Semiconductor wafer chemical nickel electroplating drying device

Abstract

The utility model discloses a semiconductor wafer chemical nickel electroplating drying device, which relates to the technical field of chip processing, and comprises a drying box body, the inner top wall of the drying box body is fixedly connected with a heating plate, the bottom of the drying box body is provided with a drying port, the bottom of the drying box body is provided with a round base, and the round base is fixedly connected with the heating plate. The wet wafers produced by electroplating equipment are continuously conveyed to the position below the drying box body through intermittent rotation of the rotary disc, drying heat is provided through the heating plate arranged in the drying box body, drying airflow is provided through the ventilation fans arranged on the two sides, and the drying efficiency is improved. And hot air from top to bottom is formed and blown to the wet wafer, so that the wafer drying rate of the drying box body is consistent with the wafer processing rate of electroplating equipment, the wet wafer can be continuously heated and dried, and subsequent wafer processing and storage are facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip processing technology field especially relates to a kind of semiconductor wafer chemical nickel electroplating drying device. BACKGROUND

[0002] Semiconductor wafer is a kind of thin sheet, usually made of semiconductor material, such as silicon, germanium, or compound semiconductor material, such as gallium arsenide, silicon carbide, etc., electroplating of semiconductor wafer can strengthen the electrical properties of wafer, is an important process of semiconductor wafer processing.

[0003] For example, the patent publication No. CN219223070U "wafer drying device", including drying box, gas circulation assembly and heating assembly, drying box is equipped with drying groove, air outlet and air inlet;Air pipe mechanism includes circulating air pipe and import air pipe, circulating air pipe two ends are communicated with air outlet and air inlet respectively, fan mechanism is communicated with circulating air pipe, drying gas forms circulating dry gas flow through circulating air pipe;Import air pipe two ends are communicated with external air and circulating air pipe respectively, import air pipe can import external air to mix drying gas, regulating valve mechanism is equipped on circulating air pipe and import air pipe, regulating valve mechanism can adjust the air intake flow of circulating air pipe and the air intake flow of import air pipe;Heating assembly is connected with circulating air pipe.

[0004] But in prior art, due to the sensitivity of some wafer materials to current, the traditional current electroplating method is not suitable, so it is necessary to use chemical nickel electroplating method to electroplate special wafer materials, chemical nickel electroplating usually uses liquid solution containing nickel salt and reducing agent, and the wafer surface is easy to adhere to liquid solution after production, which affects subsequent processing and storage. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the problems of using liquid solution containing nickel salt and reducing agent in chemical nickel electroplating in prior art, wafer surface is easy to adhere to liquid solution after production, which affects subsequent processing and storage, and proposes a kind of semiconductor wafer chemical nickel electroplating drying device.

[0006] In order to achieve the above object, the utility model discloses the following technical scheme: a semiconductor wafer chemical nickel electroplating drying device, including drying box body, the inner top wall of drying box body is fixedly connected with the heating plate, the bottom of drying box body is opened drying mouth, the bottom of drying box body is provided with round base, the top of round base is rotatably connected with carousel, the upper surface of carousel is installed with wafer carrier plate along the circumference edge equidistance, drying box body is located one side of carousel, and electroplating equipment is installed on the other side of carousel, and the bottom of carousel is provided with servo motor, and the top of servo motor is rotatably connected with driving wheel, and the bottom center position of carousel is fixedly connected with intermittent wheel, and servo motor drives intermittent wheel to carry out intermittent rotation through driving wheel.

[0007] Preferably, the bottom end of the round base is fixedly connected with a support column, and the round base is seated on the ground through the support column.

[0008] Preferably, the bottom end of the round base is fixedly connected with a support column, and the round base is seated on the ground through the support column.

[0009] Preferably, the outer side wall of the drying box body is provided with a notch, and a ventilation fan is installed in the notch.

[0010] Preferably, the outer side wall of the round base is bent upward to form a round fence.

[0011] Preferably, the surface of the wafer carrier plate is provided with a heat dissipation groove.

[0012] Preferably, the outer side wall of the drying box body is fixedly connected with a support seat, and the servo motor is installed on the base of the support seat.

[0013] Compared with the prior art, the utility model has the advantages and positive effects that:

[0014] 1、In the utility model, the humid wafer produced by the electroplating equipment is continuously transported to the lower side of the drying box body through the intermittent rotation of the carousel, the heating plate provided in the drying box body provides drying heat, the ventilation fans provided on both sides provide drying air flow, the hot air blows from top to bottom to the humid wafer, the drying rate of the wafer in the drying box body is consistent with the processing rate of the wafer in the electroplating equipment, so that the humid wafer can be continuously heated and dried, and the subsequent wafer processing and storage are facilitated.

