Cable-to-cable connector system

Abstract

A cable-to-cable connector system is described that aims to overcome the disadvantages of the prior art, or to make improvements at least on the basis of the prior art. A cable-to-cable connector system of the present invention includes first and second cable connectors, where 1) each of the first and second cable connectors includes a plurality of differential signal pairs, 2) a docking interface of the differential signal pair of one of the first and second cable connectors includes an egg-rack crosstalk shield, and 3) the docking interface of the differential signal pair of the one of the first and second cable connectors includes a plurality of differential signal pairs. And 3) the butt joint interface of the differential signal pair of the other one of the first cable connector and the second cable connector is not provided with egg rack crosstalk shielding, and the other one of the first cable connector and the second cable connector is a plug, and 4) each of the first and second cable connectors is arranged to transmit a Pam4 signal of 224 GHz per second at a rise time of 6 picoseconds, 20% to 80%.

Description

[0001] Cross-reference of related applications

[0002] This application claims priority to U.S. Patent Application No. 63 / 590,266, filed October 12, 2023, the disclosures of which are incorporated herein by reference as if set forth in their entirety. Technical Field

[0003] This embodiment generally relates to electrical connector devices / components, and the specific embodiment is presented as an electrical connector. Background Technology

[0004] Typical connectors used for 112G / 224G operation may require a relatively wide wafer substrate to accommodate the connector. However, this increased wafer package substrate size can increase insertion loss and / or make the wafer package substrate more prone to curling, warping, and / or loss of coplanarity during reflow. Therefore, it is necessary to improve the size of the wafer package substrate, reduce the connector width, minimize coplanarity issues, and / or minimize insertion loss. Utility Model Content

[0005] This invention aims to overcome the shortcomings of the prior art, or at least improve upon it. The cable-to-cable connector system of this invention includes first and second cable connectors, wherein: 1) each of the first and second cable connectors includes a plurality of differential signal pairs; 2) the mating interface of the differential signal pairs of one of the first and second cable connectors includes eggshell crosstalk shielding; 3) the mating interface of the differential signal pairs of the other of the first and second cable connectors does not have eggshell crosstalk shielding, and the other of the first and second cable connectors is a plug; and 4) each of the first and second cable connectors is configured to transmit a Pam4 signal at 224 GHz per second with a rise time of 6 picoseconds and 20% to 80% of its rise time.

[0006] Brief description of other technical features

[0007] The disclosure of U.S. Patent Application No. 63 / 590,266 is incorporated herein by reference for any and all purposes. Attached Figure Description

[0008] In the accompanying drawings, the same component shown in different views is indicated by the same reference numerals. Furthermore, the drawings are not necessarily drawn to scale, and the focus is generally on illustrating the principles of the invention.

[0009] Figure 1 This is a perspective view of an electrical connector assembly according to one embodiment, showing an electrical connector according to one embodiment.

[0010] Figure 2 yes Figure 1 An exploded view of the electrical connector shown.

[0011] Figure 3A It is multiple Figure 1 A perspective view of the electrical connector shown.

[0012] Figure 3B yes Figure 3A The side view of the vertical cable shown.

[0013] Figure 3C yes Figure 3A Side view of the right-angle cable shown.

[0014] Figure 4A yes Figure 3A A perspective view of the right-angle cable and electrical connector shown.

[0015] Figure 4B yes Figure 4A Side view of the right-angle cable shown.

[0016] Figure 5 yes Figure 1 A perspective view of one embodiment of the mating interface of the electrical connector shown.

[0017] Figure 6 yes Figure 5 The diagram shows an exploded view of the interface.

[0018] Figure 7 It is a perspective view showing an assembly of 1024 pairs of electrical connectors.

[0019] Figure 8 It is a perspective view showing an electrical connector assembly with 1192 pairs and / or 1280 pairs.

[0020] Figure 9 It is a perspective view of an electrical connector, showing the mating interface or a plate surrounding the cable connector and / or separated from the substrate by a distance.

[0021] Figure 10 This is a perspective view of an electrical connector, with the mating surfaces exposed.

[0022] Figure 11 This is a graph of one embodiment, showing the impedance curve from the cable to the package.

[0023] Figure 12 This is a graph of one embodiment, illustrating the effect of shielded echo path transition.

[0024] Figure 13 This is a graph of one embodiment, showing the total near-end crosstalk power of the differential FD.

[0025] Figure 14 This is a graph of one embodiment, showing the total far-end crosstalk power of the differential FD.

[0026] Figure 15 An example of a 64-pair block package (PKG) and PCB (printed circuit board) is shown.

[0027] Figure 16A and Figure 16B A cage of one embodiment is shown.

[0028] Figure 17 This shows a portion of the wiring on the packaging substrate.

[0029] Figure 18 This is a package and PCB comparison diagram of one embodiment, showing the turning design for vertical wiring.

[0030] Figure 19A –19C is a schematic diagram of an embodiment of a mezzanine connector, showing a height of less than 8 mm.

[0031] Figure 20 Another embodiment of the electrical connector has the cable connector portion removed to present a locking mechanism.

[0032] Figure 20A yes Figure 20 An enlarged cross-sectional view shows the latch locking mechanism used for engagement between mating interfaces.

[0033] Figure 21 yes Figure 20 The exploded diagram.

[0034] Figure 22 This is a perspective view of the mating interface, showing the assembled socket base and grounding component.

[0035] Figure 22A yes Figure 22 A magnified perspective view.

[0036] Figure 23 yes Figure 22 The exploded diagram.

[0037] Figure 24 It is a perspective view of a cavity with one or more connectors for receiving a mating interface.

[0038] Figure 25 yes Figure 24 The exploded diagram.

[0039] Figure 25A and Figure 25B yes Figure 25 A magnified perspective view.

[0040] Figure 26 Another embodiment of the electrical connector is shown, in which a portion of the cable connector is removed to reveal a mating interface and a portion of an open plug connector.

[0041] Figure 27 yes Figure 26 The perspective view of the electrical connector shown shows a partially opened housing of the mating interface and a portion of the plug connector housing removed, illustrating a reinforcement and retainer in one embodiment.

[0042] Figure 28 yes Figure 26 The diagram shows a perspective view of an electrical connector, in which the mating interface and cable connector are separated from the plug connector, and the housing portion of the mating interface has been removed.

[0043] Figure 29 yes Figure 26 The diagram shows an exploded view of a cavity in one row of the mating interface, which receives a portion of one or more connectors.

[0044] Figure 30 yes Figure 26 The graph of the illustrated embodiment shows the total near-end crosstalk power of the differential FD.

[0045] Figure 31 yes Figure 26 The graph of the illustrated embodiment shows the total far-end crosstalk power of the differential FD.

[0046] Figure 32 Another embodiment of the electrical connector system is shown, in which a portion of the first electrical connector is removed to reveal the mating interface, and a portion of the second electrical connector is in an open state.

[0047] Figure 33 yes Figure 32 The diagram shows a perspective view of an electrical connector system, in which the housing of the mating interface is partially open and a portion of the housing of the second electrical connector is removed to illustrate a reinforcement and retainer in one embodiment.

[0048] Figure 34 yes Figure 32 The diagram shows a perspective view of an electrical connector system, in which the mating interface and the first electrical connector are separated from the second electrical connector, and the housing of the mating interface is partially removed.

[0049] Figure 35 Another embodiment of the electrical connector system is shown, in which a portion of the first electrical connector is removed to reveal the mating interface and a portion of the second electrical connector is in an open state.

[0050] Figure 36 yes Figure 35The diagram shows a perspective view of an electrical connector system, in which the housing of the mating interface is partially opened and the housing of the second electrical connector is removed to illustrate a reinforcement and retainer in one embodiment.

