Sucker potential monitoring system for mask-plate-free direct-writing photoetching exposure machine and direct-writing photoetching exposure machine

Abstract

The utility model discloses a sucker potential monitoring system for a mask-plate-free direct-writing photoetching exposure machine and the direct-writing photoetching exposure machine, and the sucker potential monitoring system comprises a sucker device, a potential sensor, a switch assembly, an ion generator and a controller, the controller is used for controlling the on-off state of the switch assembly by sending a vacuum suction instruction or a vacuum breaking instruction so as to control the airflow direction of the air duct and further control the suction cup device to enter a vacuum suction state or a vacuum breaking state so as to achieve the adsorption or separation function of the plate, and receiving the potential difference sent by the potential sensor. And when the suction cup device enters the vacuum breaking state and the potential difference exceeds a pre-stored calibration value, a discharging starting instruction is sent to the ion generator, so that the ion generator starts discharging, and ions are injected into the vacuum breaking airflow in the air duct. According to the utility model, charge accumulation caused by friction between the sucking disc device and the plate can be effectively eliminated, and the damage of static electricity to electronic devices on a machine table is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of photoetching, especially to a chuck potential monitoring system for maskless direct writing photoetching exposure machine and direct writing photoetching exposure machine. BACKGROUND

[0002] In the field of PCB (Printed Circuit Board) manufacturing, the chuck of the direct writing exposure machine accumulates instantaneous potential up to 8kV or above due to frequent physical friction between the board and the chuck pad during mass exposure operation.

[0003] However, the instantaneous voltage tolerance of common electronic devices such as chips is generally low, usually below 4kV. This potential accumulation not only may directly damage static sensitive devices such as MARK (marker) lamp beads and control board cards on the chuck, affecting the stable operation and accuracy of these devices, but also may gradually erode the accuracy of sensors and shorten the service life of devices due to long-term low-voltage static interference. In addition, the static phenomenon caused by potential accumulation also puts higher requirements on the shielding effectiveness of the chuck data return cable, forcing designers to carefully choose the signal communication method to ensure the stability and reliability of data transmission, thereby increasing the complexity and cost of equipment design and production. SUMMARY

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art.

[0005] To this end, one object of the utility model is to provide a chuck potential monitoring system for maskless direct writing photoetching exposure machine, which can effectively eliminate the charge accumulation between the chuck device and the board due to friction, not only avoiding the damage of static electricity to electronic devices on the machine, but also significantly improving the efficiency and persistence of static protection, achieving the purpose of simplifying the structure and saving the cost.

[0006] To this end, a second object of the utility model is to provide a direct writing photoetching exposure machine.

[0007] To achieve the above object, the utility model discloses a first aspect of embodiment of utility model discloses a kind of chuck potential monitoring system for maskless direct writing photolithography exposure machine, comprising: chuck device, for carrying the plate material to be processed, the chuck device is provided with air duct;Potential sensor, be set on the chuck device, for monitoring the potential difference between the chuck device and the plate material;Switching component, be set on the air duct of the chuck device;Ion generator, be set on the air duct of the chuck device, and be connected in series with the switching component;Controller, the controller is connected with the potential sensor, the switching component and the ion generator respectively, for by sending suction vacuum instruction or breaking vacuum instruction to control the on-off state of the switching component, to control the airflow direction of the air duct, to control the chuck device enters suction vacuum state or breaking vacuum state, to realize the adsorption or separation function to the plate material, and receive the potential difference currently monitored by the potential sensor, to when the chuck device enters the breaking vacuum state and the potential difference exceeds pre-stored calibration value, open discharge instruction is sent to the ion generator, to make the ion generator open discharge, so that ion is injected into the breaking vacuum airflow in the air duct and becomes ion wind that can neutralize accumulated charge.

[0008] According to the chuck potential monitoring system for maskless direct writing photolithography exposure machine of the utility model embodiment, when the controller sends suction vacuum instruction or breaking vacuum instruction, the on state of switching component is controlled, and then the airflow direction in air duct can be controlled, to realize that chuck device is vacuumed or breaking vacuum to plate material, and the potential change between chuck device and plate material monitored by controller is also monitored by potential sensor.In addition, the system does not need to additionally increase air duct, but ion generator and switching component are connected in series on the air duct of chuck device skillfully, so that, when chuck device is breaking vacuum to plate material and the potential difference exceeds pre-stored calibration value, the controller will send open discharge instruction to ion generator, to make ion generator open discharge, and then ion is injected into the breaking vacuum airflow in air duct and becomes ion wind that can neutralize accumulated charge, to effectively eliminate the charge accumulation between chuck device and plate material due to friction, not only avoid the damage of static electricity to electronic device on machine, but also significantly improve the efficiency and persistence of static protection, reach the purpose of structure simplification and cost saving.

