Semiconductor LED lighting module

Abstract

The utility model discloses a semiconductor LED lighting module, and relates to the technical field of lighting equipment. Comprising a base plate, LED lamp beads are evenly arranged on the lower surface of the base plate, a protection mechanism is arranged on the lower surface of the base plate and located on the outer sides of the LED lamp beads, the protection mechanism comprises a circular ring and a transparent cover, a rectangular frame is fixedly installed on the upper surface of the base plate, a cover plate is installed on the upper surface of the rectangular frame through a limiting mechanism, and the limiting mechanism comprises an installation groove, a tension spring, a pull plate, an insertion block and an insertion groove. A sealing mechanism is arranged between the upper surface of the cover plate and the inner wall of the rectangular frame, a heat dissipation mechanism is arranged on the cover plate, and the heat dissipation mechanism comprises a heat dissipation copper pipe and a rectangular groove. The heat dissipation performance of the lighting module is greatly improved through the heat dissipation mechanism, the service life of the lighting module is prolonged, the heat dissipation mechanism can be disassembled and assembled, production is faster, the lighting module can be disassembled and overhauled conveniently in the later period, and use is more convenient.

Description

TECHNICAL FIELD

[0001] The utility model relates to lighting equipment technical field, concretely is a kind of semiconductor LED lighting module. BACKGROUND

[0002] With the continuous progress of science and technology, at present, in the centralized lighting of large field, such as road lighting or tunnel lighting, lighting module is generally used, and the lighting module is arranged according to certain rules, which is beneficial to maintenance, and can be mass-produced to save cost.

[0003] In the prior art, the conventional semiconductor LED lighting module generates a large amount of heat during use, which is difficult to quickly discharge, so that the semiconductor LED lighting module operates at high temperature, greatly reducing the service life. UTILITY MODEL CONTENT

[0004] The utility model provides a kind of semiconductor LED lighting module to solve the problems in the background art.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of semiconductor LED lighting module, including substrate, the lower surface of the substrate is uniformly provided with LED lamp pearl, the lower surface of the substrate is located LED lamp pearl outer side and is provided with protection mechanism, the upper surface of the substrate is fixedly installed with rectangular frame, the upper surface of the rectangular frame is installed with cover plate by limiting mechanism, the upper surface of the cover plate and the inner wall between rectangular frame are provided with sealing mechanism, and the cover plate is provided with heat dissipation mechanism.

[0006] Further, the protection mechanism includes a circular ring and a transparent cover, the circular ring is fixedly installed on the lower surface of the substrate, and the transparent cover is threadedly installed on the outer surface of the circular ring.

[0007] Further, the upper and lower sides of the rectangular frame are open structures, and the upper surface of the rectangular frame is attached to the lower surface of the cover plate.

[0008] Further, the limiting mechanism includes a mounting slot, a tension spring, a pull plate, an insertion block and an insertion slot, the left and right sides of the cover plate are provided with mounting slots at four corners, the tension spring is fixedly installed in the mounting slot, the pull plate is fixedly installed on the end of the tension spring away from the cover plate, the insertion block is fixedly installed on the side of the pull plate facing the rectangular frame, the insertion slot is provided on the rectangular frame corresponding to the insertion block, and the insertion block is inserted into the insertion slot.

[0009] Further, the upper surface of the insertion block facing the rectangular frame is a beveled surface structure.

[0010] Further, the sealing mechanism comprises a first sealing ring and a second sealing ring, the first sealing ring is fixedly installed on the inner wall of the rectangular frame, and the upper surface of the first sealing ring is attached to the lower surface of the cover plate, the second sealing ring is fixedly installed on the lower surface of the cover plate, and the outer surface of the second sealing ring is attached to the inner wall of the first sealing ring, and the lower surface of the second sealing ring is attached to the upper surface of the base plate.

[0011] Further, the heat dissipation mechanism comprises a heat dissipation copper pipe and a rectangular groove, the heat dissipation copper pipe is embedded in the cover plate, the front and rear sides of the heat dissipation copper pipe are in open structure, and the front and rear sides of the heat dissipation copper pipe are vertically flush with the front and rear sides of the cover plate, and the rectangular groove is arranged on the cover plate corresponding to the heat dissipation copper pipe in the second sealing ring.

[0012] Compared with the prior art, the semiconductor LED lighting module has the following beneficial effects:

[0013] 1、The semiconductor LED lighting module has the following beneficial effects:

[0014] 2、The semiconductor LED lighting module has the following beneficial effects: BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 It is a structural schematic view of the utility model;

[0016] Fig. 2 It is a sectional view of the utility model;

[0017] Fig. 3 It is a bottom view of the cover plate of the utility model.

