Light-emitting device

Abstract

The utility model relates to the technical field of display devices, and discloses a luminescent device, which comprises a device support, a shell and a metal layer, and the shell forms a bowl cup structure on the surface of the metal layer; the metal layer comprises more than two bonding pad groups, and any one bonding pad group comprises a plurality of bonding pads; the shell comprises a transverse river channel and a longitudinal river channel which are located between the bonding pads, the more than two bonding pad groups are separated based on the transverse river channel and are symmetrically distributed up and down, and the bonding pads in the same bonding pad group are separated based on the longitudinal river channel; the transverse riverway and the longitudinal riverway intersect to form a cross-shaped riverway, the top face of the cross-shaped riverway is lower than the top face of the bowl-cup structure, and the bottom face of the bowl-cup structure is composed of a metal layer and part of the surface of the cross-shaped riverway. According to the utility model, the cross-shaped riverway is arranged in the bracket, and the bonding pads are separated based on the cross-shaped riverway, so that the light-emitting chips with different light-emitting colors, which are fixedly welded on the bonding pads, can be symmetrically distributed up and down, and a local color cast phenomenon is avoided.

Description

Technical Field

[0001] This utility model relates to the field of display device technology, and in particular to a light-emitting device. Background Technology

[0002] Existing light-emitting devices include color display schemes that use blue light chips paired with phosphors. However, light-emitting devices using this display scheme have a narrow color gamut and cannot achieve better display effects. Furthermore, because the pads in the traditional bracket are designed in parallel, the blue light chips are arranged in parallel within the bracket, which can cause local color shifts during light emission and poor light mixing, resulting in poor display effects. Utility Model Content

[0003] The purpose of this utility model is to overcome the shortcomings of the prior art. This utility model provides a light-emitting device in which a cross-shaped channel formed by the intersection of horizontal and vertical channels is set in the bracket. The pads are separated by the cross-shaped channel, so that the light-emitting chips of different colors that are fixed on the pads can be symmetrically distributed vertically, without local color deviation, and the display effect is better.

[0004] This utility model provides a light-emitting device, which includes a device support, the device support includes a shell and a metal layer, and the shell forms a cup structure on the surface of the metal layer;

[0005] The metal layer includes two or more pad groups, and any one pad group includes several pads;

[0006] The housing includes transverse channels and longitudinal channels located between the pads. The two or more pad groups are separated by the transverse channels and are symmetrically distributed vertically. Several pads in the same pad group are separated by the longitudinal channels.

[0007] The transverse and longitudinal channels intersect to form a cross-shaped channel. The top surface of the cross-shaped channel is lower than the top surface of the bowl-shaped structure. The bottom surface of the bowl-shaped structure is composed of the metal layer and part of the surface of the cross-shaped channel.

[0008] Furthermore, the corners of any of the pads that contact the cross intersection of the cross-shaped channel are set to be rounded or triangular.

[0009] Furthermore, the width of the transverse channel The value range is: 0.15mm ≤ ≤0.3mm;

[0010] The width of the longitudinal channel The value range is: 0.15mm ≤ ≤0.3mm.

[0011] Furthermore, the top surface of the cross-shaped channel is higher than the top surface of the metal layer, or the top surface of the cross-shaped channel is flush with the top surface of the metal layer.

[0012] Furthermore, the height from the top surface of the cross-shaped channel to the top surface of the metal layer The range of values ​​for is: 0um≤ ≤20um.

[0013] Furthermore, the metal layer is provided with two or more sets of light-emitting chips, which are respectively soldered onto corresponding pads and distributed symmetrically in the upper and lower parts.

[0014] Furthermore, the two or more sets of light-emitting chips include one or more blue light chips and one or more green light chips.

[0015] Furthermore, the bowl-cup structure includes a long side cup wall and a short side cup wall, the inclination angle α of the long side cup wall relative to the horizontal plane is 40°-60°, and the inclination angle β of the short side cup wall relative to the horizontal plane is 25°-40°.

[0016] Furthermore, the four corners of the cup top of the bowl-cup structure are rounded (R-angles) and are all asymmetrically arranged.

