Full duplex wireless communication packaging structure

Abstract

The utility model discloses a full duplex wireless communication packaging structure, comprising a packaging substrate, the packaging substrate is provided with two groups of transmit-receive antennas, a retaining wall is arranged between the transmit-receive antennas, the retaining wall is made of a wave-absorbing material or a conductive adhesive, the retaining wall is arranged between the two transmit-receive antennas on the packaging substrate, and the retaining wall is made of the wave-absorbing material or the conductive adhesive. The crosstalk between the transmitting and receiving antennas is effectively reduced, and the stability of full duplex wireless communication is improved; the retaining wall not only provides physical isolation, but also further absorbs and shields electromagnetic waves through the characteristics of materials, reduces reflection and refraction of signals, and optimizes distribution of an electromagnetic field. The method is simple in design and controllable in cost, has mass production feasibility, and is particularly suitable for full-duplex wireless communication chips, such as communication chips in mobile terminals, Internet of Things equipment or wireless sensor networks. The arrangement of the retaining wall not only improves the reliability of communication, but also provides an effective solution for a high-performance full duplex wireless communication system.

Description

TECHNICAL FIELD

[0001] The utility model relates to communication chip technical field especially relates to a full duplex wireless communication packaging structure. BACKGROUND

[0002] Full duplex wireless communication has been the difficulty of industry design, the main reason is that the crosstalk between channels can influence the stability of communication. In the prior art, this problem is generally solved by a polarization antenna scheme, but the scheme has high design difficulty on the one hand, and even if the polarization scheme is adopted, there is still great interference between the same side transmitting and receiving antennas, resulting in poor reliability of communication. SUMMARY

[0003] The utility model wants to solve the technical problem of providing a full duplex wireless communication packaging structure to solve the problem of crosstalk between full duplex wireless communication channels affecting the stability of communication in the prior art.

[0004] In order to solve the above technical problem, the utility model adopts the technical scheme of: a full duplex wireless communication packaging structure, including packaging substrate, the packaging substrate is equipped with two groups of transmitting and receiving antennas, the transmitting and receiving antennas are equipped with retaining wall, the retaining wall is made of wave absorbing material or conductive adhesive.

[0005] Further, the overall shape of the retaining wall is linear.

[0006] Further, the overall shape of the retaining wall is annular.

[0007] Further, the overall shape of the retaining wall is bent.

[0008] Further, the cross-sectional shape of the retaining wall is rectangular.

[0009] Further, the cross-sectional shape of the retaining wall is circular.

[0010] Further, the cross-sectional shape of the retaining wall is triangular.

[0011] Further, the distance between the retaining wall and the two groups of transmitting and receiving antennas is equal.

[0012] Further, the wave absorbing material is ferrite, wave absorbing foam or wave absorbing coating.

[0013] Further, the conductive adhesive is conductive silver adhesive or conductive copper adhesive.

[0014] The full-duplex wireless communication packaging structure has the advantages that the barrier wall is made of wave-absorbing material or conductive glue, the crosstalk between the two transceiving antennas is effectively reduced, the stability of the full-duplex wireless communication is improved, the barrier wall not only provides physical isolation, but also further absorbs and shields electromagnetic waves through the characteristics of the material, reduces the reflection and refraction of signals, and optimizes the distribution of electromagnetic fields. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 Figure 2 is a side view of the full-duplex wireless communication packaging structure of the utility model embodiment one;

[0016] Figure 2 Figure 2 is a side view of the full-duplex wireless communication packaging structure of the utility model embodiment one;

[0017] Figure 3 Figure 4 is a top view of the full-duplex wireless communication packaging structure of the utility model embodiment two;

[0018] Figure 4 Figure 5 is a top view of the full-duplex wireless communication packaging structure of the utility model embodiment three;

[0019] Figure 5 Figure 5 is a top view of the full-duplex wireless communication packaging structure of the utility model embodiment three;

[0020] REFERENCE SIGNS:

[0021] 1, packaging substrate; 2, transceiving antenna; 3, via array; 4, barrier wall. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical content and effects of the utility model clearer, the following will be described in detail in combination with the embodiment and the drawings.

