Semiconductor chip pin cutting device

Abstract

The utility model provides a semiconductor chip pin cutting device which comprises a base, at least two positioning grooves are evenly formed in the top of the base in the axial direction of the base, supporting tables are arranged in the positioning grooves, the interiors of the positioning grooves are matched with semiconductor chips, and pin receding grooves matched with pins of the semiconductor chips are formed in the two sides of the positioning grooves. A supporting table corresponding to a pin of the semiconductor chip is arranged between the bottom of the positioning groove and the base; a positioning groove is formed in the supporting table, a cutter is arranged above the positioning groove in a sliding mode in the vertical direction, a downward cutting driving mechanism for driving the cutter to move up and down is arranged at the top of the cutter, the cutter is of an inverted-U-shaped groove structure, a cutter head matched with the supporting table is arranged at the bottom of the cutter, a pin pressing die is arranged in the cutter in a sliding mode, and the pin pressing die and the cutter are elastically supported; the chip pin cutting device can reduce labor input, can cut a plurality of chip pins at the same time, improves processing efficiency, and is beneficial to batch processing.

Description

Technical Field

[0001] This utility model belongs to the field of chip pin processing technology, and specifically relates to a semiconductor chip pin cutting device. Background Technology

[0002] To meet the installation requirements of semiconductor chips, the pins of the semiconductor chips need to be cut to an appropriate length. Currently, pin cutting equipment is usually used to cut the semiconductor chip pins.

[0003] In the prior art, Chinese utility model patent document with authorization announcement number CN218744560U discloses an SOP packaged chip pin cutting fixture, which can closely fit the chip to be cut, solving the problem that the cutting length cannot be controlled when using scissors to cut chip pins. This fixes the chip pin cutting position and solves the problems of uneven cutting surface and poor pin coplanarity. However, when cutting the pins, the chip to be cut needs to be placed on a placement base, with the pins embedded in the groove and flush with the surface of the placement base. A pressure block is then placed, and a U-shaped pressure knife is placed close to the left and right sides of the pressure block. Pressure is applied by a press to cut the pins. The whole process requires a large amount of manpower, and only one chip pin can be cut at a time, resulting in low efficiency and making it unsuitable for mass production.

[0004] Therefore, it is necessary to design a semiconductor chip pin cutting device that reduces manual labor input, cuts multiple chip pins simultaneously, improves processing efficiency, and facilitates batch processing to solve the current technical problems. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a semiconductor chip pin cutting device that reduces manual labor input, cuts multiple chip pins simultaneously, improves processing efficiency, and facilitates batch processing.

[0006] The technical solution of this utility model is: a semiconductor chip pin cutting device, including a base, at least two positioning grooves are evenly arranged on the top of the base along its axial direction, a support platform is arranged inside the positioning groove, the inside of the positioning groove matches the semiconductor chip, pin clearance grooves matching the pins of the semiconductor chip are opened on both sides of the positioning groove, and a support platform corresponding to the pins of the semiconductor chip is arranged between the bottom of the positioning groove and the base.

[0007] A cutter is slidably disposed above the positioning groove in a vertical direction. A cutting drive mechanism is disposed at the top of the cutter to drive the cutter to move up and down. The cutter has an inverted "U" shaped groove structure. A cutter head that cooperates with the support platform is disposed at the bottom of the cutter. A pin pressing mold is slidably disposed inside the cutter. The pin pressing mold and the cutter are elastically supported.

[0008] The pin mold has an inverted "U" shaped groove structure, and the inside of the pin mold is provided with a chip pre-pressing mechanism corresponding to the support platform.

[0009] The chip pre-compression mechanism has a buffer cylinder fixedly disposed on the top of the pin compression mold. A slider is slidably disposed inside the buffer cylinder. A pre-compression spring is disposed between the top of the slider and the inner top of the buffer cylinder. A pre-compression rod is fixedly disposed at the bottom of the slider and slidably connected to the pin compression mold.

[0010] A preload plate is fixedly installed at the bottom end of the preload rod, and a pad is fixedly installed at the bottom of the preload plate.

[0011] Guide rods are vertically fixed at the top of both ends of the pin mold. The guide rods are slidably connected to the top of the cutter. A limit plate is fixedly installed at the top of the guide rod. A compression spring is fitted on the outside of the guide rod between the cutter and the pin mold.

[0012] The base is provided with a bracket on top, the cutting drive mechanism has a hydraulic cylinder fixedly mounted on the top of the bracket, and both ends of the cutter are vertically fixed with slide rods, which are slidably connected to the top of the bracket.

[0013] The base has a hollow interior, and the top of the base has a drop hole for receiving the pins of the cut semiconductor chip. A collection drawer is slidably inserted into one side of the base.

