Bottle cap mold cooling structure

Abstract

The utility model discloses a bottle cap mold cooling structure in the technical field of bottle cap molds, which comprises a groove seat, movable plates are slidably connected to the left side and the right side of the inner cavity wall of the groove seat, the tops of the movable plates extend to the outer side of the groove seat, and a mold sleeve is fixedly connected to the upper side of the left side wall of the movable plate on the right side. A hollow mold column is fixedly connected to the upper side of the right side wall of the left movable plate, a through opening is formed in the upper side of the left side wall of the left movable plate, and the through opening communicates with the hollow mold column. And meanwhile, through cooperation with external cooling, overall heat dissipation is more uniform and efficient, so that the product cooling speed is increased, cooling water can directly act on the mold to conduct heat dissipation and cooling on the mold during cooling, intermediate media are not needed, the heat exchange efficiency is improved, and the cooling efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the field of bottle cap mold technology, specifically a bottle cap mold cooling structure. Background Technology

[0002] Bottle caps are used to seal bottles. Depending on their function, bottle caps come in different shapes and have different operating methods. They are generally round or ring-shaped. Bottle caps can be made using injection molds. When using injection molds to process injection molded products, it is necessary to wait for the injection molded product to cool down to a certain temperature before the product can be ejected. In order to facilitate the rapid solidification and molding of injection molded products, existing methods involve cooling the bottle cap mold.

[0003] The existing publication number CN221641688U discloses a water cooling structure for a bottle cap mold, including a U-shaped frame plate, a first mold, and a second mold. The first and second molds are respectively located on the top left and right sides of the U-shaped frame plate. Hydraulic cylinders are fixedly connected to the left and right ends of the outer wall of the U-shaped frame plate. The output end of the right hydraulic cylinder is located at the right end of the first mold, and the output end of the left hydraulic cylinder is located at the left end of the second mold. An injection pipe is fixedly connected to the top right end of the first mold, a water inlet pipe is fixedly connected to the left end of the second mold, and a drain pipe is fixedly connected to the right side of the front of the second mold. This invention achieves rapid and uniform cooling of the injection mold within the mold sleeve by pressing a retaining ring against the outer wall of the retaining groove when the first and second molds are connected. Cold water is injected through the water inlet pipe and flows spirally through a spiral pipe, while the hot water is discharged through the drain pipe.

[0004] The aforementioned device cools the mold by circulating cold water in a spiral tube. However, it only dissipates heat from the outer surface of the product and cannot effectively dissipate heat from the interior. Only after the outer surface temperature drops can the internal heat be transferred to the outside, resulting in slow heat dissipation and reduced cooling efficiency. Furthermore, when cooling is achieved by circulating cold water through a spiral tube, the heat must first be transferred to the spiral tube before it can be absorbed and carried away by the cold water. The cold water cannot directly absorb heat, resulting in low heat exchange efficiency, which further reduces the cooling efficiency. Therefore, we propose a cooling structure for bottle cap molds. Utility Model Content

[0005] The purpose of this invention is to provide a cooling structure for bottle cap molds, addressing the problem described in the background art where existing devices cool the mold using cold water flowing in a spiral tube. However, this only dissipates heat from the outer surface of the product and cannot effectively cool the interior. Only after the outer surface temperature drops can the internal heat be transferred to the outside, resulting in slow heat dissipation and reduced cooling efficiency. Furthermore, when cooling is achieved by transporting cold water through a spiral tube, heat must first be transferred to the spiral tube before being absorbed and carried away by the cold water. The cold water cannot directly absorb heat, leading to low heat exchange efficiency and further reducing cooling efficiency.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a bottle cap mold cooling structure, including a groove base, with movable plates slidably connected to the left and right sides of the inner cavity wall of the groove base. The top of the movable plates extends to the outer side of the groove base. A mold sleeve is fixedly connected to the upper side of the left side wall of the right movable plate, and a hollow mold column is fixedly connected to the upper side of the right side wall of the left movable plate. An opening is formed on the upper side of the left side wall of the left movable plate, and the opening communicates with the hollow mold column. A hollow mounting plate is fixedly connected to the upper side of the left side wall of the left movable plate by bolts, and a hollow mounting plate is fixed at the middle of the right side wall of the hollow mounting plate. A cylindrical body is connected to the hollow mold column. The right side wall of the cylindrical body extends into the inner cavity of the hollow mold column, and the cylindrical body is connected to the hollow mounting plate and the hollow mold column. A heat-conducting rod is fixedly connected to the outer side wall of the cylindrical body and located in the inner cavity of the hollow mold column. There are four heat-conducting rods, and the four heat-conducting rods are evenly distributed from left to right in a group. A semiconductor refrigeration chip is fixedly connected to one end of the heat-conducting rod. A thermally conductive silicone pad is provided between the cooling surface of the semiconductor refrigeration chip and the inner cavity wall of the hollow mold column. The other end of the heat-conducting rod extends into the inner cavity of the cylindrical body and is fixedly connected to a heat sink.