[0015] 2、In the utility model, the circular fence is formed on the outer edge of the round base to prevent the carousel from separating from the round base, the support frame is arranged below the intermittent wheel to support the bottom of the intermittent wheel, the carousel rotates stably along the axis, and the wafer is prevented from falling off the wafer carrier plate, so that the stability of the equipment is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1The utility model provides a kind of semiconductor wafer chemical nickel electroplating drying device's three-dimensional structure schematic Figure 1 ;

[0017] Figure 2 The utility model provides a kind of semiconductor wafer chemical nickel electroplating drying device's three-dimensional structure schematic Figure 2 ;

[0018] Figure 3 The utility model provides a kind of semiconductor wafer chemical nickel electroplating drying device's three-dimensional structure schematic

[0019] Figure 4 The utility model provides a kind of semiconductor wafer chemical nickel electroplating drying device's three-dimensional structure schematic

[0020] Figure 5 The utility model provides a kind of semiconductor wafer chemical nickel electroplating drying device's three-dimensional structure schematic

[0021] Legend: 1, drying box body;2, turntable;3, wafer carrier plate;4, round base;5, support column;6, ventilation fan;7, support seat;8, support frame;9, servo motor;10, intermittent wheel;11, driving wheel;12, drying port;13, heating plate. DETAILED DESCRIPTION

[0022] In order to more clearly understand the above-mentioned purposes, features and advantages of the utility model, the utility model is further described below in conjunction with the drawings and examples.

[0023] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, however, the present application can be practiced in a variety of ways different from those described herein, therefore, the present application is not limited to the specific embodiments disclosed in the following description.

[0024] Example one: as Figure 1 - Figure 5The utility model provides a kind of semiconductor wafer chemical nickel electroplating drying device, including drying box body 1, the inner top wall of drying box body 1 is fixedly connected with heating plate 13, the bottom of drying box body 1 is equipped with drying port 12, the bottom of drying box body 1 is provided with round base 4, the top end of round base 4 is rotatably connected with carousel 2, the upper surface of carousel 2 is installed with wafer carrier plate 3 along the circumference equidistantly, drying box body 1 is located at the side of carousel 2, electroplating equipment is installed at the other side of carousel 2, the bottom end of carousel 2 is provided with servo motor 9, the top end of servo motor 9 is rotatably connected with driving wheel 11, the bottom end central position of carousel 2 is fixedly connected with intermittent wheel 10, servo motor 9 drives intermittent wheel 10 to carry out intermittent rotation by driving wheel 11.

[0025] In the semiconductor wafer preparation process, because some wafer materials are sensitive to current, the traditional current electroplating method is not suitable. Using chemical nickel electroplating method, not only the adhesion of the plating layer of chemical nickel electroplating to the wafer is strong, which can effectively prevent the peeling or falling off of the plating layer, but also no current is needed, which can be applied to some wafer materials that are not suitable for electroplating. Chemical nickel electroplating relies on chemical reaction to reduce nickel ions from solution to the surface of the substrate. Chemical nickel electroplating usually uses a liquid solution containing nickel salt and reducing agent, and the wafer surface is easy to adhere to the liquid solution after production, which affects subsequent processing and storage.

[0026] Now the specific settings and effects of the embodiment will be described: the drying device main body and the chemical nickel electroplating are located at the two ends of the carousel 2, the chemical nickel electroplating carries out the chemical electroplating reaction of the wafer solution, after completion, the claw body of the forearm is used to transport the wafer to the wafer carrier plate 3 of the carousel 2, the servo motor 9 drives the driving wheel 11 to rotate continuously, and then the driving wheel 11 drives the intermittent wheel 10 to rotate intermittently, so that the intermittent wheel 10 drives the carousel 2 to rotate, and the wafer carrier plate 3 is rhythmically transported from below the chemical nickel electroplating equipment to below the drying box body 1, the surface solution is volatilized and dried by using the internal wind power and heating of the drying box body 1, after one wafer is processed by the electroplating equipment, the carousel 2 rotates one station, the wafer carrier plate 3 in the upper station is transferred to the electroplating equipment, and the subsequent wet wafer is carried; the wafer carrier plate 3 in the upper station carrying the wet wafer is transferred to the drying box body 1 for subsequent drying; the wafer carrier plate 3 carrying the dried wafer is separated from the drying box body 1, so that it moves to the lower station for wafer recycling.

[0027] Embodiment two: as shown in Figure 2 、 Figure 3 and Figure 4 , the bottom end of the round base 4 is fixedly connected with the support column 5, and the round base 4 is seated on the ground through the support column 5. The bottom end of the round base 4 is fixedly connected with the support frame 8, and the bottom of the intermittent wheel 10 is rotatably connected with the support frame 8. The outer side wall of the drying box body 1 is provided with a slot, and the slot is internally installed with a ventilation fan 6.