[0014] The beneficial effects of this utility model are:

[0015] (1) In this utility model, the semiconductor chip is placed inside the positioning groove for positioning. The pins of the semiconductor chip extend outward from the pin clearance groove and abut against the top of the support platform, thereby achieving precise positioning of the semiconductor chip. The cutting drive mechanism drives the cutter to move downward to cut the pins.

[0016] (2) Before cutting, the pin pressing mold first contacts the top of the pin, and at the same time, the pin pressing mold cooperates with the support table to clamp and fix the pin. The elastic support between the pin pressing mold and the cutter is compressed. As the cutter continues to descend, the elastic support between the pin pressing mold and the cutter is compressed, and the elastic pressing force of the pin pressing mold on the pin gradually increases. As the cutter continues to descend, the cutter head cooperates with the edge of the support table to cut off the pin.

[0017] (3) Multiple positioning slots can be set on the top of the base, which can cut and process multiple semiconductor chips at the same time, thereby improving the pin processing efficiency of semiconductor chips. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the semiconductor chip pin cutting device of this utility model.

[0019] Figure 2 This is one of the partial structural schematic diagrams of the semiconductor chip pin cutting device in this utility model.

[0020] Figure 3 This is the second partial structural schematic diagram of the semiconductor chip pin cutting device of this utility model.

[0021] Figure 4 for Figure 3 Cross-sectional view at point AA. Detailed Implementation

[0022] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The descriptions of the exemplary embodiments are merely illustrative and are not intended to limit the present invention or its application or use in any way. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present invention thorough and complete, and to fully express the scope of the present invention to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions, and values ​​set forth in these embodiments should be interpreted as merely exemplary and not as limiting.

[0023] The terms "first," "second," and similar words used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. Words such as "including" or "comprising" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] like Figures 1 to 4As shown, a semiconductor chip pin cutting device includes a base 1. At least two positioning grooves 8 are evenly arranged along the axial direction on the top of the base 1. A support platform 83 is provided inside the positioning groove 8, and the interior of the positioning groove 8 matches the semiconductor chip. Pin clearance grooves 81 matching the pins of the semiconductor chip are opened on both sides of the positioning groove 8. A support platform 82 corresponding to the pins of the semiconductor chip is provided between the bottom of the positioning groove 8 and the base 1. A cutter 3 is slidably arranged vertically above the positioning groove 8. A cutting drive mechanism 4 for driving the cutter 3 to move up and down is provided on the top of the cutter 3. The cutter 3 has an inverted "U"-shaped groove structure. A cutting head 31 that cooperates with the support platform 82 is provided at the bottom of the cutter 3. A pin pressing mold 5 is slidably arranged inside the cutter 3, and the pin pressing mold 5 and the cutter 3 are elastically supported. In this embodiment, the semiconductor chip is placed on the positioning groove 8. Positioning is achieved within the slot 8. The semiconductor chip's pins extend outward from the pin clearance slot 81 and abut against the top of the support platform 82, thus achieving precise positioning of the semiconductor chip. The cutting drive mechanism 4 drives the cutter 3 downward to cut the pins. Before cutting, the pin pressing mold 5 contacts the top of the pin, and the pin pressing mold 5 cooperates with the support platform 82 to clamp and fix the pin. The elastic support between the pin pressing mold 5 and the cutter 3 is compressed. As the cutter 3 continues to descend, the elastic support between the pin pressing mold 5 and the cutter 3 is compressed, and the elastic pressing force of the pin pressing mold 5 on the pin gradually increases. As the cutter 3 continues to descend, the cutter head 31 cooperates with the edge of the support platform 82 to cut the pin. Multiple positioning slots 8 can be provided on the top of the base 1, which can simultaneously cut multiple semiconductor chips, improving the pin processing efficiency of semiconductor chips.

[0025] In some embodiments, the lead mold 5 has an inverted "U" shaped groove structure. The lead mold 5 is provided with a chip pre-pressing mechanism 6 corresponding to the support platform 83. The support platform 83 provides support for the bottom of the semiconductor chip. The chip pre-pressing mechanism 6 can press and fix the main body of the semiconductor chip in the positioning groove 8 before the lead mold 5 contacts the lead. This prevents the lead on both sides of the semiconductor chip from jumping out of the positioning groove 8 without contacting the lead mold 5 at the same time, which would affect the subsequent cutting process or even cause damage to the semiconductor chip.

[0026] In some embodiments, such as Figure 4As shown, the chip pre-compression mechanism 6 has a buffer cylinder 61 fixedly installed on the top of the pin mold 5. The top of the buffer cylinder 61 is closed, and a slider 66 is slidably installed inside the buffer cylinder 61. A pre-compression spring 63 is installed between the top of the slider 66 and the inner top of the buffer cylinder 61. A pre-compression rod 62 is fixedly installed at the bottom of the slider 66 and slidably connected to the pin mold 5. When the bottom end of the pre-compression rod 62 abuts against the top of the semiconductor chip body, it no longer moves. As the cutter 3 and the pin mold 5 continue to move downward, the pre-compression rod 62 pushes the slider 66 upward to compress the pre-compression spring 63. The pre-compression spring 63 applies elastic force to the pre-compression rod 62, pressing and fixing the semiconductor chip body inside the positioning groove 8.

