Ultrathin high-brightness light-emitting LED lamp bead

Abstract

The utility model relates to an LED lamp bead, and discloses an ultrathin high-brightness light-emitting LED lamp bead which comprises a lamp bead shell and a plurality of optical assemblies arranged in the lamp bead shell, a containing cavity is formed in the top of the lamp bead shell and used for containing the optical assemblies, a plurality of light sources are arranged in the lamp bead shell, and the optical assemblies are used for changing the colors of the light sources. And a plurality of positioning assemblies are arranged on the two sides of the optical assembly, when the optical assembly is located in the containing cavity, the positioning assemblies are used for fixing the optical assembly in the containing cavity, a control circuit is arranged in the lamp bead shell, and the control circuit is used for controlling the light source. According to the utility model, when the optical assembly is installed, only the optical assembly needs to be pressed into the accommodating cavity, and the positioning assembly limits the movement of the optical assembly, so that compared with a common fixing method, the optical assembly can be installed more conveniently.

Description

Technical Field

[0001] This utility model relates to an LED lamp bead, and more particularly to an ultra-thin, high-brightness LED lamp bead. Background Technology

[0002] A common method for mounting optical components is through a front-mount package, in which the wafer is mounted face-up on a substrate, and electrodes on the wafer are connected to pins on the substrate via gold or aluminum wires. However, front-mount packages require additional wire bonding steps, which increases process complexity and cost. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an ultra-thin, high-brightness LED lamp bead.

[0004] This utility model provides an ultra-thin, high-brightness LED bead, comprising a bead housing and several optical components disposed inside the bead housing. The top of the bead housing has a receiving cavity for housing the optical components. Several light sources are disposed inside the bead housing. The optical components are used to change the color of the light sources. Several positioning components are disposed on both sides of the optical components. When the optical components are inside the receiving cavity, the positioning components are used to fix the optical components inside the receiving cavity. A control circuit is disposed inside the bead housing for controlling the light sources.

[0005] Furthermore, the optical component includes a flip-chip blue wafer, with a fluorescent pad assembly at the bottom of the flip-chip blue wafer. The flip-chip blue wafer and the fluorescent pad assembly work together to adjust the color of the light source. The fluorescent pad assembly is used to buffer the flip-chip blue wafer. A conductive plate is provided at the bottom of the fluorescent pad assembly to support the fluorescent pad assembly.

[0006] Furthermore, the positioning component includes a first limiting member, a second limiting member fixedly connected to the bottom end of the first limiting member, rotating members fixedly connected to the bottom ends of both sides of the first limiting member, the rotating members being rotatably connected to the lamp bead housing, a limiting piece fixedly connected to the top end of the first limiting member, and a locking component provided on one side of the first limiting member.

[0007] Furthermore, the locking component includes several locking blocks, and the second limiting member has locking slots on both sides. The locking slots and locking blocks are arranged in a one-to-one correspondence. When the limiting piece limits the movement of the flip-chip blue wafer, the locking blocks and locking slots engage. The bottom of the second limiting member is provided with a spring piece, which is used to provide an upward thrust to the second limiting member.

[0008] Furthermore, the positioning component includes a pressure member, which provides a thrust to the optical component when the optical component is inside the receiving cavity, with the top of the pressure member extending beyond the top of the lamp bead housing.

[0009] Furthermore, when the number of optical components is 2, the control circuit includes a power supply DC, pin a, pin b, pin c, switch S1, and switch S2;

[0010] The power supply DC, switch S1, pin a and pin b form a first circuit for controlling one of the light sources;

[0011] The power supply DC, switch S2, pin b, and pin c form a second circuit for controlling another light source.

[0012] The beneficial effects of this utility model are as follows:

[0013] 1. In this utility model, when installing optical components, it is only necessary to press the optical components into the receiving cavity, and the positioning component will limit the movement of the optical components. Compared with common fixing methods, the installation of optical components can be completed more conveniently.

[0014] 2. This utility model, through the combination of flip-chip blue chip and fluorescent adhesive assembly, can adjust the color of light source and save on wire bonding process. Compared with common LED beads, it can save a lot of costs in the mass production process and achieve the purpose of adjusting light color. Attached Figure Description

[0015] Figure 1 This is a structural schematic diagram of an ultra-thin, high-brightness LED lamp bead according to the present invention;

[0016] Figure 2 This is a cross-sectional schematic diagram of the LED bead shell of this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the first and second limiting components of this utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the second embodiment of the present invention;

[0019] Figure 5 This is a structural schematic diagram of the third embodiment of the present utility model;

[0020] Figure 6 This is a circuit diagram of the control circuit of this utility model.

