Air-cooled aluminum radiator
The air-cooled aluminum heatsink, with its copper-aluminum composite structure and gradient fin design, solves the problems of low thermal conductivity and turbulent airflow in aluminum heatsinks, achieving efficient and uniform heat management and multi-directional heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2026-03-24
AI Technical Summary
Existing aluminum heat sinks have low thermal conductivity in high-heat scenarios, making it difficult to quickly dissipate heat. Furthermore, the fin arrangement design leads to airflow turbulence and low heat dissipation area utilization, making it difficult to meet multi-directional heat dissipation requirements.
The air-cooled heat sink adopts a copper-aluminum composite structure. Copper heat pipes are embedded in the aluminum substrate and arranged in a multi-parallel layout. Combined with the gradient fin angle and height design, and wedge-shaped guide columns, it can achieve dynamic airflow path adjustment and uniform air volume distribution. Lateral heat dissipation is enhanced by trapezoidal fin groups and a four-way three-dimensional layout.
It significantly improves heat dissipation efficiency, maximizes heat dissipation area utilization, reduces wind resistance and avoids local heat accumulation, and ensures stable heat dissipation of electronic components in multiple directions.
Smart Images
Figure CN224037689U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to aluminium profile radiator technical field, especially relate to a air cooling aluminium material radiator. BACKGROUND
[0002] Aluminium material radiator is widely used in the heat dissipation field of electronic equipment because of its lightweight, easy processing and low cost advantages. The traditional aluminium radiator usually adopts the integrated design of substrate and fin, and realizes heat dissipation through increasing the heat dissipation area and forced air cooling. However, with the continuous improvement of the power density of electronic components, the inherent low thermal conductivity of aluminium material gradually becomes a bottleneck, especially in the high heat generation scenarios such as CPU and GPU, the pure aluminium radiator is difficult to quickly export heat, which easily leads to overheating, frequency reduction and even damage of the equipment.
[0003] The existing aluminium profile radiator fin is arranged at equal intervals and equal angles, and the airflow is easy to form turbulence or stagnation zone between the fins, the heat dissipation area utilization rate is low, and the heat dissipation structure design is concentrated on one side or both sides, which is difficult to meet the multi-directional heat dissipation demand inside the equipment. To solve the above problems, we propose an air cooling aluminium material radiator, which realizes efficient and uniform heat management through optimizing the layout of heat pipes, gradient fin layout and multi-directional heat dissipation design. SUMMARY
[0004] The utility model aims at providing a kind of air cooling aluminium material radiator, through copper-aluminium composite structure, gradient fin layout and multi-directional heat dissipation design, improve heat dissipation efficiency and airflow utilization rate.
[0005] To solve the above technical problems, the utility model provides an air cooling aluminium material radiator, which comprises a heat dissipation substrate, the heat dissipation substrate is made of aluminium and is in the shape of inverted "T", and a heat pipe groove is formed at one end of the heat dissipation substrate.
[0006] A heat pipe is embedded in the heat dissipation substrate along the heat pipe groove, the heat pipe is made of copper and has a sintered capillary structure, and multiple heat pipes are arranged in parallel and distributed evenly inside the heat dissipation substrate.
[0007] A main heat dissipation plate is arranged on the opposite sides of the heat dissipation substrate, which comprises a first fin group and a second fin group arranged on its surface, the first fin group and the second fin group are symmetrically arranged on both sides of the main heat dissipation plate, the included angle between the first fin group and the second fin group changes along the airflow direction, and the included angle near the fan end is smaller than that near the principle fan end.
[0008] A secondary heat dissipation plate is arranged on the other two sides of the heat dissipation substrate, which comprises a third fin group arranged on its surface.
[0009] Preferably, the heat dissipation substrate further comprises a fan mounting hole and a radiator mounting hole arranged on one side thereof, and a heat dissipation fan is fixed on one side of the heat dissipation substrate through the fan mounting hole.
[0010] Preferably, the heat pipe comprises an evaporation section arranged at the bottom of the heat dissipation base plate, and a condensation section arranged at one side of the evaporation section, and the heat pipe groove of the condensation section extends out of the heat dissipation base plate.
[0011] Preferably, the fin heights of the first fin group and the second fin group decrease along the airflow direction in a gradient manner, and a flow guide column is arranged between the two groups of fins, and the flow guide column has a wedge-shaped structure with a streamline-shaped outer wall.