[0017] This invention provides a light-emitting device. A cross-shaped channel, formed by the intersection of horizontal and vertical channels, is arranged on the device support. Pads are separated by the cross-shaped channel, forming two or more multi-channel pad groups. Two or more groups of light-emitting chips with different colors can be soldered onto these pad groups, forming a symmetrical distribution. This achieves a wider color gamut without localized color shift, resulting in better light mixing and display. Furthermore, by setting the top surface of the cross-shaped channel lower than the top surface of the cup structure, it is compatible with wire bonding and die bonding of light-emitting chips using both upright and flip-chip structures, without requiring changes to the support structure, thus offering superior adaptability and versatility. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a front view of the device support of the light-emitting device of the first structure in this embodiment of the present invention;

[0020] Figure 2 This is a first cross-sectional view of the device support of the light-emitting device of the first structure in the embodiment of this utility model;

[0021] Figure 3 This is a front view of the device support of the light-emitting device of the second structure in this embodiment of the present invention;

[0022] Figure 4 This is a front view of the device support of the light-emitting device of the third structure in this embodiment of the present invention;

[0023] Figure 5 This is a front view of the light-emitting device of the first structure in the embodiment of this utility model;

[0024] Figure 6 This is a front view of the light-emitting device of the fourth structure in this embodiment of the present invention;

[0025] Figure 7 This is a second cross-sectional view of the device support of the light-emitting device of the first structure in this embodiment of the present invention;

[0026] Figure 8 yes Figure 6 Enlarged view of point b in the middle;

[0027] Figure 9 This is a front view of the device support of the light-emitting device in the fifth structure of this utility model embodiment;

[0028] Figure 10 This is a cross-sectional view of the device support of the light-emitting device in the fifth structure of this utility model embodiment;

[0029] Figure 11 yes Figure 10 Enlarged schematic diagram of point a in the middle. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0031] In this invention, it should be understood that terms such as “comprising” or “having” are intended to indicate the presence of features, figures, steps, actions, components, portions or combinations thereof disclosed in this specification, and are not intended to exclude the possibility of the presence or addition of one or more other features, figures, steps, actions, components, portions or combinations thereof.

[0032] It should also be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0033] Example

[0034] This utility model provides a light-emitting device, which includes a device support.

[0035] The device support includes a housing and a metal layer, wherein the housing forms a cup structure on the surface of the metal layer;

[0036] The metal layer includes two or more pad groups, and any one pad group includes several pads;

[0037] The housing includes transverse channels and longitudinal channels located between the pads. The two or more pad groups are separated by the transverse channels and are symmetrically distributed vertically. Several pads in the same pad group are separated by the longitudinal channels.

[0038] The transverse and longitudinal channels intersect to form a cross-shaped channel. The top surface of the cross-shaped channel is lower than the top surface of the bowl-shaped structure. The bottom surface of the bowl-shaped structure is composed of the metal layer and part of the surface of the cross-shaped channel.

[0039] In one optional implementation of this embodiment, such as Figure 1 and Figure 2 As shown, Figure 1 This shows a front view of the device support of the light-emitting device of the first structure in an embodiment of the present invention. Figure 2 This shows a first cross-sectional view of the device support of the light-emitting device of the first structure in an embodiment of the present invention. Figure 2 yes Figure 1 A cross-sectional view along section line AA shows that the light-emitting device includes a device support 1, which includes a housing and a metal layer. The housing forms a cup structure 2 on a portion of the surface of the metal layer. The cup structure 2 is a cup-shaped structure that is wider at the top and narrower at the bottom.

[0040] Specifically, the bowl-cup structure 2 is used to place the light-emitting chip and provide reflection and refraction of the light emitted by the light-emitting chip.

[0041] In an optional implementation of this embodiment, the metal layer includes two or more pad groups, and any one pad group includes several pads.

[0042] Specifically, such as Figure 1 As shown, the metal layer includes two pad groups, wherein the first pad group 3 includes a first pad 31 and a second pad 32, and the second pad group 4 includes a third pad 41 and a fourth pad 42.

[0043] In an optional implementation of this embodiment, the housing includes transverse channels located between the pads, and the two or more pad groups are separated by the transverse channels and are symmetrically distributed vertically.

[0044] Specifically, such as Figure 1 As shown, the housing includes transverse channels 61 located between the pads. These transverse channels 61 are arranged transversely at the bottom of the cup structure 2, dividing the surface of the metal layer into several vertically arranged areas. The number of transverse channels 61 is determined according to actual design requirements. Figure 1 In the structure shown, there is one transverse channel 61, which divides the surface of the metal layer into two regions arranged vertically.

