Display substrate and display screen

Abstract

The embodiment of the utility model provides a display substrate and a display screen, a dam structure comprises an organic layer and a water-oxygen protective layer, the water-oxygen protective layer is arranged between a substrate of the display substrate and the organic layer, and the water-oxygen protective layer is higher than a chemical vapor deposition layer of a first connecting area; the difference between the height of the water-oxygen protection layer and the height of the chemical vapor deposition layer of the first connection area is larger than a preset threshold value, and the first connection area is an area between the dam structure and the outer isolation column. As the water oxygen transmission efficiency of the water oxygen protection layer is lower than that of the organic layer, the water oxygen transmission efficiency can be reduced, the generation of GDSH can be further reduced, and the display quality is improved.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a display substrate and a display screen. Background Technology

[0002] Some OLED (Organic Light Emitting Diode) display products use an AA Hole design, which means that an opening is made in the AA area (Active Area) to place sensors such as cameras in the opening of the AA area.

[0003] Currently, COE (Color Filter on Encapsulation) products have specific requirements for reducing the thickness of IJP (Ink Jet Printing). The current approach involves adding a gradient layer to the chemical vapor deposition (CVD) layer to increase its surface roughness and the size of the IJP dots, which is beneficial for IJP thinning and leveling.

[0004] However, the above solution has problems: IJP will overflow to the outer isolation pillar, which will reduce the effective encapsulation distance at the AA hole, affect the reliability at the AA hole, and pose a risk of GDSH (Growing Dark Spot), which will lead to poor display of OLED products.

[0005] Therefore, how to reduce the generation of GDSH is an urgent problem to be solved. Utility Model Content

[0006] The purpose of this utility model embodiment is to provide a display substrate and display screen to reduce the generation of GDSH. The specific technical solution is as follows:

[0007] In a first aspect, this utility model provides a display substrate, the display substrate including a display area, an opening area, and an isolation area disposed around the opening area; the isolation area includes an outer isolation pillar and an inner isolation pillar, wherein the outer isolation pillar is disposed near the opening area, and the inner isolation pillar is disposed near the display area;

[0008] The display substrate further includes:

[0009] A dam structure is disposed between the outer isolation pillar and the inner isolation pillar; the dam structure includes an organic layer and a water-oxygen protective layer; the water-oxygen protective layer is disposed between the substrate of the display substrate and the organic layer;

[0010] The height of the water-oxygen protective layer is higher than the height of the chemical vapor deposition layer in the first connecting region; and the difference between the height of the water-oxygen protective layer and the height of the chemical vapor deposition layer in the first connecting region is greater than a preset threshold, wherein the first connecting region is the area between the dam structure and the outer isolation column.

[0011] In one possible implementation, the organic layer includes a plurality of planarization layers; wherein the side away from the substrate is the upper layer and the side closer to the substrate is the lower layer, and for every two planarization layers, the orthographic projection of the first planarization layer onto the substrate lies within the orthographic projection of the second planarization layer onto the substrate, the planarization layer located on the upper layer is the first planarization layer, and the planarization layer located on the lower layer is the second planarization layer.

[0012] In one possible implementation, the dam structure further includes a diaphragm layer;

[0013] The spacer layer is disposed on the side of the organic layer away from the substrate.

[0014] In one possible implementation, the spacer layer is disposed on the side of the organic layer near the first connection region.

[0015] In one possible implementation, the spacer layer covers the water and oxygen protective layer.

[0016] In one possible implementation, the organic layer covers the water-oxygen protective layer.

[0017] In one possible implementation, the organic layer includes a plurality of planarization layers; wherein the side away from the substrate is the upper layer and the side closer to the substrate is the lower layer, and for every two planarization layers, the planarization layer in the upper layer covers the planarization layer in the lower layer.

[0018] In one possible implementation, the water-oxygen protective layer comprises an inorganic layer and at least one metal layer.

[0019] In one possible implementation, the inorganic layer includes a protective layer, an interlayer dielectric layer, a buffer layer, and a gate insulating layer;

[0020] The gate insulating layer is disposed on the substrate, the buffer layer is disposed on the side of the gate insulating layer away from the substrate, the interlayer dielectric layer is disposed between the buffer layer and the protective layer, and the protective layer is disposed on the side of the interlayer dielectric layer away from the substrate.

