Foam back adhesive multilayer insulation structure
Through a multi-layered structural design, including a foam body, a composite insulation layer, and a thermally conductive silicone pad, the problems of poor insulation performance, insufficient heat dissipation performance, and limited shock absorption effect of foam tape are solved, achieving better protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-14
- Publication Date
- 2026-03-24
AI Technical Summary
Existing foam tapes have poor insulation performance, insufficient heat dissipation performance, and limited shock absorption effect, making it difficult to provide comprehensive protection for electronic components.
It adopts a multi-layer structure design, including a foam body, a composite insulation layer, a thermally conductive silicone pad, and a high-elastic rubber layer. The composite insulation layer improves insulation performance, the thermally conductive silicone pad enhances heat dissipation, and the combination of the foam body and the rubber layer improves shock absorption.
It improves the insulation and heat dissipation performance of foam tape, while enhancing shock absorption and providing all-round protection.
Smart Images
Figure CN224030917U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of foam, especially to a foam back adhesive multilayer insulation structure. BACKGROUND
[0002] Foam is a kind of plastic particle foaming material, in the electronic equipment field, often be made into foam tape, be used for the protection of the electronic components in the equipment inside.But the existing foam tape has the following shortcomings when using: 1. the existing foam tape is generally insulated by single-layer insulation structure, and its reliability is poor, and there is the risk of breakdown;2. the existing foam tape has poor heat dissipation performance, and the heat generated by the components during operation cannot be dissipated in time, resulting in overheating of the components, and thus affecting the operation efficiency and performance of the components;3. the existing foam tape only relies on the elasticity of the foam for shock absorption, and such single shock absorption method has very limited effect, and it is difficult to protect the electronic components in all directions. UTILITY MODEL CONTENTS
[0003] The utility model aims at providing a kind of foam back adhesive multilayer insulation structure to solve the problems raised in the above background.
[0004] To solve the above technical problems, the utility model provides the following technical scheme: a kind of foam back adhesive multilayer insulation structure, including foam body, the second adhesive layer is fixedly connected on the lower surface of the foam body, the high elastic rubber layer is fixedly connected on the lower surface of second adhesive layer, composite insulation layer is arranged on the lower surface of high elastic rubber layer, composite insulation layer includes third adhesive layer, polyester film and polyimide film, and the polyester film is fixedly connected on the lower surface of high elastic rubber layer, the third adhesive layer is fixedly connected on the lower surface of polyester film, the polyimide film is fixedly connected on the lower surface of third adhesive layer, the first heat-conducting silica gel pad is fixedly connected on the lower surface of polyimide film, the second heat-conducting silica gel pad is fixedly connected on the lower surface of first heat-conducting silica gel pad, the third heat-conducting silica gel pad is fixedly connected on the lower surface of second heat-conducting silica gel pad, the fourth adhesive layer is fixedly connected on the lower surface of third heat-conducting silica gel pad, and the release film is fixedly connected on the lower surface of fourth adhesive layer.
[0005] Preferably, the third adhesive layer is a photosensitive adhesive layer, and the fourth adhesive layer is a pressure-sensitive adhesive layer.
[0006] Preferably, a plurality of first grooves are uniformly distributed on the lower surface of the foam body, a protruding rib is fixedly connected on the upper surface of the high elastic rubber layer at a position corresponding to the first grooves, and a first through hole is formed in the protruding rib.
[0007] Preferably, a first adhesive layer is fixedly connected on the upper surface of the foam body, and a polyethylene film is fixedly connected on the upper surface of the first adhesive layer.
[0008] Preferably, a plurality of second through holes are uniformly distributed on the first heat-conducting silica gel pad, and a plurality of third through holes are uniformly distributed on the second heat-conducting silica gel pad.
[0009] Preferably, the third heat-conducting silica gel pad is uniformly provided with a plurality of second grooves on the lower surface.
[0010] The foam back adhesive multilayer insulation structure has the advantages that: the composite insulation layer is added, the composite insulation layer improves the insulation performance of the product by using the polyester film combined with the polyimide film; the heat dissipation performance of the product is effectively improved by adding the heat-conducting silica gel pad and the through hole and the groove on the heat-conducting silica gel pad; the shock absorption performance of the product is improved by the combination of the foam body, the high-elastic rubber layer and the heat-conducting silica gel pad, and the hole and groove structure on the high-elastic rubber layer and the heat-conducting silica gel pad can further improve the elasticity of the product. BRIEF DESCRIPTION OF DRAWINGS
[0011] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0012] Figure 1 It is a whole three-dimensional cut structure schematic view of the present application;
[0013] Figure 2 It is a foam body three-dimensional cut structure schematic view of the present application;
[0014] Figure 3 It is a whole side view cut structure schematic view of the present application.
