MEMS shock-resistant assembly structure

Abstract

The utility model discloses an MEMS shock-resistant assembly structure, which comprises a bottom box, a mounting plate, an upper cover and four cushions, the bottom box comprises a bottom plate and four side plates arranged on the bottom box, each cushion comprises a lower layer cushion, an upper layer cushion corresponding to the lower layer cushion, a first side cushion and a second side cushion, and the first side cushion and the second side cushion are connected with the upper layer cushion and the lower layer cushion. The upper-layer pad, the lower-layer pad, the first side pad and the second side pad form a corner wrapping groove for wrapping corners of the mounting plate, the upper cover comprises a cover plate and four supporting columns arranged at the lower ends of the four corners of the cover plate respectively, the supporting columns are used for pressing the upper-layer pad, and after the buffering pad and the mounting plate are assembled, the outer side of the buffering pad abuts against the inner side of the side plate. The pin gauge detection device has the advantages that the pin gauge can be effectively prevented from being damaged during detection, the two ends of the pin gauge are clamped through the upper clamping block and the lower clamping block after unqualified products are detected, vibration of the pin gauge is reduced, and it is guaranteed that the pin gauge can be aligned and reset in time.

Description

Technical Field

[0001] This utility model relates to the field of MEMS testing, specifically a MEMS anti-vibration assembly structure. Background Technology

[0002] Since MEMS chips need to minimize the impact of external vibrations on the chip, traditional rigid connection assembly methods cannot effectively reduce the impact of external vibrations on MEMS chips. The traditional structure uses fasteners or bolts to fix the PCB board with the MEMS chip. This method is a rigid fixation, which will transmit vibration to the MEMS chip during the test, thus affecting the measured working performance parameters of the MEMS.

[0003] Therefore, it is necessary to provide a MEMS anti-vibration assembly structure. Summary of the Invention

[0004] This invention provides a MEMS anti-vibration assembly structure that effectively solves the problem of excessive vibration in existing assembly structures.

[0005] The technical solution adopted in this utility model is:

[0006] A MEMS shockproof assembly structure includes a base box, a mounting plate, a top cover, and four cushioning pads. The base box includes a base plate and four side plates disposed on the base box. The cushioning pads include a lower pad, an upper pad corresponding to the lower pad, and a first side pad and a second side pad connecting the upper pad and the lower pad. The upper pad, lower pad, first side pad, and second side pad form corner grooves that cover the corners of the mounting plate. The top cover includes a cover plate and four pillars disposed at the lower ends of the four corners of the cover plate. The pillars are used to press down on the upper pads. After the cushioning pads are assembled with the mounting plate, the outer side of the cushioning pads abuts against the inner side of the side plates.

[0007] Furthermore, the base plate includes a bottom body and four protrusions respectively disposed on the upper surfaces of the four corners of the bottom body, and the four protrusions respectively correspond to the end surfaces of the four lower pads.

[0008] Furthermore, the cover plate includes a first plate and a second plate disposed on the lower end face of the first plate. The geometric center of the first plate coincides with the geometric center of the second plate. The end face area of ​​the second plate is smaller than the end face area of ​​the first plate. The first plate and the second plate form a first annular step. The side plate is provided with a second step, which includes a first plane and a second plane lower than the first plane. When the lower end of the first plate abuts against the first plane, the lower end face of the second plate abuts against the second plane.

[0009] Furthermore, a screw hole of number one is vertically provided on the side plate, and a countersunk hole of number one corresponding to the screw hole of number one is provided on the cover plate.

[0010] Furthermore, one of the side panels is provided with a wire hole.

[0011] Furthermore, the base plate is provided with several countersunk holes of the second type, which are located on the outer side of the four side plates.

[0012] The beneficial effects of the utility model are: it can effectively prevent the needle gauge from being damaged during inspection, and after detecting unqualified products, the upper and lower clamping blocks clamp both ends of the needle gauge, reducing the vibration of the needle gauge and ensuring that the needle gauge can be aligned and reset in time. Attached Figure Description

[0013] Figure 1 An exploded view of the MEMS anti-vibration assembly structure provided for an embodiment of this application.