[0007] As a further description of the above technical solution:

[0008] A cooling fan is fixedly connected to the inner wall of the hollow mounting plate, and an air guide is fixedly connected to the middle of the left side wall of the hollow mounting plate. The air guide is connected to the hollow mounting plate.

[0009] As a further description of the above technical solution:

[0010] A limiting plate is fixedly connected to the left side of the outer wall of the hollow mold column, and a ring is fixedly connected to the right side wall of the limiting plate and located outside the hollow mold column. A silicone rubber sealing ring is provided on the inner side wall of the ring.

[0011] As a further description of the above technical solution:

[0012] The mold sleeve has a cooling cavity inside. The inner walls of the cooling cavity are fixedly connected to the left and right sides of the cavity. The right side wall of the left annular tube and the left side wall of the right annular tube have holes, and the holes are evenly distributed in a ring. The right annular tube is connected to a water inlet hose, and the left annular tube is connected to a water outlet hose.

[0013] As a further description of the above technical solution:

[0014] The inner wall of the cooling chamber is fixedly connected with a baffle plate, and the baffle plate is evenly distributed from left to right. The baffle plate is located between the inner walls of the annular tubes on the left and right sides. The outer wall of the baffle plate has flow holes, and the flow holes are evenly distributed in a ring.

[0015] As a further description of the above technical solution:

[0016] Electric telescopic rods are fixedly connected to the left and right side walls of the slot seat. The output ends of the two electric telescopic rods extend into the inner cavity of the slot seat and are fixedly connected to the outer side walls of the movable plates on the left and right sides, respectively.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] This bottle cap mold cooling structure uses a semiconductor cooling chip in conjunction with a heat-conducting rod, a cylindrical body, and a hollow mounting plate to cool the hollow mold column, thereby cooling the interior of the injection molded part. When the semiconductor cooling chip is in use, the heat-conducting rod, along with a heat sink, a cooling fan, an opening, and an air guide, cools the heating surface of the semiconductor cooling chip, thereby improving the cooling efficiency of the cooling surface of the semiconductor cooling chip. This allows for cooling of the product's interior, and combined with external cooling, the overall heat dissipation is more uniform and efficient, thus increasing the cooling speed of the product.

[0019] This bottle cap mold cooling structure features a cooling chamber through which cooling water flows. Cooling water is delivered via a right-side annular pipe with openings, and extracted via a left-side annular pipe with openings, ensuring uniform flow within the cooling chamber. The cooling water directly contacts the mold sleeve, rapidly removing heat and improving heat dissipation efficiency and uniform cooling. A baffle plate and flow holes allow the cooling water to remain within the cooling chamber for a sufficient time to absorb heat, further enhancing heat dissipation. The cooling water directly acts on the mold during cooling, eliminating the need for an intermediate medium and increasing heat exchange efficiency, thus further improving cooling performance. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of a bottle cap mold cooling structure proposed in this utility model;

[0021] Figure 2 This is a schematic front sectional view of a bottle cap mold cooling structure proposed in this utility model;

[0022] Figure 3 This is a right-side sectional view of the hollow mold column of the cooling structure for a bottle cap mold proposed in this utility model.

[0023] Figure 4 This is a schematic diagram of the flow-blocking plate of a bottle cap mold cooling structure proposed in this utility model;

[0024] Figure 5 This is a schematic diagram of the overall structure of a bottle cap mold cooling structure proposed in this utility model from the left.

[0025] Figure 6 This utility model proposes a cooling structure for a bottle cap mold. Figure 2 Enlarged structural diagram at point A in the middle;

[0026] Figure 7 This utility model proposes a cooling structure for a bottle cap mold. Figure 2 Enlarged structural diagram at point B.

