Integrated busbar of bracket formed by plastic uptake

Abstract

The utility model relates to an integrated busbar adopting a bracket formed by plastic uptake. The integrated busbar comprises the plastic uptake bracket, a plurality of confluence pieces and an acquisition assembly, a plurality of mounting grooves are formed in the plastic uptake support, and one confluence piece is mounted in one mounting groove; the middle position of the confluence piece arches to form a buffer arm, the buffer arm and the mounting groove are arranged at an interval, and the distance between the buffer arm and the mounting groove is greater than the thickness of the acquisition branch; the collecting assembly is arranged on the blister support and provided with a plurality of collecting branches, and each collecting branch is fixedly connected to the bottom of the buffer arm of the corresponding confluence piece. Compared with the prior art, the integrated busbar has the advantages that the acquisition branches are connected to the bottoms of the buffer arms of the confluence pieces, and compared with the prior art that the acquisition branches are connected to the top surfaces of the confluence pieces, the distance between the acquisition branches and the bottoms of the confluence pieces is smaller in an assembly state, so that the depth of the mounting grooves can be set to be relatively shallower; therefore, the problem that the service life of the blister bracket is shortened due to insufficient strength of corners of the mounting groove caused by too deep depth of the mounting groove is solved.

Description

Technical Field

[0001] This utility model belongs to the field of integrated busbar technology, specifically relating to an integrated busbar using a vacuum-formed bracket. Background Technology

[0002] Existing integrated busbars are formed using vacuum forming or injection molding. Because the bracket needs to have grooves for mounting busbars and data acquisition components, vacuum-formed brackets exhibit wall thinning at the corners of these grooves. This reduces the structural strength at those locations and affects the service life.

[0003] In existing busbars, to reduce the impact of battery cell expansion on the reliability of the connection between the busbar and the battery cell, an upward-arched buffer structure is set at the center of the busbar. During assembly, the busbar is installed in the groove of the bracket, and the collection branch of the acquisition component is fixed to the top surface of the busbar. This buffer structure on the busbar also means that the groove on the bracket needs to be deep enough to accommodate the busbar, but this will exacerbate the wall thinning at the corners of the groove, further reducing the structural strength at those locations. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide an integrated busbar with a support using vacuum forming.

[0005] To achieve the above objectives, this utility model discloses an integrated busbar using a vacuum-formed bracket, comprising a vacuum-formed bracket, multiple busbar components, and a data acquisition assembly;

[0006] The vacuum forming bracket is provided with multiple mounting slots, and a manifold is installed in one mounting slot;

[0007] The middle position of the manifold is arched to form a buffer arm, and the buffer arm is spaced apart from the mounting groove, with the distance between the two being greater than the thickness of the acquisition branch.

[0008] The acquisition component is mounted on the blister bracket. The acquisition component has multiple acquisition branches, and one acquisition branch is fixedly connected to the bottom of the buffer arm of a manifold.

[0009] Preferably, the top surface of the acquisition branch is coplanar with the bottom surface of the buffer arm.

[0010] Preferably, the acquisition component includes an acquisition element and multiple conductive connecting pieces, with both ends of the conductive connecting pieces welded and fixed to the acquisition element and the busbar element, respectively.

[0011] Preferably, the thermoforming bracket has a first through hole at a position opposite to the welding position of the conductive connecting piece and the busbar.

[0012] Preferably, the acquisition device is a flexible printed circuit board, which has multiple connecting arms. Each conductive connecting piece is connected to the bottom of a connecting arm, and the connecting arms and conductive connecting pieces form the acquisition branch.

[0013] Preferably, the vacuum forming bracket has a clearance groove at a position opposite to the welding position of the conductive connecting piece and the connecting arm.

[0014] Preferably, the blister packer is provided with a plurality of second hot-riveting posts, and the flexible printed circuit board is fixed to the blister packer by the plurality of second hot-riveting posts.

[0015] Preferably, there is a gap between the entire buffer arm and the blister bracket.

[0016] Preferably, the distance between the bottom surface of the buffer arm and the bottom of the mounting groove is 1.5mm to 1.8mm.