[0021] In one possible implementation, the metal layer includes a source / drain layer, a first gate layer, a second gate layer, and a third gate layer;

[0022] The first gate layer is disposed on the substrate, the second gate layer is disposed on the side of the first gate layer away from the substrate, and the third gate layer is disposed between the second gate layer and the source / drain layer, the source / drain layer being disposed on the side of the second gate layer away from the substrate.

[0023] In one possible implementation, a curing film protective layer is further included, the curing film protective layer being disposed on the side of the chemical vapor deposition layer away from the substrate; the thickness of the curing film protective layer at the first pit is greater than the thickness of the curing film protective layer in the display area, the first pit being the pit of the dam structure closer to the display area.

[0024] Secondly, embodiments of the present invention provide a display screen, including the display substrate described in any one of the first aspects.

[0025] The beneficial effects of this utility model embodiment are as follows:

[0026] The display substrate and display screen provided in this embodiment of the utility model include a dam structure comprising an organic layer and a water-oxygen protective layer. The water-oxygen protective layer is disposed between the substrate and the organic layer of the display substrate, and the height of the water-oxygen protective layer is higher than the height of the chemical vapor deposition layer in the first connection area. Furthermore, the difference between the height of the water-oxygen protective layer and the height of the chemical vapor deposition layer in the first connection area is greater than a preset threshold. The first connection area is the area between the dam structure and the outer isolation pillar. Because the water-oxygen protective layer has a lower efficiency in propagating water-oxygen than the organic layer, this reduces the efficiency of water-oxygen propagation, further reducing GDSH generation and improving display quality.

[0027] Of course, implementing any product or method of this utility model does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0029] Figure 1 This is a schematic diagram of a first type of display substrate in the related technology;

[0030] Figure 2 This is a second schematic diagram of a display substrate in the related art;

[0031] Figure 3 This is a schematic diagram of a dam structure for a display substrate in related technologies;

[0032] Figure 4 This is a first schematic diagram of a display substrate provided in an embodiment of the present utility model;

[0033] Figure 5 This is a first schematic diagram of the dam structure of the display substrate provided in an embodiment of the present utility model;

[0034] Figure 6 This is a second schematic diagram of the dam structure of the display substrate provided in this embodiment of the present utility model;

[0035] Figure 7 This is a third schematic diagram of the dam structure of the display substrate provided in this embodiment of the present utility model;

[0036] Figure 8 This is a fourth schematic diagram of the dam structure of the display substrate provided in this embodiment of the present utility model;

[0037] Figure 9 This is a second schematic diagram of the display substrate provided in an embodiment of the present utility model;

[0038] Figure 10 This is a third schematic diagram of the display substrate provided in an embodiment of the present utility model;

[0039] Figure 11 This is a fourth schematic diagram of the display substrate provided in this embodiment of the present utility model;

[0040] Figure 12 This is a fifth schematic diagram of the dam structure of the display substrate provided in this embodiment of the present utility model;

[0041] Figure 13 This is a fifth schematic diagram of the display substrate provided in an embodiment of the present utility model;

[0042] Figure 14 This is a sixth schematic diagram of the dam structure of the display substrate provided in this embodiment of the present utility model;

[0043] Figure 15 This is a sixth schematic diagram of a display substrate provided in an embodiment of the present utility model. Detailed Implementation

[0044] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art based on the present utility model are within the protection scope of the present utility model.

[0045] like Figure 1As shown, the display substrate includes a display area 1, an opening area 2, an isolation area 3, and an organic light-emitting functional layer disposed in the display area 1 and extending to the isolation area 3, which is disconnected by an isolation pillar.

[0046] like Figure 2 The diagram shows the structural distribution of a display substrate in related technologies. The cutting line refers to the line cut to accommodate devices such as cameras. The outer isolation pillars are close to the opening area, and the inner isolation pillars are close to the display area. 01 is the PI (substrate) layer, 02 is the barrier layer plus buffer layer, 03 is the GI (gate insulating layer) 1 layer, 04 is the GI2 layer, 05 is the ILD (interlayer dielectric layer) plus PVX (protective layer) layer, 06 is the CVD (chemical vapor deposition) layer 1 layer, 07 is the IJP (encapsulation leveling layer), 08 is CVD2, 09 is the TBL (touch barrier layer), 10 is the TLD (touch via insulating layer), 11 is the CLD (COE product insulating layer), and 12 is the COC (cyclic olefin copolymer).

