distribution plate; 14, liquid distribution cell;

[0025] 15, liquid inlet valve; 16, liquid pump; 17, external frame; 18, funnel type interface; 19, overflow cell; 20, overflow cell cover plate; 21, heating controller; 22, heating pipe, 23, cathode roller, 24, ring type anode; 121, overflow hole; 131, liquid distribution hole; 230, hollow main cylinder; 231, threaded cylindrical connecting part; 232, upper insulating ring cover; 233, ring type silica gel pad; 234, cathode roller main body; 235, lower insulating bottom cover. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments only constitute some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort also belong to the protection scope of the present application.

[0027] The present application provides the following technical solutions:

[0028] A rotating cathode electroplating apparatus with circulating electrolyte includes a rotating cathode roller and an electrolyte circulation system. The electrolyte circulation system includes an electrolytic cell, a separator plate, a separator pool, an overflow pool, and a pump. The rotating cathode roller is suspended in the electrolytic cell. The separator pool is located below the electrolytic cell and is isolated by the separator plate, which includes multiple vertically penetrating separator holes. The overflow pool is located on the side of the electrolytic cell and is connected to it through overflow holes. The pump is located between the separator pool and the overflow pool and is used to pump the electrolyte in the overflow pool into the separator pool via a delivery pipe. One end of the delivery pipe extending into the overflow pool has a funnel-shaped interface.

[0029] Specifically, the following is in conjunction with the appendix Figures 1-4 The present invention will be described as follows: Figure 1 This is a cross-sectional schematic diagram of a rotating cathode electroplating apparatus provided by the present invention; Figure 2 for Figure 1 A top view of the rotating cathode electroplating apparatus shown. Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure of the rotating cathode roller AA' shown; Figure 4 A schematic diagram of the structure of a separator plate provided by this utility model: A rotating cathode electroplating device with circulating electrolyte includes a rotating cathode roller 23, an annular anode 24, and an electrolyte circulation system; the electrolyte circulation system includes an electrolytic cell 11, a separator plate 13, a separator pool 14, an overflow pool 19, and a liquid pump 16; the rotating cathode roller 23 is suspended in the electrolytic cell 11 and surrounded by the annular anode 24;

[0030] The separating tank 14 is located below the electrolytic cell 11 and is isolated by the separating plate 13, which includes multiple vertically penetrating separating holes 131. The overflow tank 19 is located on the side of the electrolytic cell 11 and is connected to it through the overflow hole 121. The liquid pump 16 is located between the separating tank 14 and the overflow tank 19 and is used to pump the electrolyte in the overflow tank 19 into the separating tank 14 through the delivery pipe. The end of the delivery pipe that extends into the overflow tank 19 is a funnel-shaped interface 18. Driven by the liquid pump 16, the electrolyte flows from the overflow tank 19 into the separating tank, is rectified by the separating plate 13, and flows into the electrolytic cell 11. When the liquid level is higher than that of the overflow tank 19, it flows back to the overflow tank 19 through the overflow hole 121, thus forming an electrolyte flow circulation.

[0031] Furthermore, the electrolyte circulation system also includes a liquid inlet valve 15. The electrolyte flows through the funnel-shaped interface 18 below the overflow tank 19 under the drive of the liquid pump 16 and is fed through the liquid inlet valve 15. The liquid inlet flow rate of the electrolyte is regulated by the liquid inlet valve 15. Preferably, a one-way valve can be selected to effectively prevent liquid from flowing back into the liquid pump 16.

[0032] This application utilizes a self-positioning, vertically rotating cathode roller 23 and a matching liquid pump 16 to provide electrolyte circulation power. The high-speed rotation of the cathode roller generates a strong relative flow field on the cathode surface, thereby driving the electrolyte circulation and effectively avoiding defects such as micropores in the mesh, further improving the uniformity of electroplating. It also eliminates the need for traditional stirring paddles, reducing the need for additional stirring accessories and saving equipment space. Furthermore, the combined circulation structure of the overflow tank 19, the distribution tank 14, and the electrolytic cell 11 reduces the length of the delivery pipeline compared to traditional separate structures, saving equipment space. It also minimizes the uneven distribution of the electrolyte medium, improving coating quality. The funnel-shaped liquid inlet facilitates filling the liquid pump 16 with electrolyte, preventing dry running and motor burnout.