[0045] Furthermore, the metal layer includes two pad groups separated by the transverse channel 61, wherein the first pad 31 and the second pad 32 of the first pad group 3 are located above the transverse channel 61, and the third pad 41 and the fourth pad 42 of the second pad group 4 are located below the transverse channel 61. The first pad group 3 and the second pad group 4 are vertically symmetrical based on the transverse channel 61. Correspondingly, the first pad 31 and the third pad 41 are vertically symmetrical based on the transverse channel 61, and the second pad 32 and the fourth pad 42 are vertically symmetrical based on the transverse channel 61.

[0046] In an optional implementation of this embodiment, the housing includes longitudinal channels between pads, and several pads in the same pad group are separated by the longitudinal channels.

[0047] Specifically, such as Figure 1 As shown, the housing also includes longitudinal channels 62 located between the pads. These longitudinal channels 62 are arranged longitudinally at the bottom of the cup structure 2, dividing the surface of the metal layer into several areas arranged horizontally. The number of longitudinal channels 62 is determined according to actual design requirements. Figure 1 In the structure shown, there is one longitudinal channel 62, which divides the surface of the metal layer into two regions arranged left and right.

[0048] Furthermore, in the first pad group 3, the first pad 31 and the second pad 32 are separated by the longitudinal channel 62, with the first pad 31 located on the left side of the longitudinal channel 62 and the second pad 32 located on the right side of the longitudinal channel 62; in the second pad group 4, the third pad 41 and the fourth pad 42 are separated by the longitudinal channel 62, with the third pad 41 located on the left side of the longitudinal channel 62 and the fourth pad 42 located on the right side of the longitudinal channel 62.

[0049] In one optional implementation of this embodiment, such as Figure 3 and Figure 4 As shown, Figure 3 This shows a front view of the device support of the light-emitting device of the second structure in an embodiment of the present invention. Figure 4 This shows a front view of the device support of the light-emitting device of the third structure in an embodiment of the present invention. Figure 3 The diagram shows that the housing includes a transverse channel 61 and two longitudinal channels 62, and the metal layer includes two pad groups, each pad group comprising three pads. Figure 4 The diagram shows that the housing includes two transverse channels 61 and one longitudinal channel 62, and the metal layer includes a structure comprising three pad groups, each pad group comprising two pads.

[0050] In an optional implementation of this embodiment, the transverse channel 61 and the longitudinal channel 62 intersect to form a cross-shaped channel 6, the top surface of the cross-shaped channel 6 is lower than the top surface of the bowl-shaped structure 2, and the bottom surface of the bowl-shaped structure 2 is composed of the metal layer and part of the surface of the cross-shaped channel 6.

[0051] Specifically, such as Figure 2 As shown, the highest point of the top surface of the cross-shaped channel 6 is lower than the highest point of the top surface of the bowl-shaped structure 2.

[0052] This section considers existing color display solutions that use blue LED chips paired with phosphors. This solution only requires a single blue LED chip, so it typically employs a parallel design, placing multiple blue LED chips in a row. However, this approach has several drawbacks: First, the resulting display solution has a narrow color gamut, leading to poor display quality. Second, the parallel placement can cause localized color shifts, resulting in poor light mixing. Therefore, in this embodiment, a display scheme using a blue light chip + a green light chip, combined with phosphor, is considered. In the device support structure design, a horizontal channel is set to divide the metal layer into two sets of pad structures in upper and lower regions. The two light-emitting chips of different colors can be placed on the two sets of pad structures respectively, forming a symmetrical structure. While achieving a wider color gamut, there will be no local color deviation, better light mixing effect, and better display effect. At the same time, dual-channel control is realized, and the light-emitting chips of the same color can be controlled separately. In addition, a vertical channel is set to divide each set of pads into several pads, which can accommodate different numbers, sizes and connection methods of light-emitting chips, and has better adaptability and flexibility.

[0053] Furthermore, the bowl-cup structure 2 is a bowl-cup structure covering the metal layer. The bowl-cup structure 2 is provided with a bowl-cup wall. Therefore, the bottom surface of the bowl-cup structure 2 is composed of a portion of the surface of the metal layer and a portion of the surface of the cross-shaped channel 6.

