Mixed color light LED module
By using a frame design and phosphor layer coverage in the color mixing LED module to replace the red LED chip, the mixing of red, green, blue and white light is achieved, solving the problem of excessive red LED chip quantity and realizing small size optimization and cost reduction.
Patent Information
- Application Number
- CN202520045158.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-08
AI Technical Summary
Current mixed-color LED modules have a large number of red LED chips, which makes it difficult to optimize the design for small size and increases the overall cost.
The design employs a frame structure, dividing the blue LED chip group into multiple parallel configurations and covering the first accommodating space with a red phosphor layer to replace the red LED chip. Combined with the parallel configuration of green and blue LED chip groups, this achieves the mixing of red, green, blue, and white light.
Reducing the number of blue LED chips lowers assembly space requirements, facilitates smaller, optimized designs, and reduces overall costs.
Smart Images
Figure CN223745209U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of lighting equipment technology, and in particular relates to a color-mixing LED module. Background Technology
[0002] In recent years, RGBW (R for red, G for green, B for blue, and W for white) four-color mixed-color LED lights have become increasingly popular, hereinafter referred to as mixed-color LED modules. These modules integrate red, blue, green, and white LED chips into a single package, optimizing color mixing. Their small size makes them suitable for installation in lighting scenarios with limited space, thus contributing to their growing popularity.
[0003] However, current color-mixing LED modules directly assemble red, green, and blue LED chips separately. Since the operating voltage of red LED chips is lower than that of green and blue LED chips, a greater number of red LED chips are required to meet the design requirements of the preset rated voltage. This results in more assembly space for red LED chips, hindering the optimization of the color-mixing LED module's compact size. Furthermore, the increased number of red LED chips also leads to a higher overall cost for the color-mixing LED module. Utility Model Content
[0004] The purpose of this application is to provide a color-mixing LED module, which aims to solve the problem that the current color-mixing LED modules require a large number of red LED chips, which is not conducive to the small-volume optimization design of the color-mixing LED module.
[0005] To achieve the above objectives, the technical solution adopted in this application is: a color-mixing LED module, comprising:
[0006] The frame has three independent storage spaces: a first storage space, a second storage space, and a third storage space.
[0007] Multiple blue LED chips are configured as multiple blue LED chip groups, which are respectively mounted in a first receiving space, a second receiving space and a third receiving space. The blue LED chip group located in the first receiving space is covered with a first red phosphor layer, and the blue LED chip group located in the third receiving space is covered with a yellow phosphor layer.
[0008] A green LED chip group consisting of at least one green LED chip is mounted in the second receiving space;
[0009] All blue LED chip groups are connected in parallel with each other and with the green LED chip groups, and their switching can be controlled separately.
[0010] In some embodiments of this application, each blue LED chip group includes multiple blue LED chips, which are connected in series or in parallel. Similarly, each green LED chip group includes multiple green LED chips, which are connected in series or in parallel.
[0011] In some embodiments of this application, the first accommodating space, the second accommodating space, and the third accommodating space are arranged sequentially along the first direction. Moreover, relative to the midpoint of the frame perpendicular to the first direction, the blue LED chip group located in the second accommodating space is disposed on the side of the second accommodating space closer to the third accommodating space, and the green LED chip group is disposed on the side of the second accommodating space closer to the first accommodating space.
[0012] In some embodiments of this application, the first accommodating space, the second accommodating space, and the third accommodating space all extend along a second direction, wherein the second direction is perpendicular to the first direction.
[0013] In some embodiments of this application, the frame includes a main frame and two partitions. The main frame forms a square cavity, and the two partitions are connected to the main frame at intervals to divide the square cavity into a first accommodating space, a second accommodating space, and a third accommodating space.
[0014] In some embodiments of this application, two partitions extend along a second direction and are parallel to the cavity wall of the square cavity.
[0015] In some embodiments of this application, the number of green LED chips in the green LED chip group is equal to the number of blue LED chips in the blue LED chip group located in the second accommodating space.
[0016] In some embodiments of this application, each blue LED chip group includes three blue LED chips, and each green LED chip group includes three green LED chips.
