Integrated busbar
By setting through holes and spacing between the acquisition end and the busbar on the integrated busbar bracket, combined with a buffer arm and a vacuum forming bracket, the problems of thermal deformation and breakdown during laser welding are solved, thereby improving the heat dissipation and service life of the busbar.
Patent Information
- Application Number
- CN202520158976.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-01-22
AI Technical Summary
Existing integrated busbars suffer from thermal deformation and breakdown during laser welding, which affects the aesthetics and lifespan of the bracket and results in poor heat dissipation.
Through holes are provided on the bracket to avoid thermal deformation and breakdown. The acquisition end is spaced apart from the busbar. A buffer arm design is used to mitigate thermal expansion. A blister bracket and a flexible printed circuit board are used to improve connection stability and heat dissipation.
It effectively avoids thermal deformation and breakdown during laser welding, improves the aesthetics and service life of the bracket, and enhances heat dissipation and connection reliability.
Smart Images

Figure CN223828666U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of battery technology, specifically relating to an integrated busbar. Background Technology
[0002] In existing integrated busbars, the acquisition ends of some acquisition components (such as nickel sheets on FPCs or bare copper on FPC acquisition branches) are laser-welded to the busbars. Because a lot of heat is generated during the laser welding process, the position on the integrated busbar support opposite to the welding position will be deformed due to the high temperature. In fact, the problem of heat deformation and charring may occur when the laser welding process breaks down. This not only affects the appearance of the support, but also affects the service life of the support. Utility Model Content
[0003] The purpose of this invention is to overcome the shortcomings of the existing technology and provide an integrated busbar.
[0004] To achieve the above objectives, this utility model discloses an integrated busbar, including a bracket, multiple busbar components, and a data acquisition component;
[0005] The plurality of busbars and the acquisition assembly are mounted on the bracket;
[0006] The acquisition component has multiple acquisition branches, the free end of each acquisition branch is the acquisition end, and the acquisition end of one acquisition branch is laser welded to a busbar.
[0007] The bracket is provided with a first through hole at a position opposite to the welding position of the acquisition end and the manifold.
[0008] Preferably, the first through hole is located on the inner side of the end face of the acquisition end.
[0009] Preferably, the welding positions of the acquisition end and the manifold are spaced apart from the bracket.
[0010] Preferably, the middle position of the manifold is arched to form a buffer arm, the acquisition end is welded to the buffer arm, and the entire buffer arm is spaced apart from the bracket.
[0011] Preferably, the distance between the buffer arm and the bracket is 1.5mm to 1.8mm.
[0012] Preferably, the bracket is a vacuum-formed bracket with multiple mounting slots, and one manifold is installed in one mounting slot; the collecting end is welded to the bottom of the manifold.
[0013] Preferably, the top surface of the acquisition end is coplanar with the bottom surface of the manifold.
[0014] Preferably, the acquisition component includes an acquisition element and multiple conductive connecting pieces, with both ends of the conductive connecting pieces welded and fixed to the acquisition element and the busbar, respectively.
[0015] Preferably, the acquisition component is a flexible printed circuit board, which has multiple connecting arms. Each conductive connecting piece is connected to the bottom of a connecting arm, and the connecting arms and conductive connecting pieces form the acquisition branch.
[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0017] The integrated busbar of this utility model has a first through hole on the bracket at the position opposite to the welding position of the acquisition end and the busbar. In this way, during the laser welding process, the presence of the first through hole can avoid the problem of thermal deformation in this local position (the position on the bracket opposite to the welding position of the acquisition end and the busbar), as well as the problem of thermal deformation and charring when laser welding breaks down, thus ensuring the aesthetics of the bracket and improving the service life of the bracket.
[0018] In addition, the heat generated during laser welding can be dissipated through the first through hole, improving the heat dissipation effect during the welding process. Attached Figure Description
[0019] Figure 1 This is a top view of the integrated busbar in the embodiment;
[0020] Figure 2 for Figure 1 A bottom view of the integrated busbar;
[0021] Figure 3 for Figure 1 A cross-sectional view of the integrated busbar;
[0022] Figure 4 for Figure 1 A three-dimensional exploded view of the integrated busbar;
[0023] Bracket 100; Mounting slot 110; First hot riveting post 111; First through hole 120; Clearance slot 130; Second hot riveting post 140; Second through hole 150;
[0024] Busbar 200; Buffer arm 210;
[0025] Acquisition component 300; acquisition element 310; connecting arm 311; conductive connecting piece 320. Detailed Implementation
[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0027] An integrated busbar, see Figures 1-4The system includes a support 100, multiple busbars 200, and a data acquisition component 300. In this embodiment, the multiple busbars 200 and the data acquisition component 300 are mounted on the support 100. The data acquisition component 300 has multiple data acquisition branches, the free end of which is the data acquisition end. The data acquisition end of one data acquisition branch is laser-welded to one busbar 200.
[0028] Specifically, the bracket 100 has multiple mounting slots 110, each mounting slot 110 has a first hot-riveting post 111, and a busbar 200 (preferably an aluminum busbar) is disposed in a mounting slot 110 and fixed by hot riveting with the first hot-riveting post 111. The acquisition assembly 300 includes an acquisition element 310 and multiple conductive connecting pieces 320. The two ends of the conductive connecting pieces 320 are welded and fixed to the acquisition element 310 and the busbar 200, respectively. The acquisition element 310 is preferably a flexible printed circuit board, and the conductive connecting pieces 320 are preferably nickel sheets. The flexible printed circuit board has multiple connecting arms 311, and each conductive connecting piece 320 is connected to one connecting arm 311. The connecting arms 311 and the conductive connecting pieces 320 form an acquisition branch, and the end of the conductive connecting piece 320 away from the flexible printed circuit board is the acquisition end.
