Radio frequency front-end module packaging structure

Abstract

The utility model discloses a radio frequency front-end module packaging structure, belongs to the technical field of electronic equipment, and aims to solve the technical problem of poor heat dissipation performance of a radio frequency front-end module packaging structure in the prior art. The radio frequency front-end module packaging structure comprises a packaging box body, a circuit board is assembled in the packaging box body in a suspended mode, a power amplifier, a switch, a low-noise amplifier and a filter are assembled on the circuit board, and interfaces in circuit connection with the circuit board are formed in the two end walls of the packaging box body; a packaging box cover is assembled at the top end of the packaging box body, a plurality of radiating fins are arranged on the upper surface of the packaging box cover side by side, and a hollow groove is formed in the middle of the packaging box cover. The radio frequency front-end module packaging structure has good heat dissipation performance, heat generated by working of a power amplifier, a switch, a low-noise amplifier and a filter on the circuit board can be quickly dissipated, and the influence of heat accumulation on the radio frequency front-end module is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of electronic equipment technology, and specifically relates to a radio frequency front-end module packaging structure. Background Technology

[0002] The radio frequency (RF) front-end module is a key component in electronic devices, mainly consisting of a power amplifier (PA), a switch, a low-noise amplifier (LNA), and a filter. Located between the antenna and the transceiver, the RF front-end module is primarily responsible for processing high-frequency signals. In the transmission path, it converts baseband signals into high-frequency signals and transmits them through the antenna. In the reception path, it receives the high-frequency signals from the antenna and converts them back into baseband signals for processing.

[0003] Radio frequency (RF) front-end modules contain components that generate significant heat, such as transistors in power amplifiers, which produce a lot of heat during operation. Existing RF front-end module packaging structures generally suffer from poor heat dissipation performance, affecting the communication quality and stability of electronic devices. Therefore, this application proposes an RF front-end module packaging structure. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a radio frequency front-end module packaging structure, which aims to solve the technical problem of poor heat dissipation performance of the existing radio frequency front-end module packaging structure.

[0005] To address the aforementioned technical problems, this utility model provides a radio frequency front-end module packaging structure, including a packaging box. A circuit board is suspended inside the packaging box, and a power amplifier, a switch, a low-noise amplifier, and a filter are mounted on the circuit board. Interfaces for connecting to the circuit board are provided on both end walls of the packaging box. A packaging box cover is mounted on the top of the packaging box, and heat dissipation fins are provided on the upper surface of the packaging box cover. Several heat dissipation fins are arranged side by side.

[0006] Preferably, the packaging box cover has a hollow groove in the middle, and a heat sink is installed in the hollow groove, with the bottom of the heat sink fins attached to the heat sink.

[0007] Preferably, the heat dissipation fins and the heat dissipation plate are made of the same material, namely aluminum alloy.

[0008] Preferably, a strip arm is horizontally arranged above the heat dissipation fins, the strip arm is distributed perpendicular to the heat dissipation fins, and the two ends of the strip arm are bent downwards and fixedly connected to the packaging box cover.

[0009] Preferably, a gap is left between the side of the circuit board and the inner wall of the packaging box, and four support columns for suspending and supporting the circuit board are provided inside the packaging box.

[0010] Preferably, the bottom end of the support column is fixedly connected to the bottom wall inside the packaging box, and the top end of the support column is provided with a recess on one side facing the middle of the packaging box. A screw hole is vertically provided on the recess, and the corner of the packaging box is embedded in the recess and has a connecting hole aligned with the screw hole.

[0011] Preferably, mounting posts are vertically arranged at the four corners of the packaging box, and mounting holes are vertically opened on the mounting posts. The bottom end of the mounting posts extends downward below the lower surface of the packaging box.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] The heat dissipation fins and heat sinks on the package cover, both made of aluminum alloy, can quickly dissipate the heat generated by the power amplifier, switch, low noise amplifier and filter on the circuit board, reducing the impact of heat accumulation on the RF front-end module. The bar arm provides protection for the heat dissipation fins, minimizing the possibility of the heat dissipation fins being damaged by impact, bending or other issues.