[0051] Figure 37 yes Figure 35 The diagram shows a perspective view of an electrical connector system, in which the mating interface and the first electrical connector are separated from the second electrical connector, and the housing of the mating interface is removed. Detailed Implementation

[0052] Referring to the accompanying drawings, one embodiment provides one or more electrical connector assemblies 20. Component 20 may include at least one or more electrical connectors 30. In some embodiments, the electrical connectors may include a width of about 12.5 mm, an operating speed of about 224 gigabits per second, and / or a package size of about 75 mm. The number of wire pairs may be 64 pairs within half an inch, or a density greater than 256 pairs per square inch. In some embodiments, the size and shape of the electrical connectors allow multiple electrical connectors to be mounted on one side of a wafer package substrate no larger than about 75 mm square (75 mm x 75 mm) to about 85 mm square (85 mm x 85 mm), the multiple electrical connectors may collectively carry at least 1024 differential signal pairs, and the multiple electrical connectors may transmit about 224 gigabits per second (Gbps / sec) of Pam4 signals in a bandwidth of about 56 GHz to about 70 GHz, while the far-end crosstalk (FEXT) does not exceed about -40 dB. In various embodiments, the size and shape of the electrical connectors allow multiple electrical connectors to be mounted on one side of a wafer package substrate no larger than about 75 mm x 75 mm to about 85 mm x 85 mm. The multiple electrical connectors collectively carry at least 1024 differential signal pairs, and transmit approximately 224 gigabits per second (Gb / s) of PAM4 signal over a bandwidth of about 56 GHz to about 70 GHz, with near-end crosstalk (NEXT) not exceeding about -50 dB. In some embodiments, the side lengths of the wafer package substrate are no larger than about 75-96 mm, including side lengths of about 80 mm ± 5 mm and 91 mm ± 5 mm. Multiple electrical connectors collectively carry at least 1024 differential signal pairs, and transmit approximately 224 Gb / s of PAM-4 signal over a bandwidth of about 56 GHz to about 70 GHz, with far-end crosstalk not exceeding about -40 dB.

[0053] Now refer to the diagram, Figure 1-4BAn exemplary embodiment of an electrical connector assembly 20 according to one aspect of the present invention is shown. The electrical connector assembly 20 includes an electrical connector 30 and / or a plurality of cable connectors 40 configured to mate with the electrical connector 30. The electrical connector 30 may include or be connected to a circuit board 50, such as a wafer package substrate 50a or a printed circuit board 50b. As shown in one embodiment, the connector 30 may be positioned / mounted on one side of the circuit board 50 (e.g., 50a, 50b). However, in some embodiments, the connector 30 may be disposed on both sides. (See also...) Figure 5 and Figure 6 The electrical connector 30 may include a mating interface or cable end organizer 60 (e.g., an egg rack mating interface or shield). The mating interface 60 may include multiple interlocking plates 62 that define multiple cavities 63. The connector 30 may include or be configured to mate with one or more cable connectors 40. Each cavity 63 is sized to accept or mate with a cable connector 40. The electrical connector 30 may include one or more plug connectors 70. The electrical connector 30 or plug connector 70 also includes one or more electrical contacts 71 and / or one or more grounding contacts 72. Each electrical contact 71 is located within a cavity 63, electrically isolated from the interlocking plates 62, and configured to mate with a contact 42 (e.g., a socket) of a cable connector 40. Each grounding contact 72 is electrically grounded and configured to mate with at least one plate 62 (e.g., direct, indirect, first plate, second plate). The plug connector 70 (e.g., grounding contacts, electrical contacts) is soldered to a circuit board 50 (e.g., 50a, 50b). Figure 7 In some of the embodiments shown, a solution with 1024 pairs can be used. Figure 8 In other embodiments shown, solutions with 1192 pairs or 1280 pairs can be used. It should be understood that the wafer package substrate may have an isolation region dedicated to the integrated circuit wafer. The integrated circuit wafer may be mounted in an area of ​​the wafer package substrate. Therefore, in some examples, it is understood that no electrical connectors are mounted on or attached to the wafer package substrate in the area of ​​the isolation region. In one example, the isolation region may define an area approximately 40 mm square.

[0054] In some embodiments, at least one interlock plate 62 (e.g., a first interlock plate) is conductive and provides a ground connection between the cable connector 40 and the circuit board 50 or a portion thereof. Generally, the interlock plate 62 can be conductive or insulating. Figure 9 and Figure 10As shown, at least one interlocking plate 62 includes an end 64 remote from the circuit board 50 and a mating end 65 for electrical contact with the conductive outer shielding element 43 of the cable connector 40. To reduce / control the round-trip impedance, the spacing or distance D from the circuit board 50 (e.g., packages 50a, 50b) to the end 64 of the plate 62 / shielding element 43 can be reduced by the length L of the plate 62 or cavity 63. The remaining portion of the length or distance D from the circuit board to the end 64 may be at least one source of crosstalk. The plate 62 defining the cavity 63 covers or overlaps approximately 85% to 95% of the length L from the cable connector 40 to the package or board 50 to minimize the distance D. Figure 9 As shown in one embodiment, the plate 62 defining the cavity 63 covers or overlaps the cable connector 40 to about 90% of the length L of the package to reduce crosstalk, while the remaining portion or the remaining portion of the distance D may be 10% of the distance from the substrate. Figure 11 An example of a cable-to-package impedance curve is shown, simulating a TDR signal of 92Ω + / -5Ω at 6 picoseconds (20%-80% rise time).

[0055] In some embodiments, the end 64 of plate 62 or cavity 63 may be spaced apart from package / substrate 50 by a distance (e.g., a predetermined distance D). End 64 or plate 62 may abut / position / mate with ground contact element 72 of plug connector at distance D. Ground contact element 72, or a portion thereof, may be spaced apart from substrate 90 by distance D from plate 62, or a portion thereof (e.g., end 64). In one embodiment shown, ground contact element 72 extends / protrudes from circuit substrate 50 (e.g., 50a, 50b). Ground contact element 72 may include one or more arms / blades. For example, ground contact element may include at least one arm, at least two arms, at least three arms, at least four arms, or four or more arms. Increasing the number of arms can increase the contact area / width when mating with a mating interface (e.g., plate). As shown in one embodiment, ground contact element 72 may include two arms 72a, 72b (e.g., at least two laterally offset cantilever beams) that extend upward and are spaced apart from each other to form a groove 73 for receiving end 64 of plate 62 (e.g., first piece). These two arms may be offset from the remainder of the grounding contact element or body. The two arms 72a may be offset from each other by a distance along the length or plane of the slot 73 of the receiving plate 62. While the two arms may not overlap or cross along the length of the slot, it should be understood that in some embodiments, a portion of the two arms may overlap. One or more portions of the slot or grounding contact element 72 (e.g., arms) may define a stop or vertical stop mechanism to limit further axial movement of the plate 62 within the slot or toward the circuit board. The stop may position a mating interface, plate, or cavity at a distance D. Furthermore, the first and second arms 72a, 72b may be mirror images of each other with respect to the plane of the slot 73. The first arm 72a engages with the interior of a cavity / plate, and the second arm 72b engages with the interior of an adjacent cavity / plate. In one embodiment shown, the two grounding contact elements 72 may engage with an adjacent parallel plate 62 (e.g., a first plate) rather than an adjacent second plate defining the cavity 63 of the receiving cable connector 40. However, in some embodiments, one or more grounding contact elements 72 may engage with one or more second plates and / or one or more first plates. In one embodiment shown, each arm 72a, 72b can be resiliently loaded or biased to push against the slot 73 or engage with the plate 62. Furthermore, the free end of each arm or arm can extend / bend outward from the slot or engagement plate. As shown in one embodiment, arm 72 may be surrounded by air or free space, not in contact with plastic or insulating components. There may be no plastic between the mating end of ground contact element 72 and the mating end of signal contact element 71. The mating ends of 71 and 72 may be unrestricted or not surrounded by plastic or insulating components. Arm 72 (such as the mating end) may be independent, protruding and / or extending (e.g., not inside the plastic) above the plastic of plug connector 70 at the arm base. Furthermore, there may be no plastic or insulating material on the extension line between the mating ends of arm 72b and the adjacent mating ends of arm 72b. Figure 12 This shows an example of the S-parameters for a shielded return path or grounding contact element. Figure 12 The simulation shown was performed under conditions of 92Ω ± 5Ω and 6 picoseconds (20%–80% rise time). In some embodiments, the contact may include one or more solder balls / solder blocks 74. In one embodiment shown, the ground contact element 72 includes at least one solder ball 74. It should be understood that the ground contact element 72 may include one or more solder balls. For example, at least one solder block, at least two solder blocks, or at least three solder blocks. In some embodiments, two or more solder blocks may be adjacent to each other (e.g., linearly arranged). In some embodiments, the soldering of the contact may be one or more elongated pads of different lengths. In some embodiments, the electrical / signal contact 71 may be perpendicular to the ground contact element 72.

