Semiconductor laser hair removal instrument
By designing a laser module consisting of a mini-bar laser, an aluminum nitride substrate for heat dissipation, and a TEC cooling element in the laser hair removal device, the heat dissipation and optical path reshaping problems of the laser beauty device are solved, achieving miniaturized, safe, and efficient laser hair removal effects and a comfortable user experience.
Patent Information
- Application Number
- CN202423067900.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-11
AI Technical Summary
In existing laser beauty devices, the heat dissipation and optical path shaping design of mini-bar lasers are difficult to meet the application requirements of laser hair removal, resulting in large device size and inconvenience of use.
The laser module, composed of mini-bar lasers, incorporates an aluminum nitride substrate, a copper substrate, and a cooling fan for heat dissipation. It also uses a sapphire large optical guide and TEC cooling components for beam shaping and temperature control, forming a 5×4 light output matrix to produce a uniform flat-top light source.
It achieves miniaturization, improved safety and efficiency of laser hair removal devices, reduces skin operation risks, provides a cooling user experience, and improves hair removal effect and convenience.
Smart Images
Figure CN223787689U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a kind of semiconductor laser hair removal instrument, using ultra-small semiconductor laser system realizes laser hair removal, belong to the field of laser medical cosmetology. BACKGROUND
[0002] Laser beauty instrument is a kind of concentrated heating function using laser beam, to carry out the equipment of cosmetology to skin.The laser in the common laser beauty instrument is used to emit laser, and the size of laser is larger, so that the size of system around optical path is also larger.And with the progress of laser technology, mini-bar laser appears, i.e.mini-bar bar-shaped laser diode, is a compact laser diode;With high power density, easy to integrate, good stability, small size and other advantages, can be applied in handheld household laser beauty instrument product.
[0003] But when applied to laser beauty instrument, especially hair removal instrument class product, it also needs to design its heat dissipation, and optical path shaping system. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a kind of semiconductor laser hair removal instrument, around the application of mini-bar laser, design for heat dissipation, beam shaping, to meet the application of laser hair removal, obtain the laser hair removal instrument product of good use experience.
[0005] To achieve the above utility model purpose, the utility model provides a kind of semiconductor laser hair removal instrument, including shell, laser assembly, light guide assembly, circuit board are installed in shell;
[0006] The end of shell is equipped with opening, so that the end of light guide assembly is stretched out, forms working end;
[0007] Key, display area are equipped on shell;
[0008] Laser assembly includes laser module formed by a plurality of mini-bar lasers in series, and light guide assembly is provided on the light emitting side of laser module;
[0009] Circuit board is provided in shell, and laser module is connected with circuit board by wire.
[0010] As the further improvement of the utility model, a plurality of light emitting points are provided in single mini-bar laser, and the light emitting points of single mini-bar laser are arranged along X axis direction.
[0011] A plurality of mini-bar lasers are arranged along Y axis direction, and X axis and Y axis are orthogonal.
[0012] Further, single mini-bar laser has 5 light emitting points.
[0013] The laser module has four mini-bar lasers;
[0014] The light emitting side of the laser module forms a 5x4 light emitting matrix.
[0015] Further, the mini-bar lasers are arranged at equal intervals with a spacing of 2mm.
[0016] As a further improvement of the utility model, the plurality of mini-bar lasers are simultaneously welded on the substrate, and the other side of the substrate is provided with a heat sink.
[0017] Further, the substrate is an aluminum nitride substrate; the aluminum nitride substrate is glued on the heat sink through heat-conducting silver glue.
[0018] The heat sink is a heat sink, a VC uniform heating plate heat sink, or a copper fin heat sink.
[0019] Further, a copper substrate is arranged between the substrate and the heat sink.
[0020] Further, a heat dissipation fan is arranged at the rear side of the heat sink.
[0021] The shell is provided with an air inlet and an air outlet; the air inlet and the air outlet are respectively located on the two sides of the heat dissipation fan.
