Display module and display device

Abstract

The utility model relates to a display module and a display device.The display module comprises an array substrate, a color film substrate and a cover plate, the array substrate and the color film substrate are oppositely arranged, the cover plate is located on the side, away from the array substrate, of the color film substrate, and in the first direction, the array substrate comprises a first area covered by the color film substrate, the second area is not covered by the color film substrate, and a protective adhesive layer is arranged on one surface, facing the cover plate, of the second area; in the second direction perpendicular to the first direction, the second area comprises a binding area and edge areas located on the two opposite sides of the binding area, a supporting adhesive layer is arranged between the part, located on the edge areas, of the protection adhesive layer and the cover plate, and an isolation layer is arranged between the supporting adhesive layer and the protection adhesive layer.

Description

Technical Field

[0001] This disclosure relates to the field of display product manufacturing technology, and in particular to a display module and a display device. Background Technology

[0002] In recent years, with intensified competition among major brands in the mobile consumer electronics industry, manufacturers have increasingly pursued cost-cutting measures. The global consumer electronics industry has gradually shifted to regions with lower labor costs, such as Southeast Asia and India. This has led to domestically produced display modules being shipped to overseas OEMs for assembly. Due to the extended supply chain, the transit time for many display modules to overseas OEMs has increased. Often, products cannot be assembled immediately in the OEM warehouse, requiring storage for 1-3 months or even longer before assembly. This prolonged storage has also led to new defects in display modules that were never encountered during domestic assembly, resulting in mass product returns and even production halts by customers. One typical problem is the greening defect on both ends of the DP (bonding) side of the display module. This is mainly caused by fluorescent agents in the adhesive of the single-layer area of ​​the panel. These fluorescent agents will appear green under strong lighting in a dark workshop environment. Utility Model Content

[0003] To address the aforementioned technical problems, this disclosure provides a display module and a display device that solve the problem of poor greening on the bonding side of the display module.

[0004] To achieve the above objectives, the technical solution adopted in this disclosure is: a display module, including an array substrate and a color filter substrate disposed opposite to each other, and a cover plate located on the side of the color filter substrate away from the array substrate;

[0005] Along the first direction, the array substrate includes a first region covered by the color filter substrate and a second region not covered by the color filter substrate, wherein a protective adhesive layer is disposed on the side of the second region facing the cover plate;

[0006] In a second direction perpendicular to the first direction, the second region includes a bonding area and edge areas located on opposite sides of the bonding area. A supporting adhesive layer is provided between the portion of the protective adhesive layer located in the edge area and the cover plate, and an insulating layer is provided between the supporting adhesive layer and the protective adhesive layer.

[0007] Optionally, the orthographic projection of the insulating layer on the array substrate overlaps the orthographic projection of the supporting adhesive layer on the array substrate.

[0008] Optionally, the insulating layer is made of tape, and the insulating layer includes a substrate layer and an adhesive layer disposed on the substrate layer, wherein the adhesive layer is bonded to the protective adhesive layer.

[0009] Optionally, the material of the substrate layer is polyethylene terephthalate.

[0010] Optionally, a driver IC is provided on the bonding area;

[0011] The display module also includes a flexible circuit board, one end of which is bonded to the bonding area.

[0012] The display module further includes a conductive metal layer, which covers the driver IC and part of the flexible circuit board.

[0013] The conductive metal layer includes a first part and a second part. The orthographic projection of the first part on the array substrate is located in the second region. The second part covers a portion of the flexible circuit board. In the second direction, the first part includes a first sub-part, a second sub-part, and a third sub-part. The second sub-part is disposed in the bonding region. The first sub-part and the third sub-part are disposed in the edge region and reused as the isolation layer.

[0014] Optionally, the insulating layer is an ink layer disposed on the protective adhesive layer.

[0015] This disclosure also provides a display device, including the display module described above.

[0016] This disclosure also provides a method for manufacturing a display module, used to manufacture the above-mentioned display module, the method comprising:

[0017] Cell array substrate and color filter substrate;

[0018] A protective adhesive layer is formed in a second region of the array substrate. In a second direction perpendicular to the first direction, the second region includes a bonding region and edge regions located on opposite sides of the bonding region.

