Pressure touchpad and electronic equipment

Abstract

The embodiment of the utility model provides a pressure touchpad and electronic equipment, and the pressure touchpad part comprises a touch film which is arranged on the lower surface of a cover plate and is used for detecting the touch operation of the upper surface of the cover plate and generating a touch signal; the pressure sensor is used for detecting pressing operation on the upper surface of the cover plate and generating a pressure signal; the vibration mechanism is used for generating vibration feedback; the circuit board is arranged on the lower surface of the touch film and is provided with a touch interface connected with the touch film; the touch control module is connected with the touch interface and is used for processing the touch signal; the pressure interface is connected with the pressure sensor; the pressure processing module is connected with the pressure interface and is used for processing the pressure signal; the driving interface is connected with the vibration mechanism; and the driving module is connected with the driving interface and used for driving the vibration mechanism. The pressure touch panel is small in thickness and low in cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of pressure touch, in particular to a pressure touchpad and an electronic device. BACKGROUND

[0002] With the development of the notebook computer market, the touchpad, an important component of the notebook computer, is endowed with more requirements, such as adding a pressure sensor to detect the pressure when a finger is pressed, adding a vibration motor and other vibration mechanisms to provide a better interactive experience for users, and meanwhile, the structure of the whole machine is required to be light and thin. The pressure touchpad is the thickest part of the whole module in the motor area. Under the action of the pressure of the pressure touchpad, the position of the vibration motor is lower, and therefore, the module space required is larger. The thickness of the notebook computer tends to be thinner and thinner, and therefore, the thickness of the module is a great challenge, and thus, thinning becomes an important innovation direction of the pressure touchpad.

[0003] In the related art, the pressure touchpad uses a printed circuit board (PCB) as a touch sensor layer. The touch sensor is located on the PCB close to the cover plate side, and the devices are arranged on the back of the PCB through surface mounting technology to form a PCB assembly (PCBA). The shape of the PCBA is bound to the industrial design of a specific product, and the device area of the PCBA is consistent with the structure of the whole machine. Further, a vibration motor is arranged below the PCBA. As a result, the pressure touchpad in the related art is thick, and needs to be customized according to the industrial design of a specific product. UTILITY MODEL CONTENT

[0004] In view of the above problems, the embodiments of the present application provide a pressure touchpad and an electronic device to solve the above technical problems.

[0005] In a first aspect, the embodiments of the present application provide a pressure touchpad, comprising: a touch film arranged on the lower surface of a cover plate, used for detecting a touch operation acting on the upper surface of the cover plate and generating a touch signal; a pressure sensor used for detecting a pressing operation acting on the upper surface of the cover plate and generating a pressure signal; a vibration mechanism used for generating a vibration feedback; a circuit board arranged on the lower surface of the touch film, the circuit board being arranged with: a touch interface connected with the touch film; a touch control module connected with the touch interface, used for processing the touch signal; a pressure interface connected with the pressure sensor; a pressure processing module connected with the pressure interface, used for processing the pressure signal; a driving interface connected with the vibration mechanism; and a driving module connected with the driving interface, used for driving the vibration mechanism.

[0006] In some embodiments, the surface of the touch film is arranged with detection electrodes and pad portions connected to the detection electrodes, the pad portions being located at the edge of the lower surface of the touch film; and a touch interface is arranged on the circuit board near the edge of the pad portions.

[0007] In some embodiments, the touch film comprises: a film substrate, the upper surface of the film substrate being arranged with first detection electrodes, and the lower surface of the film substrate being arranged with second detection electrodes; a first pad portion connected to the first detection electrodes and arranged at a first side of the lower surface of the film substrate; a first connection line passing through the film substrate and connecting the first detection electrodes to the first pad portion; a second pad portion connected to the second detection electrodes and arranged at a second side of the lower surface of the film substrate; and wherein: the touch interface is located on the circuit board near one side of the first side or the second side and connected to the first pad portion and the second pad portion; or the touch interface comprises: a first touch interface located on the circuit board near the first side and connected to the first pad portion through a first connection assembly; and a second touch interface located on the circuit board near the second side and connected to the second pad portion through a second connection assembly.

[0008] In some embodiments, the pressure sensor comprises: first, second, third and fourth pressure detection assemblies located at the four corners of the film substrate, wherein the first and second pressure detection assemblies are adjacent, and the third and fourth pressure detection assemblies are adjacent; and the pressure interface comprises: a first pressure interface located on the circuit board near one side of the first and second pressure detection assemblies and connected to the first and second pressure detection assemblies through a first electrical connection assembly; and a second pressure interface located on the circuit board near one side of the third and fourth pressure detection assemblies and connected to the third and fourth pressure detection assemblies through a second electrical connection assembly; the first electrical connection assembly comprises first and second connection ends connected to the first and second pressure detection assemblies, and a third connection end connected to the first pressure interface; and the second electrical connection assembly comprises first and second connection ends connected to the third and fourth pressure detection assemblies, and a third connection end connected to the second pressure interface.

[0009] In some embodiments, the vibration mechanism is arranged on the lower surface of the touch film in a misaligned manner with the circuit board; and the drive interface is located on the circuit board near the vibration mechanism.