[0017] In some embodiments of this application, the color-mixing LED module includes a green phosphor layer and a second red phosphor layer. The green phosphor layer and the second red phosphor layer are stacked sequentially along the light emission direction to cover the blue LED chip group located in the third accommodating space, in order to replace the yellow phosphor layer.
[0018] In some embodiments of this application, the frame is a 5054 standard lead frame.
[0019] This application has at least the following beneficial effects:
[0020] In the color-mixing LED module provided in the embodiments of this application, a blue LED chip is mounted in the first accommodating space and covered with a first red phosphor layer to emit red light. A green LED chip and a blue LED chip are mounted in the second accommodating space to emit a mixture of green and blue light. A blue LED chip is mounted in the third accommodating space and covered with a yellow phosphor layer to emit white light. Thus, the light emitted by the color-mixing LED module is a mixture of four colors: red, green, blue, and white. Because the color-mixing LED module uses a method of mounting a blue LED chip in the first accommodating space and covering it with a first red phosphor layer to emit red light, it uses blue LED chips with higher operating voltages instead of red LED chips. Given the design requirements for the rated voltage, fewer blue LED chips are required to emit red light. Therefore, the frame of the color-mixing LED module provided in the embodiments of this application requires less assembly space to achieve the emission of red light, which is beneficial for the small-volume optimization design of the color-mixing LED module. Furthermore, the fewer blue LED chips reduce the overall cost of the color-mixing LED module. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the assembly structure of a color-mixing LED module according to an embodiment of this application, wherein the transparent adhesive layer, the first red phosphor layer, the green phosphor layer and the second red phosphor layer are not encapsulated;
[0023] Figure 2 for Figure 1 The diagram shows a cross-sectional view of a blue LED chip package covered with a first red phosphor layer within the first accommodating space of a color-mixing LED module.
[0024] Figure 3 for Figure 1 The diagram shows a cross-sectional view of a blue LED chip covered with a yellow phosphor layer within the third accommodating space of a color-mixing LED module.
[0025] Figure 4 This is a cross-sectional schematic diagram showing the blue LED chips in the third accommodating space of another color-mixing LED module according to an embodiment of this application, which are sequentially encapsulated and covered with a green phosphor layer and a second red phosphor layer.
[0026] Figure 5This is a cross-sectional view of the blue LED chip or green LED chip encapsulated in the second accommodating space of the mixed-color LED module in this application embodiment, with transparent encapsulating adhesive covering the encapsulation.
[0027] The figures in the diagram are labeled as follows:
[0028] 10. Frame; 101. Main frame; 102. Partition; 103. Square cavity; 11. First accommodating space; 12. Second accommodating space; 13. Third accommodating space;
[0029] 20. Blue LED chip; 21. First red phosphor layer; 22. Green phosphor layer; 23. Second red phosphor layer; 24. Yellow phosphor layer; 200. Blue LED chipset;
[0030] 30. Green LED chip; 300. Green LED chipset;
[0031] 40. Transparent encapsulating adhesive. Detailed Implementation
[0032] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.
[0033] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0034] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0035] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0036] like Figure 1 As shown, the mixed-color LED module provided in the embodiments of this application includes a frame 10, a plurality of blue LED chips 20, and a green LED chip group 300. The frame 10 has mutually independent first receiving space 11, second receiving space 12, and third receiving space 13. The plurality of blue LED chips 20 are configured as a plurality of blue LED chip groups 200, and the plurality of blue LED chip groups 200 are respectively mounted in the first receiving space 11, the second receiving space 12, and the third receiving space 13. Furthermore, as... Figure 2 As shown, the blue LED chip group 200 located in the first accommodating space 11 is covered with a first red phosphor layer 21, such as Figure 3 As shown, the blue LED chip group 200 located in the third receiving space 13 is covered with a yellow phosphor layer 24. The green LED chip group 300, consisting of at least one green LED chip 30, is mounted in the second receiving space 12. All the blue LED chip groups 200 are connected in parallel with each other and with the green LED chip group 300, and their switching can be controlled separately.