[0019] An insulating layer is formed on the portion of the protective adhesive layer located in the edge area;

[0020] A supporting adhesive layer is formed on the insulating layer;

[0021] A polarizer is attached to the light-emitting side of the color filter substrate;

[0022] A cover plate is attached to the side of the polarizer away from the color filter substrate.

[0023] Optionally, the insulating layer is made of tape, and the insulating layer includes a substrate layer and an adhesive layer disposed on the substrate layer;

[0024] An insulating layer is formed on the portion of the protective adhesive layer located in the edge area, specifically including:

[0025] A positioning film is provided, and a tape of a preset shape is placed on the positioning film at a preset position;

[0026] The positioning film is positioned using a bonding fixture so that the tape on the positioning film is aligned with the bonding position on the array substrate.

[0027] Apply the tape and remove the positioning film.

[0028] Optionally, a driver IC is provided on the bonding area;

[0029] The display module also includes a flexible circuit board, one end of which is bonded to the bonding area.

[0030] The display module further includes a conductive metal layer, which covers the driver IC and part of the flexible circuit board.

[0031] The conductive metal layer includes a first portion, the orthographic projection of the first portion on the array substrate being located in the second region, and the insulating layer being formed by the first portion extending in the second direction toward opposite sides of the driving IC;

[0032] An insulating layer is formed on the portion of the protective adhesive layer located in the edge area, specifically including:

[0033] The conductive metal layer is formed on the protective adhesive layer to complete the setting of the insulating layer.

[0034] Optionally, the insulating layer is an ink layer formed by printing ink on the protective adhesive layer;

[0035] An insulating layer is formed on the portion of the protective adhesive layer located in the edge area, specifically including:

[0036] A screen printing stencil is attached to the edge area of ​​the second region, and ink is filled onto the screen printing stencil.

[0037] The ink layer is formed in the edge area by coating and printing.

[0038] The beneficial effects of this disclosure are as follows: The display module provided in this embodiment includes an array substrate and a color filter substrate arranged opposite to each other. A cover plate is attached to the light-emitting side of the color filter substrate through an optical adhesive layer. The array substrate includes a first area covered by the color filter substrate and a second area not covered by the color filter substrate. A protective adhesive layer is coated on the second area. The second area includes a bonding area and edge areas disposed on opposite sides of the bonding area. In the edge areas, an isolation layer and a support adhesive layer are stacked between the protective adhesive layer and the cover plate. By providing an isolation adhesive layer between the protective adhesive layer and the support adhesive layer, the protective adhesive layer and the support adhesive layer are isolated, preventing the phosphor in the protective adhesive layer from diffusing into the support adhesive layer, thereby preventing the phosphor from continuing to diffuse into the optical adhesive layer through the support adhesive layer, thus solving the problem of poor greening on the bonding side of the display module. Attached Figure Description

[0039] Figure 1 This is a schematic diagram showing the structure of the display module in an embodiment of this disclosure;

[0040] Figure 2 A schematic diagram showing the bonding side of the display module in an embodiment of this disclosure;

[0041] Figure 3 A schematic diagram showing the positioning film for attaching single-sided adhesive tape in an embodiment of this disclosure;

[0042] Figure 4 A schematic diagram illustrating conductive copper foil in conventional technology;

[0043] Figure 5 A schematic diagram showing the bonding side of the display module in an embodiment of this disclosure;

[0044] Figure 6 This is a schematic diagram illustrating the conductive copper foil in an embodiment of the present disclosure. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0046] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0047] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0048] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0049] Liquid crystal display (LCD) panels in related technologies generally include a color filter substrate and an array substrate sequentially disposed from the display side to the back side of the LCD panel, with a liquid crystal layer sandwiched between the color filter substrate and the array substrate. The array substrate includes a first region covered by the color filter substrate and a second region not covered by the color filter substrate. The second region has bonding areas for bonding integrated circuit (IC) chips and flexible printed circuit (FPC) chips. Since the second region extends outwards relative to the edge of the color filter substrate, a protective adhesive layer is coated on the second region to prevent corrosion of the circuitry within the second region by moisture, which could lead to functional defects. Because the second region extends outwards relative to the edge of the color filter substrate and has a certain gap between it and the glass cover plate located on the display side of the LCD panel, a support adhesive layer is used to fill this gap after bonding the IC and FPC in the bonding area. The purpose of the support adhesive layer is to support the second region, enhancing its strength and preventing single-layer screen breakage during drops of products such as mobile phones. The lower surface of the support adhesive layer is in close contact with the protective adhesive layer, and the upper surface of the support adhesive layer is in direct contact with the cover glass CG.