[0047] A dam structure is installed between the outer and inner isolation columns. The structural diagram of the existing dam structure is shown below. Figure 3 As shown, the dam structure consists of a PS (spacer layer) and a PLN (planarization layer). When the IJP overflows to the side of the dam structure near the outer isolation column, the IJP not only reduces the effective sealing distance at the AA hole, but also, because both the PS and PLN layers are organic layers, it facilitates water vapor propagation, affecting the display.

[0048] Therefore, this utility model embodiment provides a display substrate, the display substrate including a display area, an opening area, and an isolation area disposed around the opening area; the isolation area includes an outer isolation pillar and an inner isolation pillar, wherein the outer isolation pillar is disposed near the opening area, and the inner isolation pillar is disposed near the display area;

[0049] The display substrate further includes:

[0050] A dam structure disposed between the outer isolation column and the inner isolation column; such as Figure 4 As shown, the dam structure includes an organic layer 110 and a water-oxygen protective layer 120; the water-oxygen protective layer 120 is disposed between the substrate of the display substrate and the organic layer 110.

[0051] The height of the water-oxygen protective layer 120 is higher than the height of the chemical vapor deposition layer of the first connecting region 130; the first connecting region 130 is the area between the dam structure and the outer isolation column.

[0052] like Figure 4As shown, a water-oxygen protective layer 120 is added to the dam structure. The efficiency of water-oxygen transmission in the water-oxygen protective layer is lower than that in the organic layer. The water-oxygen protective layer can be an inorganic layer and at least one metal layer. That is, the water-oxygen protective layer can consist of only one inorganic layer and at least one metal layer. When the water-oxygen protective layer includes multiple inorganic layers, the materials of each inorganic layer can be the same or different. When the water-oxygen protective layer includes multiple metal layers, the materials of each metal layer can be the same or different. The specific composition and structure of the water-oxygen protective layer can be determined based on the actual situation and are not limited here.

[0053] The height of the water-oxygen protective layer is higher than the height of the chemical vapor deposition layer in the first connection region 130, and the difference between the height of the water-oxygen protective layer and the height of the chemical vapor deposition layer in the first connection region 130 is greater than a preset threshold. The preset threshold can be set based on actual conditions and is not limited here. The chemical vapor deposition layer is located on the side of the dam structure away from the substrate. Because the height of the water-oxygen protective layer is higher than the height of the chemical vapor deposition layer in the first connection region 130, even if an IJP overflows through the dam structure to the side of the dam structure near the outer isolation pillar, that is, the IJP overflows through the dam structure onto the chemical vapor deposition layer of 130, the water-oxygen propagation path is still through the water-oxygen protective layer 120 to the display area. Since the water-oxygen protective layer can be an inorganic layer and at least one metal layer, and the efficiency of water-oxygen propagation by inorganic layers and metal layers is lower than that of water-oxygen propagation by organic layers, this can reduce the efficiency of water-oxygen propagation, further reduce GDSH generation, and improve display quality.

[0054] In one possible implementation, the organic layer 110 includes a plurality of planarization layers; wherein the side away from the substrate is the upper layer and the side closer to the substrate is the lower layer, and for every two planarization layers, the orthographic projection of the first planarization layer onto the substrate is located within the orthographic projection of the second planarization layer onto the substrate, the planarization layer located on the upper layer is the first planarization layer, and the planarization layer located on the lower layer is the second planarization layer.

[0055] Organic layer 110 includes multiple planarization layers because the orthographic projection of the first planarization layer onto the substrate lies within the orthographic projection of the second planarization layer onto the substrate; that is, the width of the upper planarization layer is smaller than the width of the lower planarization layer. For example, such as... Figure 5As shown, the organic layer 110 includes a first flat layer 111, a second flat layer 112, and a third flat layer 113. These flat layers are arranged in a stepped pattern, and the width of each upper flat layer is smaller than the width of the lower flat layer. This creates a sloping surface on the side of the entire dam structure. Even if IJP overflows, it generally accumulates at the bottom of the dam structure. In this case, the lateral water-oxygen propagation path is also through the water-oxygen protection layer 120 to the display area. Because the water-oxygen protection layer can be an inorganic layer or at least a metal layer, and the efficiency of water-oxygen propagation in inorganic and metal layers is lower than that in organic layers, this reduces the efficiency of water-oxygen propagation, further reducing GDSH generation and improving display quality.