[0010] In some embodiments, the pressure touchpad further comprises: a power interface for connecting a power supply to supply power to the pressure touchpad; a communication interface connected to at least one of the touch control module, the pressure processing module and the drive module, for communicating with an external circuit; and a conversion board arranged with a conversion interface for matching at least one of the power interface and the communication interface with an external interface.

[0011] In some embodiments, the conversion board is mounted on the circuit board or the external circuit by surface mounting technology.

[0012] In some embodiments, the pressure interface includes: a first pressure interface located on a first side of the circuit board; a second pressure interface located on a second side of the circuit board, the first side and the second side being opposite sides; the power interface and the communication interface are located on a third side of the circuit board, the third side being a side of the circuit board close to the external circuit; the touch control interface is located on the second side or a fourth side of the circuit board; or the touch control interface includes a first touch control interface located on the second side of the circuit board and a second touch control interface located on the fourth side of the circuit board; wherein the second side and / or the fourth side of the circuit board is close to the pad part of the touch film.

[0013] In some embodiments, the touch control module and the pressure processing module are integrated in a first chip, the first chip being a microcontroller or a touch chip; the driving module is integrated in a second chip, the second chip being in communication connection with the first chip.

[0014] In some embodiments, the length of the circuit board is between 50mm and 80mm, and the width is between 12mm and 50mm.

[0015] In a second aspect, the embodiments of the present application provide an electronic device, including a device main body and a pressure touch panel as described above arranged on the device main body.

[0016] The pressure touch panel provided by the embodiments of the present application separates the touch sensor from the circuit board, so that the circuit board does not need to be bound to the industrial design of a specific product, and the material cost and design cost of the circuit board can be reduced; compared with the PCBA touch panel, the touch film can reduce the thickness of the touch panel. The circuit board is designed for multiple products, which can reduce the design difficulty, storage difficulty and cost. In summary, the pressure touch panel of the embodiments of the present application can detect touch and pressure and generate vibration feedback, and has a small thickness and a low cost.

[0017] These and other aspects of the present application will become more apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0019] Figure 1 The structural schematic diagram of an electronic device to which the technical solutions of the embodiments of the present application can be applied is shown.

[0020] Figure 2A structural schematic diagram of a touch device to which the technical solutions of the embodiments of the present application can be applied is shown.

[0021] Figure 3 An exploded view of a pressure touchpad according to an embodiment of the present application is shown.

[0022] Figure 4 A layout diagram of a pressure touchpad according to an embodiment of the present application is shown.

[0023] Figure 5 A layout diagram of a circuit board according to an embodiment of the present application is shown.

[0024] Figure 6 A layout diagram of another circuit board according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0025] The embodiments of the present application will be described in detail below with reference to the drawings, in which the same or similar components are denoted by the same or similar reference numerals, and therefore repeated description is omitted. The embodiments described below are exemplary only, and are merely intended to explain the present application, and are not to be understood as limiting the present application.

[0026] To make the technical personnel in the art better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0027] In the embodiments of the present application, it should be noted that, in this document, relational terms such as first and second and the like are used solely to distinguish one entity or action from another entity or action, without necessarily requiring or implying any actual such relationship or order between or among the entities or actions.

[0028] Moreover, the terms "comprising", "comprises", "including", "includes" or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0029] In the description of the embodiments of the present application, the words "example" or "for example" or similar words are used to represent that the embodiments described are examples, illustration, or description. Any embodiment or design scheme described as "example" or "for example" in the embodiments of the present application is not interpreted as more preferred or having more advantages than another embodiment or design scheme. The words "example" or "for example" or similar words are intended to present a relative concept in a clear manner.

[0030] In addition, "multiple" in the embodiments of the present application refers to two or more, and therefore "multiple" in the embodiments of the present application can also be understood as "at least two". "At least one" can be understood as one or more, for example, understood as one, two or more. For example, including at least one means including one, two or more, and does not limit which ones are included, for example, including at least one of A, B and C, and the included can be A, B, C, A and B, A and C, B and C, or A and B and C.

[0031] It should be noted that in the embodiments of the present application, the association relationship of the associated objects described by "and / or" can represent three kinds of relationships, for example, A and / or B can represent the existence of A alone, the existence of A and B together, and the existence of B alone. In addition, the character " / ", if not specially stated, generally represents a "or" relationship between the associated objects before and after it.

[0032] It should be noted that in the embodiments of the present application, "connection" can be understood as electrical connection, and the connection between two electrical elements can be direct or indirect connection between the two electrical elements. For example, A and B are connected, which can be direct connection between A and B, or indirect connection between A and B through one or more other electrical elements.

[0033] Figure 1 The structure of an electronic device to which the technical solutions of the embodiments of the present application can be applied is shown in a schematic diagram, please refer to Figure 1 As shown, the typical hardware structure of the electronic device 100 can include a processor 101, a memory 102, a radio device 103, an audio output unit 104, an A / V input unit 105, a display unit 106, a user input unit 107, an interface unit 108, and a power supply 109. It should be understood that the electronic device 100 is not limited to the above-mentioned components. Figure 1 Only as an exemplary description of the embodiments of the present application, not as a limitation of the electronic device 100.

[0034] The display unit 106 includes various types of display panels and can display visual graphics, such as a graphical user interface (GUI). The user input unit 107 can include a keyboard, a mouse, etc. The audio output unit 104 includes a speaker, etc. The A / V input unit 105 includes an image processor 1051 and a microphone 1052.

