Light-emitting element packaging structure and light-emitting module

Abstract

The utility model discloses a light-emitting element packaging structure and a light-emitting module. The light-emitting element packaging structure comprises a base, a light-emitting element, a wall body and an optical element, the base is provided with a surface, and the light-emitting element is arranged on the base and provided with a light-emitting surface. The wall body is arranged on the base and defines a containing space together with the surface, and the light-emitting element is located in the containing space. The reflecting layer is located in the accommodating space, covers the surface of the base, surrounds the light-emitting element and exposes the light-emitting surface. The optical element covers the base, the wall body and the light-emitting element, and the optical element is provided with a top surface and a bottom surface which are opposite to each other, and a side surface connecting the top surface and the bottom surface. The top surface is a plane, the vertical projection area of the top surface on the surface is smaller than the vertical projection area of the bottom surface on the surface, and an included angle is formed between the tangent line of the side surface and the normal line of the bottom surface or the top surface. Therefore, according to the light-emitting module provided by the invention, the dark bands of every two adjacent light-emitting elements can be solved without increasing the number of the light-emitting element packaging structures.

Description

Technical Field

[0001] This application relates to a packaging structure, and more particularly to a light-emitting element packaging structure and a light-emitting module. Background Technology

[0002] With rising global awareness of environmental protection, energy-saving electronic products have become a trend. Taking the lighting industry as an example, light-emitting diodes (LEDs) have gradually gained a foothold in the market due to their advantages such as energy saving, power saving, long lifespan, and mercury-free properties.

[0003] However, the luminous intensity of LEDs is spatially distributed in a Lambertian radiation pattern with a beam angle of approximately 120 degrees. In other words, when the luminous angle exceeds 120 degrees, the intensity of the light weakens, resulting in dark bands between the luminous areas of adjacent LEDs in existing light-emitting modules.

[0004] To overcome the above problems, a typical light-emitting module must increase the number of light-emitting diodes to shorten the spacing between adjacent light-emitting diodes. However, this approach increases the cost and power consumption of the light-emitting module. Utility Model Content

[0005] The technical problem to be solved by this application is to provide a light-emitting element packaging structure that addresses the shortcomings of the prior art, thereby increasing the overall light intensity and having a light emission angle of more than 120 degrees.

[0006] The technical problem to be solved by this application is to provide a light-emitting element packaging structure to address the shortcomings of the prior art and solve the problems of increased cost and power consumption of light-emitting modules in the prior art.

[0007] To address the aforementioned technical problems, one technical solution adopted in this application is to provide a light-emitting element packaging structure, including: a base, a light-emitting element, a wall, and an optical element. The base has a surface, and the light-emitting element is disposed on the base and has a light-emitting surface. The wall is disposed on the base and, together with the surface, defines an accommodating space, in which the light-emitting element is located. A reflective layer is located in the accommodating space and covers the surface, surrounding the light-emitting element and exposing the light-emitting surface. The optical element covers the base, the wall, and the light-emitting element, and has a top surface and a bottom surface opposite to each other, as well as a side surface connecting the top and bottom surfaces. The top surface is planar, and the vertical projection area of ​​the top surface on the surface is smaller than the vertical projection area of ​​the bottom surface on the surface, and the tangent of the side surface forms an angle with the normal of the bottom or top surface.

[0008] Furthermore, the wall and the base are made of the same material and are integrally formed. The wall has a first surface facing the accommodating space and a second surface opposite to the first surface. The second surface and one side surface of the base are on the same vertical plane.

[0009] Furthermore, the wall surrounds the light-emitting element and is located between the optical element and the light-emitting element, and the wall is a polygonal ring structure composed of a continuous or discontinuous dam.

[0010] Furthermore, the light-emitting element packaging structure also includes a reflective layer located in the accommodating space and covering the surface, surrounding the light-emitting element and exposing the light-emitting surface.

[0011] Furthermore, the light-emitting element packaging structure also includes a light-transmitting layer located between the optical element and the light-emitting element, and at least covering the light-emitting surface.

[0012] Furthermore, the light-transmitting layer is made of the same material as the optical element and fills the accommodating space.

[0013] Furthermore, the light-transmitting layer is a wavelength conversion layer located between the light-emitting element and the optical element. The wavelength conversion layer at least covers the light-emitting surface, and in the direction perpendicular to the light-emitting surface, the ratio of the height of the wavelength conversion layer to the height of the reflective layer is in the range of 0.8 to 1.5.

[0014] Furthermore, the wavelength conversion layer extends to cover the reflective layer.

[0015] Furthermore, in the direction perpendicular to the light-emitting surface, the ratio of the height of the wall to the height of the light-emitting element is in the range of 0.2 to 2.

[0016] Furthermore, the optical element has a first lens structure in which the side surface includes four sub-side surfaces, each of which is a plane inclined relative to the bottom surface and the top surface.

[0017] Furthermore, the optical element has a second lens structure in which the side surface includes four side curved surfaces connected between the top surface and the bottom surface.