[0018] In the drawing: 1, base plate; 2, LED lamp bead; 3, protection mechanism; 301, circular ring; 302, transparent cover; 4, rectangular frame; 5, limiting mechanism; 501, mounting groove; 502, tension spring; 503, pull plate; 504, plug-in block; 505, plug-in groove; 6, cover plate; 7, sealing mechanism; 701, first sealing ring; 702, second sealing ring; 8, heat dissipation mechanism; 801, heat dissipation copper pipe; 802, rectangular groove. DETAILED DESCRIPTION

[0019] Clearly and completely, the technical schemes in the embodiments of the utility model will be described in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without making creative labor belong to the protection scope of the utility model.

[0020] Please refer to Figs. 1-3 The utility model discloses a semiconductor LED lighting module, including substrate 1, the lower surface of substrate 1 is evenly provided with LED lamp pearl 2, the lower surface of substrate 1 is located LED lamp pearl 2 outside and is provided with protection mechanism 3, the upper surface of substrate 1 is fixedly installed with rectangular frame 4, the upper surface of rectangular frame 4 is installed with cover plate 6 through limiting mechanism 5, the upper surface of cover plate 6 and rectangular frame 4 inner wall between are provided with sealing mechanism 7, and the upper surface of cover plate 6 is provided with heat dissipation mechanism 8.

[0021] Specifically, the protection mechanism 3 includes a circular ring 301 and a transparent cover 302, the circular ring 301 is fixedly installed on the lower surface of the substrate 1, and the transparent cover 302 is threadedly installed on the outer surface of the circular ring 301.

[0022] In the embodiment, the circular ring 301 is used for installing the transparent cover 302, and the transparent cover 302 protects the LED lamp pearl 2.

[0023] Specifically, the upper and lower sides of the rectangular frame 4 are open structures, and the upper surface of the rectangular frame 4 is attached to the lower surface of the cover plate 6.

[0024] In the embodiment, the rectangular frame 4 does not hinder the heat dissipation of the substrate 1 and the LED lamp pearl 2, and the four cover plates 6 are tightly installed.

[0025] Specifically, the limiting mechanism 5 includes a mounting groove 501, a tension spring 502, a pull plate 503, an insertion block 504 and an insertion groove 505, the left and right sides of the cover plate 6 are provided with the mounting groove 501 at the corners, the tension spring 502 is fixedly installed in the mounting groove 501, the pull plate 503 is fixedly installed on the end of the tension spring 502 away from the cover plate 6, the insertion block 504 is fixedly installed on the side of the pull plate 503 facing the rectangular frame 4, the insertion groove 505 is formed in the rectangular frame 4 corresponding to the insertion block 504, and the insertion block 504 is inserted into the insertion groove 505.

[0026] In the embodiment, the tension spring 502 pulls the pull plate 503 to move towards the cover plate 6, so that the plug block 504 is inserted into the insertion slot 505, thereby achieving the effect of connecting and fixing the cover plate 6 and the rectangular frame 4. Conversely, pulling the pull plate 503 to move away from the cover plate 6, so that the plug block 504 is separated from the insertion slot 505, thereby achieving the effect of separating the cover plate 6 and the rectangular frame 4, facilitating the disassembly and assembly of the cover plate 6.

[0027] Specifically, the upper surface of the plug block 504 towards the rectangular frame 4 is a beveled surface structure.

[0028] In the embodiment, the plug block 504 can be better inserted into the insertion slot 505.

[0029] Specifically, the sealing mechanism 7 includes a first sealing ring 701 and a second sealing ring 702. The first sealing ring 701 is fixedly installed on the inner wall of the rectangular frame 4, and the upper surface of the first sealing ring 701 is in contact with the lower surface of the cover plate 6. The second sealing ring 702 is fixedly installed on the lower surface of the cover plate 6, and the outer surface of the second sealing ring 702 is in contact with the inner wall of the first sealing ring 701. The lower surface of the second sealing ring 702 is in contact with the upper surface of the substrate 1.

[0030] In the embodiment, the first sealing ring 701 and the second sealing ring 702 are in contact with each other, and the upper surface of the first sealing ring 701 is in contact with the lower surface of the cover plate 6, and the lower surface of the second sealing ring 702 is in contact with the upper surface of the substrate 1, so that the sealing effect of the cover plate 6 on the upper side of the substrate 1 is better.

[0031] Specifically, the heat dissipation mechanism 8 includes a heat dissipation copper pipe 801 and a rectangular groove 802. The heat dissipation copper pipe 801 is embedded in the cover plate 6. The front and rear sides of the heat dissipation copper pipe 801 are open structures, and the front and rear sides of the heat dissipation copper pipe 801 are vertically flush with the front and rear sides of the cover plate 6. The rectangular groove 802 is provided on the cover plate 6 corresponding to the heat dissipation copper pipe 801 inside the second sealing ring 702.

[0032] In the embodiment, the heat generated by the substrate 1 and the LED lamp bead 2 is transmitted to the heat dissipation copper pipe 801 through the rectangular groove 802, and the heat dissipation copper pipe 801 dissipates heat through the front and rear openings, greatly improving the heat dissipation performance of the substrate 1 and the LED lamp bead 2.