[0035] Memory 102 can store data and instructions that can be executed on processor 101, including operating system 111, etc. (See reference) Figure 1 As shown, memory 102 stores one or more applications 110. The one or more applications 110 include weather, instant messaging, telephone, text messaging, email, or stocks, etc.

[0036] Please continue to refer to this. Figure 1 As shown in the embodiments of this application, the electronic device 100 also includes a touchpad 120. The touchpad 120 can detect touch operations and press operations, and generate vibration feedback based on touch operations and / or press operations. Specifically, in a laptop computer, the touchpad 120 can precisely control the position of the cursor on the display unit 106 through the sliding operation of a finger or stylus. For example, when editing a document, the cursor can be moved precisely to a specified text paragraph, facilitating operations such as inserting, deleting, and modifying text; in graphic design software, the cursor can also be accurately positioned to the graphic element that needs to be drawn or modified, just as accurately as moving the cursor with a mouse, only the operation method is more direct, achieving the corresponding displacement by sliding the finger on the surface of the touchpad 120. In some implementations, the right or left click operation of a mouse can also be simulated by lightly pressing the area below the touchpad 120 or by using a single finger to click the surface of the touchpad. In daily use, operations such as opening application icons on the desktop and selecting files or folders can be completed using this simulated right-click or left-click function, achieving the same effect as clicking with a mouse.

[0037] Figure 2 This diagram illustrates the structure of a touch device to which the technical solutions of this application are applicable. The touch device 200 can be an external touch control panel, such as... Figure 2 As shown, the touch device 200 includes a touch module 210 and a communication module 220. The touch module 210 detects touch operations and press operations, and generates vibration feedback based on the touch and / or press operations. The communication module 220 communicates with external electronic devices such as personal computers and tablets to use the touch device 200 as an electronic device (e.g.,...). Figure 1 The external touch input device of the electronic device 100 shown. The communication module 220 may include, but is not limited to, a wired interface such as a Universal Serial Bus (USB) interface, or a wireless interface such as Bluetooth, ZigBee, or Wi-Fi. In some implementations, the touch device 200 may also include a rechargeable battery. Figure 2 (Not shown in the image) is used to supply power to the touch module 210 and the communication module 220. In some implementations, the USB interface can transmit power from devices such as electronic devices.

[0038] In the related art, the touch panel 120, the touch layer and the device layer in the touch device 200 are integrated on a whole PCB, and the integrated PCBA needs to be customized according to the industrial design and structure of the product, which is not conducive to the universal design of multiple products, increases the risk of spare parts, and increases the difficulty of material storage and maintenance. The touch PCB is relatively thick, which is not conducive to the ultra-thin design of the whole machine structure. Therefore, the embodiments of the present application provide a pressure touch panel which can be applied to Figure 1 the touch panel 120 shown in Figure 2 the touch device 200 shown in.

[0039] Referring to Figure 3 and Figure 4 shown, Figure 3 and Figure 4 respectively show the exploded view and layout of the pressure touch panel provided by the embodiments of the present application, which includes a cover plate 301, a touch film 310, a pressure sensor 320, a vibration mechanism 330 and a circuit board 340. The cover plate 301 can include glass, plastic or glass fiber reinforced plastic composite materials. The touch film 310 is arranged on the lower surface of the cover plate 301, and the lower surface of the cover plate 301 can be fixed by a double-sided adhesive layer 302. The touch film 310 is used to detect the touch operation on the upper surface of the cover plate 301 and generate a touch signal, and the touch operation can be generated by a finger, a touch pen, etc. The shape and size of the touch film 310 and the cover plate 301 are adapted, specifically, if the cover plate 301 is rectangular, the length and width of the touch film 310 and the cover plate 301 are substantially equal. The pressure sensor 320 is used to detect the pressing operation on the upper surface of the cover plate 301 and generate a pressure signal. The vibration mechanism 330 is used to generate vibration feedback. The circuit board 340 is electrically connected with the touch film 310, the pressure sensor 320 and the vibration mechanism 330, and is used to process the touch signal, the pressure signal and control the vibration mechanism 330.

[0040] In some embodiments, referring to Figure 3 shown, the pressure touch panel further includes a bracket 360 for fixing the pressure touch panel. The bracket 360 is provided with a receiving space 361 for accommodating the vibration mechanism 330. The vibration mechanism 330 can be arranged in the receiving space 361. The vibration mechanism 330 has a relatively large thickness, and the lower surface of the circuit board 340 has a certain gap with the bracket 360, and the electronic elements of the circuit board 340 are arranged on the lower surface of the circuit board 340. The electronic elements include electronic elements for processing the touch signal of the touch film 310, electronic elements for processing the pressure signal of the pressure sensor 320, and electronic elements for controlling the vibration mechanism 330 to generate vibration feedback. These electronic elements can include discrete devices such as resistors, capacitors, etc., and small controllers, etc.

