A high-strength, large-deformation shape memory epoxy resin system and its preparation technology

By modifying epoxy resin with SiO2-CE@PPO particles, the problems of insufficient mechanical properties and process stability of traditional thermoplastic component-modified thermosetting epoxy resins have been solved, realizing an epoxy resin system with high strength, large deformation and complex shape memory.

CN121319374BActive Publication Date: 2026-03-10SUZHOU UNIV
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Patent Information

Application Number
CN202511909236.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-12-17
Publication Date
2026-03-10
Estimated Expiration
2045-12-17

AI Technical Summary

Technical Problem

Traditional thermoplastic components modified thermosetting epoxy resins suffer from insufficient mechanical strength and toughness, poor heat resistance and processability stability, and are difficult to achieve large deformation and complex shape memory behavior.

Method used

A high-strength, high-deformation shape memory epoxy resin system was prepared by modifying hydroxyl-terminated polyphenylene oxide (PPO) particles (SiO2-CE@PPO) with fumed SiO2 and cyanate ester CE resin through heating reaction, mixing with catalyst, acid anhydride and other components for prepolymerization reaction.

Benefits of technology

It significantly improves the toughness, strength, heat resistance and processability of epoxy resin, realizes large deformation and complex shape memory behavior, and has excellent mechanical and thermal properties.

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Abstract

This invention discloses a high-strength, large-deformation shape memory epoxy resin system and its preparation technology. Addressing the problems of poor strength, processability, and dispersibility inherent in traditional thermoplastic-modified epoxy resin systems, this invention prepares SiO2 / CE-modified PPO (SiO2 / CE@PPO) particles using hydroxyl-terminated polyphenylene ether (PPO), cyanate ester resin (CE), and fumed silica (SiO2). Compared to pure epoxy resin systems and traditional thermoplastic-modified epoxy resin systems, the SiO2 / CE@PPO particle-modified epoxy material system prepared in this invention not only significantly improves mechanical strength, impact strength, and glass transition temperature, but also exhibits a more uniform phase structure and stable processability. Furthermore, the product of this invention possesses excellent complex large-deformation and shape memory behavior, making this epoxy resin system applicable to aerospace, electronics, and automotive fields.
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