[0056] In one possible implementation, the dam structure further includes a diaphragm layer;

[0057] The spacer layer is disposed on the side of the organic layer 110 away from the substrate.

[0058] The dam structure also includes a spacer layer (PS layer), which is placed on the side of the organic layer 110 away from the substrate. The PS layer can also be placed on the side of the organic layer 110 closer to the first connection area. The organic layer 110 can also be covered with a water and oxygen protective layer, depending on the specific circumstances. This increases the height of the entire dam structure, which can alleviate IJP overflow and further reduce GDSH generation, thus improving display quality.

[0059] In one possible implementation, the spacer layer is disposed on the side of the organic layer 110 near the first connection region.

[0060] The spacer layer 114 is disposed on the side of the organic layer 110 near the outer isolation pillar. The dam structure near the display area has no spacer layer; the dam structure design is only high on the right side (the side near the outer isolation pillar), making the angle between the side of the dam structure near the display area and the substrate smaller than the angle between the side of the dam structure away from the display area and the substrate. In one example, based on... Figure 5 The illustrated embodiments, such as Figure 6 As shown, the dam structure also includes a spacer layer 114, which is disposed on the side of the organic layer 110 near the outer isolation pillar. There is no spacer layer on the side of the dam structure near the display area. The dam structure is designed to be higher only on the right side, so that the angle between the side of the dam structure near the display area and the substrate is smaller than the angle between the side of the dam structure away from the display area and the substrate. This allows IJP to be printed onto the dam structure, which can increase the height of the entire dam structure. After the dam structure is increased, the overflow of IJP can be alleviated, further reducing the generation of GDSH, improving display quality, and also facilitating the etching of TSP traces.

[0061] In one possible implementation, the spacer layer covers the water and oxygen protection layer 120.

[0062] The spacer layer is disposed on the side of the organic layer away from the substrate, and the water and oxygen protection layer is disposed between the substrate and the organic layer of the display substrate. The design of the spacer layer covering the water and oxygen protection layer 120 not only increases the height of the entire dam structure, which can alleviate the overflow of IJP, but also makes the lateral water and oxygen path pass through the spacer layer 114 first and then through the water and oxygen protection layer 120. This can increase the lateral propagation path of water and oxygen, further reduce the generation of GDSH and improve the display quality.

[0063] In one possible implementation, the organic layer 110 covers the water and oxygen protective layer.

[0064] The design of the organic layer 110 covering the water and oxygen protection layer 120 ensures that the lateral water and oxygen path passes through the organic layer 110 first and then through the water and oxygen protection layer 120. This increases the lateral propagation path of water and oxygen, further reducing the generation of GDSH and improving display quality.

[0065] In one possible implementation, the organic layer 110 covers the water and oxygen protective layer, and the organic layer 110 includes a plurality of planarization layers; wherein the side away from the substrate is the upper layer, the side closer to the substrate is the lower layer, and for every two planarization layers, the planarization layer in the upper layer covers the planarization layer in the lower layer.

[0066] like Figure 7 As shown, the organic layer 110 covers the water-oxygen protective layer, and the planarization layer includes a first planarization layer 111, a second planarization layer 112, and a third planarization layer 113. The upper planarization layer covers the lower planarization layer. Thus, when water-oxygen propagates laterally, it first passes through the first planarization layer 111, the second planarization layer 112, and the third planarization layer 113 of the organic layer, and then propagates to the display area through the water-oxygen protective layer 120. This increases the lateral propagation path of water-oxygen because the water-oxygen protective layer can be an inorganic layer and at least one metal layer. The efficiency of water-oxygen propagation by inorganic and metal layers is lower than that of water-oxygen propagation by organic layers. This can reduce the efficiency of water-oxygen propagation, further reduce the generation of GDSH, and improve display quality.