[0023] Please refer to Figures 1 to 2 A full-duplex wireless communication packaging structure, including packaging substrate 1, the packaging substrate 1 is equipped with two groups of transceiving antennas 2, the transceiving antenna 2 between being equipped with barrier wall 4, the barrier wall 4 is made of wave-absorbing material or conductive glue.

[0024] The utility model discloses the beneficial effect lies in: through the setting up of the retaining wall 4 between two transceiving antennas 2 on the packaging substrate 1, the retaining wall 4 is made of wave absorbing material or conducting glue, effectively reduce the crosstalk between transceiving antenna 2, thereby improve the stability of full duplex wireless communication, the retaining wall 4 not only provides a kind of physical isolation, still further absorbs and shields electromagnetic wave through the characteristic of material, reduces the reflection and refraction of signal, optimizes the distribution of electromagnetic field.This design is simple and cost controllable, has mass production feasibility, especially suitable for full duplex wireless communication chip, such as mobile terminal, internet of things equipment or communication chip in wireless sensor network.The setting of retaining wall 4 not only improves the reliability of communication, also provides effective solution for high-performance full duplex wireless communication system.

[0025] Further, the overall shape of the retaining wall 4 is linear.

[0026] As described above, the overall shape of the retaining wall 4 is linear, simple structure, easy to process and manufacture. The linear retaining wall 4 can effectively form physical isolation between the transceiving antennas 2, reduce the direct coupling of signals, and is suitable for scenarios with regular antenna layout.

[0027] Further, the overall shape of the retaining wall 4 is annular.

[0028] As described above, the overall shape of the retaining wall 4 is annular, which can provide more uniform shielding effect and is suitable for omnidirectional antenna or multi-beam antenna system. The annular retaining wall 4 has more uniform shielding effect in multiple directions, which can effectively reduce the omnidirectional crosstalk.

[0029] Further, the overall shape of the retaining wall 4 is bent.

[0030] As described above, the overall shape of the retaining wall 4 is bent, which can be customized according to the specific antenna layout and signal propagation characteristics, and can more accurately block and absorb interference signals. The bent retaining wall 4 has more significant shielding effect in certain specific directions, and is suitable for complex antenna layout.

[0031] Further, the cross-sectional shape of the retaining wall 4 is rectangular.

[0032] As described above, the cross-sectional shape of the retaining wall 4 is rectangular, which is simple to process, easy to implement and low in cost. The rectangular retaining wall 4 can effectively form physical isolation between the transceiving antennas 2, reduce the direct coupling of signals, but the right-angle edge may cause reflection and refraction of signals, affecting the crosstalk suppression effect.

[0033] Further, the cross-sectional shape of the retaining wall 4 is circular.

[0034] As described above, the cross-sectional shape of the barrier wall 4 is circular, without sharp edges, which can more evenly distribute the reflection and refraction of signals, reducing strong interference in a particular direction. The circular barrier wall 4 has a more uniform shielding effect in multiple directions, suitable for complex antenna layouts and high-performance full-duplex wireless communication systems.

[0035] Further, the cross-sectional shape of the barrier wall 4 is triangular.

[0036] As described above, the cross-sectional shape of the barrier wall 4 is triangular, with sharp edges that can more effectively absorb and scatter signals, reducing crosstalk in a particular direction. The triangular barrier wall 4 has a more significant shielding effect in certain specific directions, but is more difficult to process and has a higher cost.

[0037] Further, the distance between the barrier wall 4 and the two groups of transceiving antennas 2 is equal.

[0038] As described above, the distance between the barrier wall 4 and the two groups of transceiving antennas 2 is equal, which can ensure that the barrier wall 4 provides uniform isolation between the transceiving antennas 2, further improving the uniformity and stability of crosstalk suppression. This design helps to optimize the electromagnetic field distribution and reduce uneven coupling of signals.

[0039] Further, the wave-absorbing material is ferrite, wave-absorbing foam or wave-absorbing coating.