[0012] Preferably, the third fin group has a trapezoidal cross section, the top thickness is 1 / 2 of the bottom thickness, and the fins of the third fin group are arranged in parallel to the airflow.
[0013] Preferably, the bottom of the heat dissipation base plate is provided with a heat-conducting silica gel layer, the heat-conducting silica gel layer is attached to the component to be cooled, and is fixed on the component to be cooled through the heat sink mounting hole.
[0014] Compared with the prior art, the air-cooled aluminum radiator has the following beneficial effects:
[0015] 1. The air-cooled aluminum radiator adopts a structure in which copper heat pipes are embedded in an aluminum base plate, the copper heat pipes are tightly embedded in the aluminum base plate through the copper-aluminum composite structure combined with the layout of multiple parallel heat pipes, the contact thermal resistance is significantly reduced, and the diffusion efficiency of heat from the heat source to the heat dissipation area is greatly improved by utilizing the rapid phase change heat transfer characteristics of the heat pipes;
[0016] 2. The main heat dissipation plate of the air-cooled aluminum radiator is designed with a gradient change of fin angles and fin heights along the airflow direction, and cooperates with the wedge-shaped flow guide column structure to dynamically adjust the airflow path, reduce turbulence, and uniformly distribute the air volume, so that the utilization rate of the heat dissipation area is maximized, and the air resistance during the operation of the fan is also reduced;
[0017] 3. The air-cooled aluminum radiator has a secondary heat dissipation plate based on the fin group with a trapezoidal cross section and a four-way three-dimensional heat dissipation layout, which strengthens the lateral heat dissipation capacity and cooperates with the main heat dissipation plate to effectively avoid local heat accumulation and ensure stable operation of electronic components in a multi-directional heat dissipation environment. BRIEF DESCRIPTION OF DRAWINGS
[0018] Fig. 1 is a schematic view of the overall structure of the air-cooled aluminum radiator provided by the present application;
[0019] Fig. 2 is a top view of the air-cooled aluminum radiator provided by the present application;
[0020] Fig. 3 is a C-C sectional view of the air-cooled aluminum radiator provided by the present application Fig. 2
[0021] Fig. 4 is a front view of the air-cooled aluminum material radiator provided by the utility model;
[0022] Fig. 5 is a structural schematic view of the main heat dissipation plate in the air-cooled aluminum material radiator provided by the utility model;
[0023] Fig. 6 is a structural schematic view of the secondary heat dissipation plate in the air-cooled aluminum material radiator provided by the utility model;
[0024] In the figure: 1, heat dissipation base plate; 101, heat pipe groove; 102, fan mounting hole; 103, radiator mounting hole; 2, heat pipe; 201, evaporation section; 202, condensation section; 3, main heat dissipation plate; 301, first fin group; 302, second fin group; 303, flow guide column; 4, secondary heat dissipation plate; 401, third fin group; 5, heat-conducting silica gel layer. DETAILED DESCRIPTION
[0025] The utility model will be made further detailed description in combination with the drawings and specific embodiments. According to the following description and claims, the advantages and features of the utility model will be more clear. It should be noted that the drawings are all very simplified and all use non-precise scale, only to facilitate, clearly assist the purpose of describing the embodiment of the utility model.
[0026] In the description of the utility model, it needs to be understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.
[0027] In the description of the utility model, it is necessary to explain, unless another explicit provision and limitation, term '' install '' '' link '' '' connection '' should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through intermediate medium, can be two elements inside the communication。For ordinary skilled person in the art, the above-mentioned terms can be understood by the specific meaning in the utility model through specific circumstances. Embodiment
[0028] The utility model provides a kind of air-cooled aluminium material radiator, please refer to Figs. 1-6 , including heat dissipation base plate 1, the heat dissipation base plate 1 is made of aluminium and is inverted '' T '' character, and one end is provided with heat pipe groove 101;Heat pipe 2, the heat pipe 2 is embedded in heat dissipation base plate 1 along heat pipe groove 101, and heat pipe 2 is copper sintered capillary structure, and multiple heat pipes 2 are arranged in parallel, and are evenly distributed in heat dissipation base plate 1;Main heat sink 3, the main heat sink 3 is arranged on the opposite sides of the heat dissipation base plate 1, including the first fin group 301 and the second fin group 302 arranged on its surface, the first fin group 301 and the second fin group 302 are symmetrically arranged on the two sides of main heat sink 3, the included angle between the first fin group 301 and the second fin group 302 is gradient change along airflow direction, and the included angle near fan end is smaller than the included angle of air outlet end;Secondary heat sink 4, the secondary heat sink 4 is arranged on the other two sides of the heat dissipation base plate 1, including the third fin group 401 arranged on its surface.