[0050] When forming a support layer by applying a curable adhesive such as silicone sealant (taking silicone sealant as an example), the cover plate needs to be fully bonded before the silicone sealant cures. This is achieved by pressing the silicone sealant against the cover plate to ensure sufficient contact. During this pressing process, the silicone sealant overflows to the outside. Simultaneously, during the full bonding process, the optically clear adhesive (OCA) used to bond the cover plate, due to its fluidity, also overflows to the outside. Because both the optically clear adhesive and the silicone sealant have overflow areas during the full bonding process, they ultimately come into full contact. In this way, the support layer simultaneously connects the optically clear adhesive and the protective adhesive layer.

[0051] The protective adhesive layer is coated with a fluorescent agent so that the single-layer area of ​​the panel (i.e., the second area) appears light yellow. This makes it easier for operators to check whether there are any omissions in the protective adhesive layer of the second area. It is convenient for operators to observe with the naked eye and avoid the circuits on the display panel from being corroded by moisture and air due to omissions in the protective adhesive layer of the second area, which could lead to functional failure. However, the inventor discovered that the fluorescent molecules in the protective adhesive layer are quite active. Over time, the fluorescent agent will penetrate into the interior of the supporting adhesive layer that is in direct contact with it. Furthermore, because the supporting adhesive layer (made of silicone adhesive) and the OCA optically transparent adhesive (which is used to bond the cover plate) are both soft adhesives after full lamination of the narrow bezel project, they will come into contact with each other due to the deformation caused by excess adhesive. The fluorescent agent that has been transferred to the interior of the supporting adhesive layer will further diffuse into the interior of the optically transparent adhesive. As time goes on, the fluorescent agent further penetrates into the interior of the optically transparent adhesive and reaches the edge of the display area. At this time, under the dark environment of the factory workshop and the illumination of 3000 Lux, a green defect will appear at the edge of the display area of ​​the display panel, causing the OEM to strongly complain about the major defects in the product and to reject the batch. However, this green defect cannot be observed under normal external environment. However, the OEM workshops of each client are equipped with fluorescent lights and snake lights in dark environment, so the defect is triggered and manifested under specific conditions (long storage time + dark environment of the OEM workshop + strong light).

[0052] refer to Figures 1-6 To address the aforementioned issues, this disclosure provides a display module comprising an array substrate 1 and a color filter substrate 2 disposed opposite to each other, and a cover plate 3 located on the side of the color filter substrate 2 away from the array substrate 1.

[0053] Along the first direction (reference) Figure 1 In the X direction), the array substrate 1 includes a first region 11 covered by the color filter substrate 2 and a second region 12 not covered by the color filter substrate 2. A protective adhesive layer 4 is disposed on the side of the second region 12 facing the cover plate 3.

[0054] In the second direction perpendicular to the first direction (reference) Figure 2 In the Y direction, the second region 12 includes a bonding region 101 and edge regions 102 located on opposite sides of the bonding region 101. A supporting adhesive layer 5 is provided between the portion of the protective adhesive layer 4 located in the edge region 102 and the cover plate 3. An insulating layer 6 is provided between the supporting adhesive layer 5 and the protective adhesive layer 4.