[0009] In addition, according to the chuck potential monitoring system for maskless direct writing photolithography exposure machine of the utility model above-mentioned embodiment, can also have the following additional technical features:

[0010] In some embodiments, the chuck device includes chuck body and chuck pad, the chuck pad is set between the plate and the chuck body, and the air duct is communicated between the chuck body and the chuck pad.

[0011] In some embodiments, the chuck potential monitoring system for maskless direct write lithography exposure machine comprises a trigger device connected to the controller, configured to send a plate-in-place signal to the controller when the plate is placed on the chuck.

[0012] In some embodiments, the controller is configured to send the vacuum-on instruction to the switch assembly to control the switch assembly to switch its current on-off state, so that the chuck device enters the vacuum-on state, after receiving the plate-in-place signal.

[0013] In some embodiments, the controller is configured to send the vacuum-break instruction to the switch assembly to control the switch assembly to switch its current on-off state, so that the chuck device enters the vacuum-break state, after the exposure process is completed.

[0014] In some embodiments, the switch assembly comprises a first switch and a second switch: when the vacuum-on instruction is received, the first switch is switched to the on state, and the second switch is switched to the off state, so that the chuck device vacuums the plate through the air duct; when the vacuum-break instruction is received, the first switch is switched to the off state, and the second switch is controlled to switch to the on state, so that the chuck device breaks the vacuum of the plate through the air duct.

[0015] In some embodiments, the first switch and the second switch are configured as solenoid valves.

[0016] In some embodiments, the chuck potential monitoring system for maskless direct write lithography exposure machine further comprises an alarm device connected to the controller, configured to send an alarm prompt signal when receiving an alarm instruction sent by the controller, the alarm instruction being sent by the controller when the potential difference exceeds the calibrated value.

[0017] In some embodiments, the chuck potential monitoring system for maskless direct write lithography exposure machine further comprises a calibration ruler, the calibration ruler being arranged on the chuck body, the potential sensor being arranged on the calibration ruler, and the height of the calibration ruler being equal to the height of the chuck pad.

[0018] To achieve the above-mentioned purpose, the second aspect of the embodiment of the utility model discloses a direct write lithography exposure machine, comprising the chuck potential monitoring system for maskless direct write lithography exposure machine as described in the first aspect of the embodiment of the utility model.

[0019] According to the direct writing photoetching exposure machine, when the controller sends a vacuum suction instruction or a vacuum breaking instruction, the on-off state of the switch assembly is controlled, and then the airflow direction in the air duct can be controlled, so that the chuck device can suck the vacuum or break the vacuum of the plate, and the controller also monitors the potential change between the chuck device and the plate monitored by the potential sensor.In addition, the system does not need to additionally increase the air duct, but skillfully connects the ion generator and the switch assembly in series on the air duct of the chuck device, so that when the chuck device breaks the vacuum of the plate and the potential difference exceeds the pre-stored calibration value, the controller will send an opening discharge instruction to the ion generator, so that the ion generator opens the discharge, and then injects ions into the vacuum breaking airflow in the air duct to make it become an ion wind that can neutralize the accumulated electric charge, thereby effectively eliminating the charge accumulation between the chuck device and the plate due to friction, not only avoiding the damage of static electricity to electronic devices on the machine, but also significantly improving the efficiency and persistence of static protection, achieving the purposes of structural simplification and cost saving.

[0020] Additional aspects and advantages of the present application will be described in part below, some of which will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0022] Figure 1 is a structural schematic diagram of a chuck potential monitoring system for a maskless direct writing photoetching exposure machine according to an embodiment of the present application;

[0023] Figure 2 is a structural schematic diagram of a chuck potential monitoring system for a maskless direct writing photoetching exposure machine according to another embodiment of the present application;

[0024] Figure 3 is a negative pressure adsorption schematic diagram according to an embodiment of the present application;

[0025] Figure 4 is a schematic diagram of positive and negative charge neutralization according to an embodiment of the present application;

[0026] Figure 5 is a schematic diagram of static elimination according to an embodiment of the present application;

[0027] Figure 6 is a schematic diagram of opening the next vacuum breaking after potential balancing according to an embodiment of the present application;

[0028] Figure 7is a structural block diagram of a direct writing lithography exposure machine according to an embodiment of the present application. DETAILED DESCRIPTION

[0029] The embodiments of the present application are described in detail below, and the embodiments described with reference to the accompanying drawings are exemplary, and the embodiments of the present application are described in detail below.