[0029] In this embodiment, a first through hole 120 is provided on the bracket 100 at a position opposite to the welding position of the acquisition end and the busbar 200. Thus, during laser welding, the presence of the first through hole 120 avoids thermal deformation at this localized position (the position on the bracket 100 opposite to the welding position of the acquisition end and the busbar 200), as well as thermal deformation and scorching problems caused by laser welding breakdown, ensuring the aesthetics of the bracket 100 and improving its service life. Furthermore, the heat generated during laser welding can be dissipated through the first through hole 120, improving heat dissipation during the welding process.
[0030] In this embodiment, the first through hole 120 is located on the inner side of the end face of the acquisition end. Welding at this position makes the conductive connecting piece 320 more stable and less likely to affect the welding quality due to end warping.
[0031] In this embodiment, the welding positions of the acquisition end and the busbar 200 are spaced apart from the bracket 100. In this way, the heat generated during the laser welding process of the acquisition end and the busbar 200 is not easily directly conducted to the bracket 100, which greatly alleviates the problem of damage to the bracket 100 caused by the high temperature generated during the welding process.
[0032] Existing battery modules expand during use, which can affect the connection between the busbar 200 and the conductive connector 320. To reduce the impact of cell expansion, existing technology has arched the middle position of the busbar 200 to form a buffer arm 210. In this embodiment, the aforementioned acquisition end is connected to the buffer arm 210.
[0033] The buffer arm 210 is spaced apart from the support 100. This provides deformation space for the expansion of the buffer arm 210 and also alleviates the problem of damage to the support 100 caused by the high temperature during the welding process due to direct contact between the buffer arm 210 and the support 100. Preferably, the distance between the buffer arm 210 and the support 100 is 1.5mm to 1.8mm. Within this distance range, the buffering effect of the busbar 200 is ensured, the damage to the support 100 during laser welding is reduced, and the overall structure is compact.
[0034] In this embodiment, the bracket 100 is a vacuum-formed bracket 100, and the collection end is welded to the bottom of the manifold 200. Compared with the prior art where the collection branch is connected to the top surface of the manifold 200, the distance between the collection branch and the bottom of the manifold 200 is smaller in the assembled state. As a result, the depth of the mounting groove 110 can be set relatively shallower. This alleviates the problem that the corners of the mounting groove 110 are not strong enough due to the excessive depth of the mounting groove 110, which reduces the service life of the vacuum-formed bracket 100.
[0035] Preferably, the top surface of the acquisition end is coplanar with the bottom surface of the manifold 200, so that the two can be flush, which can ensure the welding effect and reduce the occurrence of incomplete welding problems.
[0036] In this embodiment, the conductive connecting piece 320 is connected to the bottom of the corresponding connecting arm 311, which can protect the connection position between the conductive connecting piece 320 and the busbar 200 and improve the connection reliability.
[0037] The bracket 100 is provided with a relief groove 130 at a position opposite to the welding position of the conductive connecting piece 320 and the connecting arm 311. The welding point of the conductive connecting piece 320 and the connecting arm 311 can be located in the relief groove 130 to avoid the problem of the connection position protruding due to the welding point.
[0038] In this embodiment, the bracket 100 is provided with a plurality of second hot riveting posts 140, and the flexible printed circuit board is fixed to the bracket 100 by the plurality of second hot riveting posts 140.
[0039] In this embodiment, the bracket 100 is also provided with a second through hole 150 that allows the busbar 200 to be welded to the battery cell.
[0040] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. An integrated busbar, characterized in that: Includes a support frame, multiple busbars, and a data acquisition assembly; The plurality of busbars and the acquisition assembly are mounted on the bracket; The acquisition component has multiple acquisition branches, the free end of the acquisition branch is the acquisition end, and the acquisition end of one acquisition branch is laser welded to a busbar. The bracket is provided with a first through hole at a position opposite to the welding position of the acquisition end and the manifold.
2. The integrated busbar according to claim 1, characterized in that: The first through hole is located on the inner side of the end face of the acquisition end.
3. The integrated busbar according to claim 1, characterized in that: The welding positions of the acquisition end and the manifold are spaced apart from the bracket.
4. The integrated busbar according to claim 3, characterized in that: The middle position of the manifold is arched to form a buffer arm, and the acquisition end is welded to the buffer arm. The entire buffer arm is spaced apart from the bracket.
5. The integrated busbar according to claim 4, characterized in that: The distance between the buffer arm and the bracket is 1.5mm to 1.8mm.
6. The integrated busbar according to claim 1, characterized in that: The bracket is a vacuum-formed bracket with multiple mounting slots, and a manifold is installed in one mounting slot; the collecting end is welded to the bottom of the manifold.
7. The integrated busbar according to claim 6, characterized in that: The top surface of the acquisition end is coplanar with the bottom surface of the manifold.
8. The integrated busbar according to claim 1, characterized in that: The acquisition component includes an acquisition element and multiple conductive connecting pieces, with both ends of the conductive connecting pieces welded and fixed to the acquisition element and the busbar, respectively.
9. The integrated busbar according to claim 8, characterized in that: The acquisition device is a flexible printed circuit board with multiple connecting arms. Each conductive connecting piece is connected to the bottom of a connecting arm, and the connecting arms and conductive connecting pieces form the acquisition branch.