Red glue thickness measuring device of solder paste detection equipment

Abstract

A red glue thickness measuring device of solder paste detection equipment comprises a solder paste detection equipment body, a built-in optical camera and a motion control system. The 3D coaxial line confocal sensor is fixedly mounted on the side of the optical camera, and a preset offset distance is kept between the 3D coaxial line confocal sensor and the central axis of the optical camera; in conclusion, the position of the red glue on the PCB is quickly scanned and identified by the optical camera, and key parameters such as the thickness, the width and the volume of the red glue are accurately measured by the 3D sensor, so that the coating quality is ensured; meanwhile, the system monitors environment temperature and humidity and vibration conditions in real time, dynamically corrects measurement errors, and improves detection accuracy; according to the utility model, the production efficiency is improved, manual intervention is reduced, defects can be timely found and marked, subsequent assembly faults caused by quality problems are effectively avoided, and the product quality and the automation level of a production line are greatly improved.

Description

Technical Field

[0001] This utility model belongs to the field of surface mount technology, specifically relating to a red glue thickness measuring device for solder paste testing equipment. Background Technology

[0002] In SMT (Surface Mount Technology) processes, many PCBs are double-sided surface mount devices. During the second reflow soldering, large components already soldered on the first side may lose their fixation due to the re-melting of the cured solder paste, leading to displacement or even detachment. To prevent this, current processes primarily involve applying red glue to the components before surface mount. This red glue provides additional fixing force during the second reflow soldering, ensuring that the soldered components are not affected and guaranteeing the quality and reliability of double-sided soldering. Currently, factories add automatic dispensing machines after the solder paste printer. Many customers hope that solder paste inspection equipment can simultaneously detect red glue defects while inspecting the solder paste, thus saving the need for a dedicated red glue thickness testing device. However, the accuracy of solder paste inspection machines depends on the solder paste... Designed to meet testing requirements, red glue differs from solder paste in optical properties such as color and transparency before and after curing. This makes it difficult for optical systems to image and identify red glue as clearly as they do for solder paste, leading to inaccurate judgment of its thickness. This is especially true today with the widespread adoption of new energy vehicles, where automotive electronics processes have extremely strict requirements on the amount of red glue used, demanding very high precision from testing equipment. However, red glue is a semi-transparent substance, and when illuminated by the professional camera light source of solder paste testing equipment, its surface appears jagged and uneven, making it impossible to accurately measure the glue thickness. Currently, factories can only monitor whether automatic dispensing machines have missed red glue through existing solder paste testing equipment, but they cannot control the specific thickness of the red glue, which has become a pain point for most automotive electronics manufacturing plants. Utility Model Content

[0003] This utility model aims to provide a red glue thickness measuring device for solder paste testing equipment, and solve some technical problems existing in the current solder paste testing equipment.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] The red glue thickness measuring device of the solder paste inspection equipment includes:

[0006] The solder paste testing equipment consists of a main body 1, a built-in optical camera 2, and a motion control system 3;

[0007] A 3D coaxial confocal sensor 4 is fixedly installed on the side of the optical camera 2, maintaining a preset offset distance from the central axis of the optical camera 2;

[0008] The data processing unit 5 is connected to the optical camera 2 and the 3D coaxial confocal sensor 4. The data processing unit 5 identifies the position of the red glue dots on the PCB board through the optical camera 2; the data processing unit 5 drives the 3D coaxial confocal sensor 4 to perform Z-axis scanning on the target red glue dots to obtain three-dimensional contour data; based on the scanned data, the data processing unit 5 calculates the thickness, width and volume of the red glue and compares them with the preset tolerance range; the data processing unit 5 simultaneously outputs the solder paste printing quality and red glue parameters to the manufacturing execution system.

[0009] Furthermore, the optical axis of the 3D coaxial confocal sensor 4 is parallel to the optical axis of the optical camera 2, and the distance between them is less than 10mm.

[0010] Furthermore, the data processing unit 5 includes a red glue feature extraction algorithm to eliminate jagged noise on the surface of the translucent glue and to distinguish between the red glue and the PCB substrate based on the difference in reflected light intensity.

[0011] Furthermore, the red glue thickness measuring device of the solder paste testing equipment also includes an environmental compensation module 6, which monitors workshop temperature, humidity and vibration data in real time, and dynamically corrects the measurement error of the 3D coaxial confocal sensor 4.

[0012] Compared with existing technologies, the advantages of this invention are as follows: This invention utilizes an optical camera 2 to quickly scan and identify the location of the red glue on the PCB board, and then uses a 3D sensor to accurately measure key parameters such as the thickness, width, and volume of the red glue to ensure coating quality; at the same time, the system monitors the ambient temperature, humidity, and vibration in real time, dynamically corrects measurement errors, and improves detection accuracy; this invention not only improves production efficiency and reduces manual intervention, but also enables timely detection and marking of defects, effectively avoiding subsequent assembly failures caused by quality problems, and greatly improving product quality and the automation level of the production line. Attached Figure Description

[0013] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0014] Figure 1 This is a schematic diagram of the red glue thickness measuring device in the solder paste testing equipment of this utility model;

[0015] Figure 2 This is a flowchart of the testing process for the red glue thickness measuring device in solder paste testing equipment. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] The present invention will be further described in detail below with reference to the embodiments.

