LED substrate and LED display screen module
By using a layered LED substrate design, the problems of high processing difficulty and low yield in existing technologies have been solved, thereby reducing processing difficulty and improving yield.
Patent Information
- Application Number
- CN202520143349.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-21
AI Technical Summary
Existing LED substrates are difficult to process and have a low yield rate.
The LED substrate with a layered design includes a lamp board and a carrier board. The lamp board includes, from bottom to top, a top layer pad for the LED beads, a first dielectric layer, and a first mating pad layer. The carrier board includes, from bottom to top, a second mating pad layer and a second dielectric layer. The layered design is achieved by welding the first mating pad layer and the second mating pad layer to reduce processing difficulty and ensure yield.
The layered design reduces the processing difficulty of the LED substrate and improves the yield rate, while the support of the substrate by the carrier plate ensures the curvature of the lamp board.
Smart Images
Figure CN223844181U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and in particular to an LED substrate and an LED display module. Background Technology
[0002] With the development of electronic technology, LED display technology has also developed rapidly. Due to the high energy efficiency of LEDs, LED displays are used in many fields.
[0003] Existing LED displays typically have an LED substrate consisting of, from bottom to top, top pads for the LED chips, a dielectric layer, bottom pads for the IC (Integrated Circuit) driver chip, and corresponding electrical circuit layers. The dielectric layer connects to the bottom pads and contains metal vias for transmitting signals between the IC driver chip and the LED chips on the upper and lower layers. The LED surface is composed of multiple LED chips arranged in an orderly fashion. Each LED chip consists of four pads, which connect to the R, G, and B color signals and the power signal, respectively. The color signals are cascaded at equal intervals in the column direction, and the power signals are cascaded at equal intervals in the row direction. The LED chips in the LED display are electrically connected to the LED substrate below them. Due to the large number of signals on the LED surface and the limited effective space in the circuit layers, LED substrates typically use multi-layer blind / buried via technology, which is difficult to manufacture and has a low yield rate.
[0004] However, existing LED substrates suffer from high processing difficulty and low yield, and no effective solution has yet been proposed. Utility Model Content
[0005] Therefore, it is necessary to provide an LED substrate and an LED display module to address the aforementioned technical problems, thereby solving the issues of high processing difficulty and low yield of existing LED substrates.
[0006] In a first aspect, this embodiment provides an LED substrate. It includes: a lamp board and a carrier board;
[0007] The lamp board, from bottom to top, includes a top layer pad for the lamp beads, a first dielectric layer, and a first mating pad layer.
[0008] The carrier board, from bottom to top, includes a second mating pad layer, a second dielectric layer, and a driver chip pad;
[0009] The lamp board is located on the lower layer of the carrier plate; and the lamp board and the carrier plate are welded together through the first mating pad layer and the second mating pad layer.
[0010] In some embodiments, the first mating pad layer includes a plurality of first mating pads, and the second mating pad layer includes a plurality of second mating pads; the number of first mating pads and second mating pads are the same, and their positions correspond one-to-one.
[0011] In some embodiments, the lamp panel includes multiple independent lamp panel units.
[0012] In some embodiments, all R signals of each column of LEDs in each lamp board unit share a first mating pad, all G signals of each column of LEDs in each lamp board unit share a first mating pad, and all B signals of each column of LEDs in each lamp board unit share a first mating pad.
[0013] In some embodiments, all R signals of each row of LEDs in each LED board unit share a first mating pad, all G signals of each row of LEDs in each LED board unit share a first mating pad, and all B signals of each row of LEDs in each LED board unit share a first mating pad.
[0014] In some embodiments, all power signals for each row or column of LEDs in each LED board unit share a single first mating pad.
[0015] In some embodiments, the carrier plate is a single-layer through-hole plate design or a double-layer through-hole plate design.
[0016] In some embodiments, the light panel is suitable for laser blind hole processes.
[0017] In some embodiments, the thickness of the lamp panel is less than the thickness of the carrier plate.
[0018] Secondly, this application also provides an LED display module. The module includes LED chips, a driver chip, a control system, a power supply, and the LED substrate described in the first aspect.