[0018] Furthermore, the optical element has a second lens structure in which the side surface includes four side curved surfaces, four side planes, and four side vertical surfaces connected between the top surface and the bottom surface. One end of each of the four side curved surfaces is connected to the top surface, each of the side planes is connected between one of the side curved surfaces and one of the side vertical surfaces, and one end of each of the four side vertical surfaces is connected to the bottom surface. Each side curved surface is curved from the top surface of the optical element toward the edge of the side plane, and each of the side planes is parallel to the bottom surface and perpendicular to the corresponding side vertical surface.

[0019] Furthermore, the ratio of the height of the first lens structure in the direction perpendicular to the light-emitting surface to the length of the bottom surface parallel to the surface is in the range of 0.25 to 0.4.

[0020] Furthermore, the ratio of the height of the second lens structure in the direction perpendicular to the light-emitting surface to the length of the bottom surface parallel to the surface is in the range of 0.25 to 0.4.

[0021] Furthermore, each of the sub-side surfaces is inclined relative to the bottom surface at a predetermined slope, the slope being in the range of 1 to 16.

[0022] Furthermore, the distance between the bottom surface and the top surface is a first height, the distance between the bottom surface and the side plane is a second height, and the ratio of the first height to the second height is in the range of 0.02 to 0.08.

[0023] Furthermore, in the direction perpendicular to the light-emitting surface, the ratio of the height of the wall to the height of the light-emitting element is in the range of 0.2 to 2.

[0024] Furthermore, the length of the bottom surface parallel to the surface is less than the length of the bottom surface parallel to the surface.

[0025] Furthermore, the ratio of the length of the top surface parallel to the surface to the length of the bottom surface parallel to the surface is in the range of 0.5 to 0.95.

[0026] Furthermore, the included angle is less than 90 degrees.

[0027] To address the aforementioned technical problems, one technical solution adopted in this application is to provide a light-emitting module, which includes: a plurality of light-emitting element packaging structures as described above and a circuit board. The plurality of light-emitting element packaging structures are arranged on the circuit board in a predetermined manner, and adjacent light-emitting element packaging structures have a spacing.

[0028] Furthermore, the preset arrangement is that the multiple light-emitting element packaging structures are arranged in an array, a column, or a row.

[0029] Furthermore, the spacing is greater than 8 cm and less than 12 cm.

[0030] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description

[0031] Figure 1 This is a three-dimensional perspective view of the light-emitting element packaging structure of this utility model.

[0032] Figure 2 This is a cross-sectional schematic diagram of the light-emitting element packaging structure according to the first embodiment of this utility model.

[0033] Figure 3 This is a cross-sectional schematic diagram of the light-emitting element packaging structure according to the second embodiment of this utility model.

[0034] Figure 4 This is a cross-sectional schematic diagram of the light-emitting element packaging structure according to the third embodiment of this utility model.

[0035] Figure 5 This is a cross-sectional schematic diagram of the light-emitting element packaging structure according to the fourth embodiment of this utility model.

[0036] Figure 6 This is a cross-sectional schematic diagram of the light-emitting element packaging structure according to the fifth embodiment of this utility model.

[0037] Figure 7 This is a luminescence intensity distribution diagram of the fifth embodiment of this utility model and the control group.

[0038] Figure 8 This is a cross-sectional schematic diagram of another embodiment of the present utility model.

[0039] Figure 9 This is a cross-sectional schematic diagram of the light-emitting element packaging structure according to the sixth embodiment of this utility model.

[0040] Figure 10 This is a cross-sectional schematic diagram of another embodiment of the sixth embodiment of the present utility model. Detailed Implementation

[0041] The following specific examples illustrate the embodiments of the "light-emitting element packaging structure" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0042] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0043] First Embodiment

[0044] Figure 1 This is a three-dimensional perspective view of the light-emitting element packaging structure of this utility model. Figure 2 This is a cross-sectional schematic diagram of the light-emitting element packaging structure according to the first embodiment of the present invention. This application provides a light-emitting element packaging structure (LEP) including a base 1, a light-emitting element 2, a wall 3, an optical element 4, and a reflective layer 5.

[0045] like Figure 2 As shown in the cross-sectional view from a side perspective, the base 1 is a plate-like structure, such as a printed circuit board (PCB), a ceramic carrier, or others, but not limited thereto. The base 1 has a first side surface S. A wall 3 is disposed on surface S and along the edge of the base 1. The wall 3 has a height DH1 along the normal direction of surface S, and together with surface S of the base 1, defines an accommodating space SP. In this embodiment, the wall 3 and the base 1 are integrally formed from the same material, and the wall 3 has a first surface S31 facing the accommodating space SP and a second surface S32 opposite to the first surface S31. In this embodiment, the tangent of the first surface S31 (e.g., the inner wall surface) forms an angle θ1 greater than or equal to 90 degrees with surface S of the base 1, and the second surface S32 (e.g., the outer wall surface) is on the same vertical plane as the side surface S10 of the base 1, that is, the second surface S32 is flush with the side surface S10 of the base 1.

