Multi-path electric device structure and electric equipment

Abstract

The utility model relates to the technical field of heat dissipation of electric devices, in particular to a multi-path electric device structure and electric equipment, the multi-path electric device structure comprises a box body and a centrifugal fan, and the box body is provided with heat dissipation holes; the box body is internally provided with at least two accommodating cavities and a heat dissipation channel extending from the two accommodating cavities to the heat dissipation holes, and the heat dissipation channel is arranged between the at least two accommodating cavities in a penetrating manner; the centrifugal fan is arranged in the heat dissipation channel, and the centrifugal fan is configured to guide airflow in the at least two containing cavities to the heat dissipation channel. The utility model aims to provide a multi-path electric device structure, and aims to improve the heat dissipation efficiency of the multi-path electric device structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to power supply technical field especially relates to a kind of multi-path electric device structure and electric equipment. BACKGROUND

[0002] Multi-path electric device structure can be power supply device such as radio frequency power supply, single-phase alternating current power supply, taking radio frequency power supply as an example, radio frequency power supply is the power supply that can generate high-frequency alternating current, frequency 1KHz and above.Because radio frequency power supply has certain energy conversion rate, the conversion rate is generally in the range of 0.2-0.95%, the rest energy is converted into internal heat of circuit.

[0003] In related technologies, multi-path electric device structure includes box, electric device, heat conduction piece and other structures, heat conduction piece discharges the heat generated by electric device through the air outlet end of box to speed up the physical cooling of electric device, in this process, limited by the size of space inside box, all electric devices are centrally arranged, resulting in low overall heat dissipation efficiency of multi-path electric device structure. SUMMARY

[0004] The main purpose of the utility model is to provide a kind of multi-path electric device structure, to improve the heat dissipation efficiency of multi-path electric device structure.

[0005] To achieve the above-mentioned purpose, the multi-path electric device structure provided by the utility model comprises:

[0006] Box, the box is provided with a heat dissipation hole;The box has at least two accommodating cavities and a heat dissipation channel extending from the two accommodating cavities to the heat dissipation hole, the heat dissipation channel is arranged between the at least two accommodating cavities;And

[0007] Centrifugal fan, arranged in the heat dissipation channel, the centrifugal fan is configured to guide the airflow in the at least two accommodating cavities to the heat dissipation channel.

[0008] In an embodiment of the utility model, the multi-path electric device structure further comprises a heat dissipation piece, the heat dissipation piece is arranged in the heat dissipation channel, and the heat dissipation piece comprises a plurality of heat dissipation fins arranged at intervals, and a plurality of spaces between any adjacent heat dissipation fins form part of the heat dissipation channel.

[0009] In an embodiment of the utility model, the multi-path electric device structure further comprises a heat dissipation sealing piece, the heat dissipation sealing piece is enclosed in the heat dissipation channel between the heat dissipation piece and the heat dissipation hole and provides airtight seal.

[0010] In an embodiment of the utility model, the inner wall of the box is provided with an isolation layer, and the heat dissipation sealing piece abuts against the isolation layer.

[0011] In an embodiment of the utility model, the accommodating cavity includes a first accommodating cavity and a second accommodating cavity, the box is provided with a first air inlet communicating with the first accommodating cavity and a second air inlet communicating with the second accommodating cavity:

[0012] The axial flow fan includes at least two axial flow fans, is arranged between the first accommodating cavity and the first air inlet and covers the first air inlet, and is configured to guide air outside the box to the first accommodating cavity through the first air inlet.

[0013] The centrifugal fan includes at least two centrifugal fans and is further used to guide air outside the box to the second accommodating cavity through the second air inlet.

[0014] In an embodiment of the utility model, the first accommodating cavity and the second accommodating cavity are arranged in an up-down manner, the first air inlet is located at the top end of the box, and the second air inlet is located at the bottom of the box.

[0015] In an embodiment of the utility model, the multi-path electric device structure is provided with a radio frequency circuit board and a power supply assembly, the radio frequency circuit board is arranged opposite to the axial flow fan in the first accommodating cavity, and the power supply assembly is arranged opposite to the centrifugal fan in the second accommodating cavity.

[0016] In an embodiment of the utility model, the multi-path electric device structure further includes a heat conduction assembly connected to the radio frequency circuit board, the heat conduction assembly includes an upper support clamping the radio frequency circuit board in a vertical direction and a heat conduction sheet, the heat conduction sheet abuts against the heat dissipation piece of the heat dissipation channel, and is used to guide partial heat of the radio frequency circuit board to the heat dissipation channel.