[0055] Since the protective adhesive layer 4 is coated to protect the effective circuitry on the array substrate 1 from corrosion by moisture and air, a special process is required to check the coating condition of the protective adhesive layer 4. Therefore, the protective adhesive layer 4 must be colored to facilitate the operator's inspection for any missed coating risks. The support adhesive layer 5 can effectively support the strength of the single-layer area of ​​the array substrate 1 (i.e., the second area 12 not covered by the color filter substrate 2) and prevent the risk of screen breakage from drops. Therefore, both the support adhesive layer 5 and the support adhesive layer 6 are essential structures. To solve the problem of greening defects at the edges of the display module caused by the diffusion of phosphor from the protective adhesive layer 4 into the support adhesive layer 5, in this embodiment, an insulating layer 6 is added between the protective adhesive layer 4 and the support adhesive layer 5 to prevent the phosphor in the protective adhesive layer 4 from diffusing and transferring to the support adhesive layer 5. This prevents the phosphor from transferring into the OCA (optical adhesive layer) used to bond the cover plate 3, thus avoiding the greening defects that occur at the edges of the CG VA area (non-display area of ​​the cover plate 3) under illumination above 3000 LUX in a dark workshop environment.

[0056] The protective adhesive layer 4 is coated on the entire second region 12 and is relatively thin, generally less than or equal to 20 μm. The support adhesive layer 5 is only formed on a part of the second region 12, specifically on the two edge regions 102 on opposite sides of the bonding region 101. In order to provide effective support, the support adhesive layer 5 is relatively thick, generally around 300-400 μm (the thickness of the support adhesive layer 5 is determined according to the spacing between the cover plate 3 and the single-layer region of the array substrate 1 in the product design). The silicone adhesive or other curable adhesive used to make the support adhesive layer 5 has good flowability. In order to avoid direct contact between the support adhesive layer 5 and the protective adhesive layer 4, an isolation layer 6 is provided between the support adhesive layer 5 and the protective adhesive layer 4 to achieve physical isolation. The orthographic projection of the isolation layer 6 on the array substrate 1 covers the orthographic projection of the support adhesive layer 5 on the array substrate 1.

[0057] For example, the support adhesive layer 5 may be formed using silicone adhesive or other curable adhesive materials.

[0058] It should be noted that a polarizer is also provided on the light-emitting side of the color filter substrate 2 (see reference). Figure 1 The upper polarizer (U-POL) is attached to the cover plate 3 via an optical adhesive layer (OCA) on the side of the polarizer away from the color filter substrate 2. Since the protective adhesive layer 4 on the second region 12 is coated across the entire surface, and the support adhesive layer 5 is only located at the edge 102 of the second region 12, although the protective adhesive layer 4 is present in the area of ​​the second region 12 other than where the support adhesive layer 5 is located, the thickness of the protective adhesive layer 4 is less than or equal to 20 μm. However, the optical adhesive layer is located between the polarizer and the cover plate 3, and the sum of the thickness of the polarizer and the color filter substrate 2 is typically greater than 200 μm. In the direction perpendicular to the color filter substrate 2 (refer to...),... Figure 1In the Z direction, the protective adhesive layer 4 cannot directly contact the optical adhesive layer, and the fluorescent agent in the protective adhesive layer 4 has no direct path to diffuse and transfer to the optical adhesive layer. Therefore, it is only necessary to add an insulating layer 6 in the setting area of ​​the supporting adhesive layer 5 (i.e., the edge area 102) to physically isolate the protective adhesive layer 4 and the supporting adhesive layer 5.

[0059] In an exemplary embodiment, the barrier layer 6 is made of tape. The barrier layer 6 includes a substrate layer and an adhesive layer disposed on the substrate layer. The adhesive layer is bonded to the protective adhesive layer 4.

[0060] For example, the material of the substrate layer is polyethylene terephthalate (PET).

[0061] For example, the thickness of the insulating layer 6 is 10um to 30um.

[0062] PET material is a crystalline saturated polyester with highly crystalline polymer characteristics and no flowability. Therefore, it can completely block the diffusion and transfer of fluorescent agents from the protective adhesive layer 4 to the interior of the supporting adhesive layer 5. For example, the insulating layer 6 uses single-sided adhesive tape. The adhesive layer is effectively adhered to the protective adhesive layer 4 to prevent detachment. The supporting adhesive layer 5 is formed by coating on the side of the substrate layer without an adhesive layer. The self-adhesiveness of the curable adhesive material (e.g., silicone sealant) forming the supporting adhesive layer 5 achieves adhesion to the insulating adhesive layer, thereby blocking the path of fluorescent agents in the protective adhesive layer 4 to the optical adhesive layer, thus fundamentally improving the problem of greening at the edges of the display module.

