Drying equipment for semiconductor lead frame

Abstract

The utility model discloses drying equipment for a semiconductor lead frame, which comprises a drying box, the top surface and the bottom surface of the drying box are respectively provided with a moisture discharging pipe and a water discharging pipe, the surface of one side of the drying box is fixedly provided with a driving motor, and the output end of the driving motor extends into the drying box and is provided with a material placing frame; a material placing frame is installed on the material placing frame, a through hole and a through groove are formed in the surface of the material placing frame, a shifting rod is arranged in the through groove, and an eccentric wheel is installed at one end of the shifting rod. According to the semiconductor lead frame spin-drying device, the semiconductor lead frames are placed on the rotary material placing frame, the material placing frame rotates to drive the semiconductor lead frames to rotate along with the material placing frame, moisture on the semiconductor lead frames can be spin-dried, and the material placing frame can contain a plurality of semiconductor lead frames at the same time. The multiple semiconductor lead frames can be dried at the same time at a time, the drying efficiency is improved, and the large-batch production requirement is met.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit lead frame technical field especially relates to a kind of drying equipment for semiconductor lead frame. BACKGROUND

[0002] Lead frame as the chip carrier of integrated circuit, it needs to pass through multiple cleaning procedures in production process, and drying link is crucial to remove surface moisture and residual chemical substances, and traditional drying equipment mainly relies on hot air circulation or static oven.

[0003] The prior art has the following problems:

[0004] After a large amount of retrieval, the patent file with application No. CN202121730918.3 discloses a drying equipment for lead frame, which, although it improves the processing capacity through multiple conveyor belts in actual use, still relies on single hot air drying, has large water residue, and static placement leads to slow water evaporation, making it difficult to meet the demand of mass production, and uneven distribution of hot air can cause local overheating or incomplete drying, leading to subsequent packaging delamination or oxidation risk, and secondly, single heat source needs to run for a long time, significantly increasing energy consumption cost.

[0005] Therefore, we propose a drying equipment for semiconductor lead frame to solve the above problems. UTILITY MODEL CONTENT

[0006] The utility model aims at providing a drying equipment for semiconductor lead frame to solve the problems in the prior art.

[0007] To achieve the above object, the utility model adopts the following technical scheme: a drying equipment for semiconductor lead frame, comprising a drying box, the top surface and bottom surface of the drying box are respectively provided with a moisture removal pipe and a drain pipe, a drive motor is fixedly installed on one side surface of the drying box, an output end of the drive motor extends into the inside of the drying box and is installed with a material placing frame, a material placing rack is installed on the material placing frame, through holes and through slots are formed on the surface of the material placing rack, a lever is arranged in the through slot, one end of the lever is installed with an eccentric wheel, and a semiconductor lead frame is arranged between the eccentric wheel and the inner wall of the material placing rack, an air compressor is fixedly installed on one side surface of the drying box, an air outlet pipe is hung on the inner wall of the drying box, an air outlet nozzle is fixedly installed on the surface of the air outlet pipe, the air outlet pipe is connected with the air outlet nozzle through a gas pipe, and an electric heating plate is fixedly installed on the inner wall of the drying box.

[0008] Preferably, the material placing rack is provided with a plurality of material placing racks, and the plurality of material placing racks are arranged in an annular array on the material placing frame.

[0009] Preferably, one side surface of the drying box is hingedly connected with a box door, and a surface of the box door is fixedly provided with an on-off switch, and the on-off switch is electrically connected with the driving motor, the electric heating plate and the air compressor through wires.

[0010] Preferably, a plurality of air outlets are arranged in an annular array on the surface of the air outlet pipe.

[0011] Preferably, the diameter of the material placing frame is smaller than the diameter of the drying box.

[0012] Preferably, the material placing frame is a hollow cuboid structure.

[0013] Compared with the prior art, the drying equipment for semiconductor lead frames has the following beneficial effects:

[0014] 1. In the drying equipment for semiconductor lead frames, the semiconductor lead frames are placed on the rotating material placing frame, the material placing frame drives the semiconductor lead frames to rotate, the moisture on the semiconductor lead frames can be spun dry, the material placing frame can accommodate a plurality of semiconductor lead frames at the same time, one-time simultaneous drying of a plurality of semiconductor lead frames is realized, the drying efficiency is improved, and the large-batch production requirement is met.