[0018] like Figure 1 and Figure 2 As shown, a specific embodiment of the red glue thickness measuring device for solder paste testing equipment provided by this utility model is as follows:

[0019] The red glue thickness measuring device of the solder paste inspection equipment includes:

[0020] The solder paste testing equipment consists of a main body 1, a built-in optical camera 2, and a motion control system 3;

[0021] A 3D coaxial confocal sensor 4 is fixedly installed on the side of the optical camera 2, maintaining a preset offset distance from the central axis of the optical camera 2;

[0022] The data processing unit 5 is connected to the optical camera 2 and the 3D coaxial confocal sensor 4. The data processing unit 5 identifies the position of the red glue dots on the PCB board through the optical camera 2; the data processing unit 5 drives the 3D coaxial confocal sensor 4 to perform Z-axis scanning on the target red glue dots to obtain three-dimensional contour data; based on the scanned data, the data processing unit 5 calculates the thickness, width and volume of the red glue and compares them with the preset tolerance range; the data processing unit 5 simultaneously outputs the solder paste printing quality and red glue parameters to the manufacturing execution system.

[0023] The optical axis of the 3D coaxial confocal sensor 4 is parallel to the optical axis of the optical camera 2, and the distance between the two is less than 10mm, so as to avoid detection blind spots.

[0024] The data processing unit 5 includes a red glue feature extraction algorithm, which is used to eliminate jagged noise on the surface of the translucent glue and to distinguish between red glue and PCB substrate based on the difference in reflected light intensity.

[0025] The red glue thickness measuring device of the solder paste testing equipment also includes an environmental compensation module 6, which monitors the temperature, humidity and vibration data of the workshop in real time and dynamically corrects the measurement error of the 3D coaxial confocal sensor 4.

[0026] The detection method of the red glue thickness measuring device in the solder paste detection equipment of this embodiment is as follows:

[0027] First, the optical camera 2 built into the main body 1 of the solder paste inspection equipment scans the PCB board to identify the red glue coating area and accurately locate the position of each red glue dot. Next, based on the positioning results, the data processing unit 5 controls the motion system to move the 3D coaxial confocal sensor 4, positioning it precisely above the target red glue dot. The 3D coaxial confocal sensor 4 is then activated to perform a Z-axis scan, acquiring the height distribution curve of the red glue, and subsequently calculating key parameters such as the thickness, width, and volume of the red glue. Simultaneously, the data processing unit 5 uses a specific algorithm to eliminate jagged noise on the surface of the translucent adhesive, accurately distinguishing the red glue from the PCB substrate based on differences in reflected light intensity, ensuring measurement accuracy.

[0028] Subsequently, the data processing unit 5 compares the calculated red glue parameters with the preset tolerance range. If any deviation exceeds the set threshold, an alarm is immediately triggered, and the defect location is marked in the system. Furthermore, this unit simultaneously outputs the solder paste printing quality and red glue parameters to the manufacturing execution system, generating a comprehensive report for subsequent analysis and production adjustments. To further improve measurement accuracy, the environmental compensation module 6 monitors the temperature, humidity, and vibration conditions in the workshop in real time and dynamically corrects the measurement error of the 3D coaxial confocal sensor 4, ensuring high-precision measurements under various environmental conditions.

[0029] It should be noted that, in this document, terms such as “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A red glue thickness measuring device for solder paste testing equipment, characterized in that, include: The main body of the solder paste testing equipment has a built-in optical camera and motion control system; A 3D coaxial confocal sensor is fixedly installed on the side of the optical camera, maintaining a preset offset distance from the central axis of the optical camera; The data processing unit is connected to the optical camera and the 3D coaxial confocal sensor. The data processing unit identifies the position of the red glue dots on the PCB board through the optical camera; the data processing unit drives the 3D coaxial confocal sensor to perform Z-axis scanning on the target red glue dots to obtain three-dimensional contour data; based on the scanned data, the data processing unit calculates the thickness, width and volume of the red glue and compares them with the preset tolerance range. The data processing unit synchronously outputs the solder paste printing quality and red glue parameters to the manufacturing execution system.

2. The red glue thickness measuring device of the solder paste testing equipment according to claim 1, characterized in that: The optical axis of the 3D coaxial confocal sensor is parallel to the optical axis of the optical camera, and the distance between the two is less than 10mm.

3. The red glue thickness measuring device of the solder paste testing equipment according to claim 1, characterized in that: The data processing unit includes a red glue feature extraction algorithm to eliminate jagged noise on the surface of the translucent glue and to distinguish between red glue and PCB substrate based on the difference in reflected light intensity.

4. The red glue thickness measuring device of the solder paste testing equipment according to claim 1, characterized in that: It also includes an environmental compensation module that monitors workshop temperature, humidity and vibration data in real time and dynamically corrects the measurement error of the 3D coaxial confocal sensor.

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