[0067] In one possible implementation, the organic layer 110 covers the water and oxygen protective layer, and the organic layer 110 includes a plurality of planar layers; wherein, when the side away from the substrate is the upper layer, the dam structure further includes a spacer layer, the spacer layer covering the organic layer 110.

[0068] like Figure 7As shown, the dam structure also includes a diaphragm layer 114, which is covered by an organic layer 110. The presence of the diaphragm layer increases the overall height of the dam structure, which can alleviate IJP overflow. In addition, the design of the diaphragm layer 114 being covered by the organic layer 110 ensures that the lateral water-oxygen path passes through the diaphragm layer 114 first, and then through the water-oxygen protection layer 120. This increases the lateral propagation path of water-oxygen, further reducing GDSH generation and improving display quality.

[0069] In one possible implementation, the organic layer 110 covers the water and oxygen protection layer, and the organic layer 110 includes a plurality of planar layers; wherein, when the side away from the substrate is the upper layer, the dam structure further includes a spacer layer, the spacer layer being disposed on the side of the organic layer 110 near the first connection region.

[0070] like Figure 8 As shown, the dam structure also includes a spacer layer 114. The spacer layer 114 is disposed on the side of the organic layer 110 near the isolation pillar. The spacer layer 114 is disposed on the side of the organic layer 110 near the outer isolation pillar. There is no spacer layer on the dam structure near the display area. The dam structure is designed to be higher only on the right side, which allows IJP to be printed onto the dam structure. This not only increases the height of the entire dam structure, but also alleviates the overflow of IJP, further reduces the generation of GDSH, improves display quality, and is also beneficial for TSP trace etching.

[0071] Based on any of the embodiments described above, in one possible implementation, the display substrate further includes a recess located between the dam structure and the outer isolation pillar.

[0072] A recess is created between the dam structure and the outer isolation pillars, such as... Figure 9 As shown, the display substrate also includes a recess 140. Even if there is an IJP overflow, the IJP will only flow into the recess and will not approach the outer isolation pillar. Moreover, the IJP flows into the recess, reducing the lateral area of ​​the IJP, which can reduce the efficiency of the IJP in absorbing water and oxygen, and thus slow down the efficiency of water and oxygen propagation to the display area.

[0073] In one possible implementation, the water-oxygen protective layer 120 includes an inorganic layer and at least one metal layer.

[0074] The water-oxygen protection layer 120 may also include inorganic and metallic layers. The materials of the inorganic and metallic layers can be determined based on actual conditions. The number of inorganic and metallic layers can also be determined based on actual conditions and is not limited here. When the water-oxygen protection layer 120 includes inorganic and metallic layers, the arrangement of the inorganic and metallic layers is not limited. When the water-oxygen protection layer 120 includes multiple inorganic layers, the materials of each inorganic layer can be the same or different. When the water-oxygen protection layer 120 includes multiple metallic layers, the materials of each metallic layer can be the same or different. The efficiency of water-oxygen transmission by inorganic and metallic layers is lower than that by organic layers. This reduces the efficiency of water-oxygen transmission, further reducing GDSH generation and improving display quality.

[0075] In one possible implementation, the inorganic layer includes a protective layer, an interlayer dielectric layer, a buffer layer, and a gate insulating layer;

[0076] The gate insulating layer is disposed on the substrate, the buffer layer is disposed on the side of the gate insulating layer away from the substrate, the interlayer dielectric layer is disposed between the buffer layer and the protective layer, and the protective layer is disposed on the side of the interlayer dielectric layer away from the substrate.

[0077] When fabricating a display substrate, the display area includes a protective layer, an interlayer dielectric layer, a buffer layer, and a gate insulating layer. Therefore, when fabricating the protective layer, interlayer dielectric layer, buffer layer, and gate insulating layer of the display area, the materials of the protective layer, interlayer dielectric layer, buffer layer, and gate insulating layer of the dam structure region can be retained. For example, such as... Figure 8 The inorganic layer of the water-oxygen protective layer 120 includes a protective layer 052, an interlayer dielectric layer 051, a buffer layer 050, and GI2 layer 04 and GI1 layer 03. This not only reduces the efficiency of water-oxygen propagation and further reduces GDSH generation, improving display quality, but also eliminates the need for additional fabrication processes, effectively utilizing existing materials and saving costs.