[0022] As a further improvement of the utility model, the light guide assembly comprises a sapphire large light guide.
[0023] The sapphire large light guide is a long rectangular body.
[0024] Further, a light uniformizing glass is arranged between the sapphire large light guide and the laser module.
[0025] Further, a refrigeration element is arranged on the sapphire large light guide.
[0026] The refrigeration element is a TEC, and the refrigeration surface of the TEC is attached to the surface of the sapphire large light guide through heat-conducting silicon.
[0027] The heating surface of the TEC is provided with a TEC heat dissipation heat sink; the TEC is connected with a circuit board.
[0028] Further, the TEC is provided with a plurality of TECs.
[0029] The TEC is arranged close to the light emitting surface of the sapphire large light guide.
[0030] As a further improvement of the utility model, a window controller is arranged close to the light emitting surface of the sapphire large light guide.
[0031] The window controller is connected with the circuit board.
[0032] The semiconductor laser hair removal instrument is based on selective photo-thermal dynamics principle, and through reasonable adjustment of laser wavelength energy pulse width, laser can pass through the skin surface to reach the root hair follicle of the hair, light energy is absorbed by melanin and converted into heat energy to destroy the hair follicle tissue, so that the hair loses the regenerative ability to achieve the use effect of hair removal.
[0033] The semiconductor laser hair removal instrument is based on selective photo-thermal dynamics principle, and through reasonable adjustment of laser wavelength energy pulse width, laser can pass through the skin surface to reach the root hair follicle of the hair, light energy is absorbed by melanin and converted into heat energy to destroy the hair follicle tissue, so that the hair loses the regenerative ability to achieve the use effect of hair removal. 2 That is, the light emitting area is larger, and the area can be simultaneously removed in a large area, the moving frequency is reduced, and the operation is more convenient; meanwhile, after being shaped by the sapphire large light guide, the energy distribution is uniform and gentle, the energy penetration depth is deeper, the skin risk caused by light spot overlapping during operation can be reduced, the safety and effectiveness can be improved, and the hair can be removed more safely and efficiently.
[0034] The semiconductor laser hair removal instrument uses infrared invisible laser hair removal, and the wavelength is 808nm; the penetration force is sufficient, the light energy is selectively absorbed by the hair follicle, the utilization rate is high, other tissues are not affected unnecessarily, and the best effect and safety are achieved.
[0035] The semiconductor laser hair removal instrument integrates a flexible plate touch sensor in the window head cover, is used for detecting the skin, a single point light emitting button can emit light in a single point, and a long-pressed light emitting button can be adjusted to a continuous light emitting mode; the light emitting button does not need to be pressed once to emit light once, and the convenience of hair removal is greatly ensured.
[0036] The semiconductor laser hair removal instrument can control the output light spot to 10mm*20mm, the laser is formed by four mini-bar lasers in series to form a laser module, a light emitting matrix is formed, and a rectangular sapphire large light guide is further used to realize a flat top light source with uniform energy distribution, so that the laser can act on the skin hair follicle to a deeper depth, the effect is better, and the comfort is better.
[0037] The laser is welded on the aluminum nitride substrate, is glued on the copper substrate through heat-conducting silver glue, the copper substrate is glued (or the heat-conducting silicone grease is applied, and the copper substrate and the aluminum heat sink are fixed by screws) on the aluminum heat sink; of course, the aluminum nitride substrate can also be directly glued on the VC heat plate with fins with better heat dissipation efficiency through heat-conducting silver glue; in this way, the laser module is well cooled, and the working environment temperature and the output power of the laser module are ensured.
[0038] This novel semiconductor laser hair removal device uses a large sapphire light guide. While providing uniform light distribution, the sapphire itself creates a cooling sensation when in contact with the skin. In addition, two TEC / semiconductor cooling chips are added near the window of the light guide to reduce the temperature of the light guide and continuously provide a cooling sensation to the skin, eliminating the burning sensation and resulting in a better hair removal experience.