[0046] Viewed from above, the accommodating space SP defined by the base 1 and the wall 3 has an upward-opening bowl-shaped structure. In the first embodiment, the wall 3 and the base 1 can be formed in one step by injecting an insulating inorganic material into a mold. The insulating inorganic material can be, for example, epoxy molding composite (EMC), but is not limited thereto. In other embodiments, the wall 3 and the base 1 can also be a two-piece structure composed of different materials (further explanation in subsequent embodiments).

[0047] The light-emitting element 2 is located in the accommodating space SP and disposed on the surface S of the base 1. The light-emitting element 2 can be, for example, a light-emitting diode (LED) or a laser diode (LD). Furthermore, the light-emitting element 2 can be fixed to the base 1 by wire bonding or flip-chip bonding. The light-emitting element 2 can be a point light source or a surface light source, and it has a light-emitting surface ES from which light is emitted. The light-emitting surface ES is parallel to the tangent direction of the surface S. In this embodiment, the light-emitting element 2 is located at the geometric center of the accommodating space SP, so that its emitted light is evenly dispersed throughout the accommodating space SP, but this invention is not limited to this. In addition, the number of light-emitting elements 2 is not limited to a single element; there can also be multiple light-emitting elements 2, which can be composed of light-emitting diodes emitting different colors.

[0048] like Figure 2 As shown, the reflective layer 5 is disposed in the accommodating space SP, covering the surface S of the base 1, surrounding the light-emitting element 2, and exposing the light-emitting surface ES. The material of the reflective layer 5 can be white silicone resin or a highly reflective colloid, and it is disposed around the light-emitting element 2. The reflective layer 5 can provide the light-emitting element 2 with a complete reflection path and sufficient reflection intensity, further improving the brightness of the light-emitting element 2.

[0049] Optical element 4 is mounted on base 1 and wall 3, sealing the opening of accommodating space SP and covering light-emitting element 2 and reflective layer 5. Viewed from top and side angles, optical element 4 appears as a multifaceted cube with a top surface TS and a side surface S40 connecting to the top surface TS. The top surface TS is a generally flat surface located at the top of optical element 4. Furthermore, the side surface S40 slopes outward from the end connecting to the top surface TS towards base 1. The outer edge of the other end of side surface S40 (away from the top surface TS) does not extend beyond the side surface S10 of base 1, or may be approximately flush with the side surface S10 of base 1.

[0050] Furthermore, in this embodiment, viewed from top and side angles, the optical element 4 appears as a cube resembling a frustum, having a top surface TS and a bottom surface BS facing each other, and a side surface S40 connecting the top surface TS and the bottom surface BS. The top surface TS is a generally flat surface located at the top of the optical element 4, and is approximately parallel to surface S. The bottom surface BS is located at the bottom of the optical element 4. Because the vertical projection area of ​​the top surface TS is smaller than the vertical projection area of ​​the bottom surface BS, the overall structure is narrower at the top and wider at the bottom. Therefore, the tangent of the side surface S40 forms an angle θ2 less than 90 degrees with the normal of the bottom surface BS or the top surface TS. For example, θ2 can be greater than or equal to 45 degrees and less than 90 degrees. The side surface S40 is located around the optical element 4, and can be a plane (as in the first embodiment) or a curved surface (further explanation in subsequent embodiments). The optical element 4 can be composed of any light-transmitting material, such as glass, silicone, polymethyl methacrylate, or polycarbonate, but this invention is not limited to these.

[0051] In the first embodiment, the optical element 4 has a first lens structure 41, whose side surface S40 includes four sub-side surfaces S41, each of which is a plane inclined relative to the bottom surface BS and the top surface TS. Viewed from a top angle, the top surface TS and the bottom surface BS are rectangular, such as prisms. In this embodiment, the first lens structure 41 is in the shape of a truncated pyramid, but the top surface TS and the bottom surface BS of this invention can also be other polygons, and their shapes are not limited to this. Viewed from a side angle in cross-section, the cross-section of the truncated pyramid along the normal direction of surface S is a trapezoidal structure, and the sides of the trapezoid are the sub-side surfaces S41, which are inclined relative to the bottom surface BS at a predetermined slope. Each sub-side surface S41 has a top edge connected to the top surface TS and a bottom edge connected to the bottom surface BS, and the length L1W1 of the top edge is less than the length L1W2 of the bottom edge.

[0052] In addition, a light-transmitting layer 6 is provided between the optical element 4 and the light-emitting element 2. The light-transmitting layer 6 covers the light-emitting surface ES and the upper surface of the reflective layer 5, and fills the accommodating space SP. In this embodiment, the light-transmitting layer 6 is composed of a light-transmitting material, and can be made of the same material as the optical element 4 to avoid the reduction of light intensity due to refraction caused by light passing through different media. In this embodiment, the light-transmitting layer 6 and the optical element 4 can be integrated. However, it should be noted that the light-transmitting layer 6 can also be made of a different material than the optical element 4. For example, in other embodiments, the light-transmitting layer 6 can be a light adjustment layer, such as a wavelength conversion layer (further explanation in subsequent embodiments). This invention is not limited to this.