[0030] The embodiments of the present application are described in detail below, and the embodiments described with reference to the accompanying drawings are exemplary, and the embodiments of the present application are described in detail below. Figures 1-6 A chuck potential monitoring system for a maskless direct writing lithography exposure machine according to an embodiment of the present application is described below.

[0031] Figure 1 is a structural schematic diagram of a chuck potential monitoring system for a maskless direct writing lithography exposure machine according to an embodiment of the present application. As shown in Figure 1 , the chuck potential monitoring system 100 for the maskless direct writing lithography exposure machine comprises: a chuck device 110, a potential sensor 120, a switch assembly 130, an ion generator 140, and a controller (not shown in the figure).

[0032] Specifically, as shown in Figure 1 , the chuck device 110 is used to carry the plate to be processed, and the chuck device 110 is provided with an air duct; the potential sensor 120 is arranged on the chuck device 110 and is used to monitor the potential difference between the chuck device 110 and the plate; the switch assembly 130 is arranged on the air duct of the chuck device 110; the ion generator 140 is arranged on the air duct of the chuck device 110 and is connected in series with the switch assembly 130; the controller is connected with the potential sensor 120, the switch assembly 130 and the ion generator 140 respectively, and is used to control the on-off state of the switch assembly 130 by sending a vacuum suction command or a vacuum breaking command, so as to control the airflow direction of the air duct, and then control the chuck device 110 to enter a vacuum suction state or a vacuum breaking state, so as to realize the adsorption or separation function of the plate, and receive the current monitored potential difference sent by the potential sensor 120, so as to send an opening discharge instruction to the ion generator 140 when the chuck device 110 enters the vacuum breaking state and the potential difference exceeds the pre-stored calibration value, so as to make the ion generator 140 open discharge, so as to inject ions into the vacuum breaking airflow in the air duct to make it become ion wind that can neutralize accumulated charges.

[0033] In the embodiments, as Figure 1As shown, the suction cup device 110 is used to carry the plate to be processed, ensuring that the plate can maintain a stable position during processing. In order to achieve this function, the suction cup device 110 is provided with an air duct, and the direction of the airflow in the air duct can be flexibly controlled through the instructions sent by the controller, thereby controlling the suction cup device 110 to enter a vacuum state or a broken vacuum state, to realize the adsorption or separation function of the plate. When the control device 110 enters the vacuum state, the airflow in the air duct is guided to the surface of the suction cup device 110, generating strong negative pressure, which firmly adsorbs the plate on the suction cup device 110; and when the suction cup device 110 enters the broken vacuum state, the airflow direction is reversed, and the negative pressure disappears, so that the plate and the suction cup device 110 can be separated.

[0034] In order to ensure that there is no static accumulation between the suction cup device 110 and the plate, which may cause safety hazards during processing, the potential sensor 120 is arranged on the suction cup device 110 to monitor the potential change between the suction cup device 110 and the plate in real time, and the controller is connected with the potential sensor 120 to determine whether the potential difference exceeds the pre-stored calibration value in real time.

[0035] At the same time, the air duct of the suction cup device 120 is also provided with a switch assembly 130 and an ion generator 140, and the ion generator 140 is connected in series with the switch assembly 130.

[0036] In addition, as shown, Figure 1 The suction cup potential monitoring system 100 for the maskless direct writing photolithography exposure machine also includes a machine table 150 for carrying and fixing the suction cup device.

[0037] Specifically, the controller is connected with the potential sensor 120, the switch assembly 130 and the ion generator 140 respectively, and will send a vacuum suction instruction or a broken vacuum instruction according to the received control signal, and then control the on-off state of the switch assembly 130 according to the vacuum suction instruction or the broken vacuum, that is, control the switch assembly 130 to switch between conduction and disconnection, so that the on-off state of the switch assembly 130 can be controlled to control the direction of the airflow in the air duct, that is, to control the opening or closing of the air duct, and then to realize the vacuum suction or broken vacuum of the plate based on the change of the airflow direction.

