Integrated device, dilution refrigerator and quantum computer

Abstract

The utility model discloses an integrated device, a dilution refrigerator and a quantum computer, and the integrated device comprises a first integrated part which is parallel to a cold disc, and a plurality of first electronic devices are integrated on the first integrated part; the second integrated parts are arranged perpendicular to the cold disc, one end of each second integrated part is fixed to the cold disc, the other end of each second integrated part is fixed to the first integrated part, and a plurality of second electronic devices arranged in the height direction of the second integrated parts are integrated on the second integrated parts; one end of the heat conduction column is mounted on the cold disc, and the other end penetrates through the first integrated part to be connected with the quantum chip. The integrated device has the advantages of being efficient in heat dissipation performance, high in integration level and space utilization rate, convenient to wire and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to quantum computer technical field especially, and it is a kind of integrated device, dilution refrigerator and quantum computer. BACKGROUND

[0002] Quantum computing is a new computing mode that basic information units are regulated and controlled following quantum mechanics law.The basic information unit of classical computing is classical bit, and the basic information unit of quantum computing is quantum bit.Classical bit can only be in one state, i.e.0 or 1, while based on quantum mechanics state superposition principle, the state of quantum bit can be in superposition state of multiple possibilities, so the computing efficiency of quantum computing is much higher than that of classical computing.

[0003] In the quantum computer of superconducting system, quantum chip needs to work in extremely low temperature environment, and extremely low temperature environment can effectively reduce the influence of environmental noise.At present, commonly used refrigeration equipment is dilution refrigerator, which uses cascade refrigeration technology to further refrigerate in extremely low temperature zone by using phase change endothermic of helium element, to obtain the lowest temperature zone.

[0004] In order to control the quantum bit of the bottom layer, the line (quantum control link) carrying quantum measurement and control signal needs to pass through the bottom layer of the refrigeration disc and enter the mixed chamber (MXC) of the bottom layer.At the same time, various corresponding devices need to be applied on the line to process and optimize the quantum measurement and control signal.

[0005] With the expansion of the number of quantum bits, the quantum measurement and control link needs to be increased accordingly, and the number of applied devices also increases, especially at the bottom layer of the cold disc, the increase of the number of devices not only brings the challenge of heat dissipation, but also leads to limited physical space, complex and inconvenient wiring.

[0006] It should be noted that the information disclosed in the background section of the present application is only intended to deepen the understanding of the general background of the present application, and should not be regarded as acknowledging or implying in any form that the information constitutes prior art known to those skilled in the art. UTILITY MODEL CONTENT

[0007] The utility model aims at providing an integrated device, dilution refrigerator and quantum computer to solve the deficiency in the prior art, and achieve the goals of high-efficiency heat dissipation performance, high integration, space utilization and convenient wiring.

[0008] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0009] The utility model discloses a first aspect and provides an integrated device, comprising:

[0010] A first integrated piece is arranged in parallel to the cold plate, and a plurality of first electronic devices are integrated on the first integrated piece;

[0011] A plurality of second integrated pieces are arranged in perpendicular to the cold plate, one end of the second integrated piece is fixed to the cold plate, and the other end is fixed to the first integrated piece, and a plurality of second electronic devices arranged along the height direction of the second integrated piece are integrated on the second integrated piece;

[0012] A heat-conducting column is installed on the cold plate at one end and connected to the quantum chip at the other end through the first integrated piece.

[0013] The integrated device as described above, further, the first integrated piece includes a first mounting plate and a plurality of first integrated plates detachably connected to the first mounting plate, and a plurality of the first electronic devices are coaxially integrated on any of the first integrated plates.

[0014] The integrated device as described above, further, the position of the first integrated plate corresponds to the position of the second integrated plate on the cold plate one by one, and the second integrated plate is used to install the third electronic device electrically connected to the first electronic device.