[0053] Furthermore, in this embodiment, the ratio (L1W1 / L1W2) of the length of the top edge L1W1 to the length of the bottom edge L1W2 of each sub-side surface S41 is in the range of 0.5 to 0.95; or the ratio (L1H / L1W2) of the height L1H of the optical element 4 in the direction perpendicular to the light-emitting surface ES to the length of the bottom edge L1W2 is in the range of 0.25 to 0.4; or the slope of the sub-side surface S41 is in the range of 1 to 16; or the ratio (DH1 / h1) of the height DH1 of the wall 3 to the height h1 of the light-emitting element 2 in the direction perpendicular to the light-emitting surface ES is in the range of 0.2 to 2.

[0054] Based on the aforementioned structure, the light emitted by the light-emitting element 2 is emitted towards and penetrates the optical element 4 through the light-transmitting layer 6. The light can be emitted outward from the top surface TS and the side surface S40, that is, the light is emitted outward from the top surface TS and the four sub-side surfaces S41 (forming five-sided light emission). Therefore, the light-emitting element packaging structure LEP of this embodiment has a light emission angle of more than 120 degrees (e.g., 165 to 170 degrees) and high uniformity of light emission.

[0055] Furthermore, through this structure, the light emitted by the light-emitting element 2 of the light-emitting element packaging structure LEP in this embodiment can achieve effective light extraction through the reflective layer 5 / wall 3, further improving the brightness of the light-emitting element 2.

[0056] Second Embodiment

[0057] Figure 3 This is a cross-sectional schematic diagram of the second embodiment of the present invention. In the second embodiment, the light-emitting element encapsulation structure (LEP) includes a base 1, a light-emitting element 2, a wall 3, an optical element 4, and a reflective layer 5. The base 1, light-emitting element 2, wall 3, optical element 4, and reflective layer 5 are based on the architecture of the first embodiment; therefore, the same elements and features as in the first embodiment will not be described again here.

[0058] The difference between the second embodiment of this utility model and the first embodiment lies in that the light-transmitting layer between the optical element 4 and the light-emitting element 2 is a light adjustment layer 7. In this embodiment, the light adjustment layer 7 is, for example, a wavelength conversion layer, which fills the accommodating space SP. The wavelength conversion layer 7 is made of a light-transmitting material including fluorescent materials (such as silicone resin). The fluorescent materials include materials based on sulfides, aluminates, oxides, silicates, nitrides, yttrium aluminum garnet (YAG), and terbium aluminum garnet, which allows the light emitted by the light-emitting element 2 to be converted into different colors through the wavelength conversion layer 7. For example, when the light-emitting element 2 is composed of red, green, and blue light-emitting diodes (RGB LEDs), because the wavelengths of red and green light are greater than those of blue light, the luminous intensity of red and green light will be greater than that of blue light when the light emission path is long. This will cause the color of the light from the side of the optical element 4 to be inconsistent and uneven with the color of the light from the top of the optical element 4. Therefore, this invention increases the amount of light emitted in a predetermined color and reduces the color difference of light by adjusting the type of fluorescent material in the wavelength conversion layer 7 and the height of the wavelength conversion layer 7. Furthermore, in the direction perpendicular to the light-emitting surface ES, the ratio (WH1 / RH1) of the maximum height WH1 of the wavelength conversion layer 7 to the minimum height RH1 of the reflective layer 5 is in the range of 0.8 to 1.5, exhibiting superior optical characteristics. These optical characteristics are measured by light uniformity or color over angle (COA) values. COA values ​​are obtained by measuring the intensity of each color at two locations: a zero emission angle and an ±45-degree emission angle. The smaller the COA value, the more consistent the color intensity measured at different angles. Based on the aforementioned structure, the minimum COA value in this embodiment can be controlled within ±0.002, indicating that the color intensity measured at different angles by the LEP (Light Emitting Element) packaging structure of this embodiment is highly consistent. Furthermore, with this structure, the light emitted by the light-emitting element 2 of the LEP (Light Emitting Element Packaging Structure) in this embodiment can achieve effective light extraction through the reflective layer 5 / wall 3, further improving the brightness of the light-emitting element 2. In addition, the LEP in this embodiment has a light emission angle of over 120 degrees and high uniformity of light emission.

[0059] Third Embodiment

[0060] Figure 4This is a cross-sectional schematic diagram of the third embodiment of the present invention. In the third embodiment, the light-emitting element encapsulation structure (LEP) includes a base 1, a light-emitting element 2, a wall 3, an optical element 4, a reflective layer 5, and a wavelength conversion layer 7. The base 1, light-emitting element 2, wall 3, reflective layer 5, and wavelength conversion layer 7 are based on the architecture of the second embodiment; therefore, the same components and features as in the second embodiment will not be described again here.

