Tool for removing electronic sealing silica gel on circuit board

Abstract

The utility model relates to the field of removing electronic sealing silica gel from a circuit board, in particular to a tool for removing electronic sealing silica gel from a circuit board, which comprises a shovel head base, a middle holding rod arranged at the upper end of the shovel head base, a shovel head front end arranged at the lower end of the shovel head base, and a hard brush head arranged at the upper end of the middle holding rod, the front end of the shovel head is a freely movable end, the movable shovel head front end and the hard brush head are provided on the basis of the operation characteristics of removing the electronic sealing silica gel on the circuit board and in combination with the practical problems encountered in the removing process, the electronic sealing silica gel on the circuit board can be rapidly and effectively removed, and the working efficiency is improved. Glue on the surface of the welding spot of the device is removed completely, and the dismantling efficiency and quality of the device are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board removes electronic seal silica gel technical field, specifically a kind of for the tooling for removing electronic seal silica gel of circuit board. BACKGROUND

[0002] The working environment of airborne electronic products is harsh, to ensure its stability and reliability, the circuit board in many electronic products is sealed by electronic seal silica gel, the purpose is to improve the resistance of circuit board to external impact, vibration, also can play the role of improving the waterproof, moisture-proof, salt fog, mildew-proof, corrosion-resistant of device. With the continuous use of airborne electronic products, product failure occurs occasionally due to component damage, when replacing components, electronic seal silica gel on the surface and around the device to be replaced must be removed clean before using tin suction gun or hot air gun to remove the chip.

[0003] But there is no tool for removing electronic seal silica gel of circuit board at present, tweezers or blades are often used in the industry. Although electronic seal silica gel is soft after solidification, it is easy to remove, but there are two shortcomings when removing seal silica gel using tweezers or blades:

[0004] 1. The tool is not suitable, and the work efficiency is low;

[0005] 2. A small amount of glue will be left on the pin surface of the device when removing it using tweezers or blades, which will affect the heat conduction of soldering point soldering tin, increase the difficulty of removing the device, and affect the quality of removing the device. INVENTION CONTENTS

[0006] In order to solve the above problems, the utility model provides a tooling for removing electronic seal silica gel of circuit board.

[0007] A tooling for removing electronic seal silica gel of circuit board, comprising a shovel head base, an intermediate handle arranged on the upper end of the shovel head base, a shovel head front end arranged on the lower end of the shovel head base, and a hard brush brush head arranged on the upper end of the intermediate handle, wherein the shovel head front end is a freely movable end.

[0008] Further, the shovel head front end is composed of a plurality of triangular prism-shaped shovel tips closely arranged.

[0009] Further, a spring assembly is arranged on the triangular prism and connected with the shovel head base.

[0010] Further, the spring assembly comprises a spring clamp and a spring connected with the spring clamp.

[0011] Further, the intermediate handle is connected with the shovel head base and the hard brush brush head through anti-slip plastic.

[0012] The utility model discloses the beneficial effect is:

[0013] The utility model discloses based on the operation characteristics of the removal circuit board electronic seal silica gel, and combining the actual problem encountered in the removal process, the shovel head front end and the hard hair brush brush head with movable are proposed, and electronic seal silica gel on the circuit board is removed quickly and effectively, and the glue on the device solder point surface is removed clean, and the removal efficiency and quality of device are improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] The utility model is further illustrated below in connection with the drawings and examples.

[0015] Figure 1 It is the three-dimensional structure schematic diagram of the utility model;

[0016] Figure 2 It is the main view structure schematic diagram of the utility model;

[0017] Figure 3 It is the side view structure schematic diagram of the utility model;

[0018] Figure 4 It is the overhead structure schematic diagram of the utility model;

[0019] Figure 5 It is the spring assembly structure schematic diagram of the utility model;

[0020] Reference signs:

[0021] 1, shovel head base;2, shovel head front end;3, hard hair brush brush head;4, intermediate holding rod;21, three prism;22, spring card;23, spring. DETAILED DESCRIPTION

[0022] In order to make the technical means, creation features, purposes and effects realized by the utility model easy to understand, the utility model is further described below.