[0033] In use, by the limiting mechanism 5 in the pull plate 503 is pulled away from the cover plate 6 direction, at this time, the cover plate 6 is placed on the rectangular frame 4 upper surface, loose hand, pull spring 502 pull plate 503 move towards the cover plate 6 direction, make the plug-in block 504 plug-in slot 505, achieve the effect of fixed connection between the cover plate 6 and the rectangular frame 4, otherwise, can be disassembled cover plate 6, cover plate 6 installation is completed, sealing mechanism 7 in the first sealing ring 701 and the second sealing ring 702 between each other, and the first sealing ring 701 upper surface and the cover plate 6 lower surface, the second sealing ring 702 lower surface and the base plate 1 upper surface, so that the cover plate 6 on the base plate 1 upside sealing effect is better, dust and moisture is not easy to enter, through the heat dissipation mechanism 8 in the rectangular groove 802 makes the base plate 1 and LED lamp beads 2 heat generated to the heat dissipation copper pipe 801, heat dissipation copper pipe 801 through the first two field opening heat dissipation, greatly improve the base plate 1 and LED lamp beads 2 heat dissipation performance, and external dust and moisture is not easy to enter, greatly improve the heat dissipation performance of the lighting module, prolong its service life, and the later stage is convenient for the lighting module disassembly repair, use more convenient.

[0034] In summary, the semiconductor LED lighting module, through the heat dissipation mechanism 8 greatly improves the heat dissipation performance of the lighting module, prolong its service life, and can be disassembled heat dissipation mechanism 8, production is more quickly, and the later stage is convenient for the lighting module disassembly repair, use more convenient.

[0035] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor LED lighting module comprising a substrate (1), characterized in that: The lower surface of the substrate (1) is uniformly provided with LED lamp beads (2), the lower surface of the substrate (1) is provided with a protection mechanism (3) outside the LED lamp beads (2), the upper surface of the substrate (1) is fixedly installed with a rectangular frame (4), the upper surface of the rectangular frame (4) is installed with a cover plate (6) through a limiting mechanism (5), the upper surface of the cover plate (6) and the inner wall of the rectangular frame (4) are provided with a sealing mechanism (7), and the cover plate (6) is provided with a heat dissipation mechanism (8).

2. The semiconductor LED lighting module of claim 1, wherein: The protection mechanism (3) comprises a circular ring (301) and a transparent cover (302), the circular ring (301) is fixedly installed on the lower surface of the substrate (1), and the transparent cover (302) is threadedly installed on the outer surface of the circular ring (301).

3. The semiconductor LED lighting module of claim 1, wherein: The upper and lower sides of the rectangular frame (4) are of an open structure, and the upper surface of the rectangular frame (4) is attached to the lower surface of the cover plate (6).

4. The semiconductor LED lighting module of claim 1, wherein: The limiting mechanism (5) comprises a mounting groove (501), a tension spring (502), a pull plate (503), an insertion block (504) and an insertion groove (505), the left and right sides of the cover plate (6) are provided with the mounting groove (501) at four corners, the tension spring (502) is fixedly installed in the mounting groove (501), the end of the tension spring (502) away from the cover plate (6) is fixedly installed with the pull plate (503), the pull plate (503) is fixedly installed with the insertion block (504) on the side surface of the rectangular frame (4), the insertion block (504) is provided with the insertion groove (505) on the corresponding rectangular frame (4), and the insertion block (504) is inserted into the insertion groove (505).

5. The semiconductor LED lighting module of claim 4, wherein: The upper surface of the insertion block (504) facing the rectangular frame (4) is of an inclined surface structure.

6. The semiconductor LED lighting module of claim 1, wherein: The sealing mechanism (7) comprises a first sealing ring (701) and a second sealing ring (702), the first sealing ring (701) is fixedly installed on the inner wall of the rectangular frame (4), the upper surface of the first sealing ring (701) is attached to the lower surface of the cover plate (6), the second sealing ring (702) is fixedly installed on the lower surface of the cover plate (6), and the outer surface of the second sealing ring (702) is attached to the inner wall of the first sealing ring (701). The lower surface of the second sealing ring (702) is attached to the upper surface of the substrate (1).

7. The semiconductor LED lighting module of claim 1, wherein: The heat dissipation mechanism (8) comprises a heat dissipation copper pipe (801) and a rectangular groove (802), the heat dissipation copper pipe (801) is embedded in the cover plate (6), the front and rear sides of the heat dissipation copper pipe (801) are of an open structure, and the front and rear sides of the heat dissipation copper pipe (801) are vertically flush with the front and rear sides of the cover plate (6), and the rectangular groove (802) is formed in the cover plate (6) at the position of the heat dissipation copper pipe (801) in the second sealing ring (702).

Images