[0027] In the diagram: 100, slot seat; 110, movable plate; 111, mold sleeve; 112, hollow mold column; 113, through port; 114, hollow mounting plate; 115, cylinder; 116, heat-conducting rod; 117, semiconductor refrigeration chip; 118, heat sink; 120, cooling fan; 121, air guide cover; 130, limiting plate; 131, ring; 140, cooling cavity; 141, annular tube; 142, hole; 150, flow baffle; 151, flow hole; 160, electric telescopic rod. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] This utility model provides a cooling structure for bottle cap molds, capable of cooling the interior of the product. Combined with external cooling, this results in more uniform and efficient heat dissipation, thereby increasing the cooling speed. During cooling, cooling water directly acts on the mold to dissipate heat, eliminating the need for an intermediate medium and improving heat exchange efficiency, thus further enhancing cooling efficiency. Please refer to [link to relevant documentation]. Figure 1-7 Including slot 100;

[0032] Please refer to it again. Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6Movable plates 110 are slidably connected to the left and right sides of the inner cavity wall of the slot 100. The movable plates 110 are used to install the mold sleeve 111 and the hollow mold column 112. The top of the movable plates 110 extends to the outside of the slot 100. The mold sleeve 111 is fixedly connected to the upper left side of the right movable plate 110, and the mold sleeve 111 is used to mate with the hollow mold column 112. The hollow mold column 112 is fixedly connected to the upper right side of the left movable plate 110, and the hollow mold column 112 is used to mate with the mold sleeve 111 for injection molding. An opening 113 is opened on the upper left side of the left movable plate 110 for ventilation and is connected to the hollow mold column 112. A hollow mounting plate 114 is fixedly connected to the upper left side of the left movable plate 110 by bolts. Mounting plate 114 is used to mount cylinder 115 and cooling fan 120. Cylinder 115 is fixedly connected to the middle of the right side wall of hollow mounting plate 114. Cylinder 115 is used to mount heat-conducting rods 116. The right side wall of cylinder 115 extends into the inner cavity of hollow mold column 112, and cylinder 115 is connected to both hollow mounting plate 114 and hollow mold column 112. Heat-conducting rods 116 are fixedly connected to the outer side wall of cylinder 115 and within the inner cavity of hollow mold column 112. Heat-conducting rods 116 are used to mount thermoelectric cooler 117 and heat sink 118. There are four heat-conducting rods 116, and the four heat-conducting rods 116 are evenly distributed from left to right in a group. One end of heat-conducting rod 116 is fixedly connected to thermoelectric cooler 117. 117 is used to cool and dissipate heat from the cooling surface of the hollow mold column 112. The semiconductor cooling chip 117 mentioned here is existing technology and will not be described in detail. A thermally conductive silicone pad is provided between the cooling surface of the semiconductor cooling chip 117 and the inner wall of the hollow mold column 112. The thermally conductive silicone pad is used to make the semiconductor cooling chip 117 fit more closely to the inner wall of the hollow mold column 112 and to improve the heat conduction effect by utilizing its good thermal conductivity. The other end of the heat-conducting rod 116 extends into the inner cavity of the cylinder 115 and is fixedly connected to a heat sink 118. The heat sink 118 is used to cool and dissipate heat from the heating surface of the semiconductor cooling chip 117 through the heat-conducting rod 116. Dissipating heat from the heating surface can reduce the temperature of the heating surface and make the temperature difference between the cooling surface and the heating surface smaller. A larger temperature difference is beneficial to improving cooling efficiency, allowing the cooling surface to lower the temperature more quickly and effectively. A cooling fan 120 is fixedly connected to the inner wall of the hollow mounting plate 114. The cooling fan 120 is used to dissipate heat from the heat sink 118. An air guide shroud 121 is fixedly connected to the middle of the left side wall of the hollow mounting plate 114. The air guide shroud 121 is used to guide the extracted hot air to prevent it from being immediately sucked back in. The air guide shroud 121 is connected to the hollow mounting plate 114. A limiting plate 130 is fixedly connected to the left side of the outer wall of the hollow mold column 112. The limiting plate 130 is used to limit the mold sleeve 111 during processing, thereby quickly performing subsequent injection molding operations. A ring 131 is fixedly connected to the right side wall of the limiting plate 130, located on the outer side of the hollow mold column 112.The circular ring 131 is used to improve the sealing of the connection with a silicone rubber sealing ring. The inner wall of the circular ring 131 is equipped with a silicone rubber sealing ring. During use, an external controller activates the thermoelectric cooler 117 and the cooling fan 120. The thermoelectric cooler 117, through its cooling surface and thermally conductive silicone pad, cools the hollow mold column 112. During operation, the heating surface of the thermoelectric cooler 117 transfers heat to the heat-conducting rod 116, which in turn transfers heat to the heat sink 118. The cooling fan 120 draws air from the opening 113 into the hollow mold column 112 to dissipate heat from the heat-conducting rod 116 and the heating surface of the thermoelectric cooler 117. Under the action of the cooling fan 120, the air flows to the end of the hollow mold column 112 and then into the cylinder 115, carrying away the heat from the heat sink 118. Finally, the air is discharged through the air guide shroud 121.