[0078] In one possible implementation, the metal layer includes a source / drain layer, a first gate layer, a second gate layer, and a third gate layer;

[0079] The first gate layer is disposed on the substrate, the second gate layer is disposed on the side of the first gate layer away from the substrate, and the third gate layer is disposed between the second gate layer and the source / drain layer, the source / drain layer being disposed on the side of the second gate layer away from the substrate.

[0080] When fabricating a display substrate, the display area includes a source / drain layer, a first gate layer, a second gate layer, and a third gate layer. Therefore, when fabricating the source / drain layer, the first gate layer, the second gate layer, and the third gate layer of the display area, the materials of the source / drain layer, the first gate layer, the second gate layer, and the third gate layer of the dam structure region can be retained. In this way, the height of the entire dam structure can be increased. After the dam structure is increased, the overflow of IJP can be alleviated, and the generation of GDSH can be further reduced, thus improving the display quality. Moreover, no additional fabrication process is required, which effectively utilizes existing materials and saves costs.

[0081] like Figure 7 As shown, the water-oxygen protective layer 120 includes a first metal layer 121, a second metal layer 122, a third metal layer 123, and a fourth metal layer 124. The materials of the first metal layer 121, the second metal layer 122, the third metal layer 123, and the fourth metal layer 124 can be determined based on the actual situation.

[0082] In one example, the first metal layer 121 is the source-drain layer (SD), the second metal layer 122 is the third gate layer (Gate3), the third metal layer 123 is the second gate layer (Gate2), and the fourth metal layer 124 is the first gate layer (Gate1).

[0083] When fabricating a display substrate, the display area includes a source / drain layer, a first gate layer, a second gate layer, and a third gate layer. Therefore, when fabricating the source / drain layer, the first gate layer, the second gate layer, and the third gate layer of the display area, the materials of the source / drain layer, the first gate layer, the second gate layer, and the third gate layer of the dam structure region can be retained. In this way, not only can the height of the entire dam structure be increased, which can alleviate the IJP overflow situation, further reduce the generation of GDSH and improve the display quality, but no additional fabrication process is required, effectively utilizing existing materials and saving costs.

[0084] Adding metal layers such as Gate1, Gate2, and SD1 to the bottom of the dam structure can increase the height of the dam structure, for example, by 6μm to 7.5μm.

[0085] In one possible implementation, a curing film protective layer is further included, the curing film protective layer being disposed on the side of the chemical vapor deposition layer away from the substrate; the thickness of the curing film protective layer at the first pit is greater than the thickness of the curing film protective layer in the display area, the first pit being the pit of the dam structure closer to the display area.

[0086] Because of the dam structure, a pit exists on the side of the dam structure closest to the display area. The display substrate also includes a TBLOC (cured film protective layer) layer. The TBL OC layer uses a half-tone process, allowing the pit inside the dam structure in the AA Hole area to be filled by the TBL OC, while also ensuring the normal TBL OC thickness in the display area. That is, the thickness of the TBL OC layer at the first pit is greater than the thickness of the TBL OC layer in the display area. When the TBL product includes TMA (Touch metal A, the first metal layer) and a second metal layer (Touch metal B, Touch metal B), this design ensures that the TMA / TMB metals do not fall into the pit, preventing incomplete exposure.

[0087] In conventional designs, the thickness of the TBL OC layer is 1.5 μm, the thickness of the dam structure is 7.5 μm, and there is a pit (approximately 3 μm to 5 μm) between the IJP (Integrated Sensor Panel) and the dam structure. The 1.5 μm TBL OC layer of the TSP (Touch Sensor Panel) cannot completely cover the pit, causing the TMA / TMB metal at the pit to exceed the exposure limit, resulting in metal residue at the pit. In this invention, the TBL OC recipe is set to 6 μm, and then the TBL OC can fill the pit. Finally, a half-tone mask is used to achieve a final film thickness of 1.5 μm in the display area.

[0088] based on Figure 7 As shown in the diagram, this utility model provides a display substrate with the structure of the display substrate as follows: Figure 10 As shown, based on Figure 8 As shown in the diagram, this utility model provides a display substrate with the structure of the display substrate as follows: Figure 11 As shown.