[0014] Figure 2 This is an overall schematic diagram of the MEMS anti-vibration assembly structure provided for an embodiment of this application.

[0015] Figure 3 This is a schematic diagram of the buffer pad of the MEMS anti-vibration assembly structure provided in the embodiments of this application.

[0016] The markings in the diagram are as follows: 1. Base box; 2. Mounting plate; 3. Top cover; 4. Buffer pad; 41. Upper pad; 42. Lower pad; 43. Side pad No. 1; 44. Side pad No. 2; 31. Cover plate; 32. Support column; 11. Base plate; 12. Side plate; 111. Bottom body; 112. Protrusion; 311. Plate No. 1; 312. Plate No. 2; 301. Annular step No. 1; 121. Plane No. 1; 122. Plane No. 2; 123. Screw hole No. 1; 302. Countersunk hole No. 1; 124. Wire hole; 110. Countersunk hole No. 2. Detailed Implementation

[0017] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0018] like Figure 1 and Figure 3As shown, a MEMS shockproof assembly structure includes a base box 1, a mounting plate 2, a top cover 3, and four cushioning pads 4. The base box 1 includes a base plate 11 and four side plates 12 disposed on the base box 1. The cushioning pads 4 include a lower pad 42, an upper pad 41 corresponding to the lower pad 42, and a first side pad 43 and a second side pad 44 connecting the upper pad 41 and the lower pad 42. The upper pad 41, lower pad 42, first side pad 43, and second side pad 44 form corner grooves that cover the corners of the mounting plate 2. The top cover 3 includes a cover plate 31 and four support pillars 32 respectively disposed at the lower ends of the four corners of the cover plate 31. The support pillars 32 are used to press down on the upper pads 41. After the cushioning pads 4 are assembled with the mounting plate 2, the outer side of the cushioning pads 4 abuts against the inner side of the side plates 12.

[0019] In actual use, the product to be tested is fixed on the mounting plate 2, and then four cushioning pads 4 are respectively placed on the four corners of the mounting plate 2, so that the upper end face of the four corners of the mounting plate 2 abuts against the upper pad 41, the lower end face of the four corners of the mounting plate 2 abuts against the lower pad 42, and the two sides of the four corners of the mounting plate 2 abut against the first side pad 43 and the second side pad 44 respectively. Then the mounting plate 2 and the four cushioning pads 4 are placed in the bottom box 1, and then the top cover 3 and the bottom box 1 are assembled, so that the four pillars 32 of the assembled top cover 3 press against the upper pad 41 of the four cushioning pads 4 respectively.

[0020] In the above design, the mounting plate 2 is wrapped with four buffer pads 4 and then pressed and fixed with four pillars 32. This ensures that the MEMS under test can maintain stable and reliable working output during the test, and provides a test environment for MEMS that can resist high-intensity vibration and shock.

[0021] Specifically: such as Figure 1 and Figure 2 As shown, the base plate 11 includes a bottom body 111 and four protrusions 112 respectively disposed on the upper surface of the four corners of the bottom body 111. The four protrusions 112 correspond to the end surfaces of the four lower pads 42 respectively.

[0022] In the above design, the lower pads 42 of the four buffer pads 4 are supported by the protrusions 112, and an empty layer is formed between the four protrusions 112, which can reduce vibration transmission.

[0023] Specifically: such as Figure 1 As shown, the cover plate 31 includes a first plate 311 and a second plate 312 disposed on the lower end face of the first plate 311. The geometric center of the first plate 311 coincides with the geometric center of the second plate 312. The end face area of ​​the second plate 312 is smaller than the end face area of ​​the first plate 311. The first plate 311 and the second plate 312 form a first annular step 301. Figure 1As shown, a second step is provided on the side plate 12. The second step includes a first plane 121 and a second plane 122 that is lower than the first plane 121. When the lower end of the first plate 311 abuts against the first plane 121, the lower end of the second plate 312 abuts against the second plane 122.