[0033] In summary, this method can cool the internal components of the product, and when combined with external cooling, it makes the overall heat dissipation more uniform and efficient, thereby improving the product's cooling speed.

[0034] Please refer to it again. Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 7The mold sleeve 111 has a cooling chamber 140 inside, which facilitates full contact between the cooling water and the mold sleeve 111. Annular pipes 141 are fixedly connected to the left and right sides of the inner wall of the cooling chamber 140. These annular pipes 141 are connected to an existing industrial circulating cooling water system via outlet and inlet hoses, respectively, to achieve cooling water circulation. The industrial circulating cooling water system is a readily available technology and will not be described in detail here. Holes are formed on the right side wall of the left annular pipe 141 and the left side wall of the right annular pipe 141. 142. The holes 142 are used to ensure the uniform distribution and flow of cooling water within the cooling chamber 140. The holes 142 are evenly distributed in a ring shape. A water inlet hose is connected to the right-side annular pipe 141, and a water outlet hose is connected to the left-side annular pipe 141. A baffle plate 150 is fixedly connected to the inner wall of the cooling chamber 140. The baffle plate 150 works in conjunction with the flow holes 151 to allow the cooling water to remain inside the cooling chamber 140 for a sufficient time to absorb heat. The baffle plates 150 are evenly distributed from left to right. Located between the inner walls of the left and right annular pipes 141, the outer wall of the baffle plate 150 has flow holes 151 to facilitate the flow of cooling water. The flow holes 151 are evenly distributed in a ring shape. Electric telescopic rods 160 are fixedly connected to the left and right side walls of the slot base 100. The electric telescopic rods 160 are used to move the movable plate 110. The output ends of the two electric telescopic rods 160 extend into the inner cavity of the slot base 100 and are fixedly connected to the outer walls of the left and right movable plates 110 respectively. In use, they cooperate with the right annular pipe 141 to... The water hose delivers cooling water into the cooling chamber 140 through the right-side hole 142. The left-side annular pipe 141, together with the outlet pipe, draws out the cooling water through the left-side hole 142. The two sides work together to ensure that the cooling water flows evenly in the cooling chamber 140. The cooling water absorbs the heat from the mold sleeve 111 to cool the product. When the cooling water is flowing to cool down, the baffle plate 150, together with the flow hole 151, slows down the flow rate of the cooling water, so that the cooling water stays in the cooling chamber 140 for a sufficient time to absorb heat.

[0035] In summary, the cooling water can be directly applied to the mold to dissipate heat and cool it down during cooling, without the need for an intermediate medium, thus improving heat exchange efficiency and further enhancing cooling efficiency.

[0036] In practical use, those skilled in the art activate the electric telescopic rods 160 on both sides via an external controller. The electric telescopic rods 160 on both sides drive the movable plates 110 on both sides to move simultaneously in opposite directions, thereby inserting the hollow mold column 112 into the mold sleeve 111. Under the action of the limiting plate 130, it is accurately positioned. Material is added between the mold sleeve 111 and the hollow mold column 112 through the injection tube on the mold sleeve 111. After the material is added, a plug is inserted into the injection tube for sealing. During injection, the ring 131 cooperates with the silicone rubber sealing ring to prevent material leakage at the connection. During cooling, the semiconductor cooling chip 117 and the cooling fan 120 are activated via an external controller. The semiconductor cooling chip 117 cools the hollow mold column 112 through the cooling surface and the thermally conductive silicone pad. During cooling, the heating surface of the semiconductor cooling chip 117 transfers heat to the heat conduction rod 116, and the heat conduction rod 116 transfers heat to the heat sink 118. The cooling fan 120 draws air into the hollow mold column 112 through the opening 113. The heat-conducting rod 116 and the heating surface of the semiconductor cooling chip 117 dissipate heat. Under the action of the cooling fan 120, the air flows to the end of the hollow mold column 112 and then enters the cylinder 115 for circulation, thereby carrying away the heat on the heat sink 118. Finally, it is discharged through the air guide shroud 121. By cooling the hollow mold column 112, the internal part of the product is cooled. At the same time, the annular pipe 141 on the right side, together with the water inlet hose, delivers cooling water to the cooling chamber 140 through the right hole 142. The annular pipe 141 on the left side, together with the water outlet hose, draws out the cooling water through the left hole 142. The two sides work together to make the cooling water circulate evenly in the cooling chamber 140. The cooling water absorbs the heat of the mold sleeve 111 to cool the outside of the product. When the cooling water is circulating for cooling, the baffle plate 150, together with the flow hole 151, slows down the flow rate of the cooling water, so that the cooling water stays in the cooling chamber 140 for a sufficient time to absorb heat, thereby quickly cooling the product.