[0038] As shown, Figure 1 When the suction cup device 110 needs to vacuum the plate, that is, the suction cup device 110 enters the vacuum state, the airflow direction in the air duct is downward, at this time a strong negative pressure will be generated between the plate and the suction cup device 110, and the plate will be firmly adsorbed on the suction cup device 110 through the negative pressure, ensuring that the plate and the suction cup device 110 are in close connection.

[0039] As shown, Figure 2As shown, when the chuck device 110 needs to break the vacuum on the plate, i.e. the chuck device 110 enters the breaking vacuum state, by switching the on-off state of the switch assembly 130, the airflow direction in the air duct changes, i.e. from the downward airflow direction to the upward airflow direction, thereby breaking the vacuum on the plate.

[0040] In combination Figure 1 and Figure 2 As shown, the chuck potential monitoring system 100 for the maskless direct write lithography exposure machine also includes a machine table 150 for carrying and fixing the chuck device 110.

[0041] When the chuck device 110 needs to suck the vacuum on the plate, as shown Figure 3 , the airflow direction in the air duct changes and generates negative pressure, and when the machine table 150 moves quickly and frequently, the machine table 150 can stably support the chuck device 110 to prevent it from deforming or shifting due to negative pressure, thereby ensuring that the plate can be firmly adsorbed on the chuck device 110. When the chuck device 110 needs to separate from the plate, the machine table 150 remains stable, so that the chuck device 110 can smoothly eliminate the negative pressure by changing the airflow direction in the air duct to achieve smooth release of the plate.

[0042] The controller is connected with the potential sensor 120, the switch assembly 130 and the ion generator 140 respectively, when the chuck device 110 needs to suck the vacuum on the plate, the controller will issue a vacuum suction command based on the received signal to control the on-off state of the switch assembly 130, thereby changing the airflow direction in the air duct, and realizing the vacuum suction of the chuck device 110 on the plate.

[0043] Similarly, when the chuck device 110 needs to break the vacuum on the plate, the controller will issue a breaking vacuum command based on the received signal, and then control the switch assembly 130 to switch the conduction state, so that the airflow direction changes to upward, thereby realizing the breaking vacuum of the chuck device 110 on the plate.

[0044] With the continuous movement of the machine 150 and the continuous frictional contact between the plate and the suction cup device 110, the static electricity between the plate and the suction cup device 110 gradually accumulates. The controller will monitor the potential difference between the plate and the suction cup device 110 through the potential sensor 120, and compare the monitored potential difference with the pre-stored calibration value. When the potential difference exceeds the calibration value and the suction cup device 110 breaks the vacuum on the plate, the controller sends an open discharge instruction to the ion generator 140 to control the ion generator 140 to open the discharge. When the potential difference exceeds the calibration value, the ion generator 140 is in standby state. Once the suction cup device 110 needs to break the vacuum on the plate, the controller immediately sends an open discharge instruction to the ion generator 140, and the ion generator 140 will immediately open the discharge, so as to inject ions into the vacuum-breaking airflow in the air duct to make it become ion wind that can neutralize the accumulated electric charge, so as to quickly neutralize the static electricity between the plate and the suction cup device 110 by the ion wind, and ensure the safety and stability of the processing process.

[0045] In combination Figure 4 and Figure 5 As shown in FIG. 1, during the exposure process of the direct writing exposure machine, positive and negative charges of equal amount and opposite polarity are generated between the plate and the suction cup device 110 due to friction. After the exposure process is completed, the suction cup device 110 breaks the vacuum on the plate, and guides the airflow carrying the ion wind to enter the small gap between the plate and the suction cup device 110 through the ion generator 140. Since the plate and the suction cup device 110 have not been completely separated, the ion wind can fully contact with them in the narrow air duct. By using the basic principle that opposite charges attract each other and same charges repel each other, the positive and negative charges carried by the ion wind neutralize the corresponding charges on the plate and the suction cup device 110 respectively, thereby effectively eliminating the charge accumulation between them and achieving potential balance.

[0046] As shown in FIG. 1, after the potential balance is achieved, the suction cup device 110 will perform the next vacuum suction on the plate. Figure 6

[0047] It should be noted that the above controller sending instructions, storing calibration values, and comparing potential with standard values, etc. are all the conventional functions of the controller. The present application only uses these functions and does not improve these functions.