[0017] Preferably, the mounting groove is provided with two first hot riveting posts, and the manifold is fixed in the mounting groove by the two hot riveting posts.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] The integrated busbar of this utility model, based on the buffer arm set on the busbar to alleviate the impact of cell expansion, fixes the acquisition branch to the bottom of the buffer arm of the busbar. Compared with the prior art that connects the acquisition branch to the top surface of the busbar, the distance between the acquisition branch and the bottom of the busbar is smaller in the assembled state. As a result, the depth of the mounting groove can be set relatively shallower. This alleviates the problem of insufficient strength at the corners of the mounting groove and reduced service life of the blister bracket caused by excessive mounting groove depth.

[0020] The buffer arm and the mounting slot are spaced apart, and the distance between them is greater than the thickness of the acquisition branch. This provides assembly space for the connection between the acquisition branch and the busbar, and at the same time, it can avoid damage to the bracket during the connection process. Attached Figure Description

[0021] Figure 1 The above view shows the integrated busbar of the vacuum-formed bracket in the embodiment.

[0022] Figure 2 for Figure 1 A three-dimensional exploded view of the integrated busbar with a vacuum-formed bracket;

[0023] Figure 3 for Figure 1 A cross-sectional view of an integrated busbar using a vacuum-formed bracket;

[0024] 10. Vacuum forming bracket; 11. Mounting groove; 12. First hot riveting post; 13. First through hole; 14. Clearance groove; 15. Second hot riveting post; 16. Second through hole;

[0025] Busbar 20; Buffer arm 21;

[0026] Acquisition component 30; acquisition element 31; connecting arm 32; conductive connecting piece 33. Detailed Implementation

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] An integrated busbar using a vacuum-formed bracket, see [link / reference]. Figures 1-3 It includes a blister pack 10, multiple manifolds 20 and a collection component 30. The accompanying drawings of this embodiment only show a portion of the structure of the blister pack 10, a portion of the structure of a manifold 20 and a portion of the structure of the collection component 30.

[0029] The vacuum forming bracket 10 is provided with multiple mounting slots 11, and a manifold 20 is installed in one mounting slot 11. Specifically, the mounting slot 11 is provided with two first hot riveting posts 12, and the manifold 20 is fixed in the mounting slot 11 by the two hot riveting posts.

[0030] The middle position of the manifold 20 is arched to form a buffer arm 21. The buffer arm 21 and the mounting groove 11 are spaced apart, and the distance between them is greater than the thickness of the collection branch. The collection assembly 30 is mounted on the blister bracket 10. The collection assembly 30 has multiple collection branches, and one collection branch is fixedly connected to the bottom of the buffer arm 21 of a manifold 20.

[0031] In this embodiment, the integrated busbar, with a buffer arm 21 on the busbar 20 to mitigate the impact of cell expansion, has a data acquisition branch fixedly connected to the bottom of the buffer arm 21 of the busbar 20. Compared to the prior art where the data acquisition branch is connected to the top surface of the busbar 20, the distance between the data acquisition branch and the bottom of the busbar 20 is smaller in the assembled state. Therefore, the depth of the mounting groove 11 can be set relatively shallower, alleviating the problem of insufficient strength at the corners of the mounting groove 11 and reduced service life of the blister bracket 10 due to excessive depth. The buffer arm 21 and the mounting groove 11 are spaced apart, and the distance between them is greater than the thickness of the data acquisition branch. This provides assembly space for the connection between the data acquisition branch and the busbar 20, while also preventing damage to the bracket during the connection process.

[0032] In this embodiment, the acquisition component 30 includes an acquisition element 31 and multiple conductive connecting pieces 33 (such as nickel sheets). The two ends of the conductive connecting pieces 33 are welded and fixed to the acquisition element 31 and the busbar 20, respectively. The structure and connection method of this acquisition component 30 are existing structures. In this embodiment, the distance between the buffer arm 21 and the mounting groove 11 is configured to be greater than the thickness of the acquisition branch. This has a better effect on this acquisition component 30. Specifically, since there is a certain distance between the two, it can greatly alleviate the problem of deformation, scorching, or even puncture of the vacuum forming bracket 10 caused by the high temperature generated during laser welding of the conductive connecting pieces 33 and the busbar 20.

[0033] To fully protect the blister packer 10, a gap exists between the entire buffer arm 21 and the blister packer 10. More specifically, the distance between the bottom surface of the buffer arm 21 and the bottom of the mounting groove 11 is 1.5mm to 1.8mm. This dimension is suitable for existing structures, ensuring good performance while offering strong versatility.