[0033] Optionally, the outer frame 17 of the electrolytic cell 11 and the overflow cell 19 is made of acrylic material, which is acid and heat resistant and facilitates observation of the electrolyte circulation process. Preferably, the bottom outer frame 17 of the electrolytic cell is made of stainless steel for support, while the upper part of the cell is made of acrylic material for acid corrosion resistance, to hold the plating solution, and to facilitate observation of the plating solution flow.

[0034] Optionally, in some other modifiable embodiments, an overflow plate 12 including an overflow hole 121 (not shown in the figure) is provided between the electrolytic cell 11 and the overflow cell 19, and the overflow hole 121 is higher than the upper edge of the overflow cell 19. Further optionally, an overflow cell cover plate 20 is provided above the overflow cell 19, and the relatively closed space structure can prevent external air, impurities, etc. from entering the interior, reducing the adverse effects on the electrolyte.

[0035] In some alternative embodiments, the liquid pump 16 is any one of a peristaltic pump, a metering pump, or a magnetic pump. When the electrolyte flow rate is ≤0.5L / min, a peristaltic pump or metering pump with higher control accuracy is preferred; when the electrolyte flow rate is ≥10L / min, a corrosion-resistant magnetic pump is preferred. The funnel-shaped interface 233 facilitates filling the pump body with liquid and avoids dry running that could burn out the motor. Furthermore, when a high-flow-rate magnetic pump is used to provide the electrolyte circulation power, the unevenness of the electrolyte in the feed solution can be minimized.

[0036] Furthermore, a metering-type liquid supply valve 15 is provided between the liquid pump 16 and the liquid distribution tank 14. With the liquid supply valve 15, the flow rate of the electrolyte can be controlled more precisely.

[0037] In some alternative embodiments, such as Figure 4 As shown, Figure 4A schematic diagram of a structure of a liquid distribution plate according to the present application is shown in FIG. 1. The liquid distribution plate 13 includes a plurality of uniformly distributed overflow holes 121 that are vertically upward. In some optional embodiments, the diameter of the overflow holes 131 on the liquid distribution plate 13 is between 2 mm and 10 mm, and is further preferably between 4 mm and 7 mm. If the diameter of the overflow holes 131 on the liquid distribution plate 13 is too small, the liquid flow rate will be reduced. If the diameter of the overflow holes 131 on the liquid distribution plate 13 is too large, the liquid will not be evenly distributed.

[0038] In some optional embodiments, the electroplating device further includes a heating pipe that is suspended in the overflow tank and is used to heat the circulating electrolyte.

[0039] Specifically, referring to FIG. 2, Figure 1 the electroplating device further includes a heating pipe 22 that is suspended in the overflow tank 19 and is used to heat the circulating electrolyte. The heating pipe 22 is suspended in the electrolyte and does not contact the inner wall of the container, but is close to the bottom of the container. The heating pipe 22 is preferably a ring-shaped heating pipe 22 as shown in FIG. 2, which is beneficial to uniform heating. The outer wall of the heating pipe 22 is made of Teflon material, which is resistant to acid, alkali and high temperature. The heating pipe 22 can be selected from any one of an L-shaped heating pipe, a disc-shaped heating pipe or a ring-shaped heating pipe. Figure 1

[0040] In some optional embodiments, the electroplating device further includes a heating controller that is connected to the heating pipe and is used to adjust the power of the heating pipe.

[0041] Specifically, referring to FIG. 2, Figure 1 the heating controller 21 is connected to the heating pipe 22 and is used to adjust the power of the heating pipe 22. According to the size of the container and the amount of plating solution, the power of the heating pipe is selected and set, for example, 1-3 KW for 1-3 L solution. By using the mode of heating while passing through the electrolyte for self-circulation, the appropriate electrolysis temperature of the electrolyte can be timely and efficiently controlled, the control of the electroplating process is enhanced, and the device space is saved.

[0042] In some optional embodiments, referring to FIGS. 3 and 4, Figure 1 and Figure 3 the vertical rotating cathode roller 23 includes a cathode roller body 234, an upper insulating ring-shaped cover 232, a ring-shaped silica gel pad 233 and a lower insulating bottom cover 235. The upper insulating ring-shaped cover 232 and the ring-shaped silica gel pad 233 are fixed on the upper surface of the cathode roller body 234 by threads. The lower insulating bottom cover 235 and the ring-shaped silica gel pad 233 are fixed on the bottom of the cathode roller body 234 by threads in the bottom of the main body.