[0048] ​Therefore, the chuck potential monitoring system 100 for the maskless direct writing photolithography exposure machine can control the air flow direction in the air duct by controlling the on-off state of the switch assembly 130 when the controller issues a vacuum suction instruction or a vacuum breaking instruction, so as to realize the vacuum suction or vacuum breaking of the chuck device 110 to the plate, and the controller also monitors the potential change between the chuck device 110 and the plate monitored by the potential sensor 120. In addition, the system does not need to additionally increase the air duct, but ingeniously connects the ion generator 140 and the switch assembly 130 in series on the air duct of the chuck device 110, so that when the chuck device 110 breaks the vacuum to the plate and the potential difference exceeds the pre-stored calibration value, the controller will send an open discharge instruction to the ion generator 140 to make the ion generator 140 open discharge, and then inject ions into the vacuum breaking air flow in the air duct to make it become ion wind that can neutralize the accumulated charge, thereby effectively eliminating the charge accumulation between the chuck device 110 and the plate due to friction, not only avoiding the damage of static electricity to the electronic devices on the machine, but also significantly improving the efficiency and persistence of static protection, achieving the purposes of structure simplification and cost saving.

[0049] In an embodiment of the present application, as shown in Figure 1 and Figure 2 , the chuck device 110 includes a chuck main body 111 and a chuck pad 112, and the chuck pad 112 is arranged between the plate and the chuck main body 111, and the air duct is communicated between the chuck main body 111 and the chuck pad 112.

[0050] In the embodiment, as shown in Figure 1 and Figure 2 , the chuck pad 112 is arranged between the plate and the chuck main body 111, which can effectively protect the surface of the plate from being damaged, such as scratches or indentations, caused by direct adsorption of the chuck main body 111, thereby maintaining the integrity and aesthetics of the plate. At the same time, the chuck pad 112 also optimizes the adsorption effect, and through the material and structural design, it can further enhance the sealing between the chuck main body 111 and the plate, reduce air leakage, and make the chuck device 110 work more efficiently.

[0051] The air duct is communicated between the chuck main body 111 and the chuck pad 112, which ensures the communication between the inside and the outside of the chuck main body 111, and also allows air to flow smoothly when the chuck device 110 works. When the chuck device 110 starts and generates negative pressure, the air duct becomes an important channel connecting the inside and outside of the chuck main body 111, so that air can be quickly sucked out, thereby forming a strong negative pressure area between the chuck main body 111 and the plate, realizing stable adsorption effect, thereby improving the working efficiency of the chuck device 110, and also ensuring the stability and reliability of the chuck device 110.

[0052] In an embodiment of the utility model, the chuck potential monitoring system 100 for maskless direct writing photolithography exposure machine includes: trigger device (not shown in the drawing), trigger device is connected with controller, is used for when board material is placed on chuck main part 111, board material is in place signal is sent to controller.

[0053] In an embodiment, when the board material needs to be placed on the chuck device 110, the trigger device can send the board material in place signal to the controller, so that the controller receives the board material in place signal and controls the chuck device 110 to vacuumize the board material, that is, controls the chuck device 110 to enter the vacuum state to adsorb the board material.

[0054] For example, when the board material needs to be placed on the chuck device 110, the trigger device can confirm whether the board material is accurately placed on the chuck device 110 based on the spacing between the board material and the chuck device 110 and the spacing required during exposure and other measurement data, and after confirming that the board material is accurately placed on the chuck device 110, the board material in place signal is sent to the controller, and the controller will send the vacuumization instruction based on the board material in place signal to control the chuck main body 111 to vacuumize, so that the chuck main body 111 quickly and stably adsorbs the board material, thereby improving the efficiency of the exposure process and reducing the errors caused by manual operation.

[0055] After the chuck main body 111 completes the vacuum adsorption of the board material, the exposure machine starts the next exposure process, and the controller sends the vacuum breaking instruction after the exposure process is completed, indicating that the chuck main body 111 can start to release the vacuum, so that the board material can be safely and smoothly removed after the exposure is completed.

[0056] In summary, through the trigger device, accurate control and automatic processing of the board placement and vacuum adsorption process are realized, thereby improving the operation efficiency and precision of the direct writing exposure machine.

[0057] In an embodiment of the utility model, the controller is used to: after receiving the board material in place signal, send the vacuumization instruction to the switch assembly 130 to control the switch assembly 130 to switch its current on-off state, so that the chuck device 110 enters the vacuum state.