[0019] The LED beads are soldered onto the LED substrate via the top solder pad of the LED beads;
[0020] The driver chip is soldered onto the LED substrate via driver chip pads and is used to control the LED beads to emit light.
[0021] The control system is used to control the driver chip to operate in response to the received input signal;
[0022] The power supply is connected to the LED substrate, the control system, and the driver chip, and is used to supply power to the LED substrate, the control system, and the driver chip.
[0023] Compared with related technologies, this embodiment provides an LED substrate, including a lamp board and a carrier board. The lamp board, from bottom to top, includes a top layer pad for the LED chips, a first dielectric layer, and a first mating pad layer; the carrier board, from bottom to top, includes a second mating pad layer, a second dielectric layer, and a driver chip pad; the lamp board is located below the carrier board; and the lamp board and the carrier board are welded together through the first and second mating pad layers. By utilizing two single boards, the lamp board and the carrier board, a layered design of the LED substrate can be achieved. This layered design allows for a smaller lamp board thickness, reducing processing difficulty and ensuring the yield of the LED substrate. Furthermore, the carrier board supports the substrate, ensuring the curvature of the lamp board. This solves the problems of high processing difficulty and low yield in related technologies for LED substrates.
[0024] Details of one or more embodiments of this application are set forth in the following drawings and description to make other features, objects and advantages of this application more readily apparent. Attached Figure Description
[0025] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0026] Figure 1 This is a schematic diagram of the structure of an LED substrate according to this embodiment;
[0027] Figure 2 This is a schematic diagram of the structure of the lamp panel in this embodiment, which is divided into multiple lamp panel units;
[0028] Figure 3 This is a schematic diagram of the pad wiring of the lamp board unit in this embodiment;
[0029] Figure 4 This is a schematic diagram of the first mating pad of the lamp board unit provided in this embodiment;
[0030] Figure 5 This is a structural schematic diagram of an LED display module according to this embodiment. Detailed Implementation
[0031] To better understand the purpose, technical solution, and advantages of this application, the application is described and illustrated below in conjunction with the accompanying drawings and embodiments.
[0032] Unless otherwise defined, the technical or scientific terms used in this application shall have the general meaning as understood by one of ordinary skill in the art to which this application pertains. Words such as “a,” “an,” “an,” “the,” “the,” and “these,” used in this application, do not indicate quantitative limitation and may be singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that comprises a series of steps or modules (units) is not limited to the listed steps or modules (units) but may include steps or modules (units) not listed, or may include other steps or modules (units) inherent to such processes, methods, products, or devices. The terms “connected,” “linked,” and “coupled,” used in this application, are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. The term “multiple” used in this application refers to two or more. The "and / or" operator describes the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: A alone, A and B simultaneously, and B alone. Typically, the character " / " indicates that the objects before and after it are in an "or" relationship. The terms "first," "second," and "third," etc., used in this application are merely for distinguishing similar objects and do not represent a specific ordering of the objects.
[0033] This embodiment provides an LED substrate. Figure 1 This is a schematic diagram of the structure of an LED substrate 100 according to this embodiment. Figure 1 As shown, the LED substrate 100 includes a lamp board 110 and a carrier board 120. The lamp board 110 includes, from bottom to top, a top layer pad 112 for the LED beads, a first dielectric layer 114, and a first mating pad layer 116. The carrier board 120 includes, from bottom to top, a second mating pad layer 122, a second dielectric layer 124, and a driver chip pad 126. The lamp board 110 is located on the lower layer of the carrier board 120. The lamp board 110 and the carrier board 120 are welded together through the first mating pad layer 116 and the second mating pad layer 122.
