Energy converter for pressure-resistant deep sea high-frequency parametric array

Abstract

The utility model provides a transducer for a pressure-resistant deep sea high frequency parametric array, which comprises a piezoelectric vibrator parametric array, a negative electrode layer, a positive electrode layer, a backing, a matching layer, a shell and a watertight layer, the size of piezoelectric vibrators is determined, the piezoelectric vibrator parametric array is formed by a plurality of piezoelectric vibrators which are arranged in an array at equal intervals, and the piezoelectric vibrator parametric array is formed by a plurality of piezoelectric vibrators which are arranged in an array at equal intervals. The anodes and the cathodes of all the piezoelectric vibrators are connected in parallel through conductive films, and an anode wire and a cathode wire are led out; a back lining is made of a high-pressure-resistant foam material, and one side of the back lining is bonded to a positive electrode layer of the piezoelectric vibrator parametric array; and shell assembling is conducted, and matching layer pouring and watertight layer pouring are conducted. Compared with the prior art, the transducer has the capability of directly working in a 6000m deep sea environment while having excellent acoustic performance, and the pressure-resistant deep sea high-frequency parametric array is simple in manufacturing process, good in consistency and suitable for large-scale manufacturing.

Description

Technical Field

[0001] This utility model relates to the field of transducer technology, and in particular to a transducer for a pressure-resistant deep-sea high-frequency parametric array. Background Technology

[0002] Due to the unique properties of water and the characteristics of marine exploration technology, the most effective method for detecting seabed sedimentary layers remains shallow seismic profiling telemetry based on underwater acoustic principles. Shallow seismic profiling (shallow profile detection) technology is mainly used in marine scientific research, submarine cable route detection, harbor basin exploration, seabed geological structure detection, underwater engineering site selection, and routine maintenance, playing a vital and irreplaceable role in marine scientific research, marine engineering, and marine development.

[0003] Parametric array technology is a typical example of the successful application of nonlinear acoustics. Compared with traditional linear shallow probing sonar technology, parametric shallow probing detection technology has unique technical characteristics and advantages: (1) Parametric sonar with a small physical aperture can realize the transmission of low-frequency, broadband, sidelobe-free narrow beam detection signals, making the system more portable than ever before while ensuring detection performance; (2) The low-frequency characteristics of the difference frequency detection signal transmitted by parametric shallow probing sonar enable it to detect deeper and shallower strata, and the broadband signal characteristics allow the shallow strata echo signal to carry richer detection information, and the narrow detection beam can ensure high lateral detection resolution at greater depths; (3) The technical characteristics of difference frequency narrow beam and no sidelobe greatly reduce the cost of transmission. The impact of seabed reverberation and environmental noise interference on the detection results is reduced. Under the same signal processing method, the shallow profiling detection effect and shallow profiling mapping quality can be directly improved. The interference such as false strata introduced by side lobes is avoided to the greatest extent, ensuring the accuracy and reliability of subsequent work such as data interpretation and ground acoustic parameter inversion. (4) The phased function of parametric sonar can make the shallow profiling detection beam always perpendicular to the seabed, so that it can achieve better detection effect for complex terrain. (5) The use of phased tilt beam is more conducive to the detection of shallow buried targets, and its electronic beam scanning detection function is also conducive to the rapid realization of target detection and target positioning.

[0004] With the increasing demands of marine development and marine engineering, over the past 30 years, foreign countries have conducted large-scale commercial research and development of parametric shallow seismic profiling technology with superior performance, and applied it to fields such as port construction, waterway surveying, geological surveys, and military applications. It can be said that parametric shallow seismic profiling technology possesses unique technological advantages and promising application prospects, representing an important direction for the future development of shallow seismic profiling technology.