[0024] In actual use, when it is necessary to assemble the cover plate 31 with the bottom box 1, the second plate 312 is placed on the second plane 122, and the first plate 311 is placed on the first plane 121.

[0025] In the above design, the cover plate 31 can be quickly positioned by the cooperation of the second step and the first annular step 301.

[0026] Specifically: such as Figure 1 and Figure 2 As shown, a screw hole 123 is vertically provided on the side plate 12, and a countersunk hole 302 corresponding to the screw hole 123 is provided on the cover plate 31.

[0027] In actual use, when it is necessary to fix the cover plate 31 to the bottom box 1, the external bolts are threaded through the first countersunk hole 302 and the first screw hole 123.

[0028] In the above design, the structural design and specific implementation of the side plate 12 and the cover plate 31 can effectively fix the bottom box 1 and the top cover 3.

[0029] Specifically: such as Figure 2 As shown, one of the side plates 12 is provided with a wire hole 124.

[0030] In actual use, the leads of the product to be tested on the mounting board 2 are led out through the wire hole 124.

[0031] In the above design, the wire hole 124 facilitates the lead wires of the product under test to be brought out.

[0032] Specifically: such as Figure 1 As shown, the base plate 11 is provided with a plurality of second countersunk holes 110, which are located on the outer side of the four side plates 12.

[0033] In actual use, the MEMS anti-vibration assembly structure of this application is fixed to the test device by external bolts passing through the second countersunk hole 110.

[0034] In further detail, it should be understood that the above description is only a specific embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A MEMS shock resistant assembly structure, characterized by: The application relates to a bottom box (1), a mounting plate (2), an upper cover (3) and four buffer pads (4), wherein the bottom box (1) comprises a bottom plate (11) and four side plates (12) arranged on the bottom box (1), the buffer pad (4) comprises a lower pad (42), an upper pad (41) corresponding to the lower pad (42), a first side edge pad (43) and a second side edge pad (44) connecting the upper pad (41) and the lower pad (42), the upper pad (41), the lower pad (42), the first side edge pad (43) and the second side edge pad (44) form a corner-enclosing groove for the mounting plate (2), the upper cover (3) comprises a cover plate (31) and four support columns (32) arranged at the lower ends of four corners of the cover plate (31), the support columns (32) are used for pressing the upper pad (41), and the outer side of the buffer pad (4) is in abutment with the inner side of the side plate (12) after the buffer pad (4) is assembled with the mounting plate (2).

2. The MEMS shock-resistant assembly structure of claim 1, wherein: The bottom plate (11) comprises a bottom body (111) and four protrusions (112) arranged at the upper end faces of four corners of the bottom body (111), and the four protrusions (112) correspond to the end faces of the four lower pads (42) respectively.

3. The MEMS shock resistant assembly structure of claim 1, wherein: The cover plate (31) comprises a first plate (311) and a second plate (312) arranged at the lower end face of the first plate (311), the geometric center of the first plate (311) coincides with the geometric center of the second plate (312), the end face area of the second plate (312) is smaller than the end face area of the first plate (311), the first plate (311) and the second plate (312) form a first annular step (301), a second step is arranged on the side plate (12), the second step comprises a first plane (121) and a second plane (122) lower than the first plane (121), and the lower end face of the second plate (312) is in abutment with the second plane (122) when the lower end of the first plate (311) is in abutment with the first plane (121).

4. The MEMS shock resistant assembly structure of claim 1, wherein: A first screw hole (123) is vertically arranged on the side plate (12), and a countersunk hole (302) corresponding to the first screw hole (123) is arranged on the cover plate (31).

5. The MEMS shock resistant assembly structure of claim 1, wherein: One of the side plates (12) is provided with a wire hole (124).

6. The MEMS shock resistant assembly structure of claim 1, wherein: A plurality of second countersunk holes (110) are arranged on the bottom plate (11), and the second countersunk holes (110) are located outside the four side plates (12).

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