[0041] In the embodiment of the present application, the touch sensor is split into the touch film 310 and the circuit board 340, the touch film is adapted to the appearance of the pressure touch panel, the circuit board 340 is designed to be universal to be applicable to pressure touch panels with different appearances, and the touch signal processing, the pressure signal processing and the vibration mechanism control are implemented on the circuit board 340. Compared with the traditional pressure touch circuit board which is basically a 4-layer board due to the integration of the touch sensor, the circuit board 340 of the embodiment of the present application can adopt a 2-layer board, and the devices are arranged on a single side, which can meet the requirements and reduce the difficulty of stacking design. Specifically, as shown in Figure 5 and Figure 6 , Figure 5 and Figure 6 respectively show the layout of the circuit board 340, and the circuit board 340 is arranged with: a touch interface 341 connected with the touch film 310; a touch control module 342 connected with the touch interface 341 and used for processing a touch signal; a pressure interface 343 connected with the pressure sensor 320; a pressure processing module 344 connected with the pressure interface 343 and used for processing a pressure signal; a drive interface 345 connected with the vibration mechanism 330; and a drive module 346 connected with the drive interface 345 and used for driving the vibration mechanism 330. Optionally, the circuit board 340 can further be arranged with: a power supply interface 347 used for connecting a power supply to supply power to the pressure touch panel; and a communication interface 348 connected with at least one of the touch control module 342, the pressure processing module 344 and the drive module 346 and used for communicating with an external circuit. The external circuit can include but is not limited to a processor 101 as shown in Figure 1 , a communication module 220 as shown in Figure 2 , etc.

[0042] In a specific implementation, the touch interface 341, the pressure interface 343, the drive interface 345, the power supply interface 347 and the communication interface 348 can include connectors and pads, and each interface can be connected with a corresponding circuit module through an electrical connection assembly such as a flexible printed circuit (FPC) board. As shown in Figure 4 , the touch interface 341 is connected with the touch film 310 through the connection assembly 311. The pressure interface 343 is connected with the pressure sensor 320 through the electrical connection assembly 321. The drive interface 345 is connected with the vibration mechanism 330 through the connection line 331. The power supply interface 347 is connected with the power supply through the power supply line 371, and the communication interface 348 is connected with the external circuit through the signal line 372. In addition, the number of channels of the touch film 310 of different products is different, in order to be compatible with the touch film 310 with different numbers of channels, the touch interface 341 can have more pins, so that the circuit board 340 can be applicable to the touch film 310 with more and fewer numbers of channels.

[0043] Further, in consideration of matching with the external circuit, as shown inFigure 6 As shown, a conversion board 350 can also be provided, which is arranged with conversion interfaces for matching at least one of the power interface 347 and the communication interface 348 with an external interface. The conversion interfaces can include a power interface 351 adapted to the power interface 347 and a communication interface 352 adapted to the communication interface 348. In particular, the conversion board 350 can adapt the order of the pins, the position of the interfaces, etc. Reference is made to Figure 6 As shown, the conversion board 350 is surface mounted to the circuit board 340. In other implementations, the conversion board 350 can be surface mounted to an external circuit. This implementation greatly improves the versatility of the circuit board 340, and in particular applications, a conversion board 350 adapted to a particular product can be provided for the particular product.

[0044] In a specific implementation, the touch control module 342, the pressure processing module 344, and the driving module 346 can employ discrete chips. For example, the touch control module 342 can employ a dedicated touch chip, the driving module 346 can employ a dedicated driving chip, and the pressure processing module 344 can employ a microcontroller (MCU). Alternatively, the touch control module 342, the pressure processing module 344, and the driving module 346 can be at least partially integrated in the same chip. For example, the touch control module 342 and the pressure processing module 344 can be integrated in a first chip, which can be a microcontroller or a touch chip, and the driving module 346 can be integrated in a second chip, which can be a dedicated driving chip. The first chip and the second chip are communicatively connected. In some implementations, the touch control module 342, the pressure processing module 344, and the driving module 346 are all integrated in the same chip, such as a microcontroller. Integrating at least some of the modules can reduce the area of the circuit board 340. Moreover, integrating the touch control module 342 for detecting touch operations and the pressure processing module 344 for detecting press operations in the first chip allows the two modules to share the same clock source or to be precisely synchronized by an internal clock distribution network, which can enhance the synchronization of the pressure signals and the touch signals. The internal communication distance of the integrated chip is short, and the delay of signal transmission between the acquisition circuits is significantly reduced, which greatly reduces the signal transmission delay and improves the real-time performance of signal acquisition. Compared with using multiple separate chips, the number of chips is reduced, the required chip packaging space is reduced, and the connection lines between the chips are also reduced. The driving module 346 is integrated in the second chip, which can select a corresponding driving module according to the vibration mechanism, such as a linear resonant actuator (LRA), an eccentric rotating mass (ERM), a piezoelectric vibration motor, or a voice coil motor (VCM), thereby increasing the application scenarios of the pressure touchpad. In summary, integrating the touch control module 342 and the pressure processing module 344 in the first chip and integrating the driving module 346 in the second chip can improve the signal acquisition and transmission quality, increase the response speed of the pressure operations and the touch operations, and accommodate various application scenarios.