[0058] In an embodiment, when the controller receives the board material in place signal from the trigger device, the controller will send the vacuumization instruction to the switch assembly 130 to control the switch assembly 130 to switch its current on-off state, so that the switch assembly 130 switches to a state that allows the chuck main body 111 to start vacuumizing the board material, that is, controls the chuck device 110 to enter the vacuum state. Thus, the rapid response and accurate control of the entire vacuumization process are ensured, and the operation efficiency and stability of the system are further improved.

[0059] In an embodiment of the utility model, the controller is configured to send a vacuum breaking instruction to the switch assembly 130 after the exposure process is completed, so as to control the switch assembly 130 to switch its current on-off state, and then make the suction cup device 110 enter a vacuum breaking state.

[0060] In an embodiment, after the exposure process is completed, the controller will send a vacuum breaking instruction to the switch assembly 130, so that the switch assembly 130 accurately switches to a state that allows the suction cup body 111 to release the vacuum adsorption state of the plate, that is, controls the suction cup device 110 to enter a vacuum breaking state, so as to realize the separation function of the suction cup device 110 to the plate. This can ensure that the plate can be safely and smoothly removed after the photoetching is completed.

[0061] In an embodiment of the utility model, the switch assembly 130 includes a first switch 131 and a second switch 132: when the vacuum suction instruction is received, the first switch 131 switches to the on state, and the second switch 132 switches to the off state, so that the suction cup device 110 can suck the vacuum of the plate through the air duct; when the vacuum breaking instruction is received, the first switch 131 switches to the off state, and the second switch 132 is controlled to switch to the on state, so that the suction cup device 110 can break the vacuum of the plate through the air duct.

[0062] In an embodiment, as shown in Figure 1 When the switch assembly 130 receives the vacuum suction instruction, the first switch 131 will switch to the on state, and the second switch 132 will switch to the off state, so that the airflow direction in the air duct will change, so that the airflow direction is downward. With the change of the airflow direction, a negative pressure is generated in the air duct, so that the suction cup device 110 and the plate have strong adsorption force, thereby ensuring that the plate can be firmly adsorbed on the suction cup device 110, and the vacuum suction of the suction cup device 110 to the plate is completed.

[0063] As shown in Figure 2 When the suction cup device 110 needs to break the vacuum of the plate, the switch assembly 130 receives the vacuum breaking instruction, at this time, the first switch 131 switches to the off state, and the second switch 132 switches to the on state, so that the airflow direction changes, and changes from the downward adsorption state to the upward release state. With the change of the airflow direction, the negative pressure environment in the air duct is effectively broken, and the vacuum adsorption of the suction cup device 110 to the plate is also released, so that the plate can be safely and smoothly removed.

[0064] In an embodiment of the utility model, the first switch 131 and the second switch 132 are configured as electromagnetic valves.

[0065] In embodiments, the first switch 131 and the second switch are configured as electromagnetic valves, for example, the first switch 131 is a vacuum suction electromagnetic valve, and the second switch 132 is a vacuum breaking electromagnetic valve, and the opening and closing of the valves are controlled by the electromagnetic force, so as to accurately regulate the flow direction of the air flow.

[0066] Not only can the switch assembly 130 ensure quick response and accurate control, but also can ensure the stability and reliability of the suction cup device 110 in the vacuum suction and vacuum breaking process, and further improve the working efficiency and processing precision of the whole system.

[0067] In an embodiment of the present application, the chuck potential monitoring system 100 for the maskless direct writing photolithography exposure machine further comprises: an alarm device (not shown in the figure), the alarm device is connected with the controller, and when the alarm instruction sent by the controller is received, an alarm prompt signal is sent, and the alarm instruction is sent by the controller when the potential difference exceeds the calibrated value.

[0068] In embodiments, the alarm device is connected with the controller, and when the controller monitors that the potential difference exceeds the calibrated value, an alarm instruction will be sent to the alarm device, and after receiving the alarm instruction, the alarm device will send an alarm prompt signal, which helps the operator to quickly find and solve the potential imbalance problem based on the alarm prompt signal, prevents it from causing adverse effects on the normal operation and processing precision of the direct writing exposure machine, and also significantly improves the safety and stability of the whole control system.