[0005] Compared with foreign countries, the development of parametric shallow profiling technology in China is still relatively lagging behind. No commercially available parametric shallow profiling products have yet been launched, and the parametric shallow profiling systems used by various professional surveying units are mainly imported from abroad. These systems are not only expensive but also difficult to maintain, hindering in-depth research into their applications. Therefore, given the rapid development of international parametric shallow profiling technology and equipment, conducting in-depth and systematic theoretical research on parametric shallow profiling technology is urgently needed.

[0006] To meet the equipment needs of domestic parametric shallow profiling, those skilled in the art have developed a transducer for a pressure-resistant deep-sea high-frequency parametric array. This transducer can be directly deployed in the deep sea, enabling higher-precision detection of fine deep-sea stratigraphic structures and buried targets, and providing equipment support for improving domestic parametric shallow profiling technology. Utility Model Content

[0007] The technical problem to be solved by this utility model is: in order to overcome the shortcomings of the prior art, this utility model provides a transducer and its manufacturing process for a pressure-resistant deep-sea high-frequency parametric array.

[0008] The technical solution adopted by this utility model to solve its technical problem is: a transducer for a pressure-resistant deep-sea high-frequency parametric array, comprising a piezoelectric oscillator parametric array, a negative electrode layer, a positive electrode layer, a backing, a matching layer, a shell, and a watertight layer. The piezoelectric oscillator parametric array is composed of several piezoelectric oscillators arranged in an array with equal spacing. The piezoelectric oscillators are made of ceramic material. The negative electrode layer is configured as a conductive film covering the upper surface of the piezoelectric oscillator parametric array. The negative electrode layer is made of conductive material, and the conductive film connects the negative electrodes of all piezoelectric oscillators in parallel and leads out a negative electrode wire. The positive electrode layer is configured as a conductive film covering the lower surface of the piezoelectric oscillator parametric array. The film comprises a positive electrode layer made of conductive material, in which the positive electrodes of all piezoelectric oscillators are connected in parallel and a positive electrode wire is led out. A backing is configured to cover the lower surface of the positive electrode layer. A matching layer is configured to cover the upper surface of the negative electrode layer. The housing is configured with an internal cavity having an upper opening, within which the backing, positive electrode layer, piezoelectric oscillator parametric array, negative electrode layer, and matching layer are all disposed. A watertight layer is configured as an outer covering structure that cooperates with the housing. The watertight layer and the housing together constitute a package for encapsulating the piezoelectric oscillator parametric array, negative electrode layer, positive electrode layer, backing, and matching layer within the package. Specifically, the watertight layer covers the housing and its internal structure from top to bottom. The piezoelectric oscillator parametric array adopts a nonlinear array arrangement, with no filler material between the piezoelectric oscillators.

[0009] Furthermore, a first limiting structure is provided between the watertight layer and the shell. The first limiting structure includes a first annular groove on the outer circumference of the shell and a first convex ring on the inner wall of the watertight layer. When the shell and the watertight layer are engaged, the first convex ring is embedded in the first groove. The concave-convex structure achieves the limiting between the shell and the watertight layer, preventing the watertight layer from falling off the shell.

[0010] Furthermore, a second limiting structure is provided on the connection surface between the shell and the matching layer. The second limiting structure includes a second annular groove on the stepped surface of the shell and a second convex ring on the lower surface of the matching layer. When the matching layer and the shell are engaged, the second convex ring is embedded in the second groove. The concave-convex structure achieves the limiting between the shell and the matching layer, preventing the watertight layer from falling off the shell.

[0011] Furthermore, to facilitate the lead-out of the wires, a lead-out portion is provided on the housing below the inner cavity. The lead-out portion has a through hole communicating with the inner cavity. A watertight connector is provided in the through hole. The positive and negative wires are led out from the through hole through the watertight connector.

[0012] Furthermore, the lower end face of the housing is provided with a plurality of threaded holes along the circumferential direction for mounting on the panel.

[0013] Furthermore, the inner cavity of the housing is bonded and fixed to one side of the lower surface of the backing.