[0061] The difference between the light-emitting element packaging structure of the third embodiment of this utility model and the second embodiment lies in the structural shape of the optical element 4. Viewed from above, the optical element 4 has a second lens structure 42, and has a top surface TS and a bottom surface BS facing each other, as well as a side surface S40 connecting the top surface TS and the bottom surface BS. The top surface TS is a generally flat surface located at the top of the optical element 4, and the bottom surface BS is located at the bottom of the optical element 4. Both the top surface TS and the bottom surface BS are parallel to the surface S. The top surface TS and the bottom surface BS can be polygonal, and their shapes are not limited to this. In this embodiment, the top surface TS and the bottom surface BS are rectangular planes, such as rectangular planes. The side surface S40 includes multiple curved side surfaces S42 connecting the top surface TS and the bottom surface BS. Because the vertical projected area of ​​the top surface TS is smaller than the vertical projected area of ​​the bottom surface BS, the overall structure presents a shape that is narrower at the top and wider at the bottom.

[0062] Viewed from a side perspective, in this embodiment, the second lens structure 42 has four side curved surfaces S42, four side planes S44, and four side vertical surfaces S46. One end of each of the four side curved surfaces S42 is connected to the top surface TS. Each side plane S44 connects to the other end of a side curved surface S42 and a side vertical surface S46. One end of each of the four side vertical surfaces S46 is connected to the bottom surface BS and is approximately perpendicular to each other. Each side curved surface S42 curves from the top surface TS of the optical element 4 towards the edge of the side plane S44. Each side plane S44 is parallel to the bottom surface BS and perpendicular to the corresponding side vertical surface S46. Each side curved surface S42 has a top edge connected to the top surface TS, and the corresponding side vertical surface S46 has a bottom edge connected to the bottom surface BS. The length L2W1 of the top edge is less than the length L2W2 of the bottom edge. In addition, the second lens structure 42 is a stepped frustum structure composed of an upper section and a lower section. The optical element 4 has a height of the first height L2H1 in the direction perpendicular to the light-emitting surface ES (that is, the distance between the bottom surface and the top surface, which is the sum of the heights of the upper and lower sections), and the distance between the side plane S44 and the bottom surface BS is the second height L2H2.

[0063] Furthermore, in this embodiment, the ratio of the length of the top edge L2W1 to the length of the bottom edge L2W2 (L2W1 / L2W2) is in the range of 0.5 to 0.95; or the ratio of the first height L2H1 to the length of the bottom edge L2W2 (L2H1 / L2W2) is in the range of 0.25 to 0.4; or the ratio of the second height L2H2 to the first height L2H1 is in the range of 0.02 to 0.08. Based on the aforementioned structure, the light-emitting element packaging structure LEP of this embodiment has better optical characteristics. The optical characteristics refer to the light emitted by the light-emitting element 2 being emitted by the second lens structure 42 to the outside with a light emission angle of more than 120 degrees (e.g., 155 to 160 degrees) and high uniformity.

[0064] Fourth embodiment

[0065] Figure 5 This is a cross-sectional schematic diagram of the light-emitting element packaging structure according to the fourth embodiment of the present invention (e.g., along...). Figure 1 (The section is taken from line II-II). The light-emitting element packaging structure of the fourth embodiment is similar to that of the first embodiment, and the similarities will not be repeated. Compared with the first embodiment, the difference of the light-emitting element packaging structure of the fourth embodiment of this utility model lies in the structure and positional connection relationship of the wall and the optical element.

[0066] Please see Figure 5 In the fourth embodiment, the light-emitting element encapsulation structure (LEP) includes a base 1, a light-emitting element 2, a wall 3', an optical element 4, and a reflective layer 5. Viewed from above, the base 1 appears as a flat plate structure of a certain thickness, and has a surface S. The light-emitting element 2 and the wall 3' are disposed on the surface S. Unlike the first embodiment, in the fourth embodiment, the wall 3' and the base 1 can be a two-piece structure composed of the same or different materials, and the wall 3' is positioned on the base 1 near the light-emitting element 2, located between the optical element 4 and the light-emitting element 2.

[0067] In this embodiment, the base 1 may be composed of bismaleimide triazineresin (BT resin) or ceramic material. The wall 3' may be composed of organic material, which may be a polymer, resin, silicone resin, organic light-converting substance, wavelength-blocking substance, or organic diffusing agent. For example, the wall 3' may contain resin and reflective particles dispersed within the resin, such as titanium oxide, zinc oxide, aluminum oxide, barium sulfate, or calcium carbonate.

[0068] Specifically, the wall 3' can be formed on the surface S by nozzle coating or printing. The overall appearance of the wall 3' can be a polygonal ring structure composed of continuous or discontinuous dams. Viewed from the side in cross-sectional view, the wall 3' is arranged around the light-emitting element 2 and is located between the optical element 4 and the light-emitting element 2. The wall 3' has a predetermined height DH2 along the normal direction of the surface S, and together with the surface S of the base 1, it defines the accommodating space SP.

