Multi-channel temperature controller
By designing a multi-channel temperature controller, and utilizing components such as temperature sensors, MCUs, and solid-state relays, a simplified control circuit for multi-channel temperature monitoring and individual control is achieved, solving the problem of cumbersome control in existing temperature controllers.
Patent Information
- Application Number
- CN202520572645.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-29
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2035-03-29
AI Technical Summary
Existing temperature controllers have cumbersome control methods and cannot achieve multi-channel temperature monitoring and separate control.
A multi-channel temperature controller is adopted, which includes components such as temperature sensors, MCU, solid-state relays, and communication chips. The MCU controls the same number of solid-state relays to achieve multi-channel temperature monitoring and individual control.
The control circuit was simplified, enabling monitoring and separate control of multiple temperatures, thus meeting existing temperature control requirements.
Smart Images

Figure CN223712081U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a temperature controller, and more particularly to a multi-channel temperature controller. Background Technology
[0002] A temperature controller is a device used to automatically regulate the temperature of a system or equipment. It detects the temperature and compares it with a set value to control the heating or cooling device to maintain the target temperature. Existing temperature controllers all implement one-to-one signal control, which is then transferred to a PLC for processing, resulting in cumbersome wiring. Summary of the Invention
[0003] To address the aforementioned shortcomings, this utility model provides a multi-channel temperature controller.
[0004] To achieve the above objectives, this utility model employs a multi-channel temperature controller, including a temperature sensor, an MCU, and a solid-state relay. The output terminal of the temperature sensor is connected to the input terminal of the MCU, and the output terminal of the MCU is connected to the solid-state relay. There are at least three temperature sensors, which are connected to the MCU in sequence through an analog switch, an operational amplifier, and an analog-to-digital converter chip. The number of solid-state relays is the same as the number of temperature sensors.
[0005] Specifically, there are 12 temperature sensors, 2 analog switches, 2 operational amplifiers, and 2 analog-to-digital converter chips, with 6 temperature sensors connected to 1 analog switch.
[0006] Specifically, the multi-channel temperature controller also includes a communication chip, a human-machine interface, and a driver chip. The communication chip is connected to the MCU, the human-machine interface is connected to the communication chip, the driver chip is connected to the output of the MCU, and the driver chip is connected to a dot matrix, a digital tube, and a tactile switch.
[0007] Specifically, the multi-channel temperature controller also includes a power supply, which powers the MCU, communication chip, human-machine interface, driver chip, analog switch, operational amplifier, and analog-to-digital converter chip.
[0008] Specifically, a high-speed optocoupler is provided between the analog-to-digital converter chip and the MCU.
[0009] Specifically, the multi-channel temperature controller also includes an inverter, which is connected to the output of the MCU and the output of the inverter is connected to an analog switch.
[0010] Specifically, a power failure detection circuit is provided between the operating power supply and the MCU.
[0011] The beneficial effect of this utility model is that by setting up the same number of temperature sensors and controlling the same number of solid-state relays through an MCU, multiple temperature monitoring channels can be monitored and controlled separately, thus meeting existing temperature control requirements. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of a specific embodiment of the present utility model. Detailed Implementation
[0013] like Figure 1 As shown, a specific embodiment of this utility model is a multi-channel temperature controller, including temperature sensors, an MCU, solid-state relays, a power supply, a communication chip, a human-machine interface, and a driver chip. The output terminal of the temperature sensor is connected to the input terminal of the MCU, and the output terminal of the MCU is connected to the solid-state relay. There are 12 temperature sensors, and there are 2 analog switches, 2 operational amplifiers, and 2 analog-to-digital converter chips for each temperature sensor. Every 6 temperature sensors are connected to 1 analog switch. The analog switch is connected to the MCU in sequence through an operational amplifier, an analog-to-digital converter chip, and a high-speed optocoupler. The number of solid-state relays is the same as the number of temperature sensors, which is also 12. An optocoupler is provided between the solid-state relays and the MCU.
[0014] The communication chip is connected to the MCU, the human-machine interface is connected to the communication chip, the driver chip is connected to the output of the MCU, and the driver chip is connected to the dot matrix, digital tube and tactile switch. The communication chip is a 458 communication chip with isolation.
[0015] The operating power supply provides power to the MCU, communication chip, human-machine interface, driver chip, analog switch, operational amplifier, and analog-to-digital converter chip. A power failure detection circuit is set between the operating power supply and the MCU.
[0016] The multi-channel temperature controller also includes an inverter, which is connected to the output of the MCU and the output of the inverter is connected to an analog switch.
[0017] In this specific embodiment of the present invention, the MCU chip is HC32F072JATA, and the analog switch is CD4051.
[0018] The preferred embodiments of the present invention described above are examples of the present invention. Other obvious variations or combinations are also within the scope of protection of the claims.
Claims
1. A multi-channel temperature controller, comprising a temperature sensor, an MCU, and a solid-state relay, wherein the output terminal of the temperature sensor is connected to the input terminal of the MCU, and the output terminal of the MCU is connected to the solid-state relay, characterized in that: There are at least three temperature sensors, which are connected to the MCU in sequence through an analog switch, an operational amplifier, and an analog-to-digital converter chip. The number of solid-state relays is the same as the number of temperature sensors.
2. The multi-channel temperature controller according to claim 1, characterized in that: The system comprises 12 temperature sensors, 2 analog switches, 2 operational amplifiers, and 2 analog-to-digital converter chips, with 6 temperature sensors connected to 1 analog switch.
3. The multi-channel temperature controller according to claim 1 or 2, characterized in that: The multi-channel temperature controller also includes a communication chip, a human-machine interface, and a driver chip. The communication chip is connected to the MCU, the human-machine interface is connected to the communication chip, the driver chip is connected to the output of the MCU, and the driver chip is connected to a dot matrix, a digital tube, and a tactile switch.
4. The multi-channel temperature controller according to claim 3, characterized in that: The multi-channel temperature controller also includes a power supply, which provides power to the MCU, communication chip, human-machine interface, driver chip, analog switch, operational amplifier, and analog-to-digital converter chip.
5. The multi-channel temperature controller according to claim 4, characterized in that: A high-speed optocoupler is provided between the analog-to-digital converter chip and the MCU.
6. The multi-channel temperature controller according to claim 4, characterized in that: The multi-channel temperature controller also includes an inverter, which is connected to the output of the MCU and the output of the inverter is connected to an analog switch.
7. The multi-channel temperature controller according to claim 4, characterized in that: A power failure detection circuit is provided between the power supply and the MCU.