[0015] The integrated device as described above, further, the heat-conducting column is fixed at the center position of the cold plate, and a plurality of the first integrated plates are arranged in a circular array around the heat-conducting column; a plurality of second integrated pieces are arranged in a circular array around the heat-conducting column.

[0016] The integrated device as described above, further, further comprising a heat-conducting plate, the heat-conducting plate covers the first surface of the quantum chip, the first surface is the surface with the largest surface area of the quantum chip; the heat-conducting plate is installed on the end face of the other end of the heat-conducting column, and tightly contacts with the first surface of the quantum chip.

[0017] The integrated device as described above, further, the second integrated piece is a columnar body, and the cross section of the columnar body is triangular.

[0018] The integrated device as described above, further, further comprising a magnetic shielding cylinder for containing the quantum chip; the magnetic shielding cylinder includes a cylinder body with an open end and a cylinder cover arranged at the opening;

[0019] A plurality of connecting rods are arranged between the cylinder cover and the first mounting plate.

[0020] The integrated device as described above, further, a plurality of first through holes are formed on the cylinder cover, and the signal transmission lines electrically connected to the quantum chip pass through the cylinder cover; a second through hole is also formed on the cylinder cover for the heat-conducting column to pass through the cylinder cover;

[0021] The first plurality of through holes are arranged in a circumferential annular shape along the cylinder cover, and the second through hole is arranged at a central position of the cylinder cover.

[0022] The utility model discloses a second aspect provides a dilution refrigerator, including above -mentioned integrated device.

[0023] The utility model discloses a third aspect provides a quantum computer, including above -mentioned dilution refrigerator and quantum chip.

[0024] The utility model has the advantages that:

[0025] The integrated device has the following three advantages:

[0026] 1. High heat dissipation performance

[0027] The first electronic device and the second electronic device generate heat, which is conducted along the second integrated piece to the cold plate, achieving effective heat dissipation. At the same time, the heat-conducting column provides an efficient heat dissipation path for the quantum chip, ensuring that the heat generated by the quantum chip can be quickly conducted to the cold plate, thereby reducing the working temperature of the quantum chip and improving its stability and computing efficiency.

[0028] 2. High integration and space utilization

[0029] The first integrated piece is arranged parallel to the cold plate, and the plurality of second integrated pieces are arranged perpendicular to the cold plate, forming a three-dimensional integrated structure. In addition to integrating the second electronic device, the plurality of second integrated pieces also serve as a connection between the first integrated piece and the cold plate. The first integrated piece and the plurality of second integrated pieces form a three-dimensional integrated structure, making full use of limited space to efficiently integrate and fix a large number of electronic devices, saving physical space occupied by the quantum measurement and control link in the lowest temperature zone, and significantly improving the integration and space utilization of the overall structure.

[0030] 3. Easy wiring

[0031] The integrated device has a reasonable structure design, making the layout of the quantum measurement and control link and related electronic devices more orderly. The three-dimensional arrangement of the first integrated piece and the second integrated piece not only optimizes space utilization, but also makes wiring more convenient, reducing the possibility of line crossing and confusion.

[0032] The dilution refrigerator and the quantum computer provided by the utility model include the integrated device described above, and therefore have the same beneficial effects, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 The structure diagram of the integrated device provided by the utility model is shown in the figure.

[0034] Figure 2 A schematic diagram of a part of the integrated device structure is provided for the embodiment of the present application.

[0035] Figure 3 A structure schematic diagram of the first electronic device integrated on the first integrated plate is provided for the embodiment of the present application.

[0036] Figure 4 A structure schematic diagram of the second integrated member is provided for the embodiment of the present application.

[0037] Figure 5 A structure schematic diagram of the cylinder cover in the magnetic shielding cylinder is provided for the embodiment of the present application.