[0056] In a preferred embodiment, the interlocking plate 62 is a metal sheet formed by any suitable method, such as metal stamping. In other embodiments, the interlocking plate 62 is formed by other methods, including molding and / or machining of polymer materials, molding and / or machining of metal, or a structure in which a metal frame is covered with a polymer material. In some embodiments, the plastic frame / base may be plated.

[0057] In some implementations, the interlock / interconnect board 62 includes a plurality of first boards 62a and a plurality of second boards 62b, such as Figure 5 and Figure 6 As shown. Plate 62 may include one or more recesses 66 and / or one or more slots 67. Recesses (if used) may interlock with slots (if used) to define cavities 63. First plate 62a may include a plurality of first slots 67a aligned with a plurality of first recesses 66a. Second plate 62b may include a plurality of second slots 67b aligned with a plurality of second recesses 66b. Second plate 62b is laterally positioned and interconnected relative to first plate 62a by interlocking the first slots 67a with the second recesses 66b and by interlocking the second slots 67b with the first recesses 66a, so that during assembly, the plurality of first plates and second plates define a plurality of cavities 63. Slots 67 / recesses 66 engage, or mating interfaces 60, to provide a fully enclosed or 360-degree shield / peripheral for one or more cable connectors 40. 360-degree shielding or plates can reduce crosstalk between cable connectors within the cavity. This can prevent or reduce gaps / holes / channels on the cavity walls, thereby reducing crosstalk. The walls at the seam / groove joint can meet or overlap the edges of the opposite seam / groove joint to reduce gaps. For example... Figure 13 As shown, multiple electrical connectors can transmit approximately 70 GHz signals with crosstalk not exceeding approximately -40 dB at the remote end. Figure 13 The simulation experiment shown was conducted under conditions of 92Ω + / - 5Ω and 6 picoseconds (20%-80% rise time).

[0058] In some embodiments, the mating interface 60 may include a housing 68. The housing 68 (if used) may include a plurality of recesses 69 located on its inner periphery. The recesses 69 may maintain the spacing of the cavity 63 / plate 62 and / or provide rigidity for one or more plates 62. The recesses 69 may receive the ends of the first plate 62a and the second plate 62b.

[0059] In some embodiments, the electrical connector 30 may include one or more gaps / spaces 32 between the cable connectors 40 to reduce crosstalk. In some embodiments, larger inter-row spaces or distances can reduce near-end crosstalk of the package. In one embodiment shown, the gap 32 may be defined by one or more rows of cavities 63 that do not contain cable connectors 40, set by a plurality of plates 62. The gap 32 within one or more rows of cable connectors 40 or an array of cable connectors 40 can reduce crosstalk between cable connectors 40. As shown in one embodiment, one or more rows / gap 32 that do not contain cable connectors 40 may be defined by a plurality of smaller cavities (e.g., smaller vias) or closely spaced plates. Smaller rows or gaps 32 (if used) may be set by at least two adjacent parallel plates (e.g., first plate 62a and / or second plate 62b) with a spacing smaller than that of the remaining parallel plates. Slots 66 and slits 67 may be provided on each plate 62 to define the gaps 32 for various row spacings / spacings D. Although not shown, the spacing (e.g., row spacing) of the intersecting plates 62 of the first and second plates may be smaller to define smaller rows. In addition, such as Figure 14 As shown, multiple electrical connectors can transmit approximately 70 GHz signals with near-end crosstalk not exceeding approximately -50 dB. Figure 14 The simulation examples shown were conducted under conditions of 92Ω + / - 5Ω and 6 picoseconds (20%-80% rise time).

[0060] In some embodiments, a component / connector or portion thereof (e.g., a mating interface, plug connector, and / or cable connector) may be a simulated 224 gigabits per second Pam4 signal in one embodiment, with 92Ω + / -5Ω at 6 picoseconds and a rise time of 20%-80%. In some embodiments, the bandwidth may be about 70 to 50 GHz. In some embodiments, the bandwidth may be about 56 GHz. In various embodiments, far-end crosstalk may be about -30 dB to about -45 dB. For example, less than or equal to -30 dB, less than or equal to -35 dB, less than or equal to -40 dB, and / or less than or equal to -45 dB. In some embodiments, insertion loss may be between about 0 dB and about -5 dB. For example, between 0 dB and -1 dB, between -1 dB and -2 dB, between -2 dB and -3 dB, between -3 dB and -4 dB, and / or between -4 dB and -5 dB. The bandwidth can be from approximately 50 GHz to approximately 80 GHz. For example, 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and / or 80 GHz. In different embodiments, near-end crosstalk can be from approximately -40 dB to approximately -60 dB. For example, less than or equal to -40 dB, less than or equal to -45 dB, less than or equal to -50 dB, less than or equal to -55 dB, and / or less than or equal to -60 dB. In some embodiments, insertion loss can be between approximately 0 dB and approximately -5 dB. For example, between 0 dB and -1 dB, between -1 dB and -2 dB, between 2 dB and -3 dB, between -3 dB and -4 dB, and / or between -4 dB and -5 dB. The bandwidth can be from approximately 50 GHz to approximately 70 GHz. For example, 50 GHz, 55 GHz, 60 GHz, 65 GHz and / or 70 GHz.

[0061] In some embodiments, component 20 or electrical connector 30 may include a bend / cable straightener 80 for one or more cables 90. In some embodiments, the bend / cable straightener 80 may include a tension reliever 81. The tension reliever 81 (if used) may be a hot melt adhesive. Figure 3A and Figure 15 As shown, the bend straightener 80 can be used for either a vertical cable 90a or a right-angle cable 90b. The total height of the electrical connector 30 or assembly 20 can be less than 15 mm. The height of the right-angle cable 90b with the bend straightener 80 is approximately 15 mm. The height of the vertical cable 90a with the bend straightener 80 is approximately 10 mm.

[0062] In some embodiments, one or more cables 90 may be connected to one or more cable connectors 40. Although in one illustrated embodiment, the cable 90 is shown as a dual cable, it should be understood that various cables may be used and are still within the scope of the invention. For example, coaxial cables may be used in some embodiments. The cable 90 may include a shielding layer, such as a wrap-around shielding layer, a crimped shielding layer, or any type of grounding shielding layer, reference shielding layer, or EMI shielding layer. The shielding may be stripped relative to the exposed surface of the central electrical insulator, or may be partially stripped, but is not limited to lengths greater than 0 mm to about 1 mm to 2 mm, or 0 mm, or 2 mm or greater, or 0 mm to 0.5 mm. Any connector may include conductive material or electrically dissipating material, magnetically absorbing material.

[0063] In some implementations, component 20 or the electrical connector may include one or more mounting brackets 95. For example... Figure 16A and 16B As shown, one example of a retaining bracket 95 could be one or more spring fingers. Retention devices (if used) ensure component fit and / or facilitate maintenance. Another example of a retaining bracket could be a latch.

[0064] In some implementations, the circuit board 50 may have a defined wiring density. For example, such as Figure 17 As shown, package or wafer substrate packaging can start with a 350-micron pitch to minimize far-end crosstalk, and then reduce the pitch to 200 microns for wiring vias. A BGA pitch of 0.35 can determine the wiring density (e.g., 224 gigabits per second). Printed circuit board embodiments with 64 pairs of blocks are possible. Figure 15 As shown, the PCB version may be approximately 5 mm wider and deeper than the chip substrate package. Furthermore, Figure 18 This diagram shows a comparison between one implementation of the package and a PCB implementation. The diagram illustrates a vertical routing design. The package can be 2 layers, while the PCB can be 4 or 8 layers.