[0054] In an optional implementation of this embodiment, the width of the transverse channel 61 is... The value range is: 0.15mm ≤ ≤0.3mm;

[0055] The width of the longitudinal channel 62 The value range is: 0.15mm ≤ ≤0.3mm.

[0056] Specifically, the width of the transverse channel 61 The value can be one of 0.15mm, 0.2mm, 0.25mm, or 0.3mm, depending on the actual design requirements;

[0057] The width of the longitudinal channel 62 The value can be one of 0.15mm, 0.2mm, 0.25mm, or 0.3mm, depending on the actual design requirements.

[0058] Here, we consider setting the width of the transverse and longitudinal channels in the cross-shaped channel to ensure the electrical isolation effect achieved after the pads are separated into vertical and horizontal symmetrical arrangements, while the overall size of the device does not change significantly, making it more versatile.

[0059] In an optional implementation of this embodiment, two or more sets of light-emitting chips are further disposed on the metal layer, and the two or more sets of light-emitting chips are respectively fixedly soldered on corresponding pads and symmetrically distributed vertically.

[0060] Specifically, such as Figure 5 As shown, Figure 5 This shows a front view of the light-emitting device of the first structure in an embodiment of the present invention. Figure 5 exist Figure 1 Based on this, the structure of the light-emitting device with light-emitting chips is shown. Two sets of light-emitting chips are disposed on the metal layer, including a first set of light-emitting chips 7 and a second set of light-emitting chips 8. The first set of light-emitting chips 7 is fixedly soldered on the second pad 32 of the first pad group 3, and the second set of light-emitting chips 8 is fixedly soldered on the fourth pad 42 of the second pad group 4. The first set of light-emitting chips 7 and the second set of light-emitting chips 8 are symmetrically distributed vertically.

[0061] Furthermore, the two or more sets of light-emitting chips include one or more blue light chips and one or more green light chips.

[0062] Specifically, in this embodiment, the first group of light-emitting chips 7 is a blue light chip, and the second group of light-emitting chips 8 is a green light chip.

[0063] Furthermore, the light-emitting chip is a conventionally mounted chip, or a flip-chip chip, or a vertically mounted chip. Figure 5 The light-emitting chips shown are all upright chips. The light-emitting chips in the same group are connected by bonding wires and are connected to the pads by bonding wires.

[0064] In an optional implementation of this embodiment, the corner of any of the pads that contacts the cross intersection of the cross-shaped channel is set to be rounded or triangular.

[0065] Specifically, the corners of the first pad 31 that contact the cross intersection 63 of the cross-shaped channel, the corners of the second pad 32 that contact the cross intersection 63 of the cross-shaped channel, the corners of the third pad 41 that contact the cross intersection 63 of the cross-shaped channel, and the corners of the fourth pad 42 that contact the cross intersection 63 of the cross-shaped channel are all set to be arc-shaped or triangular. In this embodiment, they are set to be arc-shaped.

[0066] The rounded corners increase the bonding area between the plastic material and the metal layer that form the cross-shaped channel, thereby improving the bonding force between the two and enhancing the overall stability of the device support structure.

[0067] In one optional implementation of this embodiment, the cross-shaped channel is located at the exact center of the bottom of the bowl-shaped structure.

[0068] Specifically, such as Figure 6 As shown, Figure 6 A front view of the light-emitting device of the fourth structure in an embodiment of this utility model is shown. Figure 6 In the middle, the cross intersection 63 of the cross-shaped channel 6 is located at the exact center of the bottom of the bowl-shaped structure 2.

[0069] The cross intersection is positioned at the very center, which maximizes the light mixing effect when the display solution is compatible with the structure.

[0070] Furthermore, Figure 6 The light-emitting devices in the middle also include a first group of light-emitting chips 7 and a second group of light-emitting chips 8, and Figure 6The light-emitting chips in the chip are flip-chips. The first group of light-emitting chips 7 and the second group of light-emitting chips 8 both span the longitudinal channel 62. One electrode of the first group of light-emitting chips 7 is soldered to the first pad 31 and the other electrode is soldered to the second pad 32. One electrode of the second group of light-emitting chips 8 is soldered to the third pad 41 and the other electrode is soldered to the fourth pad 42.