[0037] In the color-mixing LED module provided in the embodiments of this application, a blue LED chip 20 is mounted in the first accommodating space 11 and covered with a first red phosphor layer 21 to emit red light. A green LED chip 30 and a blue LED chip 20 are mounted in the second accommodating space 12 to emit a mixture of green and blue light. A blue LED chip 20 is mounted in the third accommodating space 13 and covered with a yellow phosphor layer 24 to emit white light. Thus, the light emitted by the color-mixing LED module is a mixture of four colors: red, green, blue, and white. Since the color-mixing LED module uses the method of mounting a blue LED chip 20 in the first accommodating space 11 and covering it with a first red phosphor layer 21 to emit red light, that is, the color-mixing LED module uses a blue LED chip 20 with a higher operating voltage to replace the red LED chip. Under the design requirement of a fixed rated voltage, the number of blue LED chips 20 required to emit red light is less than the number of red LED chips required. Fewer blue LED chips 20 mean less assembly space is required. In other words, the frame of the color-mixing LED module provided in the embodiments of this application requires less assembly space to realize the emission of red light, which is conducive to the small-volume optimization design of the color-mixing LED module. Moreover, fewer blue LED chips 20 can reduce the overall cost of the color-mixing LED module.
[0038] Before the blue LED chip group 200 in the first accommodating space 11 is covered with the first red phosphor layer 21, each blue LED chip 20 in the first accommodating space 11 is first encapsulated with transparent encapsulating adhesive 40. The transparent encapsulating adhesive 40 fills the first accommodating space 11 and covers each blue LED chip 20, and then the first red phosphor layer 21 is covered. Before the blue LED chip group 200 in the third accommodating space 13 is covered with the yellow phosphor layer 24, each blue LED chip 20 in the third accommodating space 13 is first encapsulated with transparent encapsulating adhesive 40. The transparent encapsulating adhesive 40 fills the third accommodating space 13 and covers each blue LED chip 20, and then the yellow phosphor layer 24 is covered. The blue LED chip group 200 and green LED chip group 300 located in the second accommodating space 12 only need to be covered with transparent encapsulating adhesive 40.
[0039] In some embodiments of this application, each blue LED chip group 200 may consist of only one blue LED chip 20, and the green LED chip group 300 may consist of only one green LED chip 30.
[0040] In some embodiments of the mixed-color LED module provided in this application, such as Figure 1As shown, each blue LED chip group 200 includes multiple blue LED chips 20, and the multiple blue LED chips 20 of each blue LED chip group 200 are arranged in series. Similarly, the green LED chip group 300 includes multiple green LED chips 30 arranged in series. That is, the blue LED chips 20 of all blue LED chip groups 200 are arranged in series within the same group, and the multiple green LED chips 30 of the green LED chip group 300 are arranged in series within the same group. Furthermore, all blue LED chip groups 200 are connected in parallel with each other, and with the green LED chip group 300.
[0041] In some other embodiments of the mixed-color LED module provided in this application, the multiple blue LED chips 20 in each blue LED chip group 200 may also be connected in parallel, and the multiple green LED chips 30 in the green LED chip group 300 may also be connected in parallel.
[0042] In some other embodiments of the mixed-color LED module provided in this application, the plurality of blue LED chips 20 in each blue LED chip group 200 are connected in series, while the plurality of green LED chips 30 in the green LED chip group 300 are connected in parallel; or, the plurality of blue LED chips 20 in each blue LED chip group 200 are connected in parallel, while the plurality of green LED chips 30 in the green LED chip group 300 are connected in series.
[0043] And, as Figure 1As shown, the first accommodating space 11, the second accommodating space 12, and the third accommodating space 13 are arranged sequentially along the first direction X. Relative to the midpoint of the frame 10 perpendicular to the first direction X, the blue LED chip group 200 located in the second accommodating space 12 is disposed on the side of the second accommodating space 12 closer to the third accommodating space 13, and the green LED chip group 300 is disposed on the side of the second accommodating space 12 closer to the first accommodating space 11. In this embodiment, "closer" does not refer to absolute proximity, but rather relative proximity. "Absolutely close" means that, relative to the midpoint of the frame 10, all the blue LED chips 200 located in the second accommodating space 12 are close to the third accommodating space 13; "relatively close" means that, relative to the midpoint of the frame 10, most of the blue LED chips 200 located in the second accommodating space 12 tend to be close to the third accommodating space 13. Similarly, the side of the green LED chip group 300 that is absolutely close to the first receiving space 11 means that, relative to the midpoint of the frame 10, all the green LED chips 30 of the green LED chip group 300 are close to the first receiving space 11; the side of the green LED chip group 300 that is relatively close to the first receiving space 11 means that, relative to the midpoint of the frame 10, most of the green LED chips 30 of the green LED chip group 300 tend to be close to the first receiving space 11.