[0065] In some implementations, the electrical connector assembly may include a lower RA height option. For example, cable organizer compatibility may be less than 8 mm. Figures 19A-19C As shown, the setup can be a stacked flexible sheet 98 in a sandwich configuration. As illustrated, an example could be four 3-layer flexible films stacked together, with one soldered to a connector. The flexible sheet 98 can be converted into one or more cables to achieve longer lengths.

[0066] In some embodiments, the electrical connector assembly 20, electrical connector 30, mating interface 60, 160, substrate 50, and / or plug connector 70, 170 may include one or more locking mechanisms 82 or portions thereof to couple the mating interface 160 to the plug connector 170. Figure 20-23 In one embodiment shown, the locking mechanism 82 may be an intermediate or internal locking mechanism, spaced inwardly from or positioned within the outer periphery (e.g., housing, wall) of the electrical connector 30 / connector 170 / dating interface 160. The locking mechanism 82 may include one or more latches, clips, or friction locks 82a (e.g., intermediate, internal). One or more clips 82a are shown inside or within the plug connector 170, mating interface 160, and / or electrical connector 30 (e.g., outer periphery). While clips 82a are shown inside the electrical / plug connectors 30, 170, and / or mating interface 160, it should be understood that in some embodiments, external clips (e.g., located on the outer periphery, wall) may be used in conjunction with internal clips / locking mechanisms. One or more clips 82a extend upwardly from within the spaced area at the bottom and / or outer periphery of the plug connector 170 and / or substrate 50. Clips may extend upward from an intermediate wall or inner wall 82ab extending between or inside the outer peripheral walls (e.g., opposing walls) of the mating interface 160 (e.g., base, grounding component) or the plug connector 170. In one embodiment shown, two spaced-apart clips 82a may be resiliently loaded laterally (e.g., in opposite directions toward opposite sides of the inner panel 82b) on the plane of the clips 82a and / or the inner wall 82ab. The clips 82a generate frictional force against the locking mechanism 82 of the mating interface 160 or a portion thereof (e.g., inner panel 82b, slot 82ba) to reduce or prevent axial separation between the mating interface 160 and the plug connector 170. The locking mechanism 82 of the mating interface 160 or a portion thereof may be one or more sockets / clasps 82ba and / or the inner panel 82b, releasably engaging one or more clips 82a. During assembly, the clips 82a engage with the inner panel 82b of the mating interface 160 or a portion thereof (e.g., upper notch / clasp / socket 82ba). The clip 82a of the plug connector 170 may interfere with the axial separation of the mating interface 160 or the inner / intermediate panel 82b. The inner panel 82b may be located in the gap 32 between the cable connector 40 and / or the cavity 32 (e.g., the cable connector row). The upper edge of the inner panel 82b may include one or more notches / snap mounts 82ba. If two notches 82ba are used, the notches may be spaced apart from each other along the length of the panel 82b. One or more portions of the locking mechanism 82 may be interchanged between the mating interface 160 and the plug connector 170. For example, it should be understood that in some embodiments, the mating interface 160 may include a clip, while the plug connector 170 may include an inner panel.

[0067] exist Figure 20-25In one embodiment shown, the mating interface 160 may include a plurality of interlocking plates 62 that define cavities 63 of at least one row R1, receiving at least one row or one or more cable connectors 40. The interlocking plates 62 may include at least two third / opposite / parallel plates 62c interconnected by one or more fourth / parallel plates 62d transverse to the third plates. The fourth plates 62d may define opposing end plates at opposite ends of a row of cavities or third plates 62c. Each row R1 may include a third plate and a fourth plate. The mating interface 160 may include multiple rows R1 defined by the third and fourth plates. Cavities 63 may have through-holes (e.g., top-opening and bottom-opening) defined by the third and fourth plates 62c, 62d. In some embodiments, the third plate 62c may include one or more through-holes 62ca that, during assembly, receive one or more protrusions 62da extending from the outer periphery (e.g., opposite ends / sides) of the fourth plate 62d. Figure 24 , 25 As shown in one embodiment of 25B, the third plate 62c may include one or more through holes or openings 62ca (e.g., in the direction between the mating end 65 and the end 64). Figure 24 , 25 As shown in Figure 25A, each fourth plate 62d may include one or more protrusions or elongated protrusions 62da located on opposite sides / edges, engaging with corresponding openings 62ca of the opposite third plate 62c. The mating ends 65 of one or more third plates 62c and / or fourth plates 62d may include multiple arcuate edges for mating or fitting with one or more cables 90 or cable connectors 40. Figure 24 and Figure 25 As shown, the other end of the opposing / parallel third plate 62c may be longer than and extend beyond the arcuate edge. In some embodiments, solder paste may be used near the mating point of the hole / protrusion. The cavity defined by the third and fourth plates 62c, 62d may receive a cable connector 40. The end plate or fourth plate 62d may be spaced inward from the opposing end of the third plate or row R1 to define a recess 200b. The recess 200b may include a bottom opening for receiving or inserting a tongue member 200a of the rest of the mating interface 160 (such as a base, grounding member). The third / fourth plates 62c, 62d (e.g., grounding metal) may be stamped and / or plated. In some embodiments, the plate 62 may be solder paste printed, tin-plated, and / or laser-welded together. The cavity or the third and / or fourth plate may be assembled with one or more hot blades and one or more cable connectors 40 therein. During assembly, a row of R1 cavities defined by the third plate 62c, fourth plate 62d is adjacent to one or more rows of R1 cavities. Figure 20 , 20A As shown in Figure 21, adjacent third plates 62c of adjacent cavities / rows R1 can be placed parallel to each other and / or in contact with each other. Figure 20As shown in one embodiment, the locking mechanism 82 or a portion thereof, the inner wall 82ab, the gap 32, the inner panel 82b, the groove 82ba, and / or the clip 82a can separate two adjacent rows R1.

[0068] In some embodiments, the mating interface 160 may include a plate (e.g., a third, fourth, etc.), a socket base 160a, and / or a grounding component 160b. In some embodiments, the socket base 160a may be, but is not limited to, molded plastic, and / or the grounding component 160b may be, but is not limited to, stamped metal (e.g., conductive metal). In some embodiments, the base 160a or the mating interface 160 may include one or more internal panels 82b and / or a locking mechanism 82 or a portion thereof. The base 160a may include a housing 68 having an outer peripheral wall 68a defining a through-hole 68b. The internal panels 82b may be located inside or within the outer periphery and extend between opposing walls of the outer peripheral wall 68a and / or intersect with the through-hole 68b. The grounding component 160b may include an outer peripheral wall 68c defining a through-hole 68d. The outer peripheral wall 68c of the grounding component 160b may include a channel 68e (e.g., a U-shaped, inverted channel). The outer peripheral wall 68c of the grounding component may mate with the outer peripheral wall 68a of the base. Channel 68e or grounding member wall 68c may receive the upper edge of the outer peripheral wall 68a of the base. The mating interface 160 may include one or more mortise and tenon joints 200. The opposing wall 68c of the grounding member 160b may include one or more tongue members or mating surfaces 200a adjacent to the opposing wall of the base 160a. The tongue members 200a are disposed along at least one wall of the base 160a / grounding member 160b and may be spaced apart from each adjacent tongue member 200a along the wall by slots 68f (e.g., vertical, longitudinal). Although not shown, the width of the slot 68f may increase from the distal free end of the tongue towards the proximal end or the upper edge of the grounding member. For example, the slot may include an upper slot portion larger than the lower slot portion. The tongue members may be located inside the outer peripheral wall 68a and mate / engage with one or more slots 200b at one or more rows R1 / opposite ends of the third and / or fourth plates 62c, 62d of the mating interface. Although not shown, the tenon or part thereof may be spaced inward away from the inner surface of the bottom wall 68a. Plates 62c, 62b may contact the grounding member 160b and / or one or more walls 68c (e.g., opposite wall, one wall, two walls, three walls, etc.) of adjacent plates / rows (e.g., 62c, 62b).