[0014] The circuit board is secured by four support pillars inside the enclosure. Recesses on the support pillars are embedded at the four corners of the circuit board, and screws are inserted into the screw holes on the recesses through the connection holes on the circuit board. This design not only fixes the circuit board but also suspends it in mid-air. Combined with the gap between the sides of the circuit board and the inner wall of the enclosure, the bottom, sides, and top of the circuit board are open, forming an effective heat dissipation channel. Heat dissipation fins and heat sinks further enhance heat dissipation performance. The bottom of the mounting pillars extends downwards below the lower surface of the enclosure. After the enclosure is installed and fixed, gaps remain between the lower surface of the enclosure and the mounting surface, facilitating airflow at the bottom of the enclosure and heat dissipation, significantly improving the heat dissipation performance of the RF front-end module. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a structural diagram showing the disassembled packaging box body and packaging box cover in this utility model;

[0018] Figure 3 This is a schematic diagram showing the disassembled packaging box and circuit board in this utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the packaging box cover in this utility model;

[0020] Figure 5 This is a schematic diagram of the support column in this utility model.

[0021] The labels in the attached diagram are as follows: 1. Encapsulation box; 2. Encapsulation box cover; 3. Heat sink fins; 4. Mounting post; 5. Mounting hole; 6. Circuit board; 7. Support post; 8. Connecting hole; 9. Bar arm; 10. Heat sink; 11. Recess; 12. Screw hole. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] This embodiment provides a radio frequency front-end module packaging structure, the schematic diagram of which is shown below. Figures 1-5 As shown, the package includes a housing 1, with a circuit board 6 suspended inside the housing 1. A power amplifier, a switch, a low-noise amplifier, and a filter are mounted on the circuit board 6. Interfaces for circuit connection with the circuit board 6 are provided on both ends of the housing 1.

[0024] Furthermore, the top of the encapsulation box 1 is equipped with an encapsulation box cover 2. The upper surface of the encapsulation box cover 2 is provided with heat dissipation fins 3. Several heat dissipation fins 3 are arranged side by side. A hollow groove is opened in the middle of the encapsulation box cover 2, and a heat dissipation fin 10 is installed in the hollow groove. The bottom of the heat dissipation fins 3 is in contact with the heat dissipation fin 10. The heat dissipation fins 3 and the heat dissipation fin 10 are made of the same material, aluminum alloy. Through the heat dissipation fins 3 and the heat dissipation fin 10 provided on the encapsulation box cover 2, and the fact that the heat dissipation fins 3 and the heat dissipation fin 10 are both made of aluminum alloy, the heat generated by the power amplifier, switch, low noise amplifier and filter on the circuit board 6 can be quickly dissipated, reducing the impact of heat accumulation on the RF front-end module.

[0025] In this embodiment, a strip arm 9 is horizontally arranged above the heat dissipation fin 3. The strip arm 9 is distributed perpendicular to the heat dissipation fin 3. The two ends of the strip arm 9 are bent downward and fixedly connected to the encapsulation box cover 2. The arrangement of the strip arm 9 can provide protection for the heat dissipation fin 3 and avoid the phenomenon of the heat dissipation fin 3 being damaged by collision, bending and other phenomena as much as possible.

[0026] In a further embodiment, a gap is left between the side of the circuit board 6 and the inner wall of the encapsulation box 1. The encapsulation box 1 is provided with four support pillars 7 for suspending and supporting the circuit board 6. The bottom end of the support pillar 7 is fixedly connected to the bottom wall of the encapsulation box 1. The top of the support pillar 7 is provided with a recess 11 on the side facing the middle of the encapsulation box 1. A screw hole 12 is vertically provided on the recess 11. The corners of the encapsulation box 1 are embedded in the recess 11 and have connecting holes 8 aligned with the screw holes 12. Through the four support pillars 7 provided inside the encapsulation box 1, the four corners of the circuit board 6 are embedded in the recess 11 on the support pillar 7. Screws are inserted through the connecting holes 8 on the circuit board 6 and into the screw holes 12 on the recess 11. While fixing the circuit board 6, the circuit board 6 can be suspended and supported. With the structural design of leaving a gap between the side of the circuit board 6 and the inner wall of the encapsulation box 1, the bottom, sides and top of the circuit board 6 are connected to form an effective heat dissipation channel. The heat dissipation performance is further improved by the heat dissipation fins 3 and heat sinks 10.