[0045] In a specific implementation, the touch control module 342 can communicate with an external circuit through the communication interface 348 to transmit the touch signal to the external circuit. The pressure processing module 344 can communicate with the driving module 346 to generate the vibration control parameter based on the pressure signal, and the driving module 346 controls the vibration mechanism 330 to generate the vibration feedback based on the vibration control parameter. In some implementations, the pressure processing module 344 can communicate with an external circuit through the communication interface 348 to transmit the pressure signal to the external circuit. Illustratively, the touch control module 342 and the pressure processing module 344 can be integrated in a microcontroller or a touch chip, which communicates with an external circuit through the communication interface 348, and which transmits the touch signal and the pressure signal to the external circuit through the communication interface 348. The microcontroller or the touch chip communicates with the driving module 346, and generates the vibration control parameter based on the pressure signal, and the driving module 346 controls the vibration mechanism 330 to generate the vibration feedback based on the vibration control parameter.

[0046] In some embodiments, reference is made to Figure 5 and Figure 6 As shown in the figures, the circuit board 340 is further arranged with a GND interface 349 connected with the touch film 310 and an ESD-GND (electrostatic discharge to ground) interface 3410 connected with the bracket 360. The ESD-GND interface 3410 safely conducts the electrostatic charge to the ground or the ground plane of the system through a grounding path to prevent the electrostatic from causing damage to the electronic device or the system. Specifically, the GND interface 349 and the ESD-GND interface 3410 are arranged at the edge of the circuit board 340, and the touch control module 342, the pressure processing module 344 and the driving module 346 are arranged at the middle of the circuit board 340. The touch film 310 and the GND interface 349 can be connected through a conductive cloth. The ESD-GND interface 3410 and the bracket 360 can be connected through a conductive cloth.

[0047] Further, the embodiments of the present application optimize the layout of the various interfaces and modules on the circuit board 340, so that the circuit board 340 meets the functional requirements and has a smaller size. The layout of the circuit board 340 is described below in conjunction with Figures 3 to 6

[0048] ​In some embodiments, the surface of the touch film 310 is arranged with detection electrodes and pad portions connected with the detection electrodes, and the pad portions are connected with the touch interface 341 through the connecting components 311. The pad portions are located at the edges of the touch film 310 to reduce the non-touch area of the touch film 310. The touch interface 341 is arranged on the circuit board 340 close to the edges of the pad portions, thereby shortening the line length of the connecting components 311, reducing the signal transmission delay, and improving the touch detection response speed. In this implementation, the touch film 310 is connected with the circuit board 340 through the corresponding connecting components at the adjacent sides, greatly reducing the line length and reducing the signal interference caused by line crossing. In a specific implementation, the touch film 310 can include a film substrate and detection electrodes formed on the surface of the film substrate. The detection electrodes can be made of at least one of indium tin oxide (ITO) or copper, nickel, gold, silver palladium and their alloys. The film substrate can be made of a polyethylene terephthalate (PET) substrate, a polyimide (PI) substrate or a polyethylene naphthalate (PEN) substrate.

[0049] In some implementations, the detection electrodes are formed on the upper surface of the film substrate (i.e., the surface of the touch film 310 close to the cover plate 301), and the detection electrodes have a stable capacitance value when there is no touch operation. When a finger is close to or touches the detection electrodes, the human body itself is also a conductor, which forms a new capacitive coupling with the detection electrodes, causing the capacitance value of the detection electrodes to change. The pad portions can be arranged in the long edge direction or the short edge direction of the touch film 310, and the touch interface 341 can be arranged on the circuit board 340 close to one side of the pad portions. The touch control module 342 of the circuit board 340 can detect these capacitance changes, and through certain algorithms, the position of the touch and other information can be calculated.

[0050] In some implementations, detection electrodes are formed on the upper surface (the surface close to the cover plate 301) and the lower surface (the surface away from the cover plate 301) of the film substrate, respectively referred to as first detection electrodes and second detection electrodes. The projections of the first detection electrodes and the second detection electrodes on the film substrate are staggered in the longitudinal direction and the transverse direction, the first detection electrodes serve as an array of sensing electrodes, and the second detection electrodes serve as an array of driving electrodes. When a finger touches, the finger touch changes the mutual capacitance between the driving electrodes and the sensing electrodes. The touch control module 342 of the circuit board 340 can send an excitation signal to the second detection electrodes, and then receive a response signal generated due to the change in mutual capacitance through the first detection electrodes. The circuit board 340 can process the response signal by amplification, filtering, etc., and then convert it into a digital signal. In some embodiments, in order to avoid the influence of other metal parts on the touch signal, a shielding layer is arranged on the second detection electrodes, which is used to shield the electromagnetic interference of the circuit board 340 and the like on the first detection electrodes and the second detection electrodes. The shielding layer can include an indium tin oxide (ITO) film, a steel sheet, a copper foil, or other conductive thin films.

[0051] Further, in some embodiments, in order to better fit the touch film 310 with the cover plate 301, the first detection electrodes located on the upper surface (i.e., the surface close to the cover plate 301) of the touch film 310 are connected to the lower surface (i.e., the surface away from the cover plate 301) of the touch film 310 through first connecting lines (not shown in the figure). Preferably, the first connecting lines can include a lead and a metallized via on the film substrate, and the lead connects the first detection electrodes to the metallized via. The connecting assembly 311 connects the touch film 310 to the circuit board 340 on the lower surface of the touch film 310. In specific implementations, the circuit board 340 and the touch film 310 can be connected through a Zero Insertion Force (ZIF) connector, or a separate flexible printed circuit (FPC) board can be used for connection. That is, the connecting assembly 311 can be a ZIF connector or an FPC board.