[0038] In the figure, 10 is a cold plate; 20 is a first integrated member; 21 is a first mounting plate; 22 is a first integrated plate; 30 is a second integrated member; 40 is a heat conduction column; 50 is a heat conduction plate; 60 is a magnetic shielding cylinder; 61 is a first through hole; 62 is a second through hole; 70 is a connecting rod; 80 is a first electronic device; and 90 is a second electronic device. DETAILED DESCRIPTION

[0039] In order to make the person skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as a limitation on the present application.

[0040] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0041] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise explicitly specified.

[0042] Figure 1 A schematic diagram of the integrated device provided in the embodiments of this utility model ( Figure 1 Only one first electronic device 80 and part of the second electronic device 90 are shown in the diagram. Figure 2 This is a schematic diagram of a portion of the integrated device structure provided in an embodiment of the present utility model.

[0043] like Figures 1-2 As shown: This application discloses an integrated device, including a first integrated component 20, arranged parallel to the cold plate 10, on which a plurality of first electronic devices 80 are integrated; a plurality of second integrated components 30, arranged perpendicular to the cold plate 10, one end of the second integrated component 30 being fixed to the cold plate 10 and the other end being fixed to the first integrated component 20, on which a plurality of second electronic devices 90 are integrated along the height direction of the second integrated component 30; and a heat-conducting column 40, one end of which is mounted on the cold plate 10 and the other end passing through the first integrated component 20 and connected to a quantum chip.

[0044] The integrated device in this embodiment has the following three advantages:

[0045] 1. High-efficiency heat dissipation performance

[0046] By configuring the first integrated component 20 and multiple second integrated components 30, the heat generated by the first electronic device 80 and the second electronic device 90 can be conducted along the second integrated component 30 to the cold plate 10, achieving effective heat dissipation. Simultaneously, the configuration of the heat-conducting pillars 40 provides an efficient heat dissipation path for the quantum chip, ensuring that the heat generated by the quantum chip can be quickly conducted to the cold plate 10, thereby reducing the operating temperature of the quantum chip and improving its stability and computational efficiency.

[0047] 2. High integration and space utilization

[0048] This application forms a three-dimensional integrated structure by arranging the first integrated component 20 parallel to the cold plate 10 and multiple second integrated components 30 perpendicular to the cold plate 10. In addition to integrating the second electronic device 90, the multiple second integrated components 30 also serve to connect the first integrated component 20 and the cold plate 10. The first integrated component 20 and the multiple second integrated components 30 form a three-dimensional integrated structure, making full use of limited space to efficiently integrate and fix numerous types and quantities of electronic devices. This saves the physical space occupied by the quantum measurement and control link in the lowest temperature zone, significantly improving the overall integration and space utilization of the structure.

[0049] 3. Easy to wire

[0050] The integrated device of the present application makes the layout of quantum measurement and control link and related electronic devices more orderly through reasonable structural design. The three-dimensional arrangement of the first integrated part 20 and the second integrated part 30 not only optimizes the space utilization, but also makes the wiring more convenient and reduces the possibility of line crossing and confusion.

[0051] The integrated device of the present embodiment can be used for the integration of the first electronic device 80, the second electronic device 90 and the quantum chip in the lowest temperature zone of the quantum measurement and control link, so as to facilitate the installation in the dilution refrigerator. In the present embodiment, the quantum measurement and control link includes, for example, a quantum state regulation signal link (also called XY control signal link), a quantum bit frequency control signal link (also called Z control signal link), a read input signal link (also called readout in signal link), a read feedback signal link (also called readout out signal link) and the like.

[0052] In the present embodiment, the first electronic device 80 includes a filter, an attenuator and a signal connector; and the second electronic device 90 includes a parametric amplifier and a circulator. Exemplarily, when a certain quantum measurement and control link is an XY control signal link, the first electronic device 80 can be an infrared filter; when a certain quantum measurement and control link is a Z control signal link, the first electronic device 80 can be an infrared filter; when a certain quantum measurement and control link is a readout in signal link, the first electronic device 80 can be an infrared filter; when a certain quantum measurement and control link is a readout out signal link, the first electronic device 80 can be a 0db attenuator or a signal connector, and the second quantum device is a parametric amplifier and a circulator.

