Full-duplex combined signal communication system

Abstract

The utility model discloses a full-duplex combined signal communication system which comprises a controller, a signal processing module and an execution module in communication connection with the signal processing module, and a low-speed transmission path and a high-speed transmission path are arranged between the controller and the signal processing module. The low-speed transmission path comprises a first low-speed OOK modulation and demodulation module, a non-contact coupler and a second low-speed OOK modulation and demodulation module which are connected in sequence, and the controller and the signal processing module carry out full-duplex communication through the low-speed transmission path; the high-speed transmission path comprises a first millimeter wave data transmission module and a second millimeter wave data transmission module which are matched with each other, and the signal processing module returns data to the controller through the high-speed transmission path. According to the full-duplex combined signal communication system, crosstalk between channels is improved, high-quality communication is achieved, complex full-duplex circuit and full-duplex antenna design does not need to be considered, and development cost and development difficulty are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to signal transmission technical field, especially in kind full duplex combination signal communication system. BACKGROUND

[0002] The data transmission of rotating parts generally adopts the scheme of slip ring to realize, but for the transmission of high-speed signals, the slip ring has the problem of unstable signals, in addition, the slip ring also has the problem of service life, with the wear of the sheet coating, the contact will be poor, and the signal quality will also deteriorate, in order to solve the problem, the non-contact data transmission scheme is proposed, such as optical coupling, capacitive coupling, millimeter wave and other non-contact data transmission schemes, among which the optical module has the defects of complex optical path design, high cost, high power consumption and being easily affected by dust and oil, the transmission rate of the capacitive coupling scheme is limited, and only low-speed data can be transmitted, and the millimeter wave scheme can solve the pain points of the above non-contact data transmission schemes, but the millimeter wave has certain difficulty in realizing full duplex communication, especially the crosstalk problem between channels. SUMMARY

[0003] The utility model solves the technical problem for: provide a kind of full duplex combination signal communication system, the full duplex combination signal communication system development difficulty is low and can realize high-speed high-quality data communication.

[0004] In order to solve the above technical problems, the utility model adopts the technical scheme as follows: a kind of full duplex combination signal communication system, including controller, signal processing module and the execution module being communicated with signal processing module, low-speed transmission path and high-speed transmission path are equipped between the controller and signal processing module, the low-speed transmission path includes the first low-speed OOK modulation demodulation module, non-contact coupler and second low-speed OOK modulation demodulation module connected in sequence, the first low-speed OOK modulation demodulation module is electrically connected with the controller, the second low-speed OOK modulation demodulation module is electrically connected with the signal processing module, the controller and the signal processing module carry out full duplex communication by the low-speed transmission path;The high-speed transmission path includes the first millimeter wave data transmission module and the second millimeter wave data transmission module matched, the first millimeter wave data transmission module is electrically connected with the controller, the second millimeter wave data transmission module is electrically connected with the signal processing module, and the signal processing module is transmitted back data to the controller by the high-speed transmission path.

[0005] In an embodiment, the first millimeter wave data transmission module includes a first millimeter wave chip and a first millimeter wave antenna electrically connected.

[0006] In an embodiment, the first millimeter wave chip and the first millimeter wave antenna are packaged and integrated together.

[0007] In an embodiment, the non-contact coupler comprises a first circuit board, a second circuit board, a first coupling element and a second coupling element, one of the first coupling element and one of the second coupling element are coupled to form a coupling structure, the first circuit board and the second circuit board are arranged oppositely, the first coupling element and the first millimeter wave data transmission module are arranged on the first circuit board, and the second coupling element and the second millimeter wave data transmission module are arranged on the second circuit board.

[0008] In an embodiment, the first circuit board is provided with a hole, and the first millimeter wave data transmission module is arranged at the hole.

[0009] In an embodiment, the number of the coupling structure is one or more groups.

[0010] In an embodiment, the non-contact coupler is a capacitive coupler, the first coupling element is a first metal electrode ring, the second coupling element is a second metal electrode ring, and the first millimeter wave data transmission module is located at the center of the first metal electrode ring.

[0011] In an embodiment, the non-contact coupler is a capacitive coupler, the first coupling element is a first metal electrode strip, and the second coupling element is a second metal electrode strip.

[0012] In an embodiment, the non-contact coupler is an electromagnetic coupler, and the first coupling element and the second coupling element are electromagnetic coils respectively.