[0069] In some embodiments, plates 62c, 62d defining one or more rows of cavities 63 of R1 can be engaged with grounding member 160b and / or base 160a via one or more latches. Figure 20-24In one embodiment shown, the latch may be one or more tenon-and-groove engagements 200 between the plate 62 (e.g., the third and fourth plates) and the grounding member 160b and / or the base 160a. It should be understood that various engagements or latches may be used between the plate 62 and the grounding member 160b. One or more opposing tongues 200a of the base / grounding member engage or receive opposing recesses 200b or ends of one or more rows R1 of the cavity 63 defined by the third and fourth plates, and / or position the third plates 62d of adjacent rows R1 in contact with each other during assembly. If used, the tongues 200a and / or recesses 200b adjacent to the opposite wall of the grounding member 160b may be adjacent to the opposite ends of the inner panel 82b. The ends of the third plate 62c or recesses 200b (e.g., a portion of row R1) may extend between the tongue 200a or a portion thereof (e.g., groove 68f) and / or the bottom wall 68a, thereby slidably engaging with the tongue and the recess. In some embodiments, the latching mechanism 300 can be used to axially lock the tenon-groove mat 200 or the mating interface portion therebetween. Figure 20-25 In one embodiment shown, the latch locking mechanism 300 may be a releasable engagement between the grounding member 160b and the plates 62 (e.g., 62c, 62d) and / or row R1. Figure 20A As shown, one or more third plates 62c may include one or more protrusions 300a that extend outward from opposite ends of one or more rows R1 and can releasably mate with one or more protrusions 300b that extend outward or laterally from adjacent tongues 200a into a groove 68f therebetween. If protrusions 300b are used, a portion of the groove 68f between adjacent tongues 200a may be narrowed. A latching mechanism 300 (e.g., protrusions 300a, 300b, openings, etc.) (if used) may engage after axial engagement / movement (e.g., sliding) a distance when engaging the tongue and groove engagement member 200. For example, relative sliding between the tongue and groove engagement results in engagement (e.g., axial) of one or more protrusions 300a of a row cavity / plate containing the mating interface of the cable connector 40 with one or more protrusions 300b of the grounding member and / or base of the mating interface. Furthermore, when the mating interface 160 is assembled to the plug connector 170, the clip 82a (if used) may extend upward between the inner panel 82b and an adjacent third plate 62c on one or both sides of the inner panel. If two clips 82a are used as shown in one embodiment, the clips may extend along or mate with the opposite side of the inner panel 82b of the base 160a.

[0070] In some implementations, electrical connector 30 and / or cable connector 40 may include shielding for differential signal pairs (e.g., 60, 160), while plug connectors 70, 170 do not provide shielding for differential signal pairs. Figure 1 , Figure 21 and Figure 26As shown, plug connectors 70 and 170 do not have their own independent peripheral shielding or cage shielding (e.g., crosstalk). Only electrical connector 30 and / or cable connector 40 include circumferential, cage shielding (e.g., crosstalk) or mating interfaces 60 and 160 for differential signal pairs.

[0071] In some embodiments, the electrical connector assembly 20, electrical connector 30, mating interface 60, 160, substrate 50, and / or plug connector 70, 170 may include one or more locking mechanisms 182 or portions thereof to couple the mating interface 160 to the plug connector 170 (e.g., housing, substrate). Figure 26-29 In one embodiment shown, the locking mechanism 182 may be an external locking mechanism located within the outer periphery (e.g., housing, wall) of the electrical connector 30 / connector 170 / mating interface 160. The locking mechanism 182 may include one or more latches or clips 182a (e.g., external latches or clips). One or more clips 182a are shown as being external (e.g., outer periphery) of the plug connector 170, mating interface 160, and / or electrical connector 30. Although clips 182a are shown as being external to the electrical / plug connectors 30, 170, and / or mating interface 160, it should be understood that in some embodiments, internal clips (e.g., located on the outer periphery, wall) may be used in conjunction with external clips / locking mechanisms. One or more clips 182a may extend downward from the bottom of the mating interface 160 or be contained within the housing 168 of the electrical connector 30. Clips 182a may extend downward from one or more outer walls 168a (e.g., opposite) to releasably mate with plug connectors 170 (e.g., housing 178, outer wall 178a, receptacle 179). One or more receptacles 170 within the housing 178 and / or outer wall 178a of plug connector 170 may releasably receive one or more clips 182a. Receptacles 179 may extend from or mate with wafer package substrates 50 (e.g., 50a, 50b). In one embodiment shown, two spaced-apart clips 182a may be resiliently loaded laterally (e.g., in opposite directions toward the connector) in the plane of clips 182a. Clips 182a may include one or more protrusions 182b that releasably mate with one or more holes 179a in the bracket 179 or housing 178. It should be understood that clips 182a and brackets 179 may be interchanged, but this is still within the scope of the invention.

[0072] In some embodiments, the plug connector 170 (e.g., housing) and / or circuit board 50 may include one or more reinforcements 180. The reinforcements 180 may support one or more portions of the plug connectors 70, 170. Figure 26-29As shown in one embodiment, one or more reinforcements 180 may be attached to the circuit board side of the circuit board 50 and / or mating with one or more portions of the housing 178 (e.g., bottom 178b, outer wall 178a). As shown, in some embodiments, a reinforcement may engage with three outer walls 178a, and in some embodiments, it may engage with a single outer wall or the entire periphery of an outer wall. The illustrated embodiment includes two opposing reinforcements. A reinforcement may include one or more upwardly projecting parts / tabs 181 that engage with the housing 178 (e.g., a wall). Tabs 181 may include one or more posts 181a received within the base 177 of the housing 178 and / or one or more posts 181b having holes 181ba that may receive bias tabs 178c of the housing 178. In some embodiments, a reinforcement may support the bottom / board wall 178b or the periphery or edge of the housing 178. A reinforcement or a portion thereof may be made of a conductive material, a non-conductive material, or both. In some embodiments, a reinforcement may be stainless steel. It should be understood that the reinforcement can be of various shapes, sizes, quantities, locations and structures, but is still within the scope of this invention.

[0073] In some embodiments, component 20, cable connector 40, and / or mating interfaces 60, 160 may include one or more retainers 190. One or more retainers 190 may align or retain engagement (e.g., conductive, non-conductive) between one or more portions of mating interface 160. In some embodiments, retaining members 190 may retain and / or align (e.g., horizontally, vertically) plate 62, cavity 63, egg rack shield, or mating interface, or portions thereof. In some embodiments, retaining members 190 may secure and / or align (e.g., horizontally, vertically) the egg rack shield, cavity 63, plate 62, and housing 168. Figure 26-29 In one embodiment shown, the fixing member 190 may be one or more elongated members or rods 191 (e.g., horizontal) that engage with one or more elongated slots / holes 192 of the housing 168 (e.g., wall) and / or one or more slots / holes 193 of the plate 62 / cavity 63 / egg rack shield. The fixing member or a portion thereof may be made of conductive, non-conductive, or both. It should be understood that the fixing member / mechanical device may be of various shapes, sizes, numbers, positions, and structures, but is still within the scope of this invention.

[0074] In some embodiments, one or more ends 65 of one or more plates 62 may make electrical contact with the conductive outer shielding element 43 of the cable connector 40. For example... Figure 24 , 25As shown in Figure 25A, the mating ends 65 of one or more third plates 62c and / or second plates 62d may include multiple arcuate edges to mate with or adapt to one or more cables 90 or cable connectors 40 (e.g., outer shielding element 43). In some embodiments, the mating ends 65 may directly contact the outer shielding element 43. Figure 26-29 As shown, the mating ends 65 of one or more third plates 62c may include multiple flat edges to mate or adapt with one or more cables 90 or cable connectors 40 (e.g., outer shielding element 43) or portions thereof. Furthermore, in some embodiments, the mating interface 160 and / or connector 30 may include epoxy resin 65a at one or more conductive joints. For example, as... Figure 26-29 As shown in one embodiment, epoxy resin 65a (e.g., conductive) may be used between the planar mating end 65 or one or more portions of the plate 62 (e.g., mating end) and the outer shielding element 43.