[0063] In an exemplary embodiment, a driver IC is provided on the binding area 101;

[0064] The display module also includes a flexible circuit board 30, one end of which is bonded to the bonding area 101. (Refer to...) Figure 5 ;

[0065] The display module also includes a conductive metal layer 20, which covers the driver IC and part of the flexible circuit board.

[0066] The conductive metal layer 20 includes a first portion 2001 and a second portion 2002. The orthographic projection of the first portion 2001 onto the array substrate 1 is located in the second region 12. The second portion 2002 covers a portion of the flexible circuit board 30. In the second direction, the first portion 2001 includes a first sub-portion 20011, a second sub-portion 20012, and a third sub-portion 20013. The second sub-portion 20012 is disposed in the bonding region, and the first sub-portion 20011 and the third sub-portion 20013 are disposed in the edge region and reused as the insulating layer 6. (Refer to...) Figure 6 ( Figure 6To indicate the positional relationship between the first sub-part 20011, the second sub-part 20012, and the third sub-part 20013, dashed lines are used for differentiation. However, it should be understood that in reality, these dashed lines do not exist. In other words, the insulating layer 6 is formed by the first part 2001 extending in the second direction towards the opposite sides of the driving IC.

[0067] For example, the conductive metal layer 20 is a conductive copper foil, and the thickness of the conductive metal layer 20 is 20-30 μm.

[0068] The flexible circuit board 30 has a grounded exposed copper area for electrical contact with the conductive metal layer 20, thereby driving the electrostatic discharge of the IC, and the conductive metal layer 20 can also serve as electromagnetic shielding.

[0069] contrast Figure 4 and Figure 6 In this embodiment, the structure of the existing conductive metal layer 20 in the display module is improved so that the first portion 2001 of the conductive metal layer 20 extends towards the opposite sides of the driver IC in the second direction to form the isolation layer 6. The isolation layer 6 and the conductive metal layer 20 are integrated into a single structure. When the conductive metal layer 20 is set, the isolation layer 6 is set at the same time, saving steps and simplifying the manufacturing process of the display module.

[0070] In an exemplary embodiment, the insulating layer 6 is an ink layer formed by printing ink on the protective adhesive layer 4.

[0071] For example, the thickness of the ink layer is 15–30 μm.

[0072] After applying the protective adhesive layer 4 to the FOGA (product state before bonding the cover plate 3) semi-finished state of the display module, an ink layer with a thickness of 15um to 30um is printed on the edge area 102 of the second region 12 of the array substrate 1 (i.e., the position where the support adhesive layer 5 is set) by screen printing ink. The ink layer is directly printed onto the surface of the protective adhesive layer 4. Then, silicone adhesive is coated on the surface of the ink layer to form the support adhesive layer 5. The dense ink layer prevents the phosphor in the protective adhesive layer 4 from transferring to the optical adhesive layer.

[0073] In an exemplary embodiment, an antistatic metal layer 7 is provided on the side of the color filter substrate 2 near the second region 12. The antistatic metal layer 7 extends from the color filter substrate 2 to the second region 12 to be electrically connected to the grounding circuit on the second region 12.

[0074] The color filter substrate 2 includes an exposed area exposed to the polarizer, and an antistatic metal layer 7 extends to the exposed area to effectively discharge static electricity.

[0075] For example, the antistatic metal layer 7 may include metal Ag, such as conductive silver paste.

[0076] It should be noted that the antistatic metal layer 7 is applied to the array substrate 1 by drop-dip application. During manufacturing, conductive silver paste is first applied to the display panel, and then a protective adhesive layer 4 is applied to the second area 12, with part of the protective adhesive layer 4 covering the antistatic metal layer 7.

[0077] It should be noted that, in the direction perpendicular to the array substrate 1, the height of the upper surface (the side away from the array substrate 1) of the insulating layer 6 where it does not cover the antistatic metal layer 7 is less than the height of the upper surface (the side away from the array substrate 1) of the color filter substrate 2, ensuring that there is enough supporting adhesive layer 5 to provide support and buffering.

[0078] This disclosure also provides a display device, including the display module described above.