[0039] This utility model of semiconductor laser hair removal device has a simple structure, ingenious design, and good laser hair removal effect. Attached Figure Description
[0040] Figure 1 This is a structural outline of the semiconductor laser hair removal device of this utility model;
[0041] Figure 2 This is a schematic diagram of the overall internal structure of the semiconductor laser hair removal device of this utility model. Figure 1 ;
[0042] Figure 3 This is a schematic diagram of the overall internal structure of the semiconductor laser hair removal device of this utility model. Figure 2 ;
[0043] Figure 4 This is an overall structural diagram of the laser system of this utility model;
[0044] Figure 5 This is a schematic diagram of the light guide structure of the laser system of this utility model;
[0045] Figure 6 This is a top view of the light guide structure of the laser system of this utility model;
[0046] Figure 7 This is a schematic diagram of the overall structure of the laser assembly of this utility model;
[0047] Figure 8 This is a schematic diagram of the optical guide cooling structure of this utility model;
[0048] Figure 9 This is a schematic diagram of the window controller of this utility model;
[0049] Figure 10 This is a cross-sectional view of the internal structure of the laser system of this utility model. Detailed Implementation
[0050] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.
[0051] The overall structure of this semiconductor laser hair removal device is as follows: Figure 1 As shown, the internal structure is as follows Figure 2 , Figure 3The utility model discloses a semiconductor laser hair removal appearance, as shown in the figure, the semiconductor laser hair removal appearance of the utility model is long strip structure, is equipped with the casing 1, is installed with laser assembly 2, light guide assembly 3, circuit board 4, window controller 5 in casing 1, the end of casing 1 is equipped with the opening, makes the end of light guide assembly 3 stretch out, forms the working end, is used to contact with the skin, is equipped with the button 12 on casing 1 for control, adjusts the working condition of laser hair removal appearance, is equipped with display area 13 on casing 1 for indicating the working condition, is equipped with air inlet 15 and air outlet 16 on casing 1 for the gas in and out of internal device heat dissipation.
[0052] The utility model discloses a semiconductor laser hair removal appearance's core component is the laser system that is formed by laser assembly 2, light guide assembly 3, as shown in Figure 4 、 Figure 5 、 Figure 6 The utility model discloses a semiconductor laser hair removal appearance's core component is the laser system that is formed by laser assembly 2, light guide assembly 3, as shown in
[0053] Laser assembly 2, specific structure as shown in Figure 7 It is formed by a plurality of mini-bar laser 21 series connection, and in the embodiment, 4 mini-bar lasers 21 are connected in series, and each mini-bar laser 21 outputs 12-13W, and the overall laser module outputs 50W, and each mini-bar laser 21 has 5 light emitting points, and the 4 mini-bar lasers 21 are arranged at equal intervals with a spacing of 2mm, so that a 4*5 light emitting matrix is formed.
[0054] The laser module is provided with wires 22 on both sides, which are connected to the circuit board 4, thereby supplying power to the mini-bar laser 21 to realize light emission.
[0055] The mini-bar laser 21 is welded on the aluminum nitride substrate 23, and then glued on the copper substrate 24 through heat-conducting silver glue, and the copper substrate 24 is further glued on the heat sink 25 through heat-conducting silver glue; The heat sink 25 is generally an aluminum heat sink, which can realize heat conduction and heat dissipation; The copper substrate 24 in the middle can more efficiently diffuse heat and then transfer it to the heat sink 25 for heat dissipation. Of course, the aluminum nitride substrate 23 can also be directly glued on the heat sink 25 through heat-conducting silver glue, or on a VC heat plate, the purpose being to efficiently dissipate heat from the laser module composed of mini-bar lasers 21, and to ensure the ambient temperature and output power of the laser module.
[0056] Further, the heat sink 25 is provided with a cooling fan 26, and the cooling fan 26 works to suck external air from the air inlet 15, then flow through the heat sink 25 to take away the heat on the surface, and then blow through the air outlet 16; Therefore, generally, the air inlet 15 is located near the heat source, and the air outlet 16 is located at the tail of the casing 1 because of the exhaust heat, so as to avoid blowing hot air to the operator and causing discomfort during operation.