[0014] Preferably, the backing is made of high-pressure-resistant foam material; the matching layer is made of epoxy resin material; and the shell is made of titanium alloy material.

[0015] A transducer fabrication process for fabricating the aforementioned transducer for a pressure-resistant deep-sea high-frequency parametric array includes the following steps:

[0016] Step 1: Design and fabrication of piezoelectric oscillator parametric array

[0017] First, the dimensions of the piezoelectric vibrator were optimized based on the operating frequency. To meet the 150kHz operating frequency, the dimensions of the piezoelectric vibrator (i.e., the array element) needed to be optimized. The thickness of the array element was utilized for vibration, avoiding areas of strong coupling vibration. Since the operating frequency is 150kHz, the thickness of the array element is approximately 9.5mm. The resonant frequency of the array element was controlled by adjusting the lateral dimension. Because when the lateral dimension is close to the longitudinal vibration dimension, the coupling vibration is strong, which is unfavorable for vibration in the thickness direction, the lateral dimension is made as small as possible compared to the thickness direction. Simultaneously, considering the feasibility of fabrication and the actual operating frequency, the dimensions of the piezoelectric vibrator were determined. Specifically, the thickness H of the piezoelectric vibrator is 9.83mm, and the lateral dimension a*b is 4.5mm×4.5mm. mm, a and b are the side lengths of the piezoelectric oscillator cross-section, respectively, to reduce coupling vibration while meeting frequency requirements; next, to ensure high consistency between array elements, large circular piezoelectric ceramics are cut into small ceramic particles according to a defined size to serve as piezoelectric oscillators for arraying; then, considering the directional narrow beam and the operability of the arraying process, the center spacing d of the array elements is 5 mm. Therefore, using the cut piezoelectric oscillators, an array is formed with a center spacing d = 5 mm, forming a circular piezoelectric oscillator parametric array with an effective radiating surface size of diameter D = 140 mm; the positive electrodes of all piezoelectric oscillators are connected in parallel through a conductive film to lead out a positive electrode wire; the negative electrodes of all piezoelectric oscillators are connected in parallel through a conductive film to lead out a negative electrode wire.

[0018] Step 2: Assembly of the backing

[0019] Because high-pressure-resistant foam materials possess characteristics such as high compressive strength, low sound velocity, and low density, they are suitable as backing materials. These materials are cut to the designed dimensions. Using high-pressure-resistant foam as a backing material reduces the overall weight of the transducer, addresses back-side decoupling, and improves water pressure resistance. Then, one side of the backing material is glued to the positive electrode layer of the piezoelectric vibrator parametric array. The glue layer is then cured at 30°C for 4-5 hours.

[0020] Step 3: Assembly of the housing

[0021] Because titanium alloys have low density, high strength, and corrosion resistance, they are suitable as the shell material for transducers. They can be used to manufacture the shell according to the designed dimensions. Using a lathe or CNC machining center, an inner cavity is formed on the housing, a first groove is machined on the outer circumferential surface of the housing, a stepped surface is formed on the housing at the upper end of the inner cavity, and a second groove is machined on the stepped surface. The radial and axial dimensions of the inner cavity of the housing are sufficient to simultaneously enclose the piezoelectric vibrator parametric array and the backing, and can meet the requirements of radial pressure bearing. Then, an adhesive is applied to the bottom surface of the inner cavity and / or the side of the backing facing away from the piezoelectric vibrator parametric array. The piezoelectric vibrator parametric array and the backing are simultaneously placed into the inner cavity, so that the backing is bonded to the housing. At the same time, the positive and negative leads are led out from the through holes of the lead wire exit part at the bottom of the housing and connected to the watertight connector on the lead wire exit part by threads. The contact surface between the watertight connector and the housing is provided with an O-ring groove, and the O-ring achieves sealing.