[0052] In further embodiments, the touch film 310 can include: a first pad portion (not shown in the figure) arranged on a first side of the lower surface of the film substrate; first connecting lines (not shown in the figure) passing through the film substrate to connect the first detection electrodes to the first pad portion; a first connecting assembly 311a connecting the first pad portion to a side of the circuit board 340 close to the first side; a second pad portion (not shown in the figure) arranged on a second side of the lower surface of the film substrate; second connecting lines (not shown in the figure) connecting the second detection electrodes to the second pad portion; and a second connecting assembly 311b connecting the second pad portion to a side of the circuit board 340 close to the second side. In some implementations, with reference to Figure 5 and Figure 6As shown, the touch interface 341 includes a first touch interface 341a located on the circuit board 340 close to the first side, the first touch interface 341a being connected with the first pad portion through the first connecting assembly 311a; and a second touch interface 341b located on the circuit board 340 close to the second side, the second touch interface 341b being connected with the second pad portion through the second connecting assembly 311b. In some implementations, the touch interface 341 is located on the circuit board 340 close to one of the first side or the second side, and is connected with the first pad portion and the second pad portion, i.e., the touch interface 341 on the circuit board 340 close to the first side or the second side is connected with the first detection electrode and the second detection electrode at the same time. Specifically, the first side can be one of the long side direction and the short side direction of the film substrate, and the second side can be the other of the long side direction and the short side direction of the film substrate. Referring to Figures 3 to 5 As shown, the first pad portion and the first connecting assembly 311a are located in the long side direction of the film substrate, and the second pad portion and the second connecting assembly 311b are located in the short side direction of the film substrate. The first touch interface 341a is located in the long side direction of the circuit board 340, and the second touch interface 341b is located in the short side direction of the circuit board 340.

[0053] In some embodiments, as shown in Figure 4 As shown, the touch film 310 also has an optical processing area S3, and an optical sensor is arranged below the optical processing area S3, and the optical processing area S3 can transmit specific light corresponding to the optical sensor. The optical sensor can include optical devices such as ultrasonic fingerprint with display icon and optical fingerprint sensor. In specific implementations, as shown in Figure 4 As shown, the optical processing area S3 can be arranged on the left side or the right side of the vibration mechanism 330 and the circuit board 340. In combination of the optical processing area S3 and the fingerprint application, the optical processing area S3 is preferably arranged on the left side of the device surface, i.e., on the right side of the touch panel from the touch surface, so that the unlocking can be conveniently performed by the right hand.

[0054] In some implementations, as shown in Figure 3 and 4 As shown, the pressure sensor 320 includes an electrical connecting assembly 321 and one or more pressure detection assemblies 322. The pressure detection assembly 322 is electrically connected with the electrical connecting assembly 321, and the pressure detection assembly 322 is used to detect the pressing operation and generate a pressure signal. The electrical connecting assembly 321 connects the pressure detection assembly 322 to the circuit board 340, and the electrical connecting assembly 321 is used to transmit the pressure signal generated by the pressure detection assembly 322, which can include an FPC board and the like.

[0055] Preferably, the pressure sensor 320 can include four pressure detection components 322, which are located at four corners of the pressure touchpad, respectively, a first pressure detection component 322a, a second pressure detection component 322b, a third pressure detection component 322c, and a fourth pressure detection component 322d. The first pressure detection component 322a is adjacent to the second pressure detection component 322b, and is connected to the circuit board 340 through a first electrical connection component 321a, which includes a first connection end connected to the first pressure detection component 322a, a second connection end connected to the second pressure detection component 322b, and a third connection end connected to the circuit board 340. The third pressure detection component 322c is adjacent to the fourth pressure detection component 322c, and is connected to the circuit board 340 through a second electrical connection component 321b, which includes a first connection end connected to the third pressure detection component 322c, a second connection end connected to the fourth pressure detection component 322d, and a third connection end connected to the circuit board 340. Further, as shown in FIGS. 15 and 17, the pressure interface 343 of the circuit board 340 includes a first pressure interface 343a on one side of the circuit board 340 close to the first and second pressure detection components, connected to the first and second pressure detection components through the first electrical connection component 321a, and a second pressure interface 343b on one side of the circuit board 340 close to the third and fourth pressure detection components, connected to the third and fourth pressure detection components through the second electrical connection component 321b. The first electrical connection component 321a and the second electrical connection component 321b can be FPC boards. Figure 5 and 6 The first electrical connection component 321a and the second electrical connection component 321b can be FPC boards.

[0056] In some implementations, the pressure detection component 322 can be a capacitive pressure detection component, which specifically includes a pressure sensing element and a fixed plate. The pressure sensing element is usually an elastic diaphragm made of metal film or silicon wafer, which serves as one plate of the capacitor and deforms under pressure, thereby changing the parameters of the capacitor. An insulating layer is provided between the pressure sensing element and the fixed plate to isolate the plates and prevent short circuits, and at the same time serves as part of the dielectric, whose material and thickness have an important influence on the capacitor characteristics. Pressure acting on the pressure sensing element causes displacement, resulting in a change in the distance between the plates, or a change in the effective area of the plates, or a change in the dielectric constant of the dielectric, thereby causing a change in the capacitance value. The pressure processing module 344 can calculate the pressure acting on the plate by measuring the change in the capacitance value.