[0075] As another example, see Figures 32-34 The board-to-board or mezzanine electrical connector system 53 may include first and second board connectors 96 and 97, which are configured to mat with each other. The first and second board connectors 96 and 97 are configured to be mounted on respective first and second substrates 51a and 51b, which may be individually configured as with substrate 50 described herein. The configuration of the first board connector 96 is similar to that of the electrical connector 30 described herein, including plug connectors 70 and 170. The mating interface of the second board connector 97 is similar to that of the cable connector 40 described herein, which is configured to mate with the electrical connector 30. The second board connector 97 may be configured to be mounted on a substrate, as described herein with reference to electrical connector 30, including plug connectors 70 and 170. Therefore, the second board connector 97 may be configured to be mounted on the second substrate 51b. Thus, during operation, when the first and second board connectors 96 and 97 are respectively mounted on and mated with the first and second substrates 50a and 50b, the respective substrates of the first and second substrates 51a and 51b can communicate electrically with each other.

[0076] Now for reference Figures 35-37The cable-to-cable connector system 57 may include first and second cable connectors 94 and 95, which are configured to mat with each other. Corresponding first and second plurality of cables may be mounted on the electrical contacts of the first and second cable connectors 94 and 95, respectively. The configuration of the first cable connector 94 is similar to that of cable connector 40. The mating interface of the second cable connector 95 is similar to that of the electrical connector 30 described herein, including plug connectors 70 and 170, which are configured to mat with the cable connector 40 described herein. Therefore, the second cable connector 95 may be configured to mat with the first cable connector 94. The second cable connector 95 may be configured to communicate electrically with the cables, as described in the cable connector 40. Therefore, the electrical contacts of the second cable connector 95 may be mounted on a second plurality of cables. During operation, when the first and second cable connectors 94 and 95 are mated together, corresponding cables in the first and second plurality of cables may communicate electrically with each other.

[0077] In some implementation schemes, Figure 30 and Figure 31 Show Figure 26-29 The differential FD near-end crosstalk and differential FD far-end crosstalk power of one embodiment of the electrical connector shown are illustrated. Figure 30 As shown, when multiple electrical connectors transmit signals at approximately 70 GHz, the near-end crosstalk does not exceed approximately -50 dB. Figure 30 The simulation implementation shown is the total power sum, i.e., the sum of all noise sources according to industry standards. Furthermore, as... Figure 31 As shown, when multiple electrical connectors transmit signals at approximately 70 GHz, the far-end crosstalk does not exceed approximately -30 dB. Figure 31 The simulation implementation shown is the total power, which is the sum of all noise sources according to industry standards.

[0078] In some implementations, components / connectors 20, 30, or portions thereof (e.g., mating interfaces, plug connectors, circuit boards, and / or cable connectors) may include at least 257 differential pairs per square inch, at least 256-264 differential pairs per square inch, at least 139-263 differential pairs per square inch, at least 138-145 differential pairs per square inch, and / or at least 88-137 differential pairs per square inch.

[0079] In some implementations, components / connectors 20, 30, or portions thereof (e.g., mating interfaces, plug connectors, circuit boards, and / or cable connectors) may include at least 257 single-ended pins per square inch, at least 256-264 single-ended pins per square inch, at least 139-263 single-ended pins per square inch, at least 138-145 single-ended pins per square inch, and / or at least 88-137 single-ended pins per square inch.

[0080] In some implementations, components / connectors 20, 30, or portions thereof (e.g., mating interfaces, plug connectors, circuit boards, and / or cable connectors) may include at least 127 differential pairs per square inch, at least 128 differential pairs per square inch, and / or at least 129 differential pairs per square inch.

[0081] In some implementations, components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit boards and / or cable connectors) may include conductors of about 32, 33, 34, 35 and / or 36 AWG.

[0082] In some implementations, components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit boards and / or cable connectors) may include approximately 92 ohms plus / minus 9 ohms, or plus / minus 5%, and / or plus / minus 10%.

[0083] In some implementations, components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit boards and / or cable connectors) may include an IL-XT separation of more than about 55 dB at about 25 GHz.

[0084] In some implementations, components / connectors 20, 30, or portions thereof (e.g., mating interfaces, plug connectors, circuit boards, and / or cable connectors) may include an IL-XT separation of more than about 40 dB at about 60 GHz.

[0085] In some implementations, components / connectors 20, 30, or portions thereof (e.g., mating interfaces, plug connectors, circuit boards, and / or cable connectors) may include a bandwidth of 60 GHz.

[0086] In some implementations, components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit boards and / or cable connectors) may include offset, edge-coupled connectors (completely symmetrical paths in the connector).

[0087] In some implementations, components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit boards and / or cable connectors) may include cable, interlayer and / or card edge connectors.

[0088] In some implementations, components / connectors 20, 30, or portions thereof (e.g., mating interfaces, plug connectors, circuit boards, and / or cable connectors) may include single-wire wiring in a wafer package substrate.

[0089] In some implementations, components / connectors 20, 30, or portions thereof (e.g., mating interfaces, plug connectors, circuit boards, and / or cable connectors) may include SMT / BGA / surface mount technology. In some embodiments, through-hole mounting may be used.

[0090] For example, in some embodiments of the invention, the size and shape of the electrical connectors allow multiple electrical connectors to be adapted to a single-sided wafer package substrate no larger than about 75 mm x 75 mm to about 85 mm x 85 mm, with multiple electrical connectors collectively carrying at least 1024 differential signal pairs, and / or multiple electrical connectors transmitting about 224 gigabits per second of Pam4 signal with a bandwidth of about 56 GHz to about 70 GHz, and far-end crosstalk not exceeding about -40 dB.

[0091] In some embodiments, the size and shape of the electrical connectors allow multiple electrical connectors to fit on one side of a die package substrate no larger than about 75 mm x 75 mm to about 85 mm x 85 mm, with multiple electrical connectors collectively carrying at least 1024 differential signal pairs, and / or multiple electrical connectors transmitting about 224 gigabits per second of Pam4 signal in a bandwidth of about 56 GHz to about 70 GHz, with near-end crosstalk not exceeding about -50 dB.

[0092] Furthermore, in some embodiments, the multiple electrical connectors can transmit signals at a frequency of approximately 60 GHz with far-end crosstalk not exceeding approximately -45 dB. In various embodiments, the multiple electrical connectors can transmit signals at a frequency of approximately 50 GHz with near-end crosstalk not exceeding approximately -45 dB. In some embodiments, each of the multiple electrical connectors may include a jack-up mating interface. In various embodiments, the electrical connectors may be configured to mate with cable connectors.

[0093] In some embodiments, the electrical connector may include a mating interface having a plurality of interconnected plates defining a plurality of cavities therein.

[0094] Furthermore, in some embodiments, the connector may include multiple cable connectors mating within multiple cavities. In various embodiments, each of the multiple plates may include multiple slots aligned with multiple grooves. In some embodiments, the multiple plates may define the circumference of a first cavity among the multiple cavities, wherein there are no gaps. In different embodiments, the multiple plates may define a row of cavities, wherein none of the multiple cable connectors are present. In some embodiments, the multiple plates may extend to approximately 90% of the length of the cable connectors to the substrate. In various embodiments, the electrical connector may include a substrate and a ground contact element positioning the multiple plates at a distance from the substrate. In some embodiments, the electrical connector may include a wafer package substrate no larger than approximately 75 mm x 75 mm to approximately 85 mm x 85 mm, the multiple electrical connectors collectively carrying at least 1024 differential signal pairs, and / or the multiple electrical connectors transmitting approximately 224 gigabits per second of Pam4 signal at a bandwidth of approximately 56 GHz to approximately 70 GHz, with far-end crosstalk not exceeding approximately -40 dB or near-end crosstalk not exceeding approximately -50 dB. In various embodiments, the multiple electrical connectors can transmit signals at a frequency of approximately 60 GHz with far-end crosstalk not exceeding approximately -45 dB. In some embodiments, the multiple electrical connectors can transmit signals at a frequency of approximately 50 GHz with near-end crosstalk not exceeding approximately -45 dB.

[0095] Furthermore, in some embodiments, the electrical connector configured to connect to the wafer package may include a density of at least 256 differential pairs per square inch.

[0096] In various embodiments, the electrical connector can transmit approximately 224 gigabits per second of Pam4 signal with crosstalk not exceeding approximately -40 dB. In some embodiments, the connector can transmit with a bandwidth of approximately 56 GHz to approximately 70 GHz.