[0015] In the figure: 1, foam body; 11, first groove; 12, first adhesive layer; 13, polyethylene film; 14, second adhesive layer; 15, high-elastic rubber layer; 16, convex rib; 17, first through hole; 2, composite insulation layer; 21, third adhesive layer; 22, polyester film; 23, polyimide film; 3, first heat-conducting silica gel pad; 31, second through hole; 32, second heat-conducting silica gel pad; 33, third through hole; 34, third heat-conducting silica gel pad; 35, second groove; 36, fourth adhesive layer; 37, release film. DETAILED DESCRIPTION
[0016] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without creative labor belong to the protection scope of the utility model.
[0017] Please refer to the drawings Figure 1 - the drawings Figure 3The utility model provides an embodiment: a kind of foam back glue multilayer insulation structure, including foam body 1, the lower surface of foam body 1 is fixedly connected with second adhesive layer 14, the lower surface of second adhesive layer 14 is fixedly connected with high elastic rubber layer 15, high elastic rubber layer 15 lower surface is provided with composite insulation layer 2, composite insulation layer 2 includes third adhesive layer 21, polyester film 22 and polyimide film 23, and polyester film 22 is fixedly connected on high elastic rubber layer 15 lower surface, the lower surface of polyester film 22 is fixedly connected with third adhesive layer 21, the lower surface of third adhesive layer 21 is fixedly connected with polyimide film 23, the lower surface of polyimide film 23 is fixedly connected with first heat-conducting silica gel pad 3, the lower surface of first heat-conducting silica gel pad 3 is fixedly connected with second heat-conducting silica gel pad 32, the lower surface of second heat-conducting silica gel pad 32 is fixedly connected with third heat-conducting silica gel pad 34, the lower surface of third heat-conducting silica gel pad 34 is fixedly connected with fourth adhesive layer 36, the lower surface of fourth adhesive layer 36 is fixedly connected with release film 37, foam body 1, high elastic rubber layer 15, first heat-conducting silica gel pad 3, second heat-conducting silica gel pad 32 and third heat-conducting silica gel pad 34 are used to reduce shock, first heat-conducting silica gel pad 3, second heat-conducting silica gel pad 32 and third heat-conducting silica gel pad 34 are used to dissipate heat, polyimide film 23 and polyester film 22 are compounded by third adhesive layer 21, constitute composite insulation layer 2, to improve electrical insulation performance, second adhesive layer 14 is used to stick foam body 1 on high elastic rubber layer 15, fourth adhesive layer 36 is used to stick third heat-conducting silica gel pad 34 on electronic component, release film 37 is used to protect fourth adhesive layer 36;Third adhesive layer 21 is photosensitive adhesive layer, and fourth adhesive layer 36 is pressure-sensitive adhesive layer;The lower surface of foam body 1 is uniformly distributed with a plurality of first grooves 11, the upper surface of high elastic rubber layer 15 is fixedly connected with the lug 16 at the position corresponding to the first groove 11, the lug 16 is provided with first through-hole 17, and the first groove 11 cooperates with the lug 16, which can increase the sticking area of the foam body 1 and the high elastic rubber layer 15, and the first through-hole 17 is used for ventilation and heat dissipation, and also used to improve material elasticity;The upper surface of foam body 1 is fixedly connected with first adhesive layer 12, the upper surface of first adhesive layer 12 is fixedly connected with polyethylene film 13, and the first adhesive layer 12 is used to fix polyethylene film 13 on foam body 1, and the polyethylene film 13 is used to protect foam body 1;First heat-conducting silica gel pad 3 is uniformly distributed with a plurality of second through holes 31, and second heat-conducting silica gel pad 32 is uniformly distributed with a plurality of third through holes 33, and the second through hole 31 and the third through hole 33 are used for ventilation and heat dissipation, and also used to improve material elasticity;The lower surface of third heat-conducting silica gel pad 34 is uniformly distributed with a plurality of second grooves 35, and the second groove 35 is used for ventilation and heat dissipation, also used to improve elasticity, also used to reduce sticking area, convenient to tear down.