[0053] In some embodiments of the present embodiment, the first integrated part 20 includes a first mounting plate 21 and a plurality of first integrated plates 22 detachably connected to the first mounting plate 21, and a plurality of first electronic devices 80 are coaxially integrated on any first integrated plate 22. The first integrated part 20 adopts the detachable connection mode of the first mounting plate 21 and the plurality of first integrated plates 22. This modular design facilitates installation and disassembly, improves wiring efficiency and maintenance efficiency. Specifically, when one of the first electronic devices 80 is damaged, only the first integrated plate 22 on which the first electronic device 80 is located needs to be disassembled for maintenance. In addition, the number and position of the first integrated plates 22 can be flexibly adjusted according to actual needs, further optimizing the space utilization. In addition, a plurality of first electronic devices 80 are integrated on each first integrated plate 22, so that the heat can be dispersed on the plurality of first integrated plates 22, avoiding local overheating and further optimizing the heat dissipation effect.

[0054] In some embodiments of the present embodiment, the positions of the first integrated boards 22 correspond one-to-one to the positions of second integrated boards on the cold plate 10, and the second integrated boards are used to mount third electronic devices electrically connected to the first electronic devices 80. Since the positions of the first integrated boards 22 and the second integrated boards correspond one-to-one, the first electronic devices 80 are more convenient to wire with the third electronic devices, and it is also beneficial to reduce the signal transmission path, reducing the loss and interference of the signal in the transmission process. In the above embodiment, the third electronic devices include at least one of a signal connector and an attenuator.

[0055] In the above embodiments, the shape of the first mounting plate 21 is not limited, and can be a circular plate or a square plate provided with a plurality of notches, and the notches are used to mount the first integrated boards 22. The shape of the first integrated board 22 is not limited, and can be circular or square. The shape of the second integrated board is not limited, and is preferably matched with the first integrated board 22.

[0056] It should be noted that, Figure 1 and Figure 2 The second integrated board is not shown in the above-mentioned embodiments, and the positions of the notches in the circumferential direction of the cold plate 10 are positions for mounting the second integrated board.

[0057] In order to further improve the integration, Figure 3 The structure diagram of the first integrated board 22 provided by the present embodiment is shown in the structure diagram of the first integrated board 22 provided by the present embodiment; as Figure 3 shown: a plurality of first electronic devices 80 on the first integrated board 22 can be arranged in an array; a plurality of third electronic devices on the second integrated board are arranged in an array.

[0058] In some embodiments of the present embodiment, the heat-conducting column 40 is fixed at the center position of the cold plate 10, and a plurality of first integrated boards 22 are arranged in a circular array around the heat-conducting column 40; a plurality of second integrated boards 30 are arranged in a circular array around the heat-conducting column 40. This layout makes the entire device more compact, while avoiding excessive concentration of heat in a certain direction, improving the uniformity and efficiency of heat dissipation. The circular array arrangement makes full use of the annular space around the cold plate 10, so that the entire device can accommodate more electronic devices in a limited space, further improving the space utilization.

[0059] In some embodiments of the present embodiment, the integrated device further comprises a heat-conducting plate 50, the heat-conducting plate 50 is arranged on the first surface of the quantum chip, and the first surface is the surface with the largest surface area of the quantum chip; the heat-conducting plate 50 is mounted on the end face of the other end of the heat-conducting column 40, and is tightly attached to the first surface of the quantum chip.

[0060] The heat-conducting plate 50 is directly arranged on the first surface with the largest surface area of the quantum chip and tightly contacts the other end of the heat-conducting column 40, so that the structure of the whole device is more compact and the heat dissipation effect is enhanced, the heat on the surface of the quantum chip can be quickly conducted to the heat-conducting column 40, and then conducted to the cold plate 10 through the heat-conducting column 40, so that the working temperature of the quantum chip is effectively reduced.