[0043] Specifically, referring to FIG. 5, Figure 3 ​As shown, the electrolytic cell 11 with outer square and inner circle, the rotating cathode roller 23 is suspended in the center of the electrolytic cell 11 by connecting the rotating motor (not shown in the figure) through the conductive slip ring, and the ring-shaped anode 24 is arranged around it. The rotating cathode roller 23 rotates around the cylindrical axis. The cathode roller main body 234 is divided into an upper threaded cylindrical connecting part 231 and a lower hollow main cylinder 230, which are made of titanium or stainless steel material. The threaded cylindrical connecting part 231 is used to connect the external conductive part and the rotating connecting part. The inner ring thread of the upper insulating annular cover 232 matches the threaded cylindrical connecting part 231. After the fastening of the accessories, the upper insulating annular cover 232 and the annular silica gel pad 233 are used to shield the upper ring surface of the lower hollow main cylinder 230, preventing copper from depositing on the annular surface of the main cylinder. The lower insulating bottom cover 235 has a threaded protruding part that matches the inner wall thread of the lower hollow main cylinder 230, which is used to seal the lower bottom surface of the lower hollow main cylinder 230 with the annular silica gel pad 233 to prevent copper from depositing on the bottom of the cathode roller main body 234. In specific implementation, the thickness of the upper insulating annular cover 232 is preferably greater than 2 cm, which can be beneficial to prevent the electrolyte from immersing the metal parts such as the upper threaded cylindrical connecting part 231. The hollow structure of the rotating cathode roller 23 also helps to reduce the weight of the rotating cathode roller 23, reduce material cost and reduce the load requirements of the rotating motor.

[0044] It should be emphasized that the embodiments of the present application are illustrative rather than restrictive, and thus the present application is not limited to the embodiments in the specific implementation. Any other embodiments derived by those skilled in the art from the technical solution of the present application also belong to the scope of protection of the present application.

Claims

1. A rotating cathode electroplating apparatus with circulation flow of electrolyte, characterized in that: The rotating cathode roller, the annular anode and an electrolyte circulating system; the electrolyte circulating system comprises an electrolytic cell, a liquid distribution plate, a liquid distribution pool, an overflow pool and a liquid pump; the rotating cathode roller is suspended in the electrolytic cell and surrounded by the annular anode; The liquid distribution pool is located below the electrolytic cell and separated by the liquid distribution plate, the liquid distribution plate comprises a plurality of through holes; the overflow pool is located at the side of the electrolytic cell and connected by an overflow hole; the liquid pump is arranged between the liquid distribution pool and the overflow pool, used for pumping the electrolyte in the overflow pool into the liquid distribution pool through a liquid delivery tube; the liquid delivery tube has a funnel-shaped interface at the end extending into the overflow pool.

2. The rotating cathode electroplating device of claim 1, wherein: A metering liquid inlet valve is arranged between the liquid pump and the liquid distribution pool.

3. The rotating-cathode electroplating apparatus of claim 1, wherein: The liquid pump is any one of a peristaltic pump, a metering pump or a magnetic pump.

4. The rotating cathode electroplating device of claim 3, wherein: When the flow rate of the electrolyte is ≤0.5L / min, the liquid pump is a peristaltic pump or a metering pump; when the flow rate of the electrolyte is ≥10L / min, the liquid pump is a magnetic pump.

5. The rotating cathode electroplating device of claim 1, wherein: The diameter of the liquid distribution hole is 2mm-10mm.

6. The rotating-cathode electroplating apparatus of claim 1, wherein: A heating tube is further included, the heating tube is suspended in the overflow pool and used for heating the circulating electrolyte.

7. The rotating cathode electroplating device of claim 6, wherein: The heating tube is any one of an L-shaped heating tube, a disc-shaped heating tube or a ring-shaped heating tube.

8. The rotating-cathode electroplating apparatus of claim 6, wherein: A heating controller is further included, the heating controller is connected with the heating tube and used for adjusting the power of the heating tube.

9. The rotating-cathode electroplating apparatus of claim 1, wherein: An overflow plate comprising the overflow hole is arranged between the electrolytic cell and the overflow pool, the overflow hole is higher than the upper edge of the overflow pool.

10. The rotating-cathode electroplating apparatus of claim 1, wherein: The rotating cathode roller comprises a cathode roller body, an upper insulating annular cover, an annular silica gel pad and a lower insulating bottom cover, the cathode roller body comprises a threaded cylindrical connecting part and a hollow main cylinder, the upper insulating annular cover and the annular silica gel pad are used for covering the threaded cylindrical connecting part, and the lower insulating bottom and the annular silica gel pad shield the lower bottom surface of the hollow main cylinder.

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