[0037] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0038] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A cooling structure for a bottle cap mold, characterized in that: The system includes a slotted base (100), with movable plates (110) slidably connected to the left and right sides of the inner wall of the slotted base (100). The top of the movable plates (110) extends to the outer side of the slotted base (100). A mold sleeve (111) is fixedly connected to the upper side of the left side wall of the right movable plate (110), and a hollow mold column (112) is fixedly connected to the upper side of the right side wall of the left movable plate (110). An opening (113) is opened on the upper side of the left side wall of the left movable plate (110), and the opening (113) communicates with the hollow mold column (112). A hollow mounting plate (114) is fixedly connected to the upper side of the left side wall of the left movable plate (110) by bolts. A cylinder (115) is fixedly connected to the middle of the right side wall of the hollow mounting plate (114). The right side wall extends into the inner cavity of the hollow mold column (112), and the cylinder (115) is connected to the hollow mounting plate (114) and the hollow mold column (112). A heat-conducting rod (116) is fixedly connected to the outer side wall of the cylinder (115) and located in the inner cavity of the hollow mold column (112). There are four heat-conducting rods (116), and the four heat-conducting rods (116) are evenly distributed from left to right in a group. One end of the heat-conducting rod (116) is fixedly connected to a semiconductor cooling chip (117). A thermally conductive silicone pad is provided between the cooling surface of the semiconductor cooling chip (117) and the inner cavity wall of the hollow mold column (112). The other end of the heat-conducting rod (116) extends into the inner cavity of the cylinder (115) and is fixedly connected to a heat sink (118).

2. The bottle cap mold cooling structure according to claim 1, characterized in that: A cooling fan (120) is fixedly connected to the inner wall of the hollow mounting plate (114), and an air guide shroud (121) is fixedly connected to the middle of the left side wall of the hollow mounting plate (114). The air guide shroud (121) is connected to the hollow mounting plate (114).

3. The bottle cap mold cooling structure according to claim 1, characterized in that: A limiting plate (130) is fixedly connected to the left side of the outer wall of the hollow mold column (112). A ring (131) is fixedly connected to the right side wall of the limiting plate (130) and located outside the hollow mold column (112). A silicone rubber sealing ring is provided on the inner side wall of the ring (131).

4. The bottle cap mold cooling structure according to claim 1, characterized in that: The mold sleeve (111) has a cooling cavity (140) inside. The inner walls of the cooling cavity (140) are fixedly connected to the left and right sides of the annular tube (141). The right side wall of the left annular tube (141) and the left side wall of the right annular tube (141) have holes (142), and the holes (142) are evenly distributed in annular shape. The right annular tube (141) is connected to a water inlet hose, and the left annular tube (141) is connected to a water outlet hose.

5. The bottle cap mold cooling structure according to claim 4, characterized in that: The inner wall of the cooling chamber (140) is fixedly connected with a baffle plate (150), and the baffle plates (150) are evenly distributed from left to right. The baffle plates (150) are located between the inner walls of the annular tube (141) on the left and right sides. The outer wall of the baffle plate (150) has a flow hole (151), and the flow hole (151) is evenly distributed in a ring.

6. The bottle cap mold cooling structure according to claim 1, characterized in that: Electric telescopic rods (160) are fixedly connected to the left and right side walls of the slot (100). The output ends of the two electric telescopic rods (160) extend into the inner cavity of the slot (100) and are fixedly connected to the outer side walls of the movable plates (110) on the left and right sides, respectively.

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