[0089] When fabricating a display substrate, the display area includes a source / drain layer, a first gate layer, a second gate layer, and a third gate layer. Therefore, when fabricating the source / drain layer, the first gate layer, the second gate layer, and the third gate layer of the display area, the materials of the source / drain layer, the first gate layer, the second gate layer, and the third gate layer of the dam structure region can be retained. In addition, when fabricating a display substrate, the display area includes a protective layer, an interlayer dielectric layer, a buffer layer, and a gate insulating layer. Therefore, when fabricating the protective layer, the interlayer dielectric layer, the buffer layer, and the gate insulating layer of the display area, the materials of the protective layer, the interlayer dielectric layer, the buffer layer, and the gate insulating layer of the dam structure region can be retained.

[0090] This is equivalent to adding source / drain layers, a first gate layer, a second gate layer, and a third gate layer metal beneath the dam structure, thereby increasing the height of the dam structure. This can alleviate IJP overflow, further reduce GDSH generation, improve display quality, and requires no additional fabrication processes, effectively utilizing existing materials and saving costs.

[0091] In addition, such as Figure 10 The display substrate shown also includes a TBL OC layer. The TBL OC layer uses a half-tone process, allowing the pits inside the AA Hole area dam structure to be filled by the TBL OC layer, while also ensuring the normal TBL OC thickness of the display area. This design ensures that the TMA (first metal layer for touch) / TMB (touch metal B; second metal layer for touch) metal does not fall into the pits, preventing incomplete exposure.

[0092] Based on the above embodiments, this utility model also provides a dam structure, such as... Figure 12 As shown, the water-oxygen protection layer 120 includes metal layers, namely a first metal layer 121, a second metal layer 122, a third metal layer 123, and a fourth metal layer 124. The first metal layer 121 is a source-drain layer (SD), the second metal layer 122 is a third gate layer (Gte3), the third metal layer 123 is a second gate layer (Gte2), and the fourth metal layer 124 is a first gate layer (Gte1). The water-oxygen protection layer 120 also includes inorganic layers, namely a protective layer 052, an interlayer dielectric layer 051, a buffer layer 050, a GI2 layer 04, and a GI1 layer 03.

[0093] The organic layer 110 includes a plurality of planarization layers: a first planarization layer 111, a second planarization layer 112, and a third planarization layer 113, wherein the side away from the substrate is the upper layer and the side closer to the substrate is the lower layer. For every two planarization layers, the orthographic projection of the first planarization layer onto the substrate is located within the orthographic projection of the second planarization layer onto the substrate. The planarization layer located on the upper layer is the first planarization layer, and the planarization layer located on the lower layer is the second planarization layer.

[0094] Figure 12 In the diagram, 01 is the substrate, 02 is the barrier layer plus buffer layer, 06 is the CVD (chemical vapor deposition) layer 1, 07 is the IJP (encapsulation leveling layer), and 08 is the CVD2 layer.

[0095] based on Figure 12 As shown in the diagram, this utility model provides a display substrate with the structure of the display substrate as follows: Figure 13 As shown, 05 includes a protective layer 052, an interlayer dielectric layer 051, and a buffer layer 050. (As...) Figures 12-13 As shown, the AAhole dam employs a design combining inorganic and organic membrane layers. The overall height of the AA hole remains unchanged. By adding metals such as Gate1, Gate2, and SD1 at the bottom of the dam, and covering them with inorganic layers, while the upper organic layer does not cover the lower layer, this design ensures that the membrane layers exposed on the outside of the dam structure consist of a bottom inorganic layer and an upper organic layer. IJP overflow typically accumulates at the bottom of the dam, which lengthens the lateral water-oxygen path, improving encapsulation reliability.

[0096] Its lateral water-oxygen pathway is: IJP, CVD1, inorganic layer, metal layer, inorganic layer, CVD1, organic layer, which prolongs the water-oxygen erosion path.

[0097] based on Figure 12 The illustrated embodiments, such as Figure 14 As shown Figure 15 As shown, the dam structure also includes a PS layer 114. The AA holedam still uses an inorganic plus organic film layer. The PS layer 114 increases the total height of the AA hole dam structure, changing it from 6μm to 7.5μm.