[0057] The light emitting side of the laser module composed of the mini-bar laser 21 is provided with a light guide assembly 3, which mainly comprises a sapphire large light guide 31. The sapphire large light guide 31 is a long strip-shaped rectangular body, which can shape the 4*5 light matrix emitted by the laser module, especially cut off the peak value of the edge, so as to realize a flat-top light source with uniform energy distribution, so that the laser can act on the skin follicle at a deeper depth, with better effect and better comfort.
[0058] Further, the uniform light glass 32 is arranged between the sapphire large light guide 31 and the mini-bar laser 21. The uniform light glass 32 performs uniform light processing on the light matrix, so that the light beam entering the sapphire large light guide 31 is diffused and shaped. At the same time, the uniform light glass 32 can also isolate the heat generated by the mini-bar laser 21 during operation, so as to avoid the sapphire large light guide 31 being directly close to the mini-bar laser 21 and overheating.
[0059] One end of the sapphire large light guide 31 is installed through a bracket 33, and the uniform light glass 32 is also embedded in the bracket 33. The bracket 33 is fixed on the copper substrate 24 or the heat sink 25, so that the positions and distances of the sapphire large light guide 31 and the uniform light glass 32 relative to the laser module composed of the mini-bar laser 21 are fixed, so as to finally obtain a stable and reliable laser beam matrix output.
[0060] The other end of the sapphire large light guide 31 passes through the window controller 5 and is installed on the end opening of the shell 1 as a working end.
[0061] Since the sapphire large light guide 31 is directly attached to the skin, in order to alleviate the hot burning sensation of the skin during the laser hair removal process, a refrigeration element is arranged on the sapphire large light guide 31, such as a TEC 34 (Thermal Electronic Cooler, semiconductor cooler) as shown in FIG. 6. Figure 8 Figure 10 In the embodiment, two groups of TECs 34 are arranged. The refrigerating surface of the TEC 34 is attached to the surface of the sapphire large light guide 31 through a heat-conducting silicon sheet 35. The TEC 34 is connected to the circuit board 4. After being electrified, the TEC 34 generates cold energy on the refrigerating surface, which is uniformly distributed through the heat-conducting silicon sheet 35 and then transmitted to the sapphire large light guide 31 to cool the sapphire large light guide 31. The cooling can offset the heat radiation generated by the mini-bar laser 21 to the sapphire large light guide 31 to heat it. More importantly, the temperature of the sapphire large light guide 31 is reduced, so that when it is in contact with the skin, it can continuously provide an ice-cold feeling to the skin, so that the skin does not have a hot feeling, and the hair removal experience is better. Therefore, the TEC 34 is preferably arranged close to the light emitting surface 311 of the sapphire large light guide 31, so that the cold energy can be transmitted to the light emitting surface 311 more quickly.
[0062] The other side of the refrigeration surface of the TEC 34 is a heat generating surface, so a TEC heat dissipation heat sink 36 is arranged to dissipate heat; preferably, the TEC heat dissipation heat sink 36 is located near the air inlet 15, so when the external air enters the shell 1 when the cooling fan 26 is working, it will first flow through the TEC heat dissipation heat sink 36, taking away the heat, achieving heat dissipation.
[0063] Further, a cover plate 37 is arranged, which wraps the sapphire large light guide 31, and is then connected with the TEC heat dissipation heat sink 36, so as to stably fix the TEC 34 and the TEC heat dissipation heat sink 36 on the sapphire large light guide 31.