[0029] The heat dissipation base plate 1 further includes fan mounting hole 102 and radiator mounting hole 103 arranged on one side thereof, and the heat dissipation fan is fixed on one side of the heat dissipation base plate 1 through the fan mounting hole 102;The heat pipe 2 includes the evaporation section 201 arranged at the bottom of the heat dissipation base plate 1 and the condensation section 202 arranged on one side of the evaporation section 201, and the condensation section 202 heat pipe groove 101 extends out of the heat dissipation base plate 1;The fin height of the first fin group 301 and the second fin group 302 is gradient decrease along airflow direction, and the guide column 303 is arranged between the two groups of fins, and the guide column 303 is wedge-shaped structure with streamline outer wall;The third fin group 401 is trapezoidal in cross section, and the thickness of the top is 1 / 2 of the bottom, and the fins of the third fin group 401 are arranged in parallel to airflow;The bottom of the heat dissipation base plate 1 is provided with heat-conducting silica gel layer 5, and the heat-conducting silica gel layer 5 is attached to the component to be cooled and is fixed on the component to be cooled through the radiator mounting hole 103.
[0030] It should be noted that the heat dissipation substrate 1 is made of 6063 aluminum alloy and is shaped like an inverted "T" with a vertical section height of 30 mm and a horizontal section width of 80 mm. A square heat pipe slot 101 is formed on the upper surface of the substrate, and M4 fan mounting holes 102 are provided at both ends of the raised section of the substrate. Heat sink mounting holes 103 are formed at the four corners of the horizontal section of the substrate, and the substrate is rigidly connected to the fan and electronic components through bolts. The bottom plane is coated with a 1 mm thick layer of heat-conducting silicone 104 with a thermal conductivity of 8 W / m·K, which can tightly adhere to the surface of the CPU cover and eliminate the contact thermal resistance caused by the assembly gap.
[0031] Preferably, the heat pipe 2 has seven heat pipes arranged in parallel and evenly spaced. The heat pipe 2 includes an evaporation section 201 embedded in the bottom of the heat dissipation substrate by a pressing process, and a condensation section 202 extending upward through the top of the substrate. The condensation section 202 is exposed to air and does not directly contact the heat dissipation substrate 1. The internal structure of the heat pipe 2 is a copper sintered capillary structure with a 150-mesh copper powder sintered capillary structure. The working fluid filling amount is 20% of the cavity volume, achieving bidirectional high-efficiency heat transfer.
[0032] Preferably, the main heat dissipation plate 3 is symmetrically installed on both sides of the substrate and is made of 6061 aluminum alloy and processed by numerical control milling. The first fin group 301 and the second fin group 302 are arranged radially with the center line of the substrate as the symmetry axis. The first fin group 301 and the second fin group 302 are symmetrically arranged in a "V" shape with the center line of the main heat dissipation plate as the symmetry axis. The roots of the two fin groups are welded to the surface of the substrate, forming a three-dimensional heat dissipation channel extending along the airflow direction. The initial position is away from the fan side, and the initial angle between the two fin groups is 160 degrees. The angle gradually decreases to 40 degrees near the end position of the fan side, forming a gradually changing channel from wide to narrow. The fin height gradually decreases from 25 mm far from the fan to 18 mm at the end, and the thickness remains unchanged at 0.8 mm.
[0033] Preferably, a wedge-shaped flow guide column 303 is welded at the end of the airflow channel between the first fin group 301 and the second fin group 302. The windward side of the flow guide column is a streamline arc, and the tail end is expanded into a flat wing shape. Through the design of the gradient change of the angle and height between the flow guide column 303 and the fin group, the airflow can be uniformly diffused, the vortex can be reduced, the airflow resistance can be reduced, and local dead zones can be avoided.