[0018] Working principle: in the utility model, the foam body 1, the high elastic rubber layer 15, the first heat-conducting silica gel pad 3, the second heat-conducting silica gel pad 32 and the third heat-conducting silica gel pad 34 realize the damping effect through the elasticity of itself, the first heat-conducting silica gel pad 3, the second heat-conducting silica gel pad 32 and the third heat-conducting silica gel pad 34 are also used to improve the heat dissipation effect, the first recess 11 cooperates with the convex rib 16, the first through hole 17, the second through hole 31, the third through hole 33 and the second recess 35 are used for air circulation, further improve the heat dissipation effect, also used to increase the deformation ability of material, so that the convex rib 16, the first heat-conducting silica gel pad 3, the second heat-conducting silica gel pad 32 and the third heat-conducting silica gel pad 34 show better elasticity, thereby improving the damping effect, the polyimide film 23 and the polyester film 22 are compounded through the third adhesive layer 21, and constitute a composite insulation layer 2, so as to improve the electrical insulation performance, the first adhesive layer 12 is used to fix the polyethylene film 13 on the foam body 1, the polyethylene film 13 is used to protect the foam body 1, the second adhesive layer 14 is used to paste the foam body 1 on the high elastic rubber layer 15, the fourth adhesive layer 36 is used to paste the third heat-conducting silica gel pad 34 on the electronic element, the second recess 35 can reduce the pasting area, tear off conveniently, reduce the difficulty of subsequent maintenance, the release film 37 is used to protect the fourth adhesive layer 36, and the release film 37 needs to be torn off before use;Wherein, the second through hole 31 and the third through hole 33 are horizontally and vertically staggered, and form a grid structure, so that the stress is more evenly transmitted and dispersed.
[0019] In the description of the utility model, it is necessary to explain that, unless there is definite stipulation and limitation, the terms "installation", "connection", "connection" should be understood broadly, for example, it can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be directly connected, also can be indirectly connected through intermediate medium, can be the communication of two elements inside. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0020] The device embodiments described above are only schematic, wherein the units illustrated as separate components can or can not be physically separate, and the components illustrated as units can or can not be physical units, i.e., can be located in one place, or can be distributed on multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment. Those skilled in the art can understand and implement without creative labor.
[0021] It should be finally pointed out that: the above examples are only used to illustrate the technical solutions of the utility model, and not to limit them; although the utility model has been explained in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.
Claims
1. A multilayer insulation structure of foam-backed adhesive comprising a foam body (1), characterized in that: The lower surface of the foam body (1) is fixedly connected with a second adhesive layer (14), the lower surface of the second adhesive layer (14) is fixedly connected with a high-elastic rubber layer (15), the lower surface of the high-elastic rubber layer (15) is provided with a composite insulation layer (2), the composite insulation layer (2) comprises a third adhesive layer (21), a polyester film (22) and a polyimide film (23), the polyester film (22) is fixedly connected to the lower surface of the high-elastic rubber layer (15), the lower surface of the polyester film (22) is fixedly connected with the third adhesive layer (21), the lower surface of the third adhesive layer (21) is fixedly connected with the polyimide film (23), the lower surface of the polyimide film (23) is fixedly connected with a first heat-conducting silica gel pad (3), the lower surface of the first heat-conducting silica gel pad (3) is fixedly connected with a second heat-conducting silica gel pad (32), the lower surface of the second heat-conducting silica gel pad (32) is fixedly connected with a third heat-conducting silica gel pad (34), the lower surface of the third heat-conducting silica gel pad (34) is fixedly connected with a fourth adhesive layer (36), and the lower surface of the fourth adhesive layer (36) is fixedly connected with a release film (37).
2. A multilayer insulation structure according to claim 1, wherein: The third adhesive layer (21) is a photosensitive adhesive layer, and the fourth adhesive layer (36) is a pressure-sensitive adhesive layer.
3. The foam-backed adhesive multilayer insulation structure of claim 1, wherein: The lower surface of the foam body (1) is uniformly provided with a plurality of first grooves (11), the upper surface of the high-elastic rubber layer (15) is fixedly connected with a protruding rib (16) at a position corresponding to the first grooves (11), and the protruding rib (16) is provided with a first through hole (17).
4. A multilayer insulation structure according to claim 3, wherein: The upper surface of the foam body (1) is fixedly connected with a first adhesive layer (12), and the upper surface of the first adhesive layer (12) is fixedly connected with a polyethylene film (13).
5. The foam-backed adhesive multilayer insulation structure of claim 1, wherein: The first heat-conducting silica gel pad (3) is uniformly provided with a plurality of second through holes (31), and the second heat-conducting silica gel pad (32) is uniformly provided with a plurality of third through holes (33).
6. The foam-backed adhesive multilayer insulation structure of claim 1, wherein: The lower surface of the third heat-conducting silica gel pad (34) is uniformly provided with a plurality of second grooves (35).