[0027] In some embodiments, a preload plate 64 is fixedly provided at the bottom end of the preload rod 62, and a pad 65 is fixedly provided at the bottom of the preload plate 64; specifically, the pad 65 is a rubber plate.

[0028] In some embodiments, guide rods 7 are vertically fixed at the top of both ends of the pin mold 5. The guide rods 7 are slidably connected to the top of the cutter 3. A limit plate 71 is fixedly provided at the top of the guide rods 7. A compression spring 72 is fitted on the outside of the guide rods 7 between the cutter 3 and the pin mold 5. The compression spring 72 provides elastic support between the cutter 3 and the pin mold 5.

[0029] In some embodiments, a support 2 is provided on the top of the base 1, and the cutting drive mechanism 4 has a hydraulic cylinder 41 fixedly provided on the top of the support 2. Slide rods 42 are vertically fixedly provided on the top of both ends of the cutter 3. The slide rods 42 are slidably connected to the top of the support 2. The hydraulic cylinder 41 drives the cutter 3 to move up and down to cut the pin.

[0030] In some embodiments, the base 1 has a hollow interior structure. The top of the base 1 has a drop hole 11 for receiving the pins of the cut semiconductor chip. The drop hole 11 corresponds to the pins of the semiconductor chip to be cut inside the positioning groove 8. A collection drawer 12 is slidably inserted into one side of the base 1. After the pins of the semiconductor chip to be cut are cut off, they fall into the collection drawer 12 for collection and processing.

[0031] In some embodiments, the top of the base 1 is provided with five positioning grooves 8 evenly arranged along its axial direction, which can simultaneously cut and process the pins of five semiconductor chips.

[0032] The various embodiments of this utility model have now been described in detail. To avoid obscuring the concept of this utility model, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0033] The embodiments described above only illustrate some implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A semiconductor chip pin cutting device, characterized in that: The device includes a base, on the top of which at least two positioning grooves are evenly arranged along its axial direction. A support platform is provided inside the positioning groove. The interior of the positioning groove matches the semiconductor chip. Pin clearance grooves matching the pins of the semiconductor chip are opened on both sides of the positioning groove. A support platform corresponding to the pins of the semiconductor chip is provided between the bottom of the positioning groove and the base. A cutter is slidably disposed above the positioning groove in a vertical direction. A cutting drive mechanism is disposed at the top of the cutter to drive the cutter to move up and down. The cutter has an inverted "U" shaped groove structure. A cutter head that cooperates with the support platform is disposed at the bottom of the cutter. A pin pressing mold is slidably disposed inside the cutter. The pin pressing mold and the cutter are elastically supported.

2. The semiconductor chip pin cutting device according to claim 1, characterized in that: The pin mold has an inverted "U" shaped groove structure, and the inside of the pin mold is provided with a chip pre-pressing mechanism corresponding to the support platform.

3. The semiconductor chip pin cutting apparatus according to claim 2, characterized in that: The chip pre-compression mechanism has a buffer cylinder fixedly disposed on the top of the pin compression mold. A slider is slidably disposed inside the buffer cylinder. A pre-compression spring is disposed between the top of the slider and the inner top of the buffer cylinder. A pre-compression rod is fixedly disposed at the bottom of the slider and slidably connected to the pin compression mold.

4. The semiconductor chip pin cutting apparatus according to claim 3, characterized in that: A preload plate is fixedly installed at the bottom end of the preload rod, and a pad is fixedly installed at the bottom of the preload plate.

5. The semiconductor chip pin cutting apparatus according to claim 1, characterized in that: Guide rods are vertically fixed at the top of both ends of the pin mold. The guide rods are slidably connected to the top of the cutter. A limit plate is fixedly installed at the top of the guide rod. A compression spring is fitted on the outside of the guide rod between the cutter and the pin mold.

6. The semiconductor chip pin cutting apparatus according to claim 1, characterized in that: The base is provided with a bracket on top, the cutting drive mechanism has a hydraulic cylinder fixedly mounted on the top of the bracket, and both ends of the cutter are vertically fixed with slide rods, which are slidably connected to the top of the bracket.

7. The semiconductor chip pin cutting apparatus according to claim 1, characterized in that: The base has a hollow interior, and the top of the base has a drop hole for receiving the pins of the cut semiconductor chip. A collection drawer is slidably inserted into one side of the base.

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