[0015] 2. In the drying equipment for semiconductor lead frames, the compressed air blows high-pressure air to dry the moisture on the surface of the semiconductor lead frames, and the electric heating plate is used for auxiliary drying, the drying and the auxiliary drying are used in cooperation, the drying effect and the efficiency of the semiconductor lead frames are greatly improved, the drying effect is good, local overheating or incomplete drying is not easy to cause, and the subsequent packaging delamination or oxidation risk is caused, and the cooperation of spinning, blowing and drying has a shorter running time and lower energy consumption cost. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0017] Figure 1 A sectional view of a drying equipment for semiconductor lead frames is provided in the present application.

[0018] Figure 2 A partial structure schematic view is provided in the present application. Figure 1

[0019] An enlarged schematic view of A in the present application is provided. Figure 3 Figure 2

[0020] Figure 4 ​​Fig. 1 is a schematic view of the external structure of the present application; Figure 1 Fig. 1 is a schematic view of the external structure of the present application;

[0021] Figure 5 Fig. 1 is a schematic view of the external structure of the present application;

[0022] Fig. 1 is a schematic view of the external structure of the present application;

[0023] 1, drying box; 2, exhaust pipe; 3, drain pipe; 4, electric heating plate; 5, air compressor; 6, air outlet pipe; 7, air outlet nozzle; 8, material placing frame; 9, material placing rack; 10, through slot; 11, lever; 12, eccentric wheel; 13, through hole; 14, box door; 15, switch. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0025] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application; the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance; in addition, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements inside. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0026] Please refer to Figures 1-5The utility model provides a kind of drying equipment for semiconductor lead frame, including drying cabinet 1, the top surface and bottom surface of drying cabinet 1 are provided with exhaust pipe 2 and drain pipe 3 respectively, driving motor is fixedly installed on the side surface of drying cabinet 1, and the output end of driving motor extends to the inside of drying cabinet 1 and is installed with material placing frame 8, material placing frame 8 is installed with material placing rack 9, and the surface of material placing rack 9 is provided with through hole 13 and through slot 10, eccentric wheel 12 is installed on the one end of the eccentric wheel 12 in through slot 10, and the inner wall between eccentric wheel 12 and material placing rack 9 is provided with semiconductor lead frame, air compressor 5 is fixedly installed on the side surface of drying cabinet 1, air outlet pipe 6 is hoisted on the inner wall of drying cabinet 1, and air outlet pipe 6 is fixedly installed with air outlet nozzle 7 on the surface, the air outlet nozzle 7 of air outlet pipe 6 is connected with air outlet pipe 6 by air pipe, and electric heating plate 4 is fixedly installed on the inner wall of drying cabinet 1.

[0027] When using, open the box door 14, then sequentially and orderly place semiconductor lead frame on the rotating material placing rack 9, and fix semiconductor lead frame by rotating eccentric wheel 12, wherein material placing frame 8 rotates to drive semiconductor lead frame to rotate, can preliminarily spin dry the moisture on semiconductor lead frame, and material placing frame 8 can accommodate several semiconductor lead frames simultaneously, realize simultaneous drying treatment of multiple semiconductor lead frames at a time, improve drying efficiency, meet mass production demand, then further blow dry the moisture on the surface of semiconductor lead frame by compressed air, and further blow dry the moisture on the surface of semiconductor lead frame by compressed air, and the cooperation of blow drying and drying can greatly improve the drying effect and efficiency of semiconductor lead frame, the drying effect is good, and it is not easy to cause local overheating or incomplete drying, and the cooperation of spin drying, blow drying and drying has shorter running time and lower energy consumption cost, after drying is completed, the semiconductor lead frame is taken down, and the above steps are repeated to batch dry semiconductor lead frame.

[0028] In the embodiment, the material placing rack 9 is provided with a plurality of material placing racks 9, and the plurality of material placing racks 9 are arranged in an annular array on the material placing frame 8.

[0029] Specifically, the semiconductor lead frame is supported and fixed in batches, and the drying efficiency of the semiconductor lead frame is improved.

[0030] In the embodiment, the side surface of the drying cabinet 1 is hinged to the box door 14 through a hinge, the surface of the box door 14 is fixedly installed with a switch 15, and the switch 15 is electrically connected with the driving motor, the electric heating plate 4 and the air compressor 5 through wires.