[0022] Step 4: Matching layer infusion

[0023] To ensure beamwidth fluctuations within -3dB and achieve a wider bandwidth (130kHz-170kHz), a matching layer technology was employed, further improving the overall performance of the transducer. The matching layer is made of epoxy resin, and analysis shows its thickness to be approximately 4.0mm.

[0024] An epoxy resin material is injected into the shell above the negative electrode layer to form a matching layer. The epoxy resin material is embedded in the second groove to form a second convex ring on the surface of the matching layer. The upper surface of the matching layer is flush with the upper end of the shell. Preferably, the thickness of the matching layer is 3.98mm-4.02mm. Next, the injected structure is subjected to vacuum treatment at a vacuum degree of -0.1MPa for 3min-5min. After vacuum treatment, it is cured at a constant temperature of 30℃ for at least 12h.

[0025] After the matching layer is injected, it needs to be vacuumed for a certain period of time to prevent air bubbles from being trapped, and then cured at a constant temperature for a long time to ensure the quality of the matching layer injection.

[0026] Step 5: Parametric array watertightness

[0027] To meet the requirements for use and performance testing of the parametric array in water, its surface is treated with a watertight seal. The transducer structure obtained in step 4 is placed entirely in a casting mold, and polyurethane is then injected into the mold to form a watertight layer on the outside of the shell and matching layer. The thickness of the watertight layer ranges from 5.25 mm to 5.35 mm, with 5.3 mm being the preferred thickness. After the watertight layer is injected, a vacuum treatment is performed at a vacuum degree of -0.1 MPa for 5-6 minutes. Following the vacuum treatment, constant temperature curing is carried out at 60℃-65℃ for at least 24 hours.

[0028] The beneficial effects of this invention are as follows: This invention provides a transducer and its fabrication process for a pressure-resistant deep-sea high-frequency parametric array. The array arrangement employs a nonlinear array method with no gaps between array elements, giving the parametric array excellent acoustic performance. The structural design utilizes a radial-axial pressure-resistant process, enabling the parametric array to operate directly in a 6000m deep-sea environment. It can be applied to higher-precision detection of fine deep-sea geological structures and buried targets, meeting the needs of marine scientific research, submarine cable route detection, harbor basin detection, seabed geological structure detection, underwater engineering site selection, and daily maintenance. The fabrication process is simple, has good consistency, and is suitable for mass production. Attached Figure Description

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0030] Figure 1 This is a schematic diagram of the transducer of the present invention used in a pressure-resistant deep-sea high-frequency parametric array.

[0031] Figure 2 This is a three-dimensional structural diagram of the transducer for a pressure-resistant deep-sea high-frequency parametric array according to this utility model.

[0032] Figure 3 This is a cross-sectional structural schematic diagram of the transducer used in the pressure-resistant deep-sea high-frequency parametric array of this utility model.

[0033] Figure 4 yes Figure 3 A magnified structural diagram of point A in the middle.

[0034] Figure 5 This is a schematic diagram of the piezoelectric oscillator parametric array.

[0035] Figure 6 This is a schematic diagram of the structure of a piezoelectric vibrator.

[0036] Figure 7 This is a schematic diagram of the shell structure.

[0037] Figure 8 This is a schematic diagram of the shell structure.

[0038] Figure 9 This is a schematic diagram of the cross-sectional structure of the shell.

[0039] Figure 10 This is a schematic diagram of the matching layer structure.

[0040] Figure 11 This is a schematic diagram of the watertight layer.

[0041] Figure 12 This is the admittance curve of the transducer of this utility model in water.

[0042] Figure 13 This is a high-frequency transmission voltage response curve of the transducer of this utility model.

[0043] Figure 14 This is a high-frequency receiving sensitivity curve of the transducer of this utility model.

[0044] Figure 15 This is a low-frequency receiving sensitivity curve of the transducer of this utility model.

[0045] Figure 16 This is the 150kHz directivity diagram of the transducer of this utility model.