[0040] As described above, the wave-absorbing material is ferrite, wave-absorbing foam or wave-absorbing coating, which has good wave-absorbing performance and can effectively absorb and scatter electromagnetic waves, reducing signal reflection and refraction and thus reducing crosstalk. Selecting the appropriate wave-absorbing material can be optimized according to the specific application scenario and frequency range.

[0041] Further, the conductive glue is conductive silver glue or conductive copper glue.

[0042] As described above, the conductive glue is conductive silver glue or conductive copper glue, which has good conductive performance and can effectively shield electromagnetic waves, reducing signal coupling and interference. Conductive silver glue and conductive copper glue exhibit different shielding effects in different frequency ranges, which can be selected according to specific needs.

[0043] Please refer to Figure 1 and Figure 2The utility model discloses an embodiment one for: a full duplex wireless communication package structure, including package substrate 1, package substrate 1 is equipped with two groups of transceiving antenna 2, be equipped with retaining wall 4 between transceiving antenna 2, retaining wall 4 adopts wave absorbing material or conductive glue and is made, through the retaining wall 4 that sets up between two transceiving antenna 2 on package substrate 1, this retaining wall 4 adopts wave absorbing material or conductive glue and is made, effectively reduced the crosstalk between transceiving antenna 2, to improve the stability of full duplex wireless communication, retaining wall 4 not only provides a kind of physical isolation, still further absorbs and shields electromagnetic wave through the characteristic of material, reduces the reflection and refraction of signal, optimizes the distribution of electromagnetic field. This design is simple and cost controllable, possesses mass production feasibility, especially applicable to full duplex wireless communication chip, such as mobile terminal, internet of things equipment or wireless sensor network in communication chip. The setting of retaining wall 4 not only improves the reliability of communication, also provides effective solution for high-performance full duplex wireless communication system.

[0044] In the embodiment, the overall shape of the retaining wall 4 is linear, specifically, the overall shape of the retaining wall 4 is set to be linear, which is simple in structure and easy to process and manufacture. The linear retaining wall 4 can effectively form physical isolation between the transceiving antennas 2, reduce direct coupling of signals, and be suitable for scenes with regular antenna layout. More specifically, the package substrate 1 is also provided with a via array 3. The via array 3 reduces electromagnetic coupling between signals by providing an additional ground path between signal lines, thereby effectively reducing crosstalk. The via array 3 connects the signal lines with the ground plane, providing a stable ground reference for the signals, which helps to reduce signal reflection and interference. The retaining wall 4 is covered above the via array 3, so that a more continuous shielding layer can be formed to reduce electromagnetic wave leakage and coupling, thereby significantly reducing crosstalk.

[0045] As optional, the cross-sectional shape of the barrier wall 4 can be rectangular, circular or triangular; specifically, the cross-sectional shape is the longitudinal section perpendicular to the extension direction of the barrier wall 4, it is noted that the cross-sectional shape of the barrier wall 4 can also be quasi-rectangular, quasi-circular, quasi-triangular or quasi-elliptical. When the cross-sectional shape of the barrier wall 4 is rectangular or quasi-rectangular, the processing is simple, easy to implement and low in cost. The rectangular barrier wall 4 can effectively form physical isolation between the transceiving antennas 2, reduce the direct coupling of signals, but the right-angle edges can cause signal reflection and refraction, affecting the effect of crosstalk suppression; when the cross-sectional shape of the barrier wall 4 is circular or quasi-circular, there is no sharp edge, which can more evenly distribute signal reflection and refraction, reducing strong interference in a specific direction. The shielding effect of the circular barrier wall 4 in multiple directions is relatively uniform, which is suitable for complex antenna layout and high-performance full-duplex wireless communication system; when the cross-sectional shape of the barrier wall 4 is triangular or quasi-triangular, the sharp edge can more effectively absorb and scatter signals, reducing crosstalk in a specific direction. The shielding effect of the triangular barrier wall 4 in some specific directions is more significant, but the processing difficulty is higher and the cost is higher.