[0034] In this embodiment, the aforementioned top-layer solder pad 112 of the LED bead can serve as a contact point for soldering electronic components such as LED beads. Specifically, it can be connected to the pins of the LED bead, enabling the pins of the LED bead to be connected to the wire paths of the electrical circuits in the LED substrate 100, ensuring the normal operation of the circuit. To accommodate the soldering requirements of different LED beads, the shape and size of the aforementioned top-layer solder pad 112 of the LED bead can be specifically set according to specific needs, and this embodiment does not impose specific limitations here. For example, the shape of the aforementioned top-layer solder pad 112 of the LED bead can be one or more of round, square, etc., and the size of the top-layer solder pad 112 of the LED bead can be determined according to the size of the pins of the LED beads to be connected and the circuit design of the electrical circuits in the LED substrate 100. Since the pins of the LED bead have positive and negative terminals, the top-layer solder pad 112 of the LED bead can be set as a positive terminal solder pad and a negative terminal solder pad. The positive terminal solder pad is used to solder the positive terminal of the LED bead, and the negative terminal solder pad is used to solder the negative terminal of the LED bead. Furthermore, because copper foil has good electrical and thermal conductivity, it can ensure smooth current transmission and effective heat dissipation. Therefore, the top layer pad 112 of the aforementioned LED bead can be made of copper foil. It should be noted that the material of the top layer pad 112 of the aforementioned LED bead can be specifically set according to specific requirements. For example, it can also be nickel-gold, nickel-palladium-gold, etc., as long as the pad has good electrical conductivity to ensure stable current transmission. This embodiment does not impose specific limitations here.
[0035] The first dielectric layer 114, located between the top pad 112 of the LED chip and the first mating pad layer 116, is typically made of epoxy resin or a thermally conductive medium, possessing high breakdown voltage and insulation resistance. Its primary function is to provide electrical insulation between the top pad 112 and the first mating pad layer 116. The second dielectric layer 124, located between the second mating pad layer 122 and the driver chip pad 126, is also typically made of epoxy resin or a thermally conductive medium, possessing high breakdown voltage and insulation resistance. Its primary function is to provide electrical insulation between the second mating pad layer 122 and the driver chip pad 126. The design of the first dielectric layer 114 and the second dielectric layer 124 ensures electrical safety between the LED chip and the driver chip. In addition, metal vias are provided in both the first dielectric layer 114 and the second dielectric layer 124. The vias are used to connect the circuits between different layers to achieve electrical conduction between different layers. The inner wall of the vias is metallized to ensure good conductivity, so that the top pad 112 of the lamp bead on the lamp board 110 and the pad of the driver chip on the carrier board 120 can be effectively electrically connected.
[0036] Furthermore, the aforementioned electrical circuitry can be used for transmitting current and data, and is typically made of copper foil, specifically copper foil with a thickness between 35μm and 280μm. The aforementioned driver chip pads are pads used for soldering driver chips, allowing the driver chips to be soldered onto the LED substrate 100, thus achieving electrical connection between the electrical circuitry of the LED substrate 100 and the driver chip. It should be noted that the aforementioned driver chip pads 126 and the electrical circuitry are located on the same layer of the carrier board 120, and the driver chip pads 126 are connected to the electrical circuitry.
[0037] This embodiment utilizes two single boards, the lamp board 110 and the carrier board 120, to achieve a layered design for the LED substrate 100. This layered design allows for a smaller thickness of the lamp board 110, reducing processing difficulty and ensuring a higher yield for the LED substrate 100. Furthermore, the carrier board 120 supports the substrate, ensuring the curvature of the lamp board 110. This solves the problems of high processing difficulty and low yield associated with related technologies for the LED substrate 100.
[0038] In one embodiment, the first mating pad layer 116 includes a plurality of first mating pads, and the second mating pad layer 122 includes a plurality of second mating pads; the number of first mating pads and second mating pads are the same, and their positions correspond one-to-one.
[0039] To ensure a better connection between the first and second mating pads, both pads can be made of the same material, such as copper, nickel-gold, or nickel-palladium-gold, which possess excellent electrical conductivity. To ensure proper matching between the first and second mating pads, the number of first pads in the first mating pad layer 116 and the position of the second pads in the second mating pad layer 122 must be identical and correspond one-to-one. This embodiment achieves the connection between the lamp board 110 and the carrier board 120 through the matching connection of the first and second mating pads.
[0040] Specifically, in one embodiment, the lamp panel 110 includes a plurality of independent lamp panel units.
[0041] To reduce processing difficulty and meet the requirements for blind hole laser hole processing, the thickness of the layered lamp board 110 can be designed to be smaller. Because the thickness of the layered lamp board 110 is smaller, to prevent warping of the lamp board 110, it can be divided into multiple independent lamp board units. These multiple independent lamp board units can be lamp board units of the same size, or they can be designed as lamp board units of different sizes according to requirements.