[0044] Preferably, in the mixed-color LED module provided in the embodiments of this application, the blue LED chip group 200 located in the second accommodating space 12 is on the side relatively closer to the third accommodating space 13, and the green LED chip group 300 is on the side relatively closer to the first accommodating space 11.
[0045] In the color-mixing LED module provided in the embodiments of this application, the first accommodating space 11, the second accommodating space 12, and the third accommodating space 13 all extend along the second direction Y. Wherein, as... Figure 1 As shown, the second direction Y is perpendicular to the first direction X.
[0046] like Figure 1 As shown, the frame 10 includes a main frame 101 and two partitions 102. The main frame 101 forms a square cavity 103. The two partitions 102 are spaced apart and connected to the main frame 101 to divide the square cavity 103 into three independent receiving spaces: a first receiving space 11, a second receiving space 12, and a third receiving space 13. Wherein, as... Figure 1 As shown, two partitions 102 extend along the second direction Y, and the partitions 102 are parallel to the cavity wall of the square cavity 103. In this embodiment, the frame 10 is a one-piece molded component, which has high manufacturing efficiency and good molding quality consistency.
[0047] In the color-mixing LED module provided in the embodiments of this application, such as Figure 1 As shown, the number of green LED chips 30 in the green LED chip group 300 is equal to the number of blue LED chips 20 in the blue LED chip group 200 located in the second accommodating space 12. Since the operating voltage, luminous efficiency, and other parameters of the green LED chips 30 are basically the same as those of the blue LED chips 20, and since the number of green LED chips 30 in the green LED chip group 300 is equal to the number of blue LED chips 20 in the blue LED chip group 200 located in the second accommodating space 12, the light intensity of the blue light emitted by the blue LED chip group 200 in the second accommodating space 12 is basically equal to the light intensity of the green light emitted by the green LED chips 30 in the second accommodating space 12. In other words, the mixed light of blue and green light emitted from the second accommodating space 12 is uniformly mixed and emitted, and there will be no situation where the emitted mixed light is color-distorted due to an imbalance between strong blue light (weak green light) or strong green light (weak blue light).
[0048] More specifically, such as Figure 1 As shown, each blue LED chip group 200 includes three blue LED chips 20, and each green LED chip group 300 includes three green LED chips 30. In the color-mixing LED module provided in the embodiments of this application, each blue LED chip group 200 includes three blue LED chips 20 with a rated operating voltage of 9V, and each green LED chip group 300 includes three green LED chips 30 with a rated operating voltage of 9V. Furthermore, all blue LED chip groups 200 are connected in parallel with each other and with the green LED chip group 300, thus forming a color-mixing LED module with an operating voltage of 27V. Both the actual operating voltage of the blue LED chips 20 and the actual operating voltage of the green LED chips 30 have fluctuation errors relative to the rated operating voltage. Therefore, this color-mixing LED module with an operating voltage of 27V can be well matched with a 36V driver when actually powered on.
[0049] Preferably, the color-mixing LED module in the embodiments of this application uses a 5054 standard lead frame 10, commonly known as a 5054 lead frame. The 5054 lead frame is a widely used and mature standardized electronic product, and therefore will not be described in detail here.
[0050] In another color-mixing LED module provided in the embodiments of this application, such as Figure 4As shown, the color-mixing LED module includes a green phosphor layer 22 and a second red phosphor layer 23. The green phosphor layer 22 and the second red phosphor layer 23 are sequentially stacked along the light emission direction to cover the blue LED chip group 200 located in the third accommodating space 13, replacing the yellow phosphor layer 24 to achieve white light emission. After the blue LED chip 20 is covered with the green and red phosphor layers, it can emit white light. This is because the blue light emitted by the blue LED chip 20 excites the green and red phosphor layers to emit green and red light, respectively. The three primary colors of light—red, green, and blue—mix together to produce white light. This process is based on the following principles: 1. Blue light excitation, that is, the blue light emitted by the blue LED chip 20 shines on the green phosphor layer and the red phosphor layer; 2. Phosphor layer emission, the green phosphor layer absorbs blue light and emits green light, and the red phosphor layer absorbs blue light and emits red light. In other words, blue light excites the green phosphor layer to emit green light and excites the red phosphor layer to emit red light; 3. Color mixing, that is, blue light, green light and red light are mixed together. Since the human eye is sensitive to these three colors of light, the human eye perceives the mixed light as white light.