[0013] In an embodiment, the non-contact coupler is an optical coupler, the first coupling element comprises an LED device and a PD device, the second coupling element comprises an LED device and a PD device, the LED device in the first coupling element cooperates with the PD device in the second coupling element, and the PD device in the first coupling element cooperates with the LED device in the second coupling element.

[0014] The full-duplex combined signal communication system has the advantages that: the full-duplex non-contact data transmission is realized by adopting millimeter wave and other non-contact communication technologies, specifically, the millimeter wave is adopted as a high-speed data transmission path, and other non-contact communication technologies are adopted as a low-speed data transmission path, the crosstalk between channels is improved, full-duplex high-quality communication is realized, the complicated full-duplex circuit and full-duplex antenna design are not needed, and the development cost and development difficulty are reduced.

[0015] The low-speed data transmission path can support full-duplex, and a non-contact coupling scheme, such as a capacitive coupling, a magnetic coupling, an optical coupling and the like, is adopted; the high-speed data transmission path adopts millimeter wave wireless communication technology, one-way communication, and is mainly used for large amount of data backhaul, and ensures the low delay requirement of data transmission. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained according to the structures shown in these drawings without creative labor.

[0017] Figure 1 The overall architecture diagram of the full-duplex combined signal communication system of the first embodiment of the present application;

[0018] Figure 2 The structure schematic diagram of the full-duplex combined signal communication system of the first embodiment of the present application;

[0019] Figure 3 The architecture diagram of the full-duplex combined signal communication system of the second embodiment of the present application;

[0020] Figure 4 The structure schematic diagram of the full-duplex combined signal communication system of the second embodiment of the present application Figure 1 ;

[0021] Figure 5 The front view of the first circuit board in the full-duplex combined signal communication system of the second embodiment of the present application (rotating part data communication scene);

[0022] Figure 6 The front view of the first circuit board in the full-duplex combined signal communication system of the second embodiment of the present application (fixed part data communication scene);

[0023] Figure 7 The architecture diagram of the full-duplex combined signal communication system of the third embodiment of the present application;

[0024] Figure 8 The front view of the first circuit board in the full-duplex combined signal communication system of the third embodiment of the present application;

[0025] Figure 9 The architecture diagram of the full-duplex combined signal communication system of the fourth embodiment of the present application;

[0026] Figure 10 The structure schematic diagram of the full-duplex combined signal communication system of the fourth embodiment of the present application;

[0027] Figure 11 The front view of the first circuit board in the full-duplex combined signal communication system of the fourth embodiment of the present application.

[0028] Explanation of the drawing reference numerals:

[0029] 1. controller;

[0030] 2. signal processing module;

[0031] 3. execution module;

[0032] 4. low-speed transmission path; 41, first low-speed OOK modulation and demodulation module; 42, non-contact coupler; 421, first circuit board; 4211, first hole; 422, first coupling piece; 423, second circuit board; 4231, second hole; 424, second coupling piece; 43, second low-speed OOK modulation and demodulation module;

[0033] 5. high-speed transmission path; 51, first millimeter wave data transmission module; 52, second millimeter wave data transmission module. DETAILED DESCRIPTION

[0034] The purposes, functional features and advantages of the utility model will be further described in combination with embodiments and with reference to the drawings.

[0035] The technical solutions in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0036] It should be noted that if the embodiments of the utility model involve directional indications such as up, down, left, right, front, back, etc., the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain specific posture such as shown in the drawings, and if the specific posture changes, the directional indications also change accordingly.

[0037] In addition, if the embodiments of the utility model involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include at least one feature.

[0038] In addition, the meaning of "and / or" appearing throughout the text is that it includes three parallel schemes, and "and / or" is taken as an example, including scheme, or scheme, or and simultaneously satisfied scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skill in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0039] In this application, unless otherwise expressly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and other terms should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0040] Embodiment one