[0064] A window controller 5 is arranged near the light emitting surface 311 of the sapphire large light guide 31; the window controller 5 is provided with an indicator light 51, and the working end of the shell 1 is a light-transmitting head cover, which can transmit the light of the indicator light 51; when the laser module is working, the indicator light 51 is lit, indicating that the laser is in an open state, avoiding misoperation and causing harm to the eyes; the window controller 5 is provided with a touch flexible plate 52, which is arranged around the sapphire large light guide 31; the touch flexible plate 52 is fixed on a positioning ring 54 through a buffer foam 53, and the positioning ring 54 is clamped around the sapphire large light guide 31, so as to extend the touch flexible plate 52 to the inner wall of the shell 1, realizing skin contact control; when the working end of the shell 1 is pressed against the skin, the laser module can be triggered to work, and when the skin is moved, the laser module will continue to work, avoiding the concentration of laser energy in one place and causing skin burns.
[0065] The above has specifically described the preferred embodiments of the present application, but the present application is not limited to the described embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.
Claims
1. A semiconductor laser hair removal device, characterized in that, The shell is internally provided with a laser assembly, a light guide assembly and a circuit board; An end of the shell is provided with an opening, so that an end of the light guide assembly extends out to form a working end; The shell is provided with a key and a display area; The laser assembly comprises a laser module formed by a plurality of mini-bar lasers connected in series, and the laser module is provided with the light guide assembly on a light emitting side thereof; The shell is internally provided with a circuit board, and the laser module is connected to the circuit board through wires.
2. The semiconductor laser hair removal device according to claim 1, wherein Each mini-bar laser has a plurality of light emitting points, and the light emitting points of each mini-bar laser are arranged along an X-axis direction; The plurality of mini-bar lasers are arranged along a Y-axis direction, and the X-axis and the Y-axis are orthogonal to each other.
3. The semiconductor laser hair removal device according to claim 2, wherein the semiconductor laser hair removal device is a semiconductor laser hair removal device for home use. Each mini-bar laser has five light emitting points; The laser module has four mini-bar lasers; The light emitting side of the laser module forms a 5*4 light emitting matrix.
4. The semiconductor laser hair removal device of claim 1, wherein the semiconductor laser hair removal device is a diode laser hair removal device. The plurality of mini-bar lasers are simultaneously welded on a substrate, and the other side of the substrate is provided with a heat sink.
5. The semiconductor laser hair removal device according to claim 4, wherein the semiconductor laser hair removal device is a semiconductor laser hair removal device for home use. The substrate is an aluminum nitride substrate, and the aluminum nitride substrate is glued to the heat sink through heat-conductive silver glue; The heat sink is a heat sink, a VC heat plate heat sink, or a copper fin heat sink.
6. The semiconductor laser hair removal device according to claim 4 or 5, characterized in that A copper substrate is arranged between the substrate and the heat sink. The back side of the heat sink is provided with a cooling fan; The shell is provided with an air inlet and an air outlet, and the air inlet and the air outlet are respectively located on the two sides of the cooling fan.
7. The semiconductor laser hair removal device of claim 1, wherein the semiconductor laser hair removal device is a diode laser hair removal device. The light guide assembly comprises a sapphire large light guide; The sapphire large light guide is a long rectangular body; The sapphire large light guide is provided with a light homogenizing glass between the sapphire large light guide and the laser module.
8. The semiconductor laser hair removal device of claim 7, wherein the semiconductor laser hair removal device is configured to emit the laser beam at a wavelength of 800 nm. A refrigeration element is arranged on the sapphire large light guide; The refrigeration element is a TEC, and a refrigeration surface of the TEC is attached to the surface of the sapphire large light guide through a heat-conductive silicon sheet; A TEC heat dissipation heat sink is arranged on the heating surface of the TEC, and the TEC is connected to the circuit board.
9. The semiconductor laser hair removal device of claim 8, wherein the semiconductor laser hair removal device is configured to emit the laser beam at a wavelength of 800 nm. The TEC has a plurality of TECs; The TEC is arranged close to the light emitting surface of the sapphire large light guide.
10. The semiconductor laser hair removal device of claim 7, wherein the semiconductor laser hair removal device is configured to emit the laser beam at a wavelength of 810 nm. A window controller is arranged close to the light emitting surface of the sapphire large light guide. The window controller is connected to the circuit board.