[0057] In some implementations, the pressure detection component 322 can be a stress detection component, which specifically can include a resistance strain gauge and a measurement circuit. The resistance strain gauge deforms with pressure, and the resistance change is converted into a voltage or current signal output by the pressure processing module 344.

[0058] In the embodiments of the present application, the area of the circuit board 340 is reduced by optimizing the layout of the circuit board 340, and the pressure sensor 320 and the vibration mechanism 330 can be arranged in a staggered manner under the lower surface of the touch film 310. Specifically, the length of the circuit board 340 is less than the length of the touch film 310, and the width of the circuit board 340 is less than the width of the touch film 310. Preferably, the length of the circuit board 340 is at least 1 / 2 of the length of the touch film 310, and the width of the circuit board 340 is at least 3 / 10 of the width of the touch film 310. Further, the circuit board 340 is arranged in a staggered manner with the vibration mechanism 330 under the lower surface of the touch film 310, thereby greatly reducing the thickness of the touch module. The vibration mechanism 330 and the circuit board 340 are arranged in a staggered manner under the lower surface of the touch film 310, and the driving interface 345 is located on the circuit board 340 close to the vibration mechanism 330, thereby shortening the length of the connection line 331 between the driving interface 345 and the vibration mechanism 330. Referring to Figure 4 As shown, the vibration mechanism 330 is located in a second region S2 on the upper side of the lower surface of the touch film 310, the circuit board 340 is located in a first region S1 on the lower side of the lower surface of the touch film 310, and the driving interface 345 is located on the upper left side of the circuit board 340, adjacent to the lower left side of the vibration mechanism 330. In a specific implementation, since the area of the circuit board 340 is reduced, the vibration mechanism 330 can be arranged close to the center of the pressure touch plate while being arranged in a staggered manner with the circuit board 340, i.e., the second region S2 is close to the center of the touch film 310 and the cover plate 301. In this way, the experience of vibration feedback can be improved.

[0059] In some specific implementations, the vibration mechanism 330 includes a linear motor, and the vibration mechanism 330 is arranged under the lower surface of the touch film 310. The driving module 346 can control the linear motor to generate vibration feedback. In other embodiments, the vibration mechanism 330 includes a voice coil motor, the coil of the voice coil motor is arranged under the lower surface of the touch film 310, the magnet of the voice coil motor is arranged on the support 360 and located below the coil, and there is a gap between the coil and the magnet. In the voice coil motor, a stable magnetic field is usually generated by the magnet. The driving module 346 can pass current through the coil, and the coil moves in the magnetic field due to the action of the Ampere force. Specifically, a linear voice coil motor is used, and the coil moves linearly along the axial direction.

[0060] In some embodiments, test points are provided on the circuit board 340, as shown in Figure 5 As shown, the test points are circular openings. The number and position of the test points can be set according to the test requirements, and reducing the number of test points can reduce the area of the circuit board 340. In a specific implementation, more test points can be set during the debugging stage to perform more comprehensive testing, and fewer test points can be set during the mass production stage to reduce the area of the circuit board 340. Referring to Figure 5 andFigure 6 As shown, Figure 5 The circuit board shown does not include test points. Figure 6 A circuit board containing test points is shown.

[0061] As a typical implementation method, refer to Figure 5 and Figure 6 As shown, since pressure detection components are distributed at the four corners of the pressure touchpad, arranging the pressure interfaces 343 on both sides of the circuit board 340 can reduce the line length. Specifically, the pressure interfaces 343 include a first pressure interface 343a, located on the first side of the circuit board 340; and a second pressure interface 343b, located on the second side of the circuit board 340. The first and second sides of the circuit board 340 are opposite sides, specifically along the shorter side of the circuit board 340. The power interface 347 and the communication interface 348 are located on the third side of the circuit board 340, which is the side of the circuit board 340 closest to the external circuitry, specifically along the longer side of the circuit board 340. (Reference) Figure 5 As shown, the touch interface 341 includes a first touch interface 341a located on the second side of the circuit board 340, and a second touch interface 341b located on the fourth side of the circuit board 340, combined with Figure 3 and Figure 4 The second and fourth sides of the circuit board 340 shown are near the pads of the touch film 310, with the fourth side being the opposite side to the third side, specifically along the long side of the circuit board 340. Additionally, refer to... Figure 6 As shown, the touch interface 341 is located on the fourth side of the circuit board 340. (Continue to refer to...) Figure 5 and 6 As shown, placing the drive interface 345 in the upper left corner of the circuit board 340 reduces the amount of wiring required to connect to the vibration mechanism 330. In this embodiment, the circuit board 340 has a length between 50mm and 80mm and a width between 12mm and 50mm, resulting in a smaller area.

[0062] This application also provides an electronic device, including a pressure touchpad and a processing unit. The pressure touchpad is connected to the processing unit of the electronic device, and transmits processed touch signals and pressure signals to the processing unit for processing. The processing unit can generate feedback control signals based on the pressure signals and touch signals, and the circuit board of the pressure touchpad can control a vibration mechanism to generate vibration feedback based on the feedback control signals. The electronic device may include... Figure 1In the illustrated electronic device 100, the circuit board 340 can be connected to the processor 101 through an electrical connection assembly, the processor 101 receives the touch signal and the pressure signal processed by the circuit board 340, generates a feedback control signal according to the pressure signal and the touch signal, and the circuit board 340 can control the vibration mechanism 330 to generate vibration feedback according to the feedback control signal. In some implementations, the circuit board 340 can be connected to an embedded controller (EC) of the electronic device 100, and the processor 101 is connected to the embedded controller. The embedded controller receives the touch signal and the pressure signal processed by the circuit board 340, transmits the touch signal and the pressure signal to the processor 101, and generates a feedback control signal according to the pressure signal and the touch signal, and the circuit board 340 can control the vibration mechanism 330 to generate vibration feedback according to the feedback control signal.