[0041] Please refer to Figure 1 and Figure 2 Embodiment one of the utility model is: a full duplex combined signal communication system, including controller 1, signal processing module 2 and with signal processing module 2 communication connection's execution module 3, the controller 1 with signal processing module 2 between being equipped with low-speed transmission path 4 and high-speed transmission path 5, the low-speed transmission path 4 includes the first low-speed OOK modulation demodulation module 41, non-contact coupler 42 and second low-speed OOK modulation demodulation module 43 that are connected in sequence, the first low-speed OOK modulation demodulation module 41 with the controller 1 electric connection, second low-speed OOK modulation demodulation module 43 with signal processing module 2 electric connection, the controller 1 with signal processing module 2 is carried out full duplex communication through the low-speed transmission path 4;The high-speed transmission path 5 includes the first millimeter wave data transmission module 51 and the second millimeter wave data transmission module 52 that cooperate, the first millimeter wave data transmission module 51 with the controller 1 electric connection, the second millimeter wave data transmission module 52 with signal processing module 2 electric connection, signal processing module 2 is given back data to the controller 1 through the high-speed transmission path 5.

[0042] The first millimeter wave data transmission module 51 includes electrically connected first millimeter wave chip and first millimeter wave antenna, and the second millimeter wave data transmission module 52 includes electrically connected second millimeter wave chip and second millimeter wave antenna.

[0043] For the convenience of assembling the full duplex combined signal communication system, the first millimeter wave chip and the first millimeter wave antenna are preferably packaged and integrated together, and the second millimeter wave chip and the second millimeter wave antenna are also packaged and integrated together.

[0044] The non-contact coupler 42 comprises a first circuit board 421, a second circuit board 423, a first coupling member 422 and a second coupling member 424, one of the first coupling member 422 and one of the second coupling member 424 are coupled to form a coupling structure, the first circuit board 421 and the second circuit board 423 are arranged oppositely, the first coupling member 422 and the first millimeter wave data transmission module 51 are arranged on the first circuit board 421, and the second coupling member 424 and the second millimeter wave data transmission module 52 are arranged on the second circuit board 423.

[0045] It is easy to understand that each coupling structure forms a low-speed data transmission channel, and in an actual product, the number of coupling structures is one or more, and the number of low-speed data transmission channels can be increased or decreased by increasing or decreasing the number of coupling structures, so that the actual use demand of the user can be better met.

[0046] In one or more embodiments, the first millimeter wave data transmission module 51 is arranged on the surface of the first circuit board 421, and the second millimeter wave data transmission module 52 is arranged on the surface of the second circuit board 423. In order to reduce the distance between the first circuit board 421 and the second circuit board 423 and improve the reliability and stability of data transmission, the first circuit board 421 is provided with a first hole 4211, and the first millimeter wave data transmission module 51 is arranged at the first hole 4211. The second circuit board 423 is provided with a second hole 4231, and the second millimeter wave data transmission module 52 is arranged at the second hole 4231. In an actual product, the first millimeter wave data transmission module 51 can be connected to the back of the first circuit board 421 through a gold finger, and the second millimeter wave data transmission module 52 can be connected to the back of the second circuit board 423 through a gold finger.

[0047] Embodiment two

[0048] Please refer to Figures 3 to 6 The embodiment two of the utility model takes the non-contact coupler 42 as a capacitive coupler to further illustrate the technical scheme, in the embodiment, the non-contact coupler 42 is a capacitive coupler, and there are rotating part data communication scenarios and fixed part data communication scenarios.

[0049] As Figure 4 And Figure 5As shown, in a rotating component data communication scenario, the central axis of the first circuit board 421 coincides with the central axis of the second circuit board 423, and the first circuit board 421 is rotatable relative to the second circuit board 423. At this time, the first coupling member 422 is a first metal electrode ring, and the second coupling member 424 is a second metal electrode ring. The first millimeter-wave data transmission module 51 is located in the center of the first metal electrode ring, and the second millimeter-wave data transmission module 52 is located in the center of the second metal electrode ring. The first and second millimeter-wave antennas are circularly polarized antennas. A coupling capacitor is formed between the first and second metal electrode rings, and its capacitance does not change with rotation, thus ensuring the continuity of data transmission. The presence of the first hole 4211 and the second hole 4231 ensures that the distance between the first circuit board 421 and the second circuit board 423 is sufficiently small, which is beneficial for increasing the coupling capacitance and improving the reliability and stability of transmission.

[0050] like Figure 4 and Figure 6 As shown, in the fixed component data communication scenario, the first circuit board 421 and the second circuit board 423 do not move relative to each other. The first coupling member 422 is a first metal electrode strip, and the second coupling member 424 is a second metal electrode strip. At least one side of the first millimeter wave data transmission module 51 is provided with a plurality of first metal electrode strips. Optionally, the first millimeter wave data transmission module 51 is provided with first metal electrode strips on both sides.