[0079] refer to Figure 1 The display module includes a backlight and a display panel located on the light-emitting side of the backlight;

[0080] The display panel includes an array substrate 1 and a color filter substrate 2 arranged in a cell. A polarizer (U-POL) is provided on the light-emitting side of the color filter substrate 2, and a cover plate 3 is attached to the light-emitting side of the polarizer by an optical adhesive layer.

[0081] The backlight includes a backplate SUS, which includes a base plate and side plates around the base plate. A light guide plate LGP is provided in the space formed by the base plate and the side plates. A light source is provided on the side of the light guide plate LGP. The light source includes an LED-FPC (Light Strip Circuit Board) and LEDs on the LED-FPC.

[0082] The light-emitting side of the light guide plate LGP is provided with an optical film material, which includes a diffuser sheet and a prism sheet (including an upper prism sheet U-prism and a lower prism sheet D-prism) stacked together.

[0083] Curtain tape is installed on the side of the light source away from the base plate;

[0084] A polarizer (lower polarizer D-POL) is provided on the side of the optical film material away from the light guide plate LGP.

[0085] This disclosure also provides a method for manufacturing a display module, used to manufacture the above-mentioned display module, the method comprising:

[0086] Cell array substrate and color filter substrate;

[0087] A protective adhesive layer is formed in a second region of the array substrate. In a second direction perpendicular to the first direction, the second region includes a bonding region and edge regions located on opposite sides of the bonding region.

[0088] An insulating layer is formed on the portion of the protective adhesive layer located at the edge area;

[0089] A supporting adhesive layer is formed on the insulating layer;

[0090] A polarizer is attached to the light-emitting side of the color filter substrate;

[0091] A cover plate is attached to the side of the polarizer away from the color filter substrate.

[0092] In an exemplary embodiment, the insulating layer is made of tape, and the insulating layer includes a substrate layer and an adhesive layer disposed on the substrate layer;

[0093] An insulating layer is formed on the edge portion of the protective adhesive layer, specifically including:

[0094] A positioning film is provided, and a tape of a preset shape is placed on the positioning film at a preset position;

[0095] The positioning film is positioned using a bonding fixture so that the tape on the positioning film is aligned with the position to be bonded on the array substrate.

[0096] Apply the adhesive tape and remove the positioning film.

[0097] Specifically, two separate single-sided adhesive tapes 1002 are attached to a positioning film 100, as shown in the reference. Figure 3 The required shape of the single-sided adhesive tape 1002 is processed by die cutting, ensuring that the two single-sided adhesive tapes 1002 maintain the relative positions required for the display module attachment. With the assistance of the attachment fixture, during attachment, the semi-finished display module in FOGA state is placed in the fixture slot, and the two positioning holes 1001 of the positioning film 100 with the single-sided adhesive tape 1002 are inserted into the positioning pins of the fixture for positioning. At this point, the two single-sided adhesive tapes 1002 are precisely positioned at the required attachment locations on the display module. After the two independent single-sided adhesive tapes 1002 are applied to the second region 12 of the array substrate, the positioning film is removed. After verifying the sample to form a finished TLC, and storing it for 3 months, under 5000 Lux strong light using a serpentine lamp in a dark workshop environment, no greening defects were observed, indicating good performance.

[0098] In an exemplary embodiment, a driver IC is provided on the bonding area;

[0099] The display module also includes a flexible circuit board, one end of which is bonded to the bonding area.

[0100] The display module also includes a conductive metal layer, which covers the driver IC and part of the flexible circuit board.

[0101] The conductive metal layer includes a first portion, the orthographic projection of the first portion on the array substrate is located in a second region, and the insulating layer is formed by the first portion extending toward opposite sides of the driving IC in a second direction.

[0102] An insulating layer is formed on the edge portion of the protective adhesive layer, specifically including:

[0103] A conductive metal layer is formed on the protective adhesive layer to complete the setting of the insulating layer.