[0051] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A mixed color light LED module, characterized by, The application relates to a mixed-color light LED module. The application comprises: a frame (10) having a first accommodating space (11), a second accommodating space (12) and a third accommodating space (13) which are independent of each other; a plurality of blue LED chips (20) arranged as a plurality of blue LED chip groups (200) which are respectively mounted in the first accommodating space (11), the second accommodating space (12) and the third accommodating space (13), and the blue LED chip group (200) in the first accommodating space (11) is covered with a first red fluorescent layer (21), and the blue LED chip group (200) in the third accommodating space (13) is covered with a yellow fluorescent layer (24); at least one green LED chip (30) constituting a green LED chip group (300) which is mounted in the second accommodating space (12); wherein all the blue LED chip groups (200) and the green LED chip group (300) are arranged in parallel and can be controlled to be switched on or off respectively.
2. The mixed-color light LED module according to claim 1, wherein each of the blue LED chip groups (200) comprises a plurality of the blue LED chips (20) which are arranged in series or in parallel, and the green LED chip group (300) comprises a plurality of the green LED chips (30) which are arranged in series or in parallel.
3. The mixed-color light LED module according to claim 2, wherein the first accommodating space (11), the second accommodating space (12) and the third accommodating space (13) are arranged in sequence along a first direction, and with respect to a middle plane of the frame (10) which is perpendicular to the first direction, the blue LED chip group (200) in the second accommodating space (12) is arranged on a side of the second accommodating space (12) close to the third accommodating space (13), and the green LED chip group (300) is arranged on a side of the second accommodating space (12) close to the first accommodating space (11).
4. The mixed-color light LED module according to claim 3, wherein the first accommodating space (11), the second accommodating space (12) and the third accommodating space (13) all extend along a second direction, wherein the second direction is perpendicular to the first direction.
5. The mixed-color light LED module according to claim 4, wherein the frame (10) comprises a main frame (101) and two partitions (102), the main frame (101) is formed with a square cavity (103), and the two partitions (102) are connected to the main frame (101) at intervals so as to divide the square cavity (103) into the first accommodating space (11), the second accommodating space (12) and the third accommodating space (13).
6. The mixed-color light LED module according to claim 5, wherein The two partitions (102) extend along the second direction, and the partitions (102) are parallel to the cavity walls of the square cavity (103).
7. The mixed-color LED module according to claim 2, wherein the number of the green LED chips (30) in the green LED chip group (300) is equal to the number of the blue LED chips (20) in the blue LED chip group (200) located in the second accommodating space (12).
8. The mixed-color LED module according to claim 2, wherein the number of the green LED chips (30) in the green LED chip group (300) is equal to the number of the blue LED chips (20) in the blue LED chip group (200) located in the second accommodating space (12).
8. The mixed-color LED module according to claim 2, wherein the number of the green LED chips (30) in the green LED chip group (300) is equal to the number of the blue LED chips (20) in the blue LED chip group (200) located in the second accommodating space (12).
9. The mixed-color LED module according to any one of claims 1-8, wherein each of the blue LED chip groups (200) comprises three blue LED chips (20), and the green LED chip group (300) comprises three green LED chips (30).
9. The mixed-color LED module according to any one of claims 1-8, wherein the mixed-color LED module comprises a green fluorescent layer (22) and a second red fluorescent layer (23), and the green fluorescent layer (22) and the second red fluorescent layer (23) are sequentially stacked and cover the blue LED chip group (200) located in the third accommodating space (13) in the light emitting direction to replace the yellow fluorescent layer (24).
10. The mixed-color LED module according to any one of claims 1-8, wherein the frame (10) is a lead frame of 5054 standard.