[0031] Specifically, it is a common circuit connection structure, and details are not described here, and it should be noted that the working temperature of the electric heating plate 4 supports partition control and supports gradient heating (such as 50 DEG C→120 DEG C→180 DEG C).

[0032] In the embodiment, the air outlet nozzles 7 are arranged in a circular array on the surface of the air outlet pipe 6.

[0033] Specifically, the angle of the air outlet nozzles 7 is adjustable, covering the front and back surfaces of the lead frame, and the blowing pressure is 0.3-0.8 MPa, so that the blowing is more uniform and the blowing effect is better.

[0034] In the embodiment, the diameter of the material placing frame 8 is smaller than the diameter of the drying box 1.

[0035] Specifically, the material placing frame 8 can rotate in the interior of the drying box 1, ensuring that the semiconductor lead frame is spin-dried and blown dry.

[0036] In the embodiment, the material placing frame 9 is a hollow cuboid structure.

[0037] Specifically, the two ends of the semiconductor lead frame can be fixed in the material placing frame 9, and the semiconductor lead frame located in the interior of the material placing frame 9 can be normally spin-dried and blown dry.

[0038] In the embodiment, the switch 15 is of an existing structure, and the control circuit can be realized by simple programming by those skilled in the art, which is a common knowledge in the art. Only the use is described, and no modification is made, so the control mode and circuit connection are not described in detail.

[0039] Working principle:

[0040] Loading: open the box door 14, and load the cleaned lead frame into the material placing frame 8 on the material placing frame 9, and fix it by the eccentric wheel 12.

[0041] Spin-drying: start the driving motor, and rotate the material placing frame 8 at 400 rpm for 2 minutes to remove the large water droplets on the surface.

[0042] Blowing: the compressed air system runs for 1 minute (pressure 0.5 MPa), and blows the residual water film.

[0043] Heating and drying: the electric heating plate 4 is heated to 120℃, and lasts for 10 minutes to ensure that the deep water is evaporated.

[0044] Moisture removal and cooling: after the moisture removal pipe 2 removes the moisture, the material placing frame 8 rotates at a low speed to cool to room temperature.

[0045] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A drying apparatus for semiconductor lead frames, comprising a drying chamber (1), characterized in that, The top and bottom surfaces of the drying box (1) are respectively provided with a dehumidification pipe (2) and a drain pipe (3). A drive motor is fixedly installed on one side surface of the drying box (1), and the output end of the drive motor extends into the interior of the drying box (1) where a material placement frame (8) is installed. A material placement rack (9) is installed on the material placement frame (8), and the surface of the material placement rack (9) is provided with a through hole (13) and a through groove (10). A lever (11) is provided in the through groove (10), and one end of the lever (11) is mounted on... An eccentric wheel (12) is provided, and a semiconductor lead frame is provided between the eccentric wheel (12) and the inner wall of the material rack (9). An air compressor (5) is fixedly installed on one side surface of the drying box (1). An air outlet pipe (6) is suspended on the inner wall of the drying box (1), and an air outlet nozzle (7) is fixedly installed on the surface of the air outlet pipe (6). The air outlet end of the air compressor (5) is connected to the air outlet pipe (6) through an air pipe. An electric heating plate (4) is fixedly installed on the inner wall of the drying box (1).

2. The drying equipment for semiconductor lead frames according to claim 1, characterized in that, The material rack (9) is provided in multiple ways, and the multiple material racks (9) are arranged in a circular array on the material frame (8).

3. The drying equipment for semiconductor lead frames according to claim 1, characterized in that, The drying oven (1) has a door (14) hinged to one side surface, and a switch (15) is fixedly installed on the surface of the door (14). The switch (15) is electrically connected to the drive motor, the electric heating plate (4) and the air compressor (5) through wires.

4. The drying equipment for semiconductor lead frames according to claim 1, characterized in that, The air outlet (7) is provided in multiple ways, and the multiple air outlets (7) are arranged in a ring array on the surface of the air outlet pipe (6).

5. A drying apparatus for semiconductor lead frames according to claim 1, characterized in that, The diameter of the material placement frame (8) is smaller than the diameter of the drying box (1).

6. A drying apparatus for semiconductor lead frames according to claim 1, characterized in that, The material rack (9) is a hollow cuboid structure.

Images