[0023] As Figures 1 to 5 Shown, a kind of tool for removing electronic seal silica gel of circuit board, including shovel head base 1, the intermediate holding rod 4 being arranged at the upper end of shovel head base 1, the shovel head front end 2 being arranged at the lower end of shovel head base 1, the hard hair brush brush head 3 being arranged at the upper end of intermediate holding rod 4, the shovel head front end 2 is freely movable end.

[0024] As Figure 1 、 Figure 2 、 Figure 3 And Figure 5As shown, the new shovel head front end 2 of the utility model is composed of a plurality of small triangular prism shovel tips closely arranged, and the shovel head front end 2 can freely move, so that when the electronic sealing silica gel is removed, the device pin and the PCB substrate are not damaged, and the removal efficiency is high.

[0025] The utility model discloses based on the operation characteristics of removing electronic sealing silica gel on the circuit board, and in combination with the actual problem encountered in the removal process, the movable shovel head front end 2 and the hard hair brush head 3 are provided, electronic sealing silica gel on the circuit board is quickly and effectively removed, the glue on the device soldering point surface is removed clean, and the removal efficiency and quality of the device are improved.

[0026] The center distance between the triangular prisms 21 is equal, which can be 0.254 mm in actual application, and the interval can also be adjusted according to actual needs.

[0027] As shown in the figure, Figure 5 As an optimization scheme, the triangular prism 21 is provided with a spring assembly connected with the shovel head base 1.

[0028] As shown in the figure, Figure 5 The utility model discloses the spring assembly, and the spring assembly includes a spring card 22 and a spring 23 connected with the spring card 22, the spring 23 is moderate in elasticity, and ensures that each triangular prism shovel tip can independently stretch and contract.

[0029] Specifically, as shown in the figure, Figures 1 to 3 The hard hair brush head 3 is a cylindrical brush head, which is an insulating brush with the characteristics of preventing static electricity and not easy to fall off.

[0030] The material of the hard hair brush head 3 is pig bristle, and the hard hair brush head 3 can be used to clean the residual silica gel on the PCB board after the electronic sealing silica gel is removed.

[0031] The middle handle 4 is connected with the shovel head base 1 and the hard hair brush head 3 through anti-skid plastic, and the anti-skid plastic should be wrapped around 360 degrees, which is convenient to use.

[0032] The electronic sealing silica gel on the circuit board is removed by using the tool, the movable shovel head front end 2 is used to shovel most of the silica gel on the circuit board, and then the hard hair brush head 3 is used to clean the residual silica gel on the PCB board, so that the device pin and the PCB substrate are not left with residual glue, and the efficiency is improved.

[0033] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A tooling for removing electronic sealant silicone from circuit boards, characterized in that: The utility model relates to a kind of multi-purpose cleaning tool, including spade head base (1), middle handle (4) being arranged on the upper end of spade head base (1), spade head front end (2) being arranged on the lower end of spade head base (1), bristle brush head (3) being arranged on the upper end of middle handle (4), and the spade head front end (2) is freely movable end.

2. The tooling for removing electronic seal silicone from a circuit board of claim 1, wherein: The spade head front end (2) is composed of a plurality of triangular prism (21) shaped spade tips closely arranged.

3. The tooling for removing electronic encapsulation silicone from a circuit board of claim 2, wherein: The center distance between the triangular prisms (21) is equal.

4. The tooling for removing electronic encapsulation silicone from a circuit board of claim 2, wherein: A spring assembly is arranged on the triangular prisms (21) and connected to the spade head base (1).

5. The tooling for removing electronic encapsulation silicone from a circuit board of claim 4, wherein: The spring assembly includes a spring clip (22) and a spring (23) connected to the spring clip (22).

6. The tooling for removing electronic encapsulation silicone from a circuit board of claim 1, wherein: The bristle brush head (3) is a cylindrical brush head.

7. The tooling for removing electronic encapsulation silicone from a circuit board of claim 1, wherein: The material of the bristle brush head (3) is pig bristle.

8. The tooling for removing electronic encapsulation silicone from a circuit board of claim 1, wherein: The middle handle (4) is connected to the spade head base (1) and the bristle brush head (3) by a non-slip plastic.

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