[0071] Here, by setting the top surface of the cross-shaped channel 6 to be lower than the top surface of the bowl-shaped structure 2, so that... Figure 5 The bonding wires of the light-emitting chip using a positive-mount chip structure can be welded across the longitudinal channel 62, which also makes... Figure 6 The light-emitting chip with flip-chip structure can be die bonded across the longitudinal channel 62, so that the device support of the light-emitting device in this embodiment can be adapted to both light-emitting chips with upright chip structure and flip-chip structure without changing the support structure, thus having better adaptability and versatility.

[0072] In an optional implementation of this embodiment, the bowl-cup structure includes a long side cup wall and a short side cup wall. The inclination angle α of the long side cup wall relative to the horizontal plane is 40°-60°, and the inclination angle β of the short side cup wall relative to the horizontal plane is 25°-40°.

[0073] Specifically, such as Figure 2 and Figure 7 As shown, Figure 7 A second cross-sectional view of the device support of the light-emitting device of the first structure in an embodiment of the present invention is shown. Figure 7 yes Figure 1 The cross-sectional view along section line BB shows that the bowl-cup structure 2 includes a long side cup wall 22 and a short side cup wall 23. The inclination angle α of the long side cup wall 22 relative to the horizontal plane is 40°-60°, and can be any one of 40°, 45°, 50°, 55°, and 60°. The inclination angle β of the short side cup wall 23 relative to the horizontal plane is 25°-40°, and can be any one of 25°, 30°, 35°, and 40°, determined according to actual design requirements.

[0074] In one optional implementation of this embodiment, the four corners of the cup top of the bowl-cup structure are rounded (R-angles) and are all asymmetrically arranged.

[0075] Specifically, such as Figure 6 As shown, the four corners 21 of the cup top of the bowl-cup structure 2 are R-angles, and each R-angle is asymmetrically arranged.

[0076] Furthermore, such as Figure 8 As shown, Figure 8 for Figure 6Enlarged diagram at point b in the middle, with Figure 6 Taking the upper left corner (R-angle) as an example, points A and B are the starting and ending points of the arc at the upper left corner of the bottom of the bowl-cup structure 2, points C and D are the starting and ending points of the arc at the upper left corner of the top of the bowl-cup structure 2, and point O is the center of the arc at the upper left corner of the top of the bowl-cup structure 2. Since the width of the long side of the bowl-cup structure 2's wall 22 is [missing information] in the horizontal direction... Width of the short side of the cup wall 23 The inconsistency is that the longer side of the cup wall 22 is narrower than the shorter side of the cup wall, which causes the length of CO to be inconsistent with the length of DO, resulting in an asymmetrical angle. Consequently, the curvature of the upper left corner of the cup top of the bowl-cup structure 2 on the side of the longer side of the cup wall 22 is inconsistent with the curvature on the side of the shorter side of the cup wall 23, forming an asymmetrical design. The same applies to the other three corners of the cup top of the bowl-cup structure 2.

[0077] Here, the four corners of the cup top of the bowl-cup structure are designed as R-angles and are all asymmetrically set. This allows for uniform light mixing and a large light emission angle when a large number of chips are placed in the bowl-cup structure, thus ensuring the light emission performance of the device.

[0078] In one optional implementation of this embodiment, the top surface of the cross-shaped channel is higher than the top surface of the metal layer, or the top surface of the cross-shaped channel is flush with the top surface of the metal layer.

[0079] Specifically, such as Figure 2 As shown, the top surface of the cross-shaped channel 6 is flush with the top surface of the metal layer.

[0080] More, such as Figure 9 , Figure 10 and Figure 11 As shown, Figure 9 This shows a front view of the device support of the light-emitting device in the fifth structure of this utility model embodiment. Figure 10 A cross-sectional view of the device support of the light-emitting device in the fifth structure of this utility model embodiment is shown. Figure 10 yes Figure 9 A sectional view along section line AA. Figure 11 yes Figure 10 The enlarged schematic diagram at point a shows that the top surface of the cross-shaped channel 6 is higher than the top surface of the metal layer.