[0042] For example, Figure 2 This is a schematic diagram of the structure of the lamp panel 110 in this embodiment, divided into multiple lamp panel units. For example... Figure 2 As shown, the light board 110 has M LEDs arranged horizontally and N LEDs arranged vertically. According to the preset rules, the horizontal direction is divided into m single boards and the vertical direction is divided into n single boards. M is divisible by m and M is greater than m. N is divisible by n and N is greater than n. Furthermore, n, m, N and M are all positive integers.
[0043] In another embodiment, all R signals of each column of LEDs in each LED board unit share a first mating pad, all G signals of each column of LEDs in each LED board unit share a first mating pad, and all B signals of each column of LEDs in each LED board unit share a first mating pad.
[0044] The R signal mentioned above is connected to the red signal line and is used to control the red LED to light up. The G signal mentioned above is connected to the green signal line and is used to control the green LED to light up. The B signal mentioned above is connected to the blue signal line and is used to control the blue LED to light up.
[0045] For example, Figure 3 This is a schematic diagram of the lamp surface pads and signal traces of one lamp board unit in this embodiment. Figure 3 As shown, the lamp board unit includes 8 LEDs, evenly distributed on the lamp board unit in a two-row, four-column arrangement. All R signals of the first row of LEDs are connected by signal lines, sharing a first mating pad R1; all G signals of the first row of LEDs are connected by signal lines, sharing a first mating pad G1; and all B signals of the first row of LEDs are connected by signal lines, sharing a first mating pad B1. Similarly, all R signals of the second row of LEDs are connected by signal lines, sharing a first mating pad R2; all G signals of the second row of LEDs are connected by signal lines, sharing a first mating pad G2; and all B signals of the second row of LEDs are connected by signal lines, sharing a first mating pad B2. All R signals of the third row of LEDs are connected by signal lines, sharing a first mating pad R3; all G signals of the third row of LEDs are connected by signal lines, sharing a first mating pad G3; all B signals of the third row of LEDs are connected by signal lines, sharing a first mating pad B3. Similarly, all R signals of the fourth row of LEDs are connected by signal lines, sharing a first mating pad R4; all G signals of the fourth row of LEDs are connected by signal lines, sharing a first mating pad G4; and all B signals of the fourth row of LEDs are connected by signal lines, sharing a first mating pad B4.
[0046] In one embodiment, all R signals of each row of LEDs in each LED board unit share a first mating pad, all G signals of each row of LEDs in each LED board unit share a first mating pad, and all B signals of each row of LEDs in each LED board unit share a first mating pad.
[0047] In one embodiment, all power signals for each row or column of LEDs in each LED board unit share a first mating pad.
[0048] For example, see continue. Figure 3 ,like Figure 3 As shown, the power signals of all LEDs in the first row of the LED board unit share the first mating pad Ca, and the power signals of all LEDs in the second row of the LED board unit share the first mating pad Cb.
[0049] Figure 4 This is a schematic diagram of the first mating pad of the lamp board unit provided in this embodiment. (See diagram below.) Figure 4 As shown, there are 8 LEDs in 2 rows and 4 columns. If each LED corresponds to 4 pads, then 32 pads are needed. Following the principle that all R signals of each column of LEDs in each LED board unit share one first mating pad, all G signals of each column of LEDs in each LED board unit share one first mating pad, all B signals of each column of LEDs in each LED board unit share one first mating pad, and all power signals of each row of LEDs in each LED board unit share one first mating pad, 14 mating pads are required.
[0050] Based on the above examples, it can be seen that, according to the principle that all R signals of each column of LEDs in each LED board unit share one first mating pad, all G signals of each column of LEDs in each LED board unit share one first mating pad, all B signals of each column of LEDs in each LED board unit share one first mating pad, and all power signals of each row of LEDs in each LED board unit share one first mating pad, the formula for calculating the number x of first mating pads required by the LED board unit is as follows:
[0051] x = 3a + b
[0052] Where a is the number of columns of LEDs in the LED panel unit, and b is the number of rows of LEDs in the LED panel unit.