[0063] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as above with a preferred embodiment, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of the present application. Any modification, equivalent change and modification of the above embodiments made according to the technical essence of the present application, without departing from the technical solution of the present application, are still within the scope of the technical solution of the present application.

Claims

1. A pressure-sensitive touchpad, characterized in that, include: A touch film is disposed on the lower surface of the cover plate to detect touch operations applied to the upper surface of the cover plate and generate touch signals; A pressure sensor is used to detect pressing operations applied to the upper surface of the cover plate and generate a pressure signal; Vibration mechanisms used to generate vibration feedback; A circuit board is disposed on the lower surface of the touch film, and the circuit board is provided with: A touch interface, connected to the touch film; A touch control module, connected to the touch interface, is used to process the touch signals; A pressure interface is connected to the pressure sensor. A pressure processing module, connected to the pressure interface, is used to process the pressure signal; The drive interface is connected to the vibration mechanism; A drive module, connected to the drive interface, is used to drive the vibration mechanism.

2. The pressure touch panel as described in claim 1, characterized in that, The surface of the touch film is provided with detection electrodes and pads connected to the detection electrodes, and the pads are located at the edge of the lower surface of the touch film. The touch interface is located on the edge of the circuit board near the pad portion.

3. The pressure touch panel as described in claim 2, characterized in that, The touch film includes: A film substrate, wherein a first detection electrode is arranged on the upper surface of the film substrate and a second detection electrode is arranged on the lower surface of the film substrate; The first pad portion is connected to the first detection electrode and is arranged on the first side of the lower surface of the film substrate; A first connection line passes through the film substrate and connects the first detection electrode to the first pad portion; The second pad portion is connected to the second detection electrode and is arranged on the second side of the lower surface of the film substrate; in: The touch interface is located on the circuit board near either the first or the second side, and is connected to the first pad portion and the second pad portion; or The touch interface includes: a first touch interface located on the circuit board near the first side, the first touch interface being connected to the first pad portion via a first connecting component; and a second touch interface located on the circuit board near the second side, the second touch interface being connected to the second pad portion via a second connecting component.

4. The pressure touch panel as described in claim 1, characterized in that, The pressure sensor includes: first, second, third and fourth pressure detection components located at the four corners of the touch film, wherein the first and second pressure detection components are adjacent to each other, and the third and fourth pressure detection components are adjacent to each other; The pressure interface includes: a first pressure interface located on the side of the circuit board near the first and second pressure detection components, which is connected to the first and second pressure detection components via a first electrical connection component; and a second pressure interface located on the side of the circuit board near the third and fourth pressure detection components, which is connected to the third and fourth pressure detection components via a second electrical connection component. The first electrical connection assembly includes first and second connection ends connected to the first and second pressure detection assemblies, and a third connection end connected to the first pressure interface; The second electrical connection assembly includes first and second connection terminals connected to the third and fourth pressure detection assemblies, and a third connection terminal connected to the second pressure interface.

5. The pressure touch panel as described in claim 1, characterized in that, The vibration mechanism is offset from the circuit board and is arranged on the lower surface of the touch film; The drive interface is located on the circuit board near the vibration mechanism.

6. The pressure touch panel as described in claim 1, characterized in that, Also includes: A power interface for connecting a power source to supply power to the pressure touchpad; A communication interface is connected to at least one of the touch control module, pressure processing module, and drive module, and is used to communicate with external circuits. The adapter board is provided with an adapter interface for matching at least one of the power interface and the communication interface with an external interface.

7. The pressure touch panel as described in claim 6, characterized in that, The adapter board is mounted on the circuit board or the external circuit using surface mount technology.

8. The pressure touch panel as described in claim 6, characterized in that, The pressure interface includes: a first pressure interface located on a first side of the circuit board; and a second pressure interface located on a second side of the circuit board, wherein the first side and the second side of the circuit board are opposite sides. The power interface and the communication interface are located on the third side of the circuit board, which is the side of the circuit board closest to the external circuit. The touch interface is located on the second or fourth side of the circuit board; or the touch interface includes a first touch interface located on the second side of the circuit board and a second touch interface located on the fourth side of the circuit board; wherein the second and / or fourth sides of the circuit board are close to the pad portion of the touch film.

9. The pressure touch panel as described in claim 1, characterized in that, The touch control module and the pressure processing module are integrated into a first chip, which is a microcontroller or a touch chip. The driver module is integrated into the second chip, and the second chip is communicatively connected to the first chip.

10. The pressure touch panel as described in any one of claims 1 to 9, characterized in that, The length of the circuit board is between 50mm and 80mm, and the width is between 12mm and 50mm.

11. An electronic device, characterized in that, It includes a device body and a pressure touch panel disposed on the device body as described in any one of claims 1 to 10 above.

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