[0028] The outer side wall of the round base 4 is bent upwards to form a round fence. The surface of the wafer carrier plate 3 is provided with a heat dissipation groove. The outer side wall of the drying box body 1 is fixedly connected with a support seat 7, and a servo motor 9 is installed on the base of the support seat 7.

[0029] The effect achieved by the whole embodiment is that the ventilation fan 6 is arranged on both sides of the drying box body 1, the drying port 12 is arranged on the bottom of the drying box body 1, the ventilation fan 6 is used to inhale air inwardly, the air is discharged outwardly through the drying port 12, a stable air duct in the drying box body 1 is formed, and the heating plate 13 is used to heat, so that the hot air is continuously blown to the wet wafer surface of the lower wafer carrier plate 3, the drying effect is realized, meanwhile, the heat dissipation groove is arranged on the surface of the wafer carrier plate 3, so that the lower surface of the wafer is in a suspended state, when the hot air is blown to the wafer surface, the hot air is blown outwardly from both sides, the horizontal hot air carries the liquid on the upper and lower surfaces of the wafer, and the drying is completed. In order to improve the stability of the whole material conveying of the rotating disc 2, the annular round fence is formed on the outer edge of the round base 4, the rotating disc 2 is prevented from being separated from the round base 4, the support frame 8 is arranged below the intermittent wheel 10 to support the bottom of the intermittent wheel 10, and the stability of the rotating disc 2 rotating along the shaft is improved.

[0030] The working principle of the device is as follows: after chemical electroplating is completed, the wafer processed by the electroplating equipment is conveyed to the wafer carrier plate 3 of the rotating disc 2, the servo motor 9 drives the driving wheel 11 to rotate continuously, the intermittent wheel 10 is driven to rotate intermittently by the driving wheel 11, the rotating disc 2 is driven to rotate by the intermittent wheel 10, the wafer carrier plate 3 is rhythmically conveyed from below the chemical nickel electroplating equipment to below the drying box body 1, the ventilation fan 6 inhales air inwardly, the air is discharged outwardly through the drying port 12, a stable air duct in the drying box body 1 is formed, and the heating plate 13 is used to heat, so that the hot air is continuously blown to the wet wafer surface of the lower wafer carrier plate 3, the wafer carrier plate 3 of the wafer is separated from the drying box body 1, and the wafer carrier plate 3 is moved to the next working position for wafer recovery.

[0031] The above is only a preferred embodiment of the present application, and is not intended to limit the present application in other forms. Any skilled person in the art can modify or change the above disclosed technical content to obtain equivalent embodiments applied to other fields. However, any simple modification, equivalent change and modification made on the basis of the technical essence of the present application to the above embodiments still belongs to the protection scope of the technical scheme of the present application.

Claims

1. A semiconductor wafer electroless nickel plating drying apparatus, comprising a drying chamber (1), wherein a heating plate (13) is fixedly connected to the inner top wall of the drying chamber (1), and a drying port (12) is provided at the bottom of the drying chamber (1), characterized in that: The bottom of the drying chamber (1) is provided with a circular base (4), and the top of the circular base (4) is rotatably connected to a turntable (2). Wafer carriers (3) are installed at equal intervals along the periphery of the upper surface of the turntable (2). The drying chamber (1) is located on one side of the turntable (2), and the electroplating equipment is installed on the other side of the turntable (2). A servo motor (9) is provided at the bottom of the turntable (2), and a drive wheel (11) is rotatably connected to the top of the servo motor (9). An intermittent wheel (10) is fixedly connected at the center of the bottom of the turntable (2). The servo motor (9) drives the intermittent wheel (10) to rotate intermittently through the drive wheel (11).

2. The semiconductor wafer electroless nickel plating drying apparatus according to claim 1, characterized in that: The bottom end of the circular base (4) is fixedly connected to a support column (5), and the circular base (4) rests on the ground through the support column (5).

3. The semiconductor wafer electroless nickel plating drying apparatus according to claim 1, characterized in that: A support frame (8) is fixedly connected to the bottom of the round base (4), and the bottom of the intermittent wheel (10) is rotatably connected to the support frame (8).

4. The semiconductor wafer electroless nickel plating drying apparatus according to claim 1, characterized in that: The outer wall of the drying chamber (1) is provided with a slot, and a ventilation fan (6) is installed inside the slot.

5. The semiconductor wafer electroless nickel plating drying apparatus according to claim 1, characterized in that: The outer wall of the circular base (4) is bent upward to form a circular fence.

6. The semiconductor wafer electroless nickel plating drying apparatus according to claim 1, characterized in that: The surface of the wafer carrier (3) is provided with heat dissipation grooves.

7. The semiconductor wafer electroless nickel plating drying apparatus according to claim 1, characterized in that: The outer wall of the drying chamber (1) is fixedly connected to a support base (7), and the servo motor (9) is mounted on the base of the support base (7).

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