[0098] However, the PS layer only exists on the upper right side of Dam; there is no PS film layer on the left half of Dam near the AA area. The Dam design is only high on the right side, which allows IJP to be printed onto Dam, which is beneficial for TSP trace etching. In this scheme, the TBL OC mask is a normal mask and does not require a half-tone mask. Its lateral water-oxygen path is: IJP, CVD1, inorganic layer, metal layer, inorganic layer, CVD1, organic layer, which prolongs the water-oxygen erosion path.

[0099] This utility model provides a display screen, including the display substrate described in any of the above-mentioned embodiments.

[0100] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0101] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0102] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the scope of protection of this utility model.

Claims

1. A display substrate, characterized in that, The display substrate includes a display area, an opening area, and an isolation area surrounding the opening area; the isolation area includes an outer isolation pillar and an inner isolation pillar, wherein the outer isolation pillar is located near the opening area, and the inner isolation pillar is located near the display area; The display substrate further includes: A dam structure is disposed between the outer isolation pillar and the inner isolation pillar; the dam structure includes an organic layer and a water-oxygen protective layer; the water-oxygen protective layer is disposed between the substrate of the display substrate and the organic layer; the water-oxygen protective layer has a lower efficiency in propagating water-oxygen than the organic layer. The height of the water-oxygen protective layer is higher than the height of the chemical vapor deposition layer in the first connecting region; and the difference between the height of the water-oxygen protective layer and the height of the chemical vapor deposition layer in the first connecting region is greater than a preset threshold, wherein the first connecting region is the area between the dam structure and the outer isolation column.

2. The display substrate according to claim 1, characterized in that, The organic layer includes multiple planarization layers; wherein the side away from the substrate is the upper layer, and the side closer to the substrate is the lower layer. For every two planarization layers, the orthographic projection of the first planarization layer onto the substrate is located within the orthographic projection of the second planarization layer onto the substrate. The planarization layer located on the upper layer is the first planarization layer, and the planarization layer located on the lower layer is the second planarization layer.

3. The display substrate according to claim 1, characterized in that, The dam structure also includes a diaphragm layer; The spacer layer is disposed on the side of the organic layer away from the substrate.

4. The display substrate according to claim 3, characterized in that, The spacer layer is disposed on the side of the organic layer near the first connection area.

5. The display substrate according to claim 3, characterized in that, The diaphragm layer covers the water and oxygen protective layer.

6. The display substrate according to claim 1, characterized in that, The organic layer covers the water and oxygen protective layer.

7. The display substrate according to claim 6, characterized in that, The organic layer includes multiple planarization layers; wherein the side away from the substrate is the upper layer and the side closer to the substrate is the lower layer, and for every two planarization layers, the planarization layer in the upper layer covers the planarization layer in the lower layer.

8. The display substrate according to any one of claims 1-7, characterized in that, The display substrate also includes a recess located between the dam structure and the outer isolation column.

9. The display substrate according to any one of claims 1-7, characterized in that, The water-oxygen protective layer includes an inorganic layer and at least one metal layer.

10. The display substrate according to claim 9, characterized in that, The inorganic layer includes a protective layer, an interlayer dielectric layer, a buffer layer, and a gate insulating layer; The gate insulating layer is disposed on the substrate, the buffer layer is disposed on the side of the gate insulating layer away from the substrate, the interlayer dielectric layer is disposed between the buffer layer and the protective layer, and the protective layer is disposed on the side of the interlayer dielectric layer away from the substrate.

11. The display substrate according to claim 9, characterized in that, The metal layer includes a source / drain layer, a first gate layer, a second gate layer, and a third gate layer; The first gate layer is disposed on the substrate, the second gate layer is disposed on the side of the first gate layer away from the substrate, and the third gate layer is disposed between the second gate layer and the source / drain layer, the source / drain layer being disposed on the side of the second gate layer away from the substrate.

12. The display substrate according to claim 1, characterized in that, It also includes a curing film protective layer, which is disposed on the side of the chemical vapor deposition layer away from the substrate; the thickness of the curing film protective layer at the first pit is greater than the thickness of the curing film protective layer in the display area, and the first pit is the pit of the dam structure near the display area.

13. A display screen, characterized in that, Includes the display substrate as described in any one of claims 1-12.

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