[0069] In an embodiment of the present application, the chuck potential monitoring system 100 for the maskless direct writing photolithography exposure machine further comprises: a calibration ruler 170, the calibration ruler 170 is arranged on the chuck body 111, and the potential sensor 120 is arranged on the calibration ruler 170, and the height of the calibration ruler 170 is equal to the height of the chuck pad 112.

[0070] In embodiments, the calibration ruler 170 is installed on the chuck body 111, and the height thereof is consistent with the height of the chuck pad 112, which ensures that the installation position of the potential sensor 120 on the calibration ruler 170 can accurately reflect the potential state of the working surface of the chuck body 111. The potential sensor 120 is arranged on the calibration ruler 170, which can capture the change of the potential of the chuck body 111 region in real time, so that the controller can analyze and process based on these data, thereby not only improving the accuracy and reliability of the potential monitoring, but also helping to find and correct the potential imbalance problem in time, so as to ensure that the direct writing exposure machine can maintain the best potential balance state in the processing process, and further improve the processing precision and stability.

[0071] In addition, in the specific embodiments of the present application, the surface potential meter return value part of Table 1 is as follows.

[0072]

[0073] Table 1

[0074] The data in Table 1 shows the results of continuous static electricity measurement on the table top of the chuck body 111 before and after the static electricity elimination scheme is adopted. The data is expressed in hexadecimal form, wherein "00 00" of the potential part represents that the potential reaches the balanced state, and "00 01" indicates that there is positive charge at this time. By analyzing the data, under the condition that the chuck body 111 is applied with a 2KV voltage load, the ion generator 140 successfully neutralizes the table top charge to the balanced state in just 15 seconds, which shows that the effect of the static electricity elimination scheme is remarkable, and the static electricity can be quickly and effectively eliminated, thereby ensuring the stability and safety of the table top of the chuck body 111 during use.

[0075] In summary, according to the chuck potential monitoring system 100 for the maskless direct writing photolithography exposure machine in the embodiment of the present application, when the controller issues a vacuum suction instruction or a vacuum breaking instruction, the on-off state of the switch assembly 130 is controlled, and then the airflow direction in the air duct can be controlled to realize the vacuum suction or vacuum breaking of the chuck device 110 on the plate. In addition, the controller also monitors the potential change between the chuck device 110 and the plate monitored by the potential sensor 120. In addition, the system does not need to additionally increase the air duct, but skillfully connects the ion generator 140 and the switch assembly 130 in series on the air duct of the chuck device 110. In this way, when the chuck device 110 breaks the vacuum on the plate and the potential difference exceeds the pre-stored calibration value, the controller will send an opening discharge instruction to the ion generator 140, so that the ion generator 140 opens the discharge, and then injects ions into the vacuum breaking airflow in the air duct to make it become ion wind that can neutralize the accumulated charge. Therefore, the accumulated charge between the chuck device 110 and the plate due to friction can be effectively eliminated, not only avoiding the damage of static electricity to electronic devices on the machine, but also significantly improving the efficiency and persistence of static electricity protection, achieving the purpose of structure simplification and cost saving.

[0076] The present application also proposes a direct writing photolithography exposure machine 200 in the embodiment.

[0077] As shown in Figure 7 Fig. 1 is a structural block diagram of a direct writing photolithography exposure machine according to an embodiment of the present application. The direct writing photolithography exposure machine 200 comprises a chuck potential monitoring system 100 for a maskless direct writing photolithography exposure machine according to any one of the above embodiments of the present application.

[0078] It should be noted that the direct writing photoetching exposure machine 200 in the process of chuck potential monitoring, its specific implementation mode is similar to the specific implementation mode of the chuck potential monitoring system 100 for the maskless direct writing photoetching exposure machine of any one of the above embodiments of the utility model, and thus the detailed exemplary description of the process of the direct writing photoetching exposure machine 200 in the process of chuck potential balance monitoring control can be referred to the foregoing related description of the chuck potential monitoring system 100 for the maskless direct writing photoetching exposure machine, and for the sake of reducing redundancy, the detailed exemplary description will not be repeated here.