[0046] Preferably, the distance between the barrier wall 4 and the two groups of transceiving antennas 2 is equal, so that the barrier wall 4 can provide uniform isolation effect between the transceiving antennas 2, further improving the uniformity and stability of crosstalk suppression. This design helps to optimize the electromagnetic field distribution and reduce uneven coupling of signals.

[0047] As optional, the wave-absorbing material can be ferrite, wave-absorbing foam or wave-absorbing coating, which has good wave-absorbing performance and can effectively absorb and scatter electromagnetic waves, reducing signal reflection and refraction and thus reducing crosstalk. Selecting appropriate wave-absorbing materials can be optimized according to specific application scenarios and frequency ranges; the conductive adhesive can be conductive silver adhesive or conductive copper adhesive, which has good conductivity and can effectively shield electromagnetic waves, reducing signal coupling and interference. Conductive silver adhesive and conductive copper adhesive exhibit different shielding effects in different frequency ranges, which can be selected according to specific needs.

[0048] Please refer to Figure 3 The embodiment two of the utility model improves the barrier wall 4 based on the embodiment one, in this embodiment two: the overall shape of barrier wall 4 is annular, specifically, set the overall shape of barrier wall 4 is annular, can provide more uniform shielding effect, be applicable to omnidirectional antenna or multi-beam antenna system. The shielding effect of the annular barrier wall 4 in multiple directions is relatively uniform, which can effectively reduce the omnidirectional crosstalk.

[0049] Please refer to Figure 4 and Figure 5The embodiment three of the utility model further improves the retaining wall 4 on the basis of the embodiment one, in this embodiment three: further, the overall shape of retaining wall 4 is bended shape, so, can be customized design according to the specific antenna layout and signal propagation characteristic, can more accurately block and absorb interference signal. The shielding effect of bended shape retaining wall 4 in certain specific direction is more remarkable, is applicable to complex antenna layout.

[0050] In conclusion, the full duplex wireless communication packaging structure provided by the utility model effectively reduces the crosstalk between the transceiving antennas by setting the retaining wall between the two transceiving antennas on the packaging substrate, thereby improving the stability of the full duplex wireless communication; the retaining wall not only provides a physical isolation, but also further absorbs and shields electromagnetic waves through the characteristics of the material, reduces the reflection and refraction of signals, and optimizes the distribution of electromagnetic field. This design is simple and cost-controllable, has mass production feasibility, and is particularly suitable for full duplex wireless communication chips, such as communication chips in mobile terminals, Internet of Things devices or wireless sensor networks. The setting of the retaining wall not only improves the reliability of communication, but also provides an effective solution for high-performance full duplex wireless communication systems.

[0051] The above is only the embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent transformation or direct or indirect application in the related technical field by using the content of the utility model specification and drawings is also included in the patent protection range of the utility model.

Claims

1. A full duplex wireless communication package structure, characterized by, The application relates to a package substrate provided with two groups of transceiving antennas, and a baffle wall is arranged between the transceiving antennas, wherein the baffle wall is made of a wave-absorbing material or conductive glue.

2. The full-duplex wireless communication package structure of claim 1, wherein, The overall shape of the baffle wall is linear.

3. The full-duplex wireless communication package structure of claim 1, wherein, The overall shape of the baffle wall is annular.

4. The full-duplex wireless communication package structure of claim 1, wherein, The overall shape of the baffle wall is bent.

5. The full-duplex wireless communication package structure of claim 1, wherein, The cross-sectional shape of the baffle wall is rectangular.

6. The full-duplex wireless communication package structure of claim 1, wherein, The cross-sectional shape of the baffle wall is circular.

7. The full-duplex wireless communication package structure of claim 1, wherein, The cross-sectional shape of the baffle wall is triangular.

8. The full-duplex wireless communication package structure of claim 1, wherein, The distance between the baffle wall and the two groups of transceiving antennas is equal.

9. The full-duplex wireless communication package structure of claim 1, wherein, The wave-absorbing material is ferrite, wave-absorbing foam or wave-absorbing coating.

10. The full-duplex wireless communication package structure of claim 1, wherein, The conductive glue is conductive silver glue or conductive copper glue.

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