[0046] In the figure: 1. Piezoelectric vibrator parametric array, 1.1. Piezoelectric vibrator, 2. Negative electrode layer, 3. Positive electrode layer, 4. Backing, 5. Matching layer, 5.1. Second convex ring, 6. Housing, 6.1. Lead wire exit, 6.2. Threaded hole, 6.3. Inner cavity, 6.4. Second groove, 6.5. First groove, 6.6. Through hole, 6.7. Stepped surface, 7. Watertight layer, 7.1. First convex ring, 8. Watertight connector. Detailed Implementation

[0047] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention. Therefore, they only show the components, orientations, and references (e.g., up, down, left, right, etc.) relevant to the present invention and are intended only to aid in the description of the features in the drawings. Therefore, the following specific embodiments are not intended to be restrictive, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents.

[0048] like Figures 1-3As shown, this utility model discloses a transducer for a pressure-resistant deep-sea high-frequency parametric array, comprising a piezoelectric resonator parametric array 1, a negative electrode layer 2, a positive electrode layer 3, a backing 4, a matching layer 5, a housing 6, and a watertight layer 7. The piezoelectric resonator parametric array 1 is composed of several piezoelectric resonators 1.1 arranged in an equally spaced array. The piezoelectric resonators 1.1 are made of ceramic material. The negative electrode layer 2 is configured as a conductive film covering the upper surface of the piezoelectric resonator parametric array 1. The negative electrode layer 2 is made of conductive material, and the negative electrodes of all piezoelectric resonators 1.1 are connected in parallel, with a single negative electrode wire leading out. The positive electrode layer 3 is configured as a conductive film covering the lower surface of the piezoelectric resonator parametric array 1. The positive electrode layer 3 is made of conductive material, and the conductive film... A piezoelectric vibrator 1.1 is connected in parallel with its positive electrode, and a positive electrode wire is led out from it. The backing 4 is configured to cover the lower surface of the positive electrode layer 3. The matching layer 5 is configured to cover the upper surface of the negative electrode layer 2. The housing 6 is configured to have an inner cavity 6.3 with an upper opening. The backing 4, positive electrode layer 3, piezoelectric vibrator parametric array 1, negative electrode layer 2, and matching layer 5 are all disposed within the inner cavity 6.3. The watertight layer 7 is configured as an outer covering structure that cooperates with the housing 6. The watertight layer 7 and the housing 6 together constitute a package for encapsulating the piezoelectric vibrator parametric array 1, negative electrode layer 2, positive electrode layer 3, backing 4, and matching layer 5 inside the package. The inner cavity 6.3 of the housing 6 is bonded and fixed to one side of the lower surface of the backing 4. Specifically, the watertight layer 7 covers the housing 6 and its internal structure from top to bottom. Preferably, the backing 4 is made of high pressure-resistant foam material; the matching layer 5 is made of epoxy resin material; and the shell 6 is made of titanium alloy material.

[0049] like Figure 4 As shown, a first limiting structure is provided between the watertight layer 7 and the shell 6, and a second limiting structure is provided on the connection surface between the shell 6 and the matching layer 5, as shown. Figures 7-11 As shown, the first limiting structure includes a first annular groove 6.5 on the outer circumference of the housing 6 and a first protruding ring 7.1 on the inner wall of the watertight layer 7. When the housing 6 and the watertight layer 7 are engaged, the first protruding ring 7.1 is embedded in the first groove 6.5. The second limiting structure includes a second annular groove 6.4 on the stepped surface 6.7 of the housing 6 and a second protruding ring 5.1 on the lower surface of the matching layer 5. When the matching layer 5 and the housing 6 are engaged, the second protruding ring 5.1 is embedded in the second groove 6.4.