[0069] like Figure 5 As shown, the reflective layer 5 covers the surface S of the base 1 and fills the accommodating space SP. The material of the reflective layer 5 can be white silicone resin or a highly reflective colloid, which is coated around the light-emitting element 2 and exposes the light-emitting surface ES. The reflective layer 5 can provide the light-emitting element 2 with a complete reflection path and sufficient reflection intensity, thus further improving the brightness of the light-emitting element 2.

[0070] In this embodiment, the optical element 4 is the same first lens structure 41 as in the first embodiment. Viewed from above, the bottom surface BS of the optical element 4 and the surface S of the base 1 are approximately the same size (e.g., rectangular), with each side of the bottom surface BS corresponding to each side of the surface S. Furthermore, the optical element 4 covers the surface S of the base 1, the light-emitting element 2, the wall 3', and the reflective layer 5. In this embodiment, in the direction perpendicular to the light-emitting surface ES, the ratio (DH2 / h2) of the height DH2 of the wall 3' to the height h2 of the light-emitting element 2 is in the range of 0.2 to 2. Therefore, based on the aforementioned structure, the wall 3' using a dam structure can confine the reflective layer 5 surrounding the light-emitting element 2, achieving effective light extraction and reducing the amount of reflective colloid used, thereby reducing process costs. Moreover, the light emitted by the light-emitting element 2 penetrates the optical element 4 and diverges outward from the top surface TS and the side surface S40 (forming five-sided light emission), thus the light-emitting element encapsulation structure LEP of this embodiment has a light emission angle exceeding 120 degrees.

[0071] Fifth Embodiment

[0072] Figure 6 This is a cross-sectional schematic diagram of the fifth embodiment of the present invention. Figure 7 This is a diagram showing the luminous intensity and angle distribution of the fifth embodiment of this utility model and the control group. Figure 8 This is a cross-sectional schematic diagram of another embodiment of the present invention. The light-emitting element packaging structure of the fifth embodiment is similar to that of the fourth embodiment, and the similarities will not be repeated. Compared with the fourth embodiment, the light-emitting element packaging structure of the fifth embodiment of the present invention differs in that the light-emitting element packaging structure also includes a wavelength conversion layer 7', which covers the light-emitting element 2 and extends to cover the reflective layer 5, but does not exceed the wall 3'.

[0073] Please see Figure 6 In the fifth embodiment, the light-emitting element package structure LEP includes a base 1, a light-emitting element 2, a wall 3', an optical element 4, a reflective layer 5, and a wavelength conversion layer 7'. The base 1, light-emitting element 2, wall 3', optical element 4, and reflective layer 5 are based on the architecture of the fourth embodiment; therefore, the same elements and features as in the fourth embodiment will not be repeated here.

[0074] In the fifth embodiment, a wavelength conversion layer 7' is provided between the optical element 4 and the light-emitting element 2. The wavelength conversion layer 7' covers the light-emitting surface ES and extends to the upper surface of the reflective layer 5. Viewed from above, the vertical projection area of ​​the reflective layer 5 onto the base 1 is greater than or equal to the vertical projection area of ​​the wavelength conversion layer 7' onto the base 1, and the vertical projection area of ​​the wavelength conversion layer 7' onto the base 1 is greater than the vertical projection area of ​​the light-emitting surface ES onto the base 1. Furthermore, the wavelength conversion layer 7' can form a lens structure with a curved surface. This invention exhibits superior optical characteristics by having a ratio (WH2 / RH2) of the maximum height WH2 of the wavelength conversion layer 7' to the minimum height RH2 of the reflective layer 5 in the direction perpendicular to the light-emitting surface ES within the range of 0.8 to 1.5. The optical characteristics are measured by the values ​​of light uniformity or color overangle (COA). The COA value is obtained by measuring the intensity of each color at two points: a zero emission angle and a ±45 degree emission angle. The smaller the COA value, the more consistent the color intensity measured at different angles. Based on the aforementioned structure, the COA value in this embodiment can be controlled to a minimum of ±0.002, indicating that the color intensity measured at different angles in this embodiment is highly consistent. Furthermore, with this structure, the light emitted by the light-emitting element 2 of the LEP in this embodiment can achieve effective light extraction through the reflective layer 5 / wall 3', further improving the brightness of the light-emitting element 2. Moreover, based on the aforementioned structure, the light emitted by the light-emitting element 2 penetrates the optical element 4 and diffuses outward from the top surface TS and the side surface S40, thereby giving the LEP in this embodiment a emission angle exceeding 120 degrees and highly uniform light emission.

[0075] Please see details Figure 7 , Figure 7The graphs show the luminous intensity and angular distribution of the LEP (Light Emitting Device) package structure of the fifth embodiment and a control group. The control group is a conventional luminous element package structure without the optical element 4 and reflective layer 5 of this invention. Curve A in the graph represents the control group, whose luminous angle distribution range is within 120 degrees, i.e., the light intensity is between -60 degrees and 60 degrees. Curve A is approximately circular. Curve B represents the LEP package structure of the fifth embodiment, whose luminous angle distribution range is between 130 degrees and 160 degrees, i.e., the light intensity is between -80 degrees and 80 degrees. Curve B is approximately elliptical. The luminous intensity and angular distribution graphs show that the LEP package structure of this invention can expand the luminous angle and improve uniformity without increasing power consumption.