[0021] In the diagram: 1. LED bead housing; 2. Inverted blue chip; 3. Fluorescent gel assembly; 4. Conductive plate; 5. First limiting component; 6. Limiting piece; 7. Rotating component; 8. Second limiting component; 9. Slot; 10. Block; 11. Spring; 12. Locking component; 13. Pressure component. Detailed Implementation

[0022] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0023] LED is an abbreviation for "Light Emitting Diode." It is a solid-state semiconductor device that directly converts electrical energy into light. LEDs offer several advantages: high energy efficiency (consuming less power to produce the same light output compared to traditional light sources like incandescent bulbs), long lifespan (typically much longer than traditional light sources), environmental friendliness (containing no harmful substances like mercury, resulting in less environmental impact after disposal), and small size (allowing for miniaturization and easy design and installation). They also boast fast response times (allowing for rapid switching, suitable for dimming or flashing displays). Due to their high efficiency and durability, LEDs are widely used in various fields, including but not limited to traffic lights, automotive headlights, indoor and outdoor lighting, displays, and backlights for mobile phones and other electronic devices.

[0024] Currently, some color-changing LED chips employ a dual flip-chip die bonding process to save manufacturing steps. Two blue flip-chips are placed in the functional area, and different phosphor substrates are used during molding to change the emitted color. Different chips and phosphor substrates can also be combined to change the emitted color according to market demand. This eliminates the need for wire bonding, achieving ultra-thinness, high brightness, and different emitted colors, increasing product application range, and achieving the best results with minimal cost. To further reduce costs, such as... Figure 1 As shown, the first embodiment of this utility model proposes an ultra-thin high-brightness LED bead, including a bead housing 1 and several optical components disposed inside the bead housing 1; specifically, the bead housing 1 serves as a carrier for the light source and optical components, has the function of fixing the light source and optical components in a predetermined position, and can protect them from external influences.

[0025] The top of the LED bead housing 1 has a receiving cavity for housing optical components. Several light sources are located inside the LED bead housing 1, and the optical components are used to change the color of the light sources. Specifically, to save on processes (i.e., wire bonding) while still allowing for color adjustment of the light sources, the optical components include a flip-chip blue chip 2. A phosphor cake assembly 3 is located at the bottom of the flip-chip blue chip 2. The flip-chip blue chip 2 and the phosphor cake assembly 3 work together to adjust the color of the light sources. The phosphor cake assembly 3 serves to buffer the flip-chip blue chip 2. A conductive plate 4 is located at the bottom of the phosphor cake assembly 3, which supports the phosphor cake assembly 3. The fluorescent gel cake assembly 3 can connect the flip-chip blue chip 2 and the conductive plate 4. When the LED needs to emit pure white light, the fluorescent gel cake assembly 3 is made of yellow phosphor; when the LED needs to emit warm white light, the fluorescent gel cake assembly 3 is made of green and red phosphor. This saves costs and increases the application range of the product. In addition, because the material of the fluorescent gel cake assembly 3 is relatively soft, the friction between the fluorescent gel cake assembly 3 and the flip-chip blue chip 2 is relatively large, which can ensure that the flip-chip blue chip 2 is not easy to fall off when it is placed on the fluorescent gel cake assembly 3.

[0026] This invention, through the combination of a flip-chip blue chip 2 and a fluorescent adhesive cake assembly 3, can adjust the color of the light source and save on wire bonding processes. Compared with common LED beads, it can save a lot of costs in the mass production process and achieve the purpose of adjusting the color of the light.

[0027] Several positioning components are provided on both sides of the optical component. When the optical component is inside the receiving cavity, the positioning components are used to fix the optical component inside the receiving cavity. Specifically, a common method for fixing the optical component is to use wire bonding, etc. However, since the LED beads are small in size, fixing a large number of optical components by wire bonding would be very labor-intensive. Therefore, the positioning components include a first limiting member 5, a second limiting member 8 fixedly connected to the bottom end of the first limiting member 5, and rotating members 7 fixedly connected to the bottom positions on both sides of the first limiting member 5. The rotating members 7 are rotatably connected to the LED bead shell 1, and the top end of the first limiting member 5 is fixedly connected to a limiting member 8. The fixing plate 6 has a locking component on one side of the first limiting member 5. Specifically, the first limiting member 5 and the second limiting member 8 are combined in an L-shape. When the optical component enters the receiving cavity, the bottom end of the conductive plate 4 provides a downward push to the second limiting member 8. Under the action of the rotating member 7, the first limiting member 5 receives a horizontal push. At this time, the fixing plate 6 adheres to the side wall of the flip-chip blue wafer 2 and the fluorescent film assembly 3, increasing friction to prevent the optical component from falling off. In addition, since the optical component is fixed only by friction, if there is severe vibration, the optical component may fall off. Therefore, if... Figure 2-3As shown, the locking assembly includes several locking blocks 10. The second limiting member 8 has slots 9 on both sides, and the slots 9 and locking blocks 10 are arranged in a one-to-one correspondence. When the limiting piece 6 limits the movement of the flip-chip blue wafer 2, the locking blocks 10 and slots 9 engage. The bottom of the second limiting member 8 is provided with a spring piece 11, which provides an upward pushing force to the second limiting member 8. Specifically, the spring piece 11 is used to keep the second limiting member 8 in a higher position, that is, to keep the limiting piece 6 away from the receiving cavity. When the optical component enters the receiving cavity, the spring force of the spring piece 11 is compressed, and the locking blocks 10 and slots 9 engage, thereby limiting the movement of the second limiting member 8. This ensures that the optical component is not easily dislodged under severe vibration. In addition, the locking blocks 10 are made of elastic rubber or plastic to ensure that they can be disassembled.