[0027] In a further embodiment, mounting posts 4 are vertically arranged at the four corners of the encapsulation box 1. Mounting holes 5 are vertically opened on the mounting posts 4 for mounting and fixing the encapsulation box 1. The bottom end of the mounting posts 4 extends downward below the lower surface of the encapsulation box 1. With this structural design, after the encapsulation box 1 is installed and fixed, there is a gap between the lower surface of the encapsulation box 1 and the mounting surface, which is conducive to air circulation at the bottom of the encapsulation box 1 and heat dissipation.

[0028] Working principle: During use, the heat dissipation fins 3 and 10 on the enclosure cover 2, both made of aluminum alloy, can quickly dissipate the heat generated by the power amplifier, switch, low-noise amplifier, and filter on the circuit board 6. The bar arm 9 provides protection for the heat dissipation fins 3, minimizing the risk of damage from impacts, bending, or other injuries. Furthermore, four support pillars 7 inside the enclosure 1 are used to insert the circuit board 6 into the recesses 11 on the support pillars 7 at its four corners. Screws are then inserted into the recesses 11 through the connection holes 8 on the circuit board 6. The screw holes 12 not only fix the circuit board 6 but also suspend and support it. Combined with the structural design that leaves gaps between the side of the circuit board 6 and the inner wall of the package box 1, the bottom, sides and top of the circuit board 6 are connected to form an effective heat dissipation channel. The heat dissipation performance is further improved by the heat dissipation fins 3 and heat sinks 10. Furthermore, the structural design that extends the bottom of the mounting post 4 downward below the lower surface of the package box 1 leaves a gap between the lower surface of the package box 1 and the mounting surface after the package box 1 is installed and fixed. This facilitates air circulation at the bottom of the package box 1 and heat dissipation, which greatly improves the heat dissipation performance of the RF front-end module.

[0029] All technical features in this embodiment can be freely combined according to actual needs.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A radio frequency front end module packaging structure, comprising a packaging box body (1), characterized in that: a circuit board (6) is suspendedly assembled in the packaging box body (1), a power amplifier, a switch, a low noise amplifier and a filter are assembled on the circuit board (6), and interfaces electrically connected with the circuit board (6) are arranged on the two end walls of the packaging box body (1); a packaging box cover (2) is assembled at the top of the packaging box body (1), heat dissipation fins (3) are arranged on the upper surface of the packaging box cover (2), and a plurality of heat dissipation fins (3) are arranged side by side. A hollow groove is formed in the middle of the packaging box cover (2), a heat dissipation fin (10) is assembled in the hollow groove, and the bottom of the heat dissipation fin (3) is attached to the heat dissipation fin (10).

2. The radio frequency front end module package structure of claim 1, wherein, The heat dissipation fin (3) and the heat dissipation fin (10) are made of the same material, which is aluminum alloy.

3. The RF front-end module package structure of claim 1, wherein, A strip arm (9) is horizontally arranged above the heat dissipation fin (3), the strip arm (9) is perpendicular to the heat dissipation fin (3), and the two ends of the strip arm (9) are downwardly bent and fixedly connected to the packaging box cover (2).

4. The radio frequency front end module package structure of claim 1, wherein, A gap is left between the side edge of the circuit board (6) and the inner wall of the packaging box body (1), and four support columns (7) for suspendingly supporting the circuit board (6) are arranged in the packaging box body (1).

5. The radio frequency front end module package structure of claim 1, wherein, The bottom end of the support column (7) is fixedly connected to the inner bottom wall of the packaging box body (1), a recess (11) is formed in the top end of the support column (7) towards one side of the middle of the packaging box body (1), a screw hole (12) is vertically formed in the recess (11), and a connecting hole (8) aligned with the screw hole (12) is embedded in the recess (11) at the corner of the packaging box body (1).

6. The radio frequency front end module package structure of claim 5, wherein, Mounting columns (4) are vertically arranged at the four corners of the packaging box body (1), mounting holes (5) are vertically formed in the mounting columns (4), and the bottom ends of the mounting columns (4) downwardly extend below the lower surface of the packaging box body (1).

7. The radio frequency front end module package structure of claim 1, wherein, ​

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