[0076] Furthermore, in the fifth embodiment, the measured light intensity of the light-emitting element 2 is greater than the light intensity of the existing light-emitting chip without optical element 4 and reflective layer 5. The increased light intensity ratio is greater than or equal to 0.12. Therefore, without increasing power consumption and maintaining the original length and width of the light-emitting element packaging structure LEP, the present invention can increase the overall light intensity by configuring optical element 4 and reflective layer 5.

[0077] The fifth embodiment also includes another method, such as Figure 8 As shown, the wavelength conversion layer 7' only covers the light-emitting surface ES, forming a slightly hemispherical lens structure with curvature. The amount of wavelength conversion layer 7' required is small, which can save the overall cost of the light-emitting element packaging, while also having a light emission angle of more than 120 degrees.

[0078] Sixth Embodiment

[0079] Figure 9 This is a cross-sectional schematic diagram of the sixth embodiment of the present invention. Figure 10 This is a cross-sectional schematic diagram of another embodiment of the present invention (sixth embodiment). The packaging structure of the light-emitting element in the sixth embodiment is similar to that in the fifth embodiment, and the similarities will not be repeated. The difference between the packaging structure of the light-emitting element in the sixth embodiment and that in the fifth embodiment lies in the shape and structure of the optical element 4.

[0080] In the sixth embodiment, the optical element 4 is a second lens structure 42. The morphology and structure of the second lens structure 42 are as described in the third embodiment, and will not be repeated here.

[0081] A wavelength conversion layer 7' is provided between optical element 4 and light-emitting element 2, such as Figure 9 As shown, the wavelength conversion layer 7' can cover the light surface ES and extend to the upper surface of the reflective layer 5, or the wavelength conversion layer 7' can simply cover the light surface ES (as shown in the image). Figure 10 (As shown).

[0082] Figure 10 In another embodiment of the sixth embodiment, as shown in the figure, the wavelength conversion layer 7' only covers the light-emitting surface ES, forming a slightly hemispherical lens structure with curvature. The amount of wavelength conversion layer 7' required is small, which can save the overall cost of the light-emitting element packaging, while having a light emission angle of more than 120 degrees.

[0083] In addition, this utility model also provides a light-emitting module, which can be composed of multiple light-emitting element package structures (LEPs) of any of the foregoing embodiments of this utility model. In the light-emitting module, multiple light-emitting element package structures (LEPs) are disposed on a circuit board in a preset arrangement, such as arranging the multiple light-emitting element package structures into an array, a column, or a row.

[0084] Furthermore, when multiple light-emitting element package structures (LEPs) are arranged in a preset manner, adjacent LEPs can have a spacing between them, ensuring that no dark bands appear between adjacent light-emitting elements. In one embodiment, the spacing is greater than 8 cm and less than 12 cm.

[0085] Because the light in each LED package structure (LEP) passes through the light-transmitting layer / wavelength conversion layer and optical element 4, forming a secondary optical path, the light emitted by the LED can have a emission angle exceeding 120 degrees, and exhibits better light uniformity and intensity. Therefore, when applied to LED modules, it is not necessary to increase the number of LED package structures to solve the dark band problem between adjacent LEDs. In other words, increasing the spacing between adjacent LED package structures (LEPs) effectively reduces the number of LED package structures used in the overall LED module, thereby reducing costs.

[0086] Beneficial effects of the embodiments

[0087] One of the beneficial effects of this utility model is that, without increasing power consumption and maintaining the original length and width of the light-emitting element packaging structure LEP, this utility model can increase the overall light intensity and have a light emission angle of more than 120 degrees by configuring optical elements with special structures as secondary optics and reflective layers; the ratio of the height of the wall to the height of the light-emitting element is in the range of 0.2 to 2.

[0088] Another beneficial effect of this invention is that by adjusting the type of fluorescent material in the wavelength conversion layer and the height of the wavelength conversion layer, and with the ratio of the height of the wavelength conversion layer to the height of the reflective layer in the range of 0.8 to 1.5, the amount of light emitted by a predetermined color can be increased, thereby reducing the difference in the color performance of light with angle, that is, minimizing the numerical difference in color change at angles (which can be controlled within ±0.002), making the color intensity measured at different angles consistent, and exhibiting high light uniformity.

[0089] In summary, because the LEP (Light Emitting Element) packaging structure of this invention combines a large emission angle, light intensity, and high uniformity, it can solve the dark band problem between adjacent light-emitting elements when applied to light-emitting modules without increasing the number of LEP packaging structures. In other words, increasing the spacing between adjacent LEP packaging structures effectively reduces the number of LEP packaging structures used in the overall light-emitting module, thereby reducing costs.

[0090] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of protection of the claims of the present utility model. Therefore, all equivalent technical changes made based on the content of the present utility model specification and drawings are included in the scope of protection of the claims of the present utility model.