[0061] In some embodiments of the present embodiment, Figure 4 A structure diagram of the second integrated component in the magnetic shielding cylinder is provided for the present embodiment; as shown in the figure: Figure 4 The second integrated component 30 is a columnar body, and the cross section of the columnar body is triangular. The second integrated component 30 adopts a columnar body with a triangular cross section, which can better utilize the space while providing sufficient mechanical strength, so that the whole device is more compact; this structure also enables the second electronic device 90 to be installed on the side surface at three different angles according to the needs, which facilitates the arrangement of the second electronic device 90 and the line connection with other devices. Of course, the second integrated component 30 can also be a columnar body with a pentagonal or hexagonal cross section, which can also meet the requirement of arranging the second electronic device 90 at different angles for line connection, but the volume of the second integrated component 30 will also increase accordingly, and the occupied space will also increase. Therefore, after comprehensive consideration, the second integrated component 30 is preferably a columnar body with a triangular cross section.

[0062] In actual work, the quantum chip will also be subjected to electromagnetic interference of microwave devices such as circulators in the quantum measurement and control link. In some embodiments of the present embodiment, the integrated device further comprises a magnetic shielding cylinder 60 for accommodating the quantum chip; the magnetic shielding cylinder 60 comprises a cylinder body with an open end and a cylinder cover arranged at the opening; a plurality of connecting rods 70 are arranged between the cylinder cover and the first mounting plate 21.

[0063] By arranging the magnetic shielding cylinder 60, electromagnetic interference can be effectively shielded to protect the normal work of the quantum chip. The cylinder cover of the magnetic shielding cylinder 60 and the first mounting plate 21 are connected through a plurality of connecting rods 70, which not only provides stable structural support, but also makes the whole device more compact, while avoiding additional space occupation. In addition, the connecting rod 70 can serve as an additional heat dissipation path to conduct the heat generated by the quantum chip to the magnetic shielding cylinder 60, and then to the cold plate 10 through the magnetic shielding cylinder 60, further enhancing the heat dissipation effect.

[0064] The arrangement of the plurality of connecting rods 70 in the above embodiments is not specifically limited, and for example, the plurality of connecting rods 70 are arranged in a circumferential ring along the cylinder cover.

[0065] In some embodiments of the present embodiment, Figure 5 A structure diagram of the cylinder cover in the magnetic shielding cylinder 60 is provided for the present embodiment; as shown in the figure:Figure 5 As shown: a plurality of first through holes 61 are formed on the barrel cover for signal transmission lines electrically connected with the quantum chip to pass through the barrel cover; a second through hole 62 is also formed on the barrel cover for the heat conduction column 40 to pass through the barrel cover; the plurality of first through holes 61 are arranged in a circumferential ring along the barrel cover; and the second through hole 62 is arranged at the center position of the barrel cover.

[0066] The plurality of first through holes 61 are arranged in a circumferential ring along the barrel cover, and the second through hole 62 is arranged at the center position of the barrel cover, which not only allows the signal transmission lines and the heat conduction column 40 to pass through, but also optimizes the heat dissipation path, so that heat can be more evenly distributed. The circumferentially arranged first through holes 61 can guide the heat to be evenly distributed along the circumference, avoiding local overheating, while the second through hole 62 is arranged at the center position of the barrel cover to ensure that the heat conduction column 40 can directly conduct heat to the cold plate 10, further improving the heat dissipation efficiency. In this embodiment, the heat conduction column 40, the heat conduction plate 50, the first integrated piece 20, the second integrated piece 30 and the connecting rod 70 are all made of heat-conducting materials. In order to further improve the heat dissipation effect, the heat conduction column 40 is made of solid copper column, and the heat conduction plate 50, the first integrated piece 20, the second integrated piece 30 and the connecting rod 70 are all made of oxygen-free copper material. These materials have high thermal conductivity and low resistivity, which can efficiently conduct heat, thereby improving the heat dissipation effect of the entire device.