[0050] like Figures 7-9As shown, the housing 6 below the inner cavity 6.3 is provided with a lead wire exit portion 6.1. The lead wire exit portion 6.1 has a through hole 6.6 communicating with the inner cavity 6.3. A watertight connector 8 is provided in the through hole 6.6. The positive and negative wires are led out from the through hole 6.6 through the watertight connector 8. In this embodiment, the through hole 6.6 is a threaded hole, and the watertight connector 8 is threaded into the through hole 6.6. The lower end face of the housing 6 has a plurality of threaded holes 6.2 along the circumferential direction for mounting on a panel. The transducer can be mounted on the customer's panel through the threaded holes 6.2.

[0051] A transducer fabrication process for fabricating the aforementioned transducer for a pressure-resistant deep-sea high-frequency parametric array includes the following steps:

[0052] Step 1: Design and fabrication of piezoelectric oscillator parametric array 1

[0053] First, the dimensions of piezoelectric vibrator 1.1 are optimized based on the operating frequency. To meet the 150kHz operating frequency requirement, the dimensions of piezoelectric vibrator 1.1 (i.e., the array element) need to be optimized. The thickness of the array element is utilized for vibration, avoiding areas of strong coupling vibration. Since the operating frequency is 150kHz, the array element thickness is approximately 9.5mm. The resonant frequency of the array element is controlled by adjusting the lateral dimension. Because when the lateral dimension is close to the longitudinal vibration dimension, the coupling vibration is strong, which is unfavorable for vibration in the thickness direction, the lateral dimension is made as small as possible compared to the thickness direction. Simultaneously, considering the feasibility of fabrication and the actual operating frequency, the dimensions of piezoelectric vibrator 1.1 are determined as follows: Figure 5 and Figure 6 As shown, the thickness H of the piezoelectric vibrator 1.1 is 9.83 mm, and the lateral dimension a*b is 4.5 mm × 4.5 mm, where a and b are the side lengths of the cross-section of the piezoelectric vibrator 1.1, respectively, to reduce coupling vibration while meeting frequency requirements. Next, to ensure high consistency among array elements, large circular piezoelectric ceramics are cut into small ceramic particles according to a defined size to serve as the piezoelectric vibrators 1.1 for arraying. Then, considering the directional narrow beam and the operability of the arraying process, the center spacing d of the array elements is 5 mm. Therefore, using the cut piezoelectric vibrators 1.1, an array is formed with a center spacing d = 5 mm, creating a circular piezoelectric vibrator parametric array 1 with an effective radiating surface diameter D = 140 mm. The positive electrodes of all piezoelectric vibrators 1.1 are connected in parallel through a conductive film to form a positive electrode wire. The negative electrodes of all piezoelectric vibrators 1.1 are connected in parallel through a conductive film to form a negative electrode wire.

[0054] Step 2: Assembly of backing 4

[0055] Because high-pressure-resistant foam materials possess characteristics such as high compressive strength, low sound velocity, and low density, the backing material 4 is obtained by cutting it according to the design dimensions. In this embodiment, as a preferred embodiment, the dimensions of the backing material are: diameter 144mm and height 4.65mm. Using high-pressure-resistant foam material as the backing material 4 can reduce the overall weight of the transducer, solve the back decoupling problem of the transducer, and achieve water pressure resistance of the transducer, making it suitable as the material for the backing material 4 of the transducer. Then, one side of the backing material 4 is bonded to the positive electrode layer 3 of the piezoelectric vibrator parametric array 1 using adhesive, and the adhesive layer is cured at a curing temperature of 30℃ for 4-5 hours.