[0053] Furthermore, if we follow the principle that all R signals of each column of LEDs in each LED board unit share one first mating pad, all G signals of each column of LEDs in each LED board unit share one first mating pad, all B signals of each column of LEDs in each LED board unit share one first mating pad, and all power signals of each column of LEDs in each LED board unit share one first mating pad, then the formula for calculating the number x of first mating pads required by the LED board unit is as follows:
[0054] x = 4a
[0055] Furthermore, if we follow the principle that all R signals of each row of LEDs in each LED board unit share one first mating pad, all G signals of each row of LEDs in each LED board unit share one first mating pad, all B signals of each row of LEDs in each LED board unit share one first mating pad, and all power signals of each column of LEDs in each LED board unit share one first mating pad, then the formula for calculating the number x of first mating pads required by the LED board unit is as follows:
[0056] x = 4b
[0057] If we follow the principle that all R signals of each row of LEDs in each LED board unit share one first mating pad, all G signals of each row of LEDs in each LED board unit share one first mating pad, all B signals of each row of LEDs in each LED board unit share one first mating pad, and all power signals of each column of LEDs in each LED board unit share one first mating pad, then the formula for calculating the number x of first mating pads required by the LED board unit is as follows:
[0058] x = a + 3b
[0059] This embodiment divides the lamp board 110 into multiple small blocks, which can prevent the lamp board 110 from warping. In addition, by dividing it into small blocks, if a single lamp bead is damaged, it can be replaced according to the small blocks. Furthermore, because the number of bonding pads is relatively reduced compared to traditional LED substrates, the gaps can be designed to be larger, making the operation easier, reducing maintenance time, and lowering maintenance costs.
[0060] In another embodiment, the carrier plate 120 is a single-layer through-hole plate design or a double-layer through-hole plate design.
[0061] It should be noted that the selection of the design structure of the carrier board 120 can be determined by comprehensively considering factors such as the specific application, circuit complexity, cost budget, and electrical performance requirements. For example, when the circuit structure is relatively simple, the carrier board 120 can be a single-layer through-hole board design; when the circuit structure is relatively complex, the carrier board 120 can be a double-layer through-hole board design. Furthermore, it should be noted that because the lamp board 110 is divided into multiple independent lamp board units, the number of first bonding pads is reduced, and the number of second bonding pads in the carrier board 120 is also reduced accordingly, thus reducing the processing difficulty and cost of the carrier board 120.
[0062] Furthermore, in one embodiment, the light panel 110 is adapted for laser blind hole processing.
[0063] Existing LED substrates, due to the four pads corresponding to each LED chip, are difficult to manufacture and generally employ blind via technology. The lamp board 110 provided in this embodiment can reduce the number of first mating pads, thereby reducing the thickness of the lamp board 110. It can use laser blind via technology, which can reduce the number of mechanically buried vias in the inner layer of the lamp board 110 and reduce the overall manufacturing difficulty.
[0064] In addition, the lamp board 110 in this embodiment is thinner than the traditional LED substrate, allowing for the use of smaller via diameters and making it suitable for smaller lamp spacing.
[0065] Furthermore, after the LED chips are welded onto the LED board 110, it can be used with testing fixtures, reducing the overall testing time compared to the time required for a single LED chip.
[0066] Furthermore, after the lamp board 110 is welded, it can be mixed with materials again to reduce the difference in lamp beads. It can also be classified and archived according to the display effect of the lamp board 110 for easy assembly into modules later.
[0067] In one embodiment, the thickness of the lamp panel 110 is less than the thickness of the carrier plate 120.
[0068] The thicknesses of the lamp panel 110 and the carrier plate 120 can be specifically set according to specific needs. Generally, to save space and materials, and to keep the lamp panel 110 lightweight, it is usually relatively thin. For example, the thickness of the lamp panel 110 can be one of 0.5mm, 1mm, or 1.5mm. The carrier plate 120, because it needs to support the lamp panel 110 and other possible components, is usually designed to be thicker than the lamp panel 110. For example, the thickness of the carrier plate 120 can be one of 2mm, 2.5mm, or 3mm. It should be noted that the thicknesses of the lamp panel 110 and the carrier plate 120 are not specifically limited in this embodiment, as long as the thickness of the lamp panel 110 is less than the thickness of the carrier plate 120, and the carrier plate 120 can support the lamp panel 110.