[0097] Furthermore, in some embodiments, the electrical connector may include a mating interface. In various embodiments, the connector may include a plug connector having at least one grounding contact element configured to mate with the mating interface.

[0098] In some embodiments, the grounding contact element may include at least one arm that mates with the mating interface. In various embodiments, the grounding contact element may include at least two arms that mate with the mating interface. In some embodiments, the grounding contact element may include at least three arms that mate with the mating interface. In various embodiments, the grounding contact element may include at least four arms that mate with the mating interface. In some embodiments, the grounding contact element includes four or more arms that mate with the mating interface. In various embodiments, the grounding contact element may include at least one solder block. In some embodiments, the grounding contact element may include at least two solder blocks that are adjacent to each other. In various embodiments, the grounding contact element may include at least three solder blocks that are adjacent to each other.

[0099] In some embodiments, the electrical connector may include at least one of a mating interface, a plug connector, and / or a cable connector. In various embodiments, the connector may include a 224 gigabits per second Pam4 signal with a rise time of 6 picoseconds and a rise time of 20%-80%.

[0100] In some embodiments, the connector may include at least one of far-end crosstalk and / or insertion loss. In various embodiments, far-end crosstalk may be less than or equal to -30 dB. In some embodiments, far-end crosstalk may be less than or equal to -35 dB. In various embodiments, far-end crosstalk may be less than or equal to -40 dB. In some embodiments, far-end crosstalk may be less than or equal to -45 dB. In various embodiments, insertion loss may be between 0 dB and -1 dB. In some embodiments, insertion loss may be between -1 dB and -2 dB. In various embodiments, insertion loss may be between -2 dB and -3 dB. In some embodiments, insertion loss may be between -3 dB and -4 dB. In various embodiments, insertion loss may be between -4 dB and -5 dB. In some embodiments, the connector frequency may be 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and / or 80 GHz.

[0101] In various embodiments, the electrical connector may include at least one of near-end crosstalk and / or insertion loss. In some embodiments, the near-end crosstalk may be less than or equal to -40 dB. In various embodiments, the near-end crosstalk may be less than or equal to -45 dB. In various embodiments, the near-end crosstalk may be less than or equal to -50 dB. In some embodiments, the near-end crosstalk may be less than or equal to -55 dB. In various embodiments, the near-end crosstalk may be less than or equal to -60 dB. In some embodiments, the insertion loss may be between 0 dB and -1 dB. In various embodiments, the insertion loss may be between -1 dB and -2 dB. In some embodiments, the insertion loss may be between -2 dB and -3 dB. In some embodiments, the insertion loss may be between -3 dB and -4 dB. In various embodiments, the insertion loss may be between -4 dB and -5 dB. In some embodiments, the connector frequency may be 50 GHz, 55 GHz, 60 GHz, 65 GHz, and / or 70 GHz.

[0102] Furthermore, in some embodiments, the electrical connector may include a periphery. In different embodiments, the connector may include a locking mechanism positioned within the periphery of the electrical connector.

[0103] In some embodiments, the electrical connector may include a mating interface and a plug connector, wherein a locking mechanism may be located within the periphery of at least one of the mating interface and / or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In different embodiments, the locking mechanism may include at least one notch. In some embodiments, the locking mechanism may include at least two notches. In various embodiments, the locking mechanism may be located within at least one gap between adjacent rows of cavities. In some embodiments, the electrical connector may include a plurality of cable connectors, wherein the locking mechanism may be located between adjacent cable connectors of the plurality of cable connectors. In various embodiments, the electrical connector may include a plurality of cavities, wherein the locking mechanism may be disposed between adjacent cavities of the plurality of cavities. In some embodiments, the locking mechanism may be internally located away from one or more walls of the outer periphery of the electrical connector. In different embodiments, the connector may be configured to connect to a wafer package having a density of at least 256 differential pairs per square inch.

[0104] In some embodiments, the electrical connector may include multiple differential signal pairs. In various embodiments, the electrical connector may include multiple ground contact elements, each ground contact element being configured to receive a corresponding portion of the eggshell shield of the mating connector, wherein the electrical connector has no eggshell crosstalk shield, and its size and shape are such that each of the multiple electrical connectors is respectively adapted to one side of a wafer package substrate with a side length not greater than about 75-96 mm, including about 80 mm ± 5 mm and 91 mm ± 5 mm, the multiple electrical connectors collectively carrying at least 1024 differential signal pairs, the multiple electrical connectors transmitting about 224 gigabits per second of PAM-4 signal with a bandwidth of about 56 GHz to about 70 GHz, and far-end crosstalk not exceeding about -40 dB.

[0105] Furthermore, in some embodiments, the electrical connector further includes a first housing carrying differential signal pairs, and at least two or more of the plurality of ground contacts each defining at least two laterally offset cantilever beams, wherein each of the at least two laterally offset cantilever beams has its own free end. In various embodiments, the differential signal pairs are surface-mount mounted on a wafer package substrate. In some embodiments, the differential signal pairs may each include first and second stamped electrical conductors. In some embodiments, the electrical connector may further include conductive or non-conductive, magnetically dissipating, or electrically loss-inducing materials. In various embodiments, the plurality of differential signal pairs are electrically connected, physically connected, or both electrically and physically connected to corresponding connection tabs on the wafer package substrate.

[0106] In some embodiments, the electrical connector may include a mating interface having a housing and a plurality of plates defining a plurality of cavities within the housing. In various embodiments, the electrical connector may include at least one retainer for holding at least one of the plurality of plates between the housings or / or holding the plurality of plates together with the housing.

[0107] Furthermore, in some embodiments, at least one fastener secures multiple plates therebetween. In various embodiments, at least one fastener secures multiple plates to a housing. In some embodiments, at least one fastener secures multiple plates therebetween and also secures multiple plates to a housing. In different embodiments, at least one fastener may be an elongated member that engages with one or more slots. In some embodiments, at least one fastener may be conductive or non-conductive.

[0108] In some embodiments, the electrical connector may include an outer periphery. In various embodiments, the electrical connector may include a locking mechanism disposed on the outer periphery of the electrical connector.

[0109] Furthermore, in some embodiments, the electrical connector may include a mating interface and a plug connector, wherein a locking mechanism may be located on the outer periphery of at least one of the mating interface and / or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In various embodiments, the locking mechanism may include at least one releasably mated to at least one clip. In some embodiments, the electrical connector may include another locking mechanism located on its outer periphery.

[0110] In some embodiments, the electrical connector may include a plug connector having a housing. In various embodiments, the electrical connector may include at least one reinforcement member connected to the housing.

[0111] Furthermore, in some embodiments, at least one reinforcement may be attached to the side of the wafer packaging substrate. In various embodiments, the electrical connector may include at least two reinforcements spaced apart from each other in a horizontal plane. In some embodiments, at least one reinforcement may be conductive or non-conductive.

[0112] Several embodiments have been described and illustrated herein, but those skilled in the art will readily envision various other methods and / or structures to achieve the functions and / or results and / or one or more advantages described herein, and each such variation and / or modification is considered to be within the scope of the embodiments described herein. More generally, it will be readily understood by those skilled in the art that all parameters, dimensions, materials, and settings described herein are exemplary, and actual parameters, dimensions, materials, and / or settings will depend on one or more specific applications using the invention. Those skilled in the art will recognize, or can determine simply by conventional experimentation, that the specific embodiments described herein have many equivalents. Therefore, it should be understood that the foregoing embodiments are presented by way of example only, and embodiments may be practiced in ways other than those specifically described and claimed within the scope of the appended claims and their equivalents. The embodiments of this disclosure pertain to each individual feature, system, article of manufacture, material, and / or method described herein. Furthermore, any combination of two or more features, systems, articles of manufacture, materials, and / or methods that do not contradict each other is also included within the scope of this disclosure.

[0113] All definitions defined and used herein should be understood to take precedence over dictionary definitions, definitions incorporated by reference in the document, and / or the general meaning of the defined terms.

[0114] The indefinite articles “a” and “a” used in this specification and claims shall be understood as “at least one” unless there is an explicit indication to the contrary.