[0067] Based on the same application concept, the embodiment of the present application also proposes a dilution refrigerator, which comprises the integrated device of the above-mentioned embodiment.

[0068] The dilution refrigerator of the present application comprises the above-mentioned integrated device, and therefore has the same beneficial effects as the above-mentioned integrated device, which will not be described here again.

[0069] Based on the same application concept, the embodiment of the present application also proposes a quantum computer, which comprises the dilution refrigerator of the above-mentioned embodiment and a quantum chip.

[0070] The quantum computer of the present application comprises the above-mentioned dilution refrigerator, and therefore has the same beneficial effects as the above-mentioned dilution refrigerator, which will not be described here again.

[0071] In the description of the present specification, the description referring to the terms "some embodiments" or "example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above-mentioned terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.

[0072] The above are only preferred embodiments of the present application, and do not have any limiting effect on the present application. Any person skilled in the art, without departing from the technical scheme of the present application, makes any form of equivalent replacement or modification of the technical scheme and technical content disclosed by the present application, and the variation belongs to the content of the technical scheme of the present application, and still belongs to the protection scope of the present application.

Claims

1. An integrated device, characterized by The application relates to an integrated device for quantum chip. The first integrated part is arranged in parallel to the cold plate, and a plurality of first electronic devices are integrated on the first integrated part. A plurality of second integrated parts are arranged in perpendicular to the cold plate, one end of the second integrated part is fixed to the cold plate, the other end is fixed to the first integrated part, and a plurality of second electronic devices arranged along the height direction of the second integrated part are integrated on the second integrated part. A heat-conducting column is installed on the cold plate at one end and connected to the quantum chip at the other end through the first integrated part.

2. The integrated device of claim 1, wherein, The first integrated part comprises a first mounting plate and a plurality of first integrated plates detachably connected to the first mounting plate, and a plurality of the first electronic devices are coaxially integrated on any first integrated plate.

3. The integrated device of claim 2, wherein, The position of the first integrated plate corresponds to the position of a second integrated plate on the cold plate, and the second integrated plate is used for mounting a third electronic device electrically connected to the first electronic device.

4. The integrated device of claim 3, wherein, The heat-conducting column is fixed at the center position of the cold plate, and a plurality of the first integrated plates are arranged in a circular array around the heat-conducting column; a plurality of second integrated parts are arranged in a circular array around the heat-conducting column.

5. The integrated device of claim 1, wherein, A heat-conducting plate is further arranged on the first surface of the quantum chip, the first surface is the surface with the largest area of the quantum chip, the heat-conducting plate is installed on the end face of the other end of the heat-conducting column, and is tightly combined with the first surface of the quantum chip.

6. The integrated device of claim 1, wherein, The second integrated part is a columnar body, and the cross section of the columnar body is triangular.

7. The integrated device of claim 2, wherein, A magnetic shielding cylinder is further arranged for containing the quantum chip, the magnetic shielding cylinder comprises a cylinder body with an open end and a cylinder cover arranged at the opening. A plurality of connecting rods are arranged between the cylinder cover and the first mounting plate.

8. The integrated device of claim 7, wherein, A plurality of first through holes are formed on the cylinder cover, signal transmission lines electrically connected to the quantum chip pass through the cylinder cover, and a second through hole is further formed on the cylinder cover for the heat-conducting column to pass through the cylinder cover. The plurality of first through holes are arranged in a circular array along the circumference of the cylinder cover, and the second through hole is arranged at the center position of the cylinder cover.

9. A dilution refrigerator, characterized by, The application further relates to an integrated device as claimed in any one of claims 1-8.

10. A quantum computer, characterized by, The application further relates to a dilution refrigerator and a quantum chip as claimed in claim 9.

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