Thermoplastic packaging adhesive film for perovskite lamination and photovoltaic module

Abstract

The utility model belongs to the technical field of packaging adhesive films for photovoltaic modules, and particularly relates to a thermoplastic packaging adhesive film for perovskite lamination and a photovoltaic module, which comprise a thermoplastic adhesive film layer positioned on the upper layer and a cross-linking layer positioned on the lower layer, the crosslinking layer is any one of a pre-crosslinking adhesive film, a thermocuring adhesive film and a photocuring adhesive film; the crosslinking degree of the crosslinking layer is 35 to 90 percent; according to the thermoplastic packaging adhesive film for perovskite lamination, the cross-linking layer with the cross-linking degree is selected to be combined with the thermoplastic adhesive film layer to form an upper layer and a lower layer in a photovoltaic module, so that the optical performance reduction caused by adding high-melting-point resin into the thermoplastic adhesive film layer is avoided, the lamination temperature is also reduced, and the perovskite material is protected; meanwhile, the crosslinking layer with the pre-crosslinking degree can well inhibit free radical dissociation, the creep resistance is more excellent, and a good protection effect is achieved on the perovskite battery in the lamination process under blocking of the thermoplastic adhesive film layer.

Description

Technical Field

[0001] This utility model belongs to the technical field of encapsulating films for photovoltaic modules, specifically a thermoplastic encapsulating film for perovskite stacks and a photovoltaic module. Background Technology

[0002] Perovskite solar cells are solar cells that use perovskite-type organometal halide semiconductors as light-absorbing materials. They belong to the third generation of solar cells and are also known as new concept solar cells.

[0003] Currently, thermoplastic encapsulating films are commonly used to encapsulate perovskite components to avoid or reduce damage to the perovskite during the encapsulation process. However, because thermoplastic films have poor heat resistance, high-melting-point resins are usually added, which leads to a decrease in the performance of the encapsulating film in terms of haze and light transmittance.

[0004] Therefore, overcoming the shortcomings of thermoplastic encapsulation films for perovskites in achieving both heat resistance and optical performance is a technical problem that urgently needs to be solved in this field.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0006] This disclosure provides at least one thermoplastic encapsulating film for perovskite stacks and a photovoltaic module.

[0007] In a first aspect, embodiments of this disclosure provide a thermoplastic encapsulating film for perovskite laminates, comprising: an upper thermoplastic film layer and a lower crosslinked layer; the crosslinked layer is any one of a pre-crosslinked film, a thermosetting film, and a photocurable film; and the degree of crosslinking of the crosslinked layer is 35-90%.

[0008] In one optional embodiment, the thermoplastic film layer is made of any one of polyethylene, polyvinyl chloride, and polycarbonate.

[0009] In one alternative embodiment, the thickness of the thermoplastic film layer is 50-400 μm.

[0010] In one optional embodiment, the crosslinking layer is made of any one of ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, and ethylene-acrylate ionomer.

[0011] In one alternative embodiment, the thickness of the crosslinked layer is 50-400 μm.

[0012] In one optional embodiment, a barrier layer is further provided between the thermoplastic film layer and the crosslinking layer.

[0013] In one optional embodiment, the barrier layer is made of any one of ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, ethylene-acrylate ionomer, ethylene-acrylate ionomer, polyolefin, polyester, polyamide, acrylate, and polyurethane.

[0014] In one alternative embodiment, the thickness of the barrier layer is 50-300 μm.

[0015] Secondly, embodiments of this disclosure also provide a photovoltaic module, including: a thermoplastic encapsulating film as described above, and a perovskite tandem solar cell in contact with the thermoplastic encapsulating film layer of the thermoplastic encapsulating film.

[0016] The beneficial effects of this invention are that the thermoplastic encapsulating film for perovskite stacks and photovoltaic modules are combined with a cross-linked layer with a high degree of cross-linking to form upper and lower layers. This avoids the decrease in optical performance caused by adding high-melting-point resin to the thermoplastic film layer, and also reduces the lamination temperature to protect the perovskite material. At the same time, the cross-linked layer with a high degree of cross-linking can better suppress the release of free radicals and has better creep resistance. Under the barrier of the thermoplastic film layer, the perovskite cell plays a good protective role during the lamination process.

[0017] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description, claims, and drawings.

[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of a thermoplastic encapsulating film for perovskite stacks provided in an embodiment of this disclosure;

[0021] Figure 2This is a schematic diagram of the structure of a thermoplastic encapsulating film for perovskite stacks provided in an embodiment of this disclosure.

[0022] In the picture:

[0023] 1. Thermoplastic film layer; 2. Crosslinking layer; 3. Barrier layer. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0026] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0027] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0030] Please see Figure 1 ,like Figure 1 As shown, this disclosure provides a thermoplastic encapsulating film for perovskite laminates, comprising: an upper thermoplastic film layer and a lower crosslinked layer; the crosslinked layer is any one of a pre-crosslinked film, a thermosetting film, and a photocurable film; and the degree of crosslinking of the crosslinked layer is 35-90%.