[0028] The lamp bead housing 1 contains a control circuit, which is used to control the light source; specifically, such as... Figure 6 As shown, in scenarios requiring multiple lighting colors, two inverted blue wafers 2 arranged side-by-side can be placed in the housing cavity. One inverted blue wafer 2 has a fluorescent patch assembly 3 made of yellow phosphor at its bottom, while the other inverted blue wafer 2 has a fluorescent patch assembly 3 made of green and red phosphor at its bottom. This allows the two inverted blue wafers 2 to emit pure white light and warm white light respectively. To control different emission colors, when the number of optical components is 2, the control circuit includes a power supply DC, pin a, pin b, pin c, switch S1, and switch S2.

[0029] The first circuit consists of a power supply DC, a switch S1, pin a, and pin b, and is used to control one of the light sources.

[0030] The power supply DC, switch S2, pin b and pin c form a second circuit to control another light source. Specifically, when it is necessary to turn on the pure white light or the warm white light, only switch S1 or switch S2 needs to be closed. When it is necessary to turn on both the pure white light and the warm white light at the same time, switch S1 and switch S2 need to be closed at the same time.

[0031] As a second embodiment of this utility model, such as Figure 4 As shown, the locking assembly includes several locking members 12, and the locking members 12 and the first limiting member 5 are arranged in a one-to-one correspondence. When the limiting piece 6 limits the movement of the flip blue wafer 2, the straight surface of the locking member 12 is in contact with one side of the first limiting member 5. Specifically, the locking member 12 is wedge-shaped and has a certain elasticity. When the limiting piece 6 moves toward the receiving cavity, the limiting piece 6 causes the locking member 12 to undergo a slight deformation, thereby passing the position where the locking member 12 is located. At this time, the locking member 12 limits the movement of the limiting piece 6, thereby preventing the optical component from falling off.

[0032] The purpose of the third embodiment of this utility model is to address the fact that the optical components in Embodiments 1 and 2 are not easily removed after installation. Therefore, as... Figure 5 As shown, the positioning component includes a pressure member 13. When the optical component is inside the receiving cavity, the pressure member 13 is used to push the optical component. The top of the pressure member 13 exceeds the top of the lamp bead housing 1. Specifically, the pressure member 13 has a movable elasticity. The pressure members 13 on both sides of the optical component can clamp the optical component in the middle position to increase friction and prevent the optical component from falling off. When it is necessary to disassemble the optical component, it is only necessary to push the top of the pressure member 13 to remove the optical component.

[0033] In this invention, when installing optical components, it is only necessary to press the optical components into the receiving cavity, and the positioning component will limit the movement of the optical components. Compared with common fixing methods, the installation of optical components can be completed more conveniently.

[0034] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An ultra-thin, high-brightness LED bead, comprising a plurality of light sources disposed inside the bead housing (1), characterized in that, The lamp bead housing (1) is provided with several optical components for changing the color of the light source. The top of the lamp bead housing (1) is provided with a receiving cavity for placing the optical components. Several positioning components are provided on both sides of the optical components for fixing the optical components inside the receiving cavity. The lamp bead housing (1) is provided with a control circuit for controlling the light source. The optical component includes a flip-chip blue wafer (2), the bottom end of which is provided with a fluorescent gel cake assembly (3) for buffering the flip-chip blue wafer (2), and the bottom of the fluorescent gel cake assembly (3) is provided with a conductive plate (4) for supporting the fluorescent gel cake assembly (3).

2. The ultra-thin high-brightness LED bead according to claim 1, characterized in that: The positioning component includes a first limiting member (5), a second limiting member (8) is fixedly connected to the bottom end of the first limiting member (5), a rotating member (7) is fixedly connected to the bottom ends of both sides of the first limiting member (5), the rotating member (7) is rotatably connected to the lamp bead shell (1), a limiting piece (6) is fixedly connected to the top end of the first limiting member (5), and a locking component is provided on one side of the first limiting member (5).

3. The ultra-thin high-brightness LED bead according to claim 2, characterized in that: The locking component includes several locking blocks (10), and the second limiting member (8) has locking slots (9) on both sides. The locking slots (9) and locking blocks (10) are arranged in a one-to-one correspondence. The locking blocks (10) and locking slots (9) are engaged. The bottom of the second limiting member (8) is provided with a spring piece (11) for providing an upward thrust to the second limiting member (8).

4. The ultra-thin high-brightness LED bead according to claim 1, characterized in that: The positioning assembly includes a pressure member (13) for applying a thrust to the optical assembly, the top of which extends beyond the top of the lamp housing (1).

5. The ultra-thin high-brightness LED bead according to claim 1, characterized in that: The control circuit includes a power supply DC, pin a, pin b, pin c, switch S1, and switch S2. The power supply DC, switch S1, pin a and pin b form a first circuit for controlling one of the light sources; The power supply DC, switch S2, pin b, and pin c form a second circuit for controlling another light source.

Images