[0104] Specifically, such as Figure 5 The diagram shows the conductive copper foil attachment state. The conductive metal layer is the conductive copper foil 20. The traditional conductive copper foil structure is optimized by extending the 20µm & 30µm thick conductive copper foil 20 to both sides. The shape of the extended conductive copper foil on both sides is designed according to the shape of the second region, so that when the conductive copper foil is applied, the extended parts on both sides are directly applied to the protective adhesive layer of the second region, thus serving as the insulating layer 6. In this embodiment, the conductive copper foil 20, while fulfilling its original function (anti-static, etc.), can also act as an insulating layer on both sides, allowing one structural component to serve two purposes simultaneously. Furthermore, it can save a film application step in actual operation. This structure still achieves the purpose of physically isolating the supporting adhesive layer and the protective adhesive layer from contact. After the sample was assembled into a TLCM finished product and stored for 3 months, under 5000Lux strong light from a snake-shaped lamp in a dark workshop environment, no greening defects were observed, indicating good performance.

[0105] In an exemplary embodiment, the insulating layer is an ink layer formed by printing ink on a protective adhesive layer;

[0106] An insulating layer is formed on the edge portion of the protective adhesive layer, specifically including:

[0107] The screen printing stencil is attached to the edge area of ​​the second region, and ink is filled onto the screen printing stencil.

[0108] Printing is performed to form an ink layer in the edge areas.

[0109] Specifically, the process of forming the ink layer is as follows:

[0110] Using a special fixture, the FOGA display module is placed in the fixture slot. A screen printing stencil is attached to the edge area of ​​the second region to support the adhesive layer to be set. Ink is then filled onto the screen printing stencil. A mesh frame is set around the screen printing stencil to prevent ink from overflowing and contaminating the product.

[0111] Start the doctor blade after the ink has finished filling;

[0112] The squeegee begins to move to scrape the ink. The squeegee applies pressure to the ink, causing it to be squeezed out of the mesh openings of the screen printing plate, so that a pattern consistent with the screen printing plate is formed on the second area. After completing one operation, the squeegee is raised and the ink return blade is pressed down, bringing the ink back to the starting position in the return direction without applying pressure, so as to prepare for the next printing.

[0113] As the ink penetrates the mesh openings of the screen printing stencil, a dense ink layer gradually forms on the protective adhesive layer in the second area. The thickness of the ink layer can be controlled by adjusting the number of squeegee strokes.

[0114] After the ink layer is coated, a surface drying process is performed to solidify and solidify the ink layer.

[0115] The following points need to be explained:

[0116] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0117] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0118] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0119] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display module, comprising an array substrate and a color filter substrate disposed opposite to each other, and a cover plate located on the side of the color filter substrate away from the array substrate, characterized in that, Along the first direction, the array substrate includes a first region covered by the color filter substrate and a second region not covered by the color filter substrate, wherein a protective adhesive layer is disposed on the side of the second region facing the cover plate; In a second direction perpendicular to the first direction, the second region includes a bonding area and edge areas located on opposite sides of the bonding area. A supporting adhesive layer is provided between the portion of the protective adhesive layer located in the edge area and the cover plate, and an insulating layer is provided between the supporting adhesive layer and the protective adhesive layer.

2. The display module according to claim 1, characterized in that, The orthogonal projection of the insulating layer on the array substrate overlaps the orthogonal projection of the supporting adhesive layer on the array substrate.

3. The display module according to claim 1, characterized in that, The insulating layer is made of tape, and the insulating layer includes a substrate layer and an adhesive layer disposed on the substrate layer, wherein the adhesive layer is bonded to the protective adhesive layer.

4. The display module according to claim 3, characterized in that, The substrate layer is made of polyethylene terephthalate.

5. The display module according to claim 1, characterized in that, A driver IC is provided on the binding area; The display module also includes a flexible circuit board, one end of which is bonded to the bonding area. The display module further includes a conductive metal layer, which covers the driver IC and part of the flexible circuit board. The conductive metal layer includes a first part and a second part. The orthographic projection of the first part on the array substrate is located in the second region. The second part covers a portion of the flexible circuit board. In the second direction, the first part includes a first sub-part, a second sub-part, and a third sub-part. The second sub-part is disposed in the bonding region. The first sub-part and the third sub-part are disposed in the edge region and reused as the isolation layer.

6. The display module according to claim 1, characterized in that, The insulating layer is an ink layer disposed on the protective adhesive layer.

7. A display device, characterized in that, Includes the display module as described in any one of claims 1-6.

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