[0056] Step 3: Assembly of housing 6

[0057] Because titanium alloy has the characteristics of low density, high strength, and corrosion resistance, it is used to manufacture the shell 6 according to the designed dimensions. Using titanium alloy as the shell 6 reduces the overall weight of the transducer, makes the transducer resistant to seawater corrosion, and achieves water pressure resistance, making it a suitable material for the transducer shell 6. Using a lathe or CNC machining center, an inner cavity 6.3 is formed in the shell 6, a first groove 6.5 is machined on the outer circumference of the shell 6, a stepped surface 6.7 is formed on the upper end of the inner cavity 6.3, and a second groove 6.4 is machined on the stepped surface 6.7. The radial and axial dimensions of the inner cavity 6.3 of the shell 6 are sufficient to simultaneously enclose the piezoelectric vibrator parametric array 1 and the backing 4, and can meet the radial pressure requirements; in this embodiment, the radial pressure reaches 72 MPa. Then… Adhesive is applied to the bottom surface of the inner cavity 6.3 and / or the side of the backing 4 facing away from the piezoelectric vibrator parametric array 1. The piezoelectric vibrator parametric array 1 and the backing 4 are simultaneously placed into the inner cavity 6.3, so that the backing 4 is bonded to the housing 6. At the same time, the positive and negative wires are led out from the through hole 6.6 of the lead wire exit part 6.1 at the bottom of the housing 6 and connected to the watertight connector 8 on the lead wire exit part 6.1 by threads. The watertight connector 8 has an O-ring groove on the contact surface with the housing 6, and the O-ring achieves sealing.

[0058] Step 4: Injection of matching layer 5

[0059] To ensure the beamwidth fluctuates within -3dB and achieve a wider bandwidth, matching layer 5 is made of epoxy resin, and its thickness is determined to be 4.0mm. After the matching layer 5 is infused, it needs to be vacuumed for a certain period of time to prevent air bubbles from forming, followed by a long-term constant-temperature curing process to ensure the quality of the matching layer 5 infusion.

[0060] An epoxy resin material is injected into the housing 6 above the negative electrode layer 2 to form a matching layer 5. The epoxy resin material is embedded in the second groove 6.4 to form a second convex ring 5.1 on the surface of the matching layer 5. The upper surface of the matching layer 5 is flush with the upper end of the housing 6. Preferably, the thickness of the matching layer 5 is in the range of 3.98mm-4.02mm, and the preferred thickness is 4.0mm. Next, the injected structure is subjected to vacuum treatment with a vacuum degree of -0.1MPa for 3min-5min. After vacuum treatment, it is cured at a constant temperature of 30℃ for at least 12h.

[0061] Step 5: Parametric array watertightness

[0062] To meet the requirements for use and performance testing of the parametric array in water, its surface is treated with a watertight seal. The transducer structure obtained in step 4 is placed in a casting mold, and polyurethane is then injected into the mold to form a watertight layer 7 on the outside of the shell 6 and the matching layer 5. The thickness of the watertight layer 7 ranges from 5.25 mm to 5.35 mm, preferably 5.3 mm. After the watertight layer is injected, a vacuum treatment is performed at a vacuum degree of -0.1 MPa for 5 to 6 minutes. After the vacuum treatment, constant temperature curing is carried out at 60°C to 65°C for at least 24 hours.

[0063] The transducer was fabricated using the above process. The transducer array employed a nonlinear array arrangement with no gaps between array elements, resulting in excellent acoustic performance of the piezoelectric resonator parametric array. The transducer was then tested, and the results are as follows:

[0064] like Figure 12 The figure shows the impedance of the transducer in water from 100kHz to 200kHz. The red solid line represents the impedance G curve, and the blue dashed line represents the impedance Cp curve. The horizontal axis represents the frequency, the left vertical axis represents G, and the right vertical axis represents Cp. The transducer resonant frequency is 150kHz, and the operating bandwidth is ≥30kHz.

[0065] like Figure 13 The figure shows the transmit voltage response of the transducer from 100kHz to 200kHz. The horizontal axis represents the frequency and the vertical axis represents the transmit voltage response. The transmit voltage response of the transducer at the operating frequency (135kHz-175kHz) is ≥181dB.

[0066] like Figure 14 The figure shows the receiver sensitivity of the transducer at high frequencies of 100kHz-200kHz, with the horizontal axis representing frequency and the vertical axis representing receiver sensitivity; the receiver sensitivity of the transducer at the resonant frequency of 150kHz is ≥-180dB.