[0079] According to the direct writing photoetching exposure machine 200 of the utility model embodiment, when the controller sends the vacuum suction instruction or the vacuum breaking instruction, the on-off state of the switch assembly 130 is controlled, and then the airflow direction in the air duct can be controlled, so that the chuck device 110 can suck the vacuum or break the vacuum of the plate, and the controller also monitors the potential change between the chuck device 110 and the plate monitored by the potential sensor 120. In addition, the system does not need to additionally increase the air duct, but ingeniously connects the ion generator 140 and the switch assembly 130 in series on the air duct of the chuck device 110, so that when the chuck device 110 breaks the vacuum of the plate and the potential difference exceeds the pre-stored calibration value, the controller will send an opening discharge instruction to the ion generator 140, so that the ion generator 140 opens the discharge, and then injects ions into the vacuum breaking airflow in the air duct to make it become ion wind that can neutralize the accumulated charge, thereby effectively eliminating the charge accumulation between the chuck device 110 and the plate due to friction, not only avoiding the damage of static electricity to the electronic devices on the machine, but also significantly improving the efficiency and persistence of static protection, achieving the purpose of simplifying the structure and saving the cost.

[0080] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example.

[0081] Although the embodiments of the utility model have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A chuck potential monitoring system for a maskless direct-write lithography exposure machine, characterized in that, include: A suction cup device is used to support the sheet material to be processed, and the suction cup device is provided with an air duct; An electric potential sensor is disposed on the suction cup device to monitor the potential difference between the suction cup device and the plate. A switch assembly is disposed on the air duct of the suction cup device; An ion generator is installed on the air duct of the suction cup device and connected in series with the switch assembly; The controller, connected to the potential sensor, the switching assembly, and the ion generator, controls the on / off state of the switching assembly by sending a vacuum suction command or a vacuum breaking command, thereby controlling the airflow direction of the air duct and controlling the suction cup device to enter a vacuum suction state or a vacuum breaking state to achieve the adsorption or separation function of the plate. The controller also receives the currently monitored potential difference from the potential sensor and, when the suction cup device enters the vacuum breaking state and the potential difference exceeds a pre-stored calibration value, sends an activation discharge command to the ion generator to activate the discharge, thereby injecting ions into the vacuum-breaking airflow in the air duct to transform it into an ion wind capable of neutralizing accumulated charges.

2. The chuck potential monitoring system for a maskless direct-write lithography exposure machine according to claim 1, characterized in that, The suction cup device includes a suction cup body and a suction cup pad, the suction cup pad being disposed between the plate and the suction cup body, and the air duct connecting the suction cup body and the suction cup pad.

3. The chuck potential monitoring system for a maskless direct-write lithography exposure machine according to claim 2, characterized in that, include: A triggering device, connected to the controller, is used to send a board placement signal to the controller when the board is placed on the suction cup device.

4. The chuck potential monitoring system for a maskless direct-write lithography exposure machine according to claim 3, characterized in that, The controller is used for: Upon receiving the signal indicating that the plate has reached its position, a vacuum suction command is sent to the switching assembly to control the switching assembly to switch its current on / off state, thereby causing the suction cup device to enter the vacuum suction state.

5. The chuck potential monitoring system for a maskless direct-write lithography exposure machine according to claim 3, characterized in that, The controller is used for: After the exposure process is completed, the vacuum breaking command is sent to the switching component to control the switching component to switch its current on / off state, thereby causing the suction cup device to enter the vacuum breaking state.

6. The chuck potential monitoring system for a maskless direct-write lithography exposure machine according to claim 4 or 5, characterized in that, The switching assembly includes a first switch and a second switch: Upon receiving the vacuum suction command, the first switch switches to the ON state and the second switch switches to the OFF state, so that the suction cup device can vacuum the board through the air duct; Upon receiving the vacuum breaking command, the first switch is switched to the off state, and the second switch is controlled to switch to the on state, so that the suction cup device can break the vacuum on the board through the air duct.

7. The chuck potential monitoring system for a maskless direct-write lithography exposure machine according to claim 6, characterized in that, The first switch and the second switch are configured as solenoid valves.

8. The chuck potential monitoring system for a maskless direct-write lithography exposure machine according to claim 1, characterized in that, Also includes: An alarm device, connected to the controller, is used to issue an alarm signal when it receives an alarm command sent by the controller. The alarm command is issued by the controller when the potential difference exceeds the calibrated value.

9. The chuck potential monitoring system for a maskless direct-write lithography exposure machine according to claim 2, characterized in that, Also includes: A calibration ruler is mounted on the suction cup body, and a potential sensor is mounted on the calibration ruler. The height of the calibration ruler is equal to the height of the suction cup pad.

10. A direct-write lithography exposure machine, characterized in that, Includes the chuck potential monitoring system for a maskless direct-write lithography exposure machine as described in any one of claims 1-9.

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