[0034] In this embodiment, in order to facilitate the welding of the busbar 20 and the conductive connecting piece 33, the top surface of the conductive connecting piece 33 and the bottom surface of the buffer arm 21 are coplanar. In this way, the two can be flat, which can ensure the welding effect and reduce the occurrence of incomplete welding.

[0035] To further reduce the impact of welding the busbar 20 and the conductive connecting piece 33 on the vacuum forming bracket 10, a first through hole 13 is provided on the vacuum forming bracket 10 at a position opposite to the welding position of the conductive connecting piece 33 and the busbar 20. Since the temperature is highest at the position opposite the weld point, setting this position as a through hole completely avoids problems such as deformation, burning, or even breakdown. In this embodiment, the conductive connecting piece 33 is located below the busbar 20, and the first through hole 13 is provided, allowing welding to be performed from one side of the first through hole 13 when welding the acquisition branch and the busbar 20, making welding more convenient and ensuring welding quality.

[0036] In this embodiment, the acquisition component 31 is a flexible printed circuit board with multiple connecting arms 32. Each conductive connecting piece 33 is connected to the bottom of a connecting arm 32, which protects the connection position between the conductive connecting piece 33 and the busbar 20 and improves the connection reliability. The connecting arm 32 and the corresponding conductive connecting piece 33 form the acquisition branch described above.

[0037] In this embodiment, a relief groove 14 is provided on the vacuum forming bracket 10 at a position opposite to the welding position of the conductive connecting piece 33 and the connecting arm 32. The welding point of the conductive connecting piece 33 and the connecting arm 32 can be located in the relief groove 14 to avoid the problem of the connection position protruding due to the welding point.

[0038] In this embodiment, the blister bracket 10 is provided with a plurality of second hot riveting posts 15, and the flexible printed circuit board is fixed to the blister bracket 10 by the plurality of second hot riveting posts 15.

[0039] In this embodiment, the vacuum forming bracket 10 is also provided with a second through hole 16 that allows the busbar 20 to be welded to the battery cell.

[0040] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An integrated busbar using a vacuum-formed bracket, characterized in that: Includes a vacuum-formed bracket, multiple busbars, and a data acquisition assembly; The vacuum forming bracket is provided with multiple mounting slots, and a manifold is installed in one mounting slot; The middle position of the manifold is arched to form a buffer arm, and the buffer arm is spaced apart from the mounting groove, with the distance between the two being greater than the thickness of the acquisition branch. The acquisition component is mounted on the blister bracket. The acquisition component has multiple acquisition branches, and one acquisition branch is fixedly connected to the bottom of the buffer arm of a manifold.

2. The integrated busbar with a vacuum-formed bracket according to claim 1, characterized in that: The top surface of the acquisition branch is coplanar with the bottom surface of the buffer arm.

3. The integrated busbar with a vacuum-formed bracket according to claim 1, characterized in that: The acquisition component includes an acquisition element and multiple conductive connecting pieces, with both ends of the conductive connecting pieces welded and fixed to the acquisition element and the busbar, respectively.

4. The integrated busbar with a vacuum-formed bracket according to claim 3, characterized in that: The thermoforming bracket has a first through hole at a position opposite to the welding position of the conductive connecting piece and the busbar.

5. The integrated busbar using a vacuum-formed bracket according to claim 3, characterized in that: The acquisition device is a flexible printed circuit board with multiple connecting arms. Each conductive connecting piece is connected to the bottom of a connecting arm, and the connecting arms and conductive connecting pieces form the acquisition branch.

6. The integrated busbar using a vacuum-formed bracket according to claim 5, characterized in that: The vacuum forming bracket is provided with a clearance groove at the position opposite to the welding position of the conductive connecting piece and the connecting arm.

7. The integrated busbar of the vacuum-formed bracket according to claim 5, characterized in that: The blister pack is provided with multiple second hot-riveting posts, and the flexible printed circuit board is fixed to the blister pack through the multiple second hot-riveting posts.

8. The integrated busbar of the vacuum-formed bracket according to claim 1, characterized in that: There is a gap between the entire buffer arm and the blister bracket.

9. The integrated busbar of the vacuum-formed bracket according to claim 8, characterized in that: The distance between the bottom surface of the buffer arm and the bottom of the mounting groove is 1.5mm to 1.8mm.

10. The integrated busbar of the vacuum-formed bracket according to claim 1, characterized in that: The mounting groove is provided with two first hot riveting posts, and the manifold is fixed in the mounting groove by the two hot riveting posts.

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