Claims

1. A light emitting element package structure characterized by comprising: The light emitting element package structure comprises: a base having a surface; a light emitting element disposed on the base and having an emitting surface; a wall disposed on the base and defining a receiving space with the surface, the light emitting element being located in the receiving space; a reflective layer located in the receiving space and covering the surface, and surrounding the light emitting element and exposing the emitting surface; and an optical element covering the base, the wall and the light emitting element, the optical element having a top surface and a bottom surface opposite to each other, and a side surface connecting the top surface and the bottom surface; wherein the top surface is a plane, a vertical projection area of the top surface on the surface is less than a vertical projection area of the bottom surface on the surface, and a tangent of the side surface has an included angle with a normal of the bottom surface or the top surface.

2. The light emitting element package structure according to claim 1, wherein The wall and the base are composed of the same material and are an integral piece, the wall has a first surface facing the receiving space and a second surface opposite to the first surface, and the second surface and a side surface of the base are in the same vertical plane.

3. The light emitting element package structure according to claim 1, wherein The wall surrounds the light emitting element and is located between the optical element and the light emitting element, and the wall is a polygonal ring structure composed of a continuous or discontinuous dam.

4. The light emitting element package structure according to claim 1, wherein The light emitting element package structure further comprises a light-transmitting layer located between the optical element and the light emitting element and covering at least the emitting surface.

5. The light emitting element package structure according to claim 4, wherein The light-transmitting layer and the optical element are made of the same material and fill the receiving space.

6. The light emitting element package structure according to claim 4, wherein The light-transmitting layer is a wavelength conversion layer located between the light emitting element and the optical element, the wavelength conversion layer covers at least the emitting surface, and in a direction perpendicular to the emitting surface, a ratio of a height of the wavelength conversion layer to a height of the reflective layer is in a range of 0.8 to 1.

5.

7. The light emitting element package structure according to claim 6, wherein The wavelength conversion layer extends to cover the reflective layer.

8. The light emitting element package structure according to claim 3, wherein In a direction perpendicular to the emitting surface, a ratio of a height of the wall to a height of the light emitting element is in a range of 0.2 to 2.

9. The light emitting element package structure according to any one of claims 1 to 8, wherein The optical element has a first lens structure, in which the side surface includes four sub-side surfaces, each of which is a plane inclined with respect to the bottom surface and the top surface.

10. The light emitting element package structure according to any one of claims 1 to 8, wherein The optical element has a second lens structure, in which the side surface includes four side curved surfaces connected between the top surface and the bottom surface.

11. The light emitting element package structure according to any one of claims 1 to 8, wherein The optical element has a second lens structure, in which the side surface includes four side curved surfaces connected to the top surface, four side flat surfaces connected between one of the side curved surfaces and one of the side vertical surfaces, and four side vertical surfaces connected to the bottom surface, each of the side curved surfaces is curved from the top surface of the optical element towards an edge of the side flat surface, each of the side flat surfaces is parallel to the bottom surface and perpendicular to the corresponding side vertical surface.

12. The light emitting element package structure according to claim 9, wherein A ratio of a height of the first lens structure in a direction perpendicular to the light exit surface to a length of the bottom surface in parallel to the surface is in a range from 0.25 to 0.

4.

13. The light emitting element package structure according to claim 11, wherein A ratio of a height of the second lens structure in a direction perpendicular to the light exit surface to a length of the bottom surface in parallel to the surface is in a range from 0.25 to 0.

4.

14. The light emitting element package structure according to claim 9, wherein Each of the sub-sides is inclined with respect to the bottom surface at a predetermined slope, and the slope is in a range from 1 to 16.

15. The light emitting element package structure according to claim 11, wherein A distance between the bottom surface and the top surface is a first height, a distance between the bottom surface and the side surface is a second height, and a ratio of the first height to the second height is in a range from 0.02 to 0.

08.

16. The light emitting element package structure according to claim 1, wherein In a direction perpendicular to the light exit surface, a ratio of a height of the wall to a height of the light emitting element is in a range from 0.2 to 2.

17. The light emitting element package structure according to claim 1, wherein A length of the top surface in parallel to the surface is less than a length of the bottom surface in parallel to the surface.

18. The light emitting element package structure according to claim 17, wherein A ratio of the length of the top surface in parallel to the surface to the length of the bottom surface in parallel to the surface is in a range from 0.5 to 0.

95.

19. The light emitting element package structure according to claim 1, wherein The included angle is less than 90 degrees.

20. A light emitting module characterized in that The light emitting module comprises: a plurality of light emitting element package structures according to any one of claims 1 to 8; a circuit substrate, the plurality of light emitting element package structures are arranged on the circuit substrate in a preset arrangement manner, and two adjacent light emitting element package structures have a spacing.

21. The light module of claim 20, wherein, The preset arrangement manner is that the plurality of light emitting element package structures are arranged in an array, a column or a row.

22. The light module of claim 20, wherein, The spacing is greater than 8 cm and less than 12 cm.

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