[0031] In some embodiments, specifically, the thermoplastic film layer is made of any one of polyethylene, polyvinyl chloride, and polycarbonate.

[0032] In some embodiments, specifically, the thickness of the thermoplastic film layer is 50-400 μm.

[0033] In some embodiments, specifically, the crosslinking layer is made of any one of ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, and ethylene-acrylate ionomer.

[0034] In some embodiments, specifically, the thickness of the crosslinked layer is 50-400 μm.

[0035] Please see Figure 2 ,like Figure 2 As shown, in some embodiments, specifically, a barrier layer is further provided between the thermoplastic film layer and the crosslinking layer. The barrier layer can further block the absorption of free radicals generated by the lower thermosetting film and photocuring film.

[0036] Specifically, preferably, when no barrier layer is provided, the degree of crosslinking of the crosslinking layer is 50-90%, which can significantly reduce the problem of free radical release. When a barrier layer is provided, the degree of crosslinking of the crosslinking layer is 35-55%, which can achieve the barrier effect.

[0037] In some embodiments, specifically, the barrier layer is made of any one of ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, ethylene-acrylate ionomer, polyolefin, polyester, polyamide, acrylate, and polyurethane.

[0038] In some embodiments, specifically, the thickness of the barrier layer is 50-300 μm. When a barrier layer is provided, the maximum thickness of both the thermoplastic film layer and the crosslinking layer is not higher than 300 μm to avoid the overall thickness of the encapsulation film being too large.

[0039] Secondly, embodiments of this disclosure also provide a photovoltaic module, including: a thermoplastic encapsulating film as described above, and a perovskite tandem solar cell in contact with the thermoplastic encapsulating film layer of the thermoplastic encapsulating film.

[0040] Example

[0041] Please refer to Table 1, which shows the structural and performance data of each embodiment in this application.

[0042]

[0043] Specifically, in Examples 1 and 3, the crosslinking layer was prepared using benzoyl peroxide (BPO) as a thermal initiator to obtain a thermosetting adhesive film.

[0044] Specifically, in Example 2, the crosslinking layer was prepared using benzoin dimethyl ether (BDK) as a photoinitiator to obtain a photocurable film.

[0045] In summary, this perovskite laminated thermoplastic encapsulating film and photovoltaic module, by selecting a cross-linked layer with a high degree of cross-linking and a thermoplastic film layer to form the upper and lower layers, avoids the optical performance degradation caused by adding high-melting-point resin to the thermoplastic film layer, and also reduces the lamination temperature to protect the perovskite material. At the same time, the cross-linked layer with a high degree of cross-linking can better suppress the release of free radicals and has better creep resistance. Under the barrier of the thermoplastic film layer, the perovskite cell has a good protective effect during the lamination process.

[0046] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A thermoplastic encapsulation film for perovskite stacks, characterized by, Comprising: a thermoplastic film layer on the upper layer and a crosslinked layer on the lower layer; the crosslinked layer is any one of a pre-crosslinked film, a thermally cured film and a light cured film; and the crosslinking degree of the crosslinked layer is 35-90%.

2. The thermoplastic packaging film for perovskite stacked layer according to claim 1, wherein the material of the thermoplastic film layer is any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, polyethylene, polyvinyl chloride, and polycarbonate.

3. The thermoplastic packaging film for perovskite stacked layer according to claim 1, wherein the thickness of the thermoplastic film layer is 50-400 μm.

4. The thermoplastic packaging film for perovskite stacked layer according to claim 1, wherein the material of the crosslinked layer includes any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, and ethylene-acrylic acid salt ionomer.

5. The thermoplastic packaging film for perovskite stacked layer according to claim 1, wherein the thickness of the crosslinked layer is 50-400 μm.

6. The thermoplastic packaging film for perovskite stacked layer according to claim 1, wherein a barrier layer is further provided between the thermoplastic film layer and the crosslinked layer.

7. The thermoplastic packaging film for perovskite stacked layer according to claim 6, wherein the material of the barrier layer includes any one of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene acrylic acid copolymer, ethylene acrylic ester copolymer, ethylene-acrylic acid salt ionomer, polyolefin, polyester, polyamide, acrylic ester, and polyurethane.

8. The thermoplastic packaging film for perovskite stacked layer according to claim 6, wherein the thickness of the barrier layer is 50-300 μm.

9. A photovoltaic module, characterized by Comprising: the thermoplastic packaging film according to any one of claims 1-8, and a perovskite stacked layer battery piece in contact with the thermoplastic film layer of the thermoplastic packaging film.

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