[0034] Preferably, the secondary heat dissipation plate 4 is distributed on the front and rear sides of the substrate. The third fin group 401 adopts a trapezoidal cross-sectional design with a bottom thickness of 1.2 mm, a top narrowing to 0.6 mm, and a uniform height of 15 mm. The fin is arranged in a 90° orthogonal direction with the airflow direction, and the side turbulence intensity is increased to improve the utilization rate of the heat dissipation area.
[0035] In summary, the air-cooled aluminum material radiator improves the heat dissipation performance and energy efficiency by a plurality of innovative designs: firstly, the copper-aluminum composite structure technology is adopted, the copper heat pipe is closely embedded in the aluminum substrate to form a plurality of parallel layouts, the conduction efficiency of heat from the heat source to the heat dissipation area is greatly optimized by reducing the contact thermal resistance and combining the heat pipe fast phase change heat transfer characteristics; secondly, the airflow dynamics optimization scheme is introduced in the design of the main heat dissipation plate, the fin angle and height are adjusted along the airflow direction gradient, and the airflow path is dynamically guided by the wedge-shaped flow guide column, so that the turbulence is effectively reduced and the air volume is uniformly distributed, the wind resistance energy consumption is reduced while the utilization rate of the maximum heat dissipation area is maximized; in addition, the trapezoidal cross-section fin group and the four-way three-dimensional heat dissipation layout of the secondary heat dissipation plate form a cooperative heat dissipation network with the main heat dissipation plate, the lateral heat dissipation capacity is strengthened and the local heat accumulation is eliminated, so that the electronic components can maintain efficient and stable operation in a multidimensional heat dissipation environment, and the three technical features are mutually coordinated to jointly build an efficient and balanced heat dissipation system.
[0036] The above description is only a description of the preferred embodiment of the utility model, and does not limit the scope of the utility model, and any change or modification made by the ordinary skilled in the art according to the above disclosure is within the protection scope of the claims.
Claims
1. A wind-cooled aluminum heat sink, characterized in that, include: Heat dissipation substrate (1), the heat dissipation substrate (1) is made of aluminum and is in the shape of an inverted "T", and a heat pipe groove (101) is provided at one end. Heat pipe (2), the heat pipe (2) is embedded in the heat dissipation substrate (1) along the heat pipe groove (101), the heat pipe (2) is a copper sintered capillary structure, and multiple heat pipes (2) are arranged in parallel and evenly distributed inside the heat dissipation substrate (1). The main heat sink (3) is disposed on opposite sides of the heat sink substrate (1), including a first fin group (301) and a second fin group (302) disposed on its surface. The first fin group (301) and the second fin group (302) are symmetrically disposed on both sides of the main heat sink (3). The included angle between the first fin group (301) and the second fin group (302) varies in gradient along the airflow direction, and the included angle near the fan end is smaller than the included angle away from the fan end. Secondary heat sink (4), which is disposed on the other two sides of the heat sink substrate (1), includes a third fin group (401) disposed on its surface.
2. The air-cooled aluminum heat sink as described in claim 1, characterized in that, The heat dissipation substrate (1) also includes a fan mounting hole (102) and a heat sink mounting hole (103) disposed on one side thereof, and the heat dissipation fan is fixed to one side of the heat dissipation substrate (1) through the fan mounting hole (102).
3. The air-cooled aluminum heat sink as described in claim 1, characterized in that, The heat pipe (2) includes an evaporation section (201) disposed at the bottom of the heat dissipation substrate (1) and a condensation section (202) disposed on one side of the evaporation section (201), wherein the heat pipe groove (101) of the condensation section (202) extends out of the heat dissipation substrate (1).
4. The air-cooled aluminum heat sink as described in claim 1, characterized in that, The fin heights of the first fin group (301) and the second fin group (302) decrease gradually along the airflow direction, and a guide column (303) is provided between the two fin groups. The guide column (303) has a wedge-shaped structure with a streamlined outer wall.
5. A wind-cooled aluminum heat sink as described in claim 4, characterized in that, The third fin group (401) has a trapezoidal cross-section, with the top thickness being half the bottom thickness, and the fins of the third fin group (401) are arranged parallel to the airflow.
6. The air-cooled aluminum heat sink as described in claim 2, characterized in that, The heat dissipation substrate (1) has a thermally conductive silicone layer (5) at the bottom. The thermally conductive silicone layer (5) is attached to the component to be dissipated and fixed to the component to be dissipated through the heat sink mounting hole (103).