[0069] In addition, this embodiment also provides an LED display module. Figure 5 This is a structural schematic diagram of an LED display module according to this embodiment. Figure 5As shown, the module includes LED beads 510, driver chip 520, control system 530, power supply 540, and LED substrate 100. The LED beads 510 are soldered to the LED substrate 100 via top-layer pads 112. The driver chip 520 is soldered to the LED substrate 100 via driver chip pads and is used to control the LED beads 510 to emit light. The control system 530 is used to control the driver chip 520 to operate in response to received input signals. The power supply 540 connects the LED substrate 100, control system 530, and driver chip 520 and is used to supply power to the LED substrate 100, control system 530, and driver chip 520.
[0070] It should be noted that the specific examples in this embodiment can refer to the examples described in the above embodiments and optional implementations, and will not be repeated in this embodiment.
[0071] It should be understood that the specific embodiments described herein are merely illustrative of the application and not intended to limit it. All other embodiments derived by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application.
[0072] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.
[0073] Obviously, the accompanying drawings are merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar situations based on these drawings without any creative effort. Furthermore, it is understood that although the work done in this development process may be complex and lengthy, for those skilled in the art, certain design, manufacturing, or production modifications made based on the technical content disclosed in this application are merely conventional technical means and should not be considered as insufficient disclosure of this application.
[0074] The term "embodiment" in this application refers to a specific feature, structure, or characteristic described in connection with an embodiment that may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily imply the same embodiment, nor does it imply that it is mutually exclusive with or independent of other embodiments. It will be clearly or implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.
[0075] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of patent protection. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the appended claims.
Claims
1. An LED substrate, characterized in that, include: Light panel and carrier board; The lamp board, from bottom to top, includes a top layer pad for the lamp beads, a first dielectric layer, and a first mating pad layer. The carrier board, from bottom to top, includes a second mating pad layer, a second dielectric layer, and a driver chip pad; The lamp board is located on the lower layer of the carrier plate; and the lamp board and the carrier plate are welded together through the first mating pad layer and the second mating pad layer.
2. The LED substrate according to claim 1, characterized in that, The first mating pad layer includes a plurality of first mating pads, and the second mating pad layer includes a plurality of second mating pads; the number of first mating pads and second mating pads are the same, and their positions correspond one-to-one.
3. The LED substrate according to claim 1, characterized in that, The lamp panel includes multiple independent lamp panel units.
4. The LED substrate according to claim 3, characterized in that, All R signals of each column of LEDs in each LED board unit share a first mating pad, all G signals of each column of LEDs in each LED board unit share a first mating pad, and all B signals of each column of LEDs in each LED board unit share a first mating pad.
5. The LED substrate according to claim 3, characterized in that, All R signals of each row of LEDs in each LED board unit share a first mating pad, all G signals of each row of LEDs in each LED board unit share a first mating pad, and all B signals of each row of LEDs in each LED board unit share a first mating pad.
6. The LED substrate according to any one of claims 4 or 5, characterized in that, All power signals for each row or column of LEDs in each LED board unit share a single first mating pad.
7. The LED substrate according to claim 1, characterized in that, The carrier plate is designed as a single-layer perforated plate or a double-layer perforated plate.
8. The LED substrate according to claim 1, characterized in that, The light panel is suitable for laser blind hole technology.
9. The LED substrate according to claim 1, characterized in that, The thickness of the lamp panel is less than the thickness of the carrier plate.
10. An LED display module, characterized in that, The module includes LED beads, a driver chip, a control system, a power supply, and an LED substrate as described in any one of claims 1-9; The LED beads are soldered onto the LED substrate via the top solder pad of the LED beads; The driver chip is soldered onto the LED substrate via driver chip pads and is used to control the LED beads to emit light. The control system is used to control the driver chip to operate in response to the received input signal; The power supply is connected to the LED substrate, the control system, and the driver chip, and is used to supply power to the LED substrate, the control system, and the driver chip.