[0115] The phrase “and / or” as used herein in the specification and claims should be understood as “any one or both” of the elements so combined, that is, elements present in some cases but not in others. Multiple elements listed with “and / or” should be understood in the same way, that is, elements “one or more” joined together. In addition to the elements specifically indicated by the “and / or” clause, other elements may be optionally present, whether related to or unrelated to the specifically indicated elements. Thus, as a non-limiting example, when “A and / or B” is used with open-ended language such as “comprising,” in one embodiment, it may refer only to A (optionally including elements other than B); in another embodiment, it may refer only to B (optionally including elements other than A); in yet another embodiment, it may refer to both A and B (optionally including other elements); and so on.

[0116] The word “or” as used in the specification and claims shall be understood to have the same meaning as “and / or” as defined above. For example, when separating items in a list, “or” or “and / or” shall be interpreted as inclusive, meaning it includes at least one, but also includes more than one list of quantities or elements, as well as optional additional unlisted items. Only terms that explicitly indicate the opposite, such as “only one” or “exactly one,” or “composed of” as used in the claims, refer to containing only one element from the list of quantities or elements. Generally, the term “or” as used herein is interpreted as indicating an alternative alternative (i.e., “either one or the other”) only when preceded by alternative terms such as “any,” “one of,” “only one,” or “exactly one”. The phrase “composed primarily of” as used in the claims shall have the ordinary meaning used in the field of patent law.

[0117] As used herein in the specification and claims, the phrase "at least one" when referring to one or more lists of elements should be understood to mean that at least one element is selected from any one or more elements in the list of elements, but does not necessarily include at least one of every element specifically listed in the list of elements, nor any combination of elements other than those in the list of elements. This definition also allows for the selective presence of other elements in the list of elements referred to by the phrase "at least one," in addition to the specifically specified elements, whether or not these elements are related to the specifically specified elements. Thus, as a non-limiting example, "at least one of A and B" (or equivalent to "at least one of A or B," or equivalent to "at least one of A and / or B") in one embodiment may refer to at least one, optionally including more than one A, without B (optionally including elements other than B); in another embodiment, it may refer to at least one optionally including more than one B, without A (optionally including elements other than A); in yet another embodiment, it may refer to at least one optionally including more than one A, and at least one optionally including more than one B (optionally including other elements), and so on.

[0118] It should also be understood that, unless the contrary is explicitly stated, in any method in which the claims herein include more than one step or action, the order of the steps or actions of the method is not necessarily limited to the order in which the steps or actions of the method are stated.

[0119] In the claims and the foregoing description, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “consisting of,” etc., shall be understood as open-ended, i.e., including but not limited to. Only the transitional phrases “consisting of” and “mainly composed of” shall be closed or semi-closed transitional phrases, respectively, as specified in Section 2111.03 of the U.S. Patent and Trademark Office’s Manual of Patent Examination Procedure.

[0120] It should be understood that the application of the embodiments of the present invention is not limited to the structural details and component arrangements described in the description or shown in the drawings. The present invention may also have other embodiments and may be implemented or performed in various ways. Unless otherwise limited, the terms “connection,” “coupled,” “communicating with,” and “installed,” and variations thereof, are broad terms to include direct and indirect connections, couplings, and installations. Furthermore, the terms “connection” and “coupled,” and variations thereof, are not limited to physical or mechanical connections or couplings.

[0121] The foregoing description of several embodiments of the present invention is for illustrative purposes. It is not intended to be exhaustive or to limit the invention to the precise steps and / or forms disclosed, and many modifications and variations will be apparent from the foregoing teachings.

Claims

1. A cable-to-cable connector system, characterized in that, It includes first and second cable connectors, wherein 1) each of the first and second cable connectors includes multiple differential signal pairs, 2) the mating interface of the differential signal pairs of each of the first and second cable connectors includes eggshell crosstalk shielding, 3) the mating interface of the differential signal pairs of the other cable connector of the first and second cable connectors does not have eggshell crosstalk shielding, and the other cable connector of the first and second cable connectors is a plug, and 4) each of the first and second cable connectors is configured to transmit a Pam4 signal at 224 GHz per second at 6 picoseconds and a rise time of 20% to 80%.

2. The cable-to-cable connector system according to claim 1, characterized in that, It also includes at least one far-end crosstalk and / or insertion loss.

3. The cable-to-cable connector system of claim 2, wherein the far-end crosstalk is less than or equal to -30 dB.

4. The cable-to-cable connector system according to any one of claims 2 to 3, wherein the far-end crosstalk is less than or equal to -35 dB.

5. The cable-to-cable connector system according to any one of claims 2 to 3, wherein the far-end crosstalk is less than or equal to -40 dB.

6. The cable-to-cable connector system according to any one of claims 2 to 3, wherein the far-end crosstalk is less than or equal to -45 dB.

7. The cable-to-cable connector system according to any one of claims 2 to 3, wherein the insertion loss is between 0 dB and -1 dB.

8. The cable-to-cable connector system according to any one of claims 2 to 3, wherein the insertion loss is between -1 dB and -2 dB.

9. The cable-to-cable connector system according to any one of claims 2 to 3, wherein the insertion loss is between -2dB and -3dB.

10. The cable-to-cable connector system according to any one of claims 2 to 3, wherein the insertion loss is between -3dB and -4dB.

11. The cable-to-cable connector system according to any one of claims 2 to 3, wherein the insertion loss is between -4dB and -5dB.

12. The cable-to-cable connector system according to any one of claims 2 to 3, characterized in that, It operates at 50GHz.

13. The cable-to-cable connector system according to any one of claims 2 to 3, characterized in that, It operates at 55GHz.

14. The cable-to-cable connector system according to any one of claims 2 to 3, characterized in that, It operates at 60GHz.

15. The cable-to-cable connector system according to any one of claims 2 to 3, characterized in that, It operates at 65GHz.

16. The cable-to-cable connector system according to any one of claims 2 to 3, characterized in that, It operates at 70GHz.

17. The cable-to-cable connector system according to any one of claims 2 to 3, characterized in that, It operates at 75GHz.

18. The cable-to-cable connector system according to any one of claims 2 to 3, characterized in that, It operates at 80GHz.

19. The cable-to-cable connector system according to claim 1, characterized in that, It also includes at least one near-end crosstalk and / or insertion loss.

20. The cable-to-cable connector system of claim 19, wherein the near-end crosstalk is less than or equal to -40 dB.

21. The cable-to-cable connector system according to any one of claims 19 to 20, wherein the near-end crosstalk is less than or equal to -45 dB.

22. The cable-to-cable connector system according to any one of claims 19 to 20, wherein the near-end crosstalk is less than or equal to -50 dB.

23. The cable-to-cable connector system according to any one of claims 19 to 20, wherein the near-end crosstalk is less than or equal to -55 dB.

24. The cable-to-cable connector system according to any one of claims 19 to 20, wherein the near-end crosstalk is less than or equal to -60 dB.

25. The cable-to-cable connector system according to any one of claims 19 to 20, wherein the insertion loss is between 0 dB and -1 dB.

26. The cable-to-cable connector system according to any one of claims 19 to 20, wherein the insertion loss is between -1 dB and -2 dB.

27. The cable-to-cable connector system according to any one of claims 19 to 20, wherein the insertion loss is between -2dB and -3dB.

28. The cable-to-cable connector system according to any one of claims 19 to 20, wherein the insertion loss is between -3dB and -4dB.

29. The cable-to-cable connector system according to any one of claims 19 to 20, wherein the insertion loss is between -4 dB and -5 dB.

30. The cable-to-cable connector system according to any one of claims 19 to 20, characterized in that, It operates at 50GHz.

31. The cable-to-cable connector system according to any one of claims 19 to 20, characterized in that, It operates at 55GHz.

32. The cable-to-cable connector system according to any one of claims 19 to 20, characterized in that, It operates at 60GHz.

33. The cable-to-cable connector system according to any one of claims 19 to 20, characterized in that, It operates at 65GHz.

34. The cable-to-cable connector system according to any one of claims 19 to 20, characterized in that, It operates at 70GHz.

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