[0051] Example 3

[0052] Please refer to Figure 7 and Figure 8 The third embodiment of this utility model uses a non-contact coupler 42 as an electromagnetic coupler to illustrate the technical solution in more detail: In this embodiment, the non-contact coupler 42 is an electromagnetic coupler, and the first coupling element 422 and the second coupling element 424 are electromagnetic coils, respectively.

[0053] Example 4

[0054] Please refer to Figures 9 to 11 The following is a more detailed description of the technical solution using a non-contact coupler 42 as an optical coupler in Embodiment 4 of this utility model: In this embodiment, the non-contact coupler 42 is an optical coupler, the first coupling element 422 includes an LED device and a PD device, the second coupling element 424 includes an LED device and a PD device, the LED device in the first coupling element 422 cooperates with the PD device in the second coupling element 424, and the PD device in the first coupling element 422 cooperates with the LED device in the second coupling element 424.

[0055] The above are only optional embodiments of the utility model, and do not limit the patent range of the utility model, and any equivalent structural transformation made by using the utility model specification and the contents of the drawings, or direct / indirect application in other related technical fields are included in the patent protection range of the utility model.

Claims

1. A full duplex combined signal communication system, characterized by: The application relates to a signal processing device, which comprises a controller, a signal processing module and an execution module in communication connection with the signal processing module, wherein a low-speed transmission path and a high-speed transmission path are arranged between the controller and the signal processing module, the low-speed transmission path comprises a first low-speed OOK modulation and demodulation module, a non-contact coupler and a second low-speed OOK modulation and demodulation module which are sequentially connected, the first low-speed OOK modulation and demodulation module is electrically connected with the controller, the second low-speed OOK modulation and demodulation module is electrically connected with the signal processing module, and the controller and the signal processing module perform full-duplex communication through the low-speed transmission path; the high-speed transmission path comprises a first millimeter wave data transmission module and a second millimeter wave data transmission module which are matched, the first millimeter wave data transmission module is electrically connected with the controller, the second millimeter wave data transmission module is electrically connected with the signal processing module, and the signal processing module transmits data back to the controller through the high-speed transmission path.

2. The full duplex combined signal communication system of claim 1, wherein: The first millimeter wave data transmission module comprises a first millimeter wave chip and a first millimeter wave antenna which are electrically connected.

3. The full duplex combined signal communication system of claim 2, wherein: The first millimeter wave chip and the first millimeter wave antenna are packaged and integrated together.

4. The full duplex combined signal communication system of claim 1, wherein: The non-contact coupler comprises a first circuit board, a second circuit board, a first coupling element and a second coupling element, one first coupling element and one second coupling element are coupled with each other to form a coupling structure, the first circuit board and the second circuit board are oppositely arranged, the first coupling element and the first millimeter wave data transmission module are arranged on the first circuit board, and the second coupling element and the second millimeter wave data transmission module are arranged on the second circuit board.

5. The full duplex combined signal communication system of claim 4, wherein: Holes are arranged on the first circuit board, and the first millimeter wave data transmission module is arranged at the holes.

6. The full duplex combined signal communication system of claim 4, wherein: The number of the coupling structures is one or more.

7. The full duplex combined signal communication system of claim 4, wherein: The non-contact coupler is a capacitive coupler, the first coupling element is a first metal electrode ring, the second coupling element is a second metal electrode ring, and the first millimeter wave data transmission module is located at the center of the first metal electrode ring.

8. The full duplex combined signal communication system of claim 4, wherein: The non-contact coupler is a capacitive coupler, the first coupling element is a first metal electrode strip, and the second coupling element is a second metal electrode strip.

9. The full duplex combined signal communication system of claim 4, wherein: The non-contact coupler is an electromagnetic coupler, and the first coupling element and the second coupling element are electromagnetic coils respectively.

10. The full duplex combined signal communication system of claim 4, wherein: The non-contact coupler is an optical coupler, the first coupling element comprises an LED device and a PD device, the second coupling element comprises an LED device and a PD device, the LED device in the first coupling element cooperates with the PD device in the second coupling element, and the PD device in the first coupling element cooperates with the LED device in the second coupling element.

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