[0067] like Figure 15The figure shows the receiver sensitivity of the transducer in the low-frequency range of 5kHz-30kHz. The horizontal axis represents the frequency and the vertical axis represents the receiver sensitivity. The transducer has a flat receiver sensitivity in the low-frequency range of 5kHz-30kHz.

[0068] like Figure 16 The diagram shows the horizontal / vertical directivity of the transducer at 150kHz, with a -3dB opening angle of 4.3° at 150kHz.

[0069] The above tests show that the pre-matching layer technology enables the parametric array to operate at a bandwidth of ≥30kHz. The structural design employs radial and axial pressure-resistant processes, enabling the parametric array to operate directly in a 6000m deep-sea environment: the parametric array has passed a 72MPa hydrostatic test.

[0070] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the scope of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A transducer for a pressure-resistant deep-sea high-frequency parametric array, characterized in that: The device comprises a piezoelectric oscillator parametric array, a negative electrode layer, a positive electrode layer, a backing, a matching layer, a housing, and a watertight layer. The piezoelectric oscillator parametric array consists of several piezoelectric oscillators arranged in an array with equal spacing. The negative electrode layer is configured as a conductive film covering the upper surface of the piezoelectric oscillator parametric array, with the negative electrodes of all piezoelectric oscillators connected in parallel and a negative electrode wire leading out. The positive electrode layer is configured as a conductive film covering the lower surface of the piezoelectric oscillator parametric array, with the positive electrodes of all piezoelectric oscillators connected in parallel and a positive electrode wire leading out. The electrode conductor; the backing is configured to cover the lower surface of the positive electrode layer; the matching layer is configured to cover the upper surface of the negative electrode layer; the housing is configured to have an internal cavity with an upper opening, and the backing, positive electrode layer, piezoelectric oscillator parametric array, negative electrode layer and matching layer are all disposed within the internal cavity; the watertight layer is configured as an outer covering structure that cooperates with the housing, and the watertight layer and the housing together constitute an encapsulation body for encapsulating the piezoelectric oscillator parametric array, negative electrode layer, positive electrode layer, backing, and matching layer inside the encapsulation body.

2. The transducer for a pressure-resistant deep-sea high-frequency parametric array as described in claim 1, characterized in that: A first limiting structure is also provided between the watertight layer and the shell. The first limiting structure includes a first groove arranged in an annular shape on the outer circumference of the shell and a first protruding ring arranged on the inner wall of the watertight layer. When the shell and the watertight layer are engaged, the first protruding ring is embedded in the first groove.

3. The transducer for a pressure-resistant deep-sea high-frequency parametric array as described in claim 1, characterized in that: The connection surface between the housing and the matching layer is provided with a second limiting structure. The second limiting structure includes a second annular groove on the stepped surface of the housing and a second convex ring on the lower surface of the matching layer. When the matching layer and the housing are engaged, the second convex ring is embedded in the second groove.

4. The transducer for a pressure-resistant deep-sea high-frequency parametric array as described in claim 1, characterized in that: The housing below the inner cavity is provided with a lead wire exit part, and the lead wire exit part is provided with a through hole communicating with the inner cavity. A watertight connector is provided in the through hole, and the positive and negative wires are led out from the through hole through the watertight connector.

5. The transducer for a pressure-resistant deep-sea high-frequency parametric array as described in claim 1, characterized in that: The lower end face of the housing is provided with multiple threaded holes along the circumferential direction for mounting on the panel.

6. The transducer for a pressure-resistant deep-sea high-frequency parametric array as described in claim 1, characterized in that: The inner cavity of the housing is bonded and fixed to one side of the lower surface of the backing.

7. The transducer for a pressure-resistant deep-sea high-frequency parametric array as described in claim 1, characterized in that: The backing is made of high-pressure resistant foam material; the matching layer is made of epoxy resin material; and the shell is made of titanium alloy material.

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