[0081] Furthermore, the height from the top surface of the cross-shaped channel 6 to the top surface of the metal layer The range of values ​​for is: 0um≤ ≤20um, can take one of the following values: 0um, 5um, 10um, 15um, 20um, determined according to actual design requirements.

[0082] Specifically, such as Figure 1 and Figure 2 In the structure shown, the height from the top surface of the cross-shaped channel 6 to the top surface of the metal layer The value is 0um, such as Figure 9 , Figure 10 and Figure 11 In the structure shown, the height from the top surface of the cross-shaped channel 6 to the top surface of the metal layer The range of values ​​is 0um < ≤20um.

[0083] The top surface of the cross-shaped channel is designed to be higher than the top surface of the metal layer, which can effectively prevent short circuit failure caused by solder paste bridging between adjacent pads.

[0084] The top surface of the cross-shaped channel is flush with the top surface of the metal layer, ensuring a smooth metal layer surface during die bonding or wire bonding, increasing the effective area of ​​the pads, and making chip mounting more stable; the encapsulating adhesive flows more evenly, reducing bubbles and stress concentration; the bottom of the cup structure is flat, resulting in more uniform light reflection.

[0085] In summary, this utility model embodiment provides a light-emitting device. A cross-shaped channel, formed by the intersection of horizontal and vertical channels, is provided on the device support. The pads are separated by the cross-shaped channel, forming two or more multi-channel pad groups. Two or more groups of light-emitting chips with different emitting colors can be soldered onto these pad groups, forming a symmetrical distribution. This achieves a wider color gamut without local color shift, resulting in better light mixing and display effects. By setting the top surface of the cross-shaped channel higher than the top surface of the metal layer, short-circuit failures caused by solder paste bridging between adjacent pads can be effectively prevented. The top surface of the cross-shaped channel is lower than the top surface of the cup structure, making it suitable for wire bonding and die bonding of light-emitting chips using both upright and flip-chip structures without requiring changes to the support structure, thus offering superior adaptability and versatility.

[0086] The above provides a detailed description of a light-emitting device provided by the embodiments of this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A light-emitting device, characterized in that, The light-emitting device includes a device support, which includes a housing and a metal layer, wherein the housing forms a cup structure on the surface of the metal layer; The metal layer includes two or more pad groups, and any one pad group includes several pads; The housing includes transverse channels and longitudinal channels located between the pads. The two or more pad groups are separated by the transverse channels and are symmetrically distributed vertically. Several pads in the same pad group are separated by the longitudinal channels. The transverse and longitudinal channels intersect to form a cross-shaped channel. The top surface of the cross-shaped channel is lower than the top surface of the bowl-shaped structure. The bottom surface of the bowl-shaped structure is composed of the metal layer and part of the surface of the cross-shaped channel.

2. The light-emitting device as described in claim 1, characterized in that, The corner of any of the pads that contacts the cross intersection of the cross-shaped channel is set to be rounded or triangular.

3. The light-emitting device as described in claim 1, characterized in that, The width of the transverse channel The value range is: 0.15mm ≤ ≤0.3mm; The width of the longitudinal channel The value range is: 0.15mm ≤ ≤0.3mm.

4. The light-emitting device as described in claim 1, characterized in that, The top surface of the cross-shaped channel is higher than the top surface of the metal layer, or the top surface of the cross-shaped channel is flush with the top surface of the metal layer.

5. The light-emitting device as described in claim 4, characterized in that, The height from the top surface of the cross-shaped channel to the top surface of the metal layer The range of values ​​for is: 0um≤ ≤20um.

6. The light-emitting device as described in claim 1, characterized in that, The metal layer is further provided with two or more sets of light-emitting chips, which are respectively soldered on corresponding pads and distributed symmetrically in the upper and lower parts.

7. The light-emitting device as described in claim 6, characterized in that, The two or more groups of light-emitting chips include one or more blue light chips and one or more green light chips.

8. The light-emitting device as described in claim 1, characterized in that, The bowl-cup structure includes a long side cup wall and a short side cup wall. The inclination angle α of the long side cup wall relative to the horizontal plane is 40°-60°, and the inclination angle β of the short side cup wall relative to the horizontal plane is 25°-40°.

9. The light-emitting device as described in claim 1, characterized in that, The four corners of the cup top of the bowl-cup structure are rounded (R-angles) and are asymmetrically arranged.

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