[0017] In an embodiment of the utility model, the heat conduction sheet further includes a first heat conduction sheet and a second heat conduction sheet made of materials with different heat conduction coefficients, the first heat conduction sheet made of a material with a higher heat conduction coefficient is used to guide heat generated by high-heat electronic elements of the radio frequency circuit board to the heat dissipation channel.

[0018] The utility model further provides a kind of electric equipment, and the electric equipment includes the multi-path electric device structure.

[0019] The utility model discloses a technical scheme, multi -way electric device structure includes the box for containing multi -way power supply, is set up with the heat dissipation hole on the box, and the box has at least two containing cavities and the heat dissipation channel extending from two containing cavities to the heat dissipation hole, and the heat dissipation channel is arranged between at least two containing cavities. The containing cavity in the box is used for containing electric device, and the electric device can be power supply, circuit board, electric wire and the like electronic device, and the electronic device is electrified and produces certain heat, and thus, the limited space of the box is fully utilized to disperse each electric device, avoids the heat produced by electric device to concentrate in single area, prevents the heat stress of producing too big and leads to the box or other structure to be destroyed, further, the heat dissipation channel is located between two containing cavities, and the hot air in the containing cavity is guided to the heat dissipation channel through centrifugal fan, and the electric device in the at least two containing cavities distributed in the box is concentrated and heat conduction is carried out, is concentrated and is discharged from the heat dissipation hole of the box, thereby improving the cooling speed and heat dissipation efficiency of electric device. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to the structure shown in these drawings without creating labor.

[0021] Figure 1 The structure schematic diagram of an embodiment of the electric equipment provided by the utility model is shown in the figure.

[0022] Figure 2 The structure explosion map of an embodiment of the multi -way electric device structure provided by the utility model is shown in the figure.

[0023] Figure 3 The partial structure explosion map of an embodiment of the multi -way electric device structure provided by the utility model is shown in the figure.

[0024] Figure 4 The airflow direction schematic diagram of the multi -way electric device structure provided by the utility model is shown in the figure.

[0025] Explanation of reference numerals:

[0026] 10, box;10a, containing cavity;10b, heat dissipation channel;10c, heat dissipation hole;20, axial flow fan;30, centrifugal fan;40, heat dissipation piece;50, heat dissipation sealing piece;50a, heat gathering channel;60, radio frequency circuit board;70, power supply assembly;80, heat conduction sheet;81, first heat conduction sheet;82, second heat conduction sheet;90, upper support;91, first upper support;92, second upper support.

[0027] The purposes, functional features and advantages of the utility model will be further described in combination with embodiments with reference to the drawings. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the utility model.

[0029] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0030] In addition, if the embodiments of the utility model involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one feature. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B schemes are satisfied at the same time. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0031] Please refer to Figure 1 , Figure 1 It is a sectional view of an electric device with a multi-path electrical device structure proposed by the utility model, the multi-path electrical device structure is arranged in the interior of the electric device, the multi-path electrical device structure proposed by the utility model comprises:

[0032] The box body 10 is provided with a heat dissipation hole 10c; the box body 10 has at least two containing cavities 10a and a heat dissipation channel 10b extending from the two containing cavities 10a to the heat dissipation hole 10c, the heat dissipation channel 10b is arranged between the at least two containing cavities 10a; and

[0033] The centrifugal fan 30 is arranged in the heat dissipation channel 10b, and the centrifugal fan 30 is configured to guide the airflow in the at least two containing cavities 10a to the heat dissipation channel 10b.

[0034] The technical scheme of the utility model discloses, the containing space of multi -way electric device structure is split into the space area with at least three different functions, at least two containing cavities 10a in the box are used for containing electric device, and this electric device can be power supply, circuit board, electric wire etc. Electronic device generates certain heat when electrified, in this way, make full use of the limited space of box 10 and disperse each electric device, avoid the heat generated by electric device to concentrate in single area, prevent generating excessive thermal stress and lead to the destruction of box 10 or other structure, further, the heat dissipation channel 10b is defined as the channel extending from two containing cavities 10a to the heat dissipation hole 10c, and is used to concentrate the heat conduction of electric device in at least two containing cavities 10a, and then is discharged from the heat dissipation hole 10c of box 10. In the present application, the heat dissipation channel 10b is defined as the channel extending from two containing cavities 10a to the heat dissipation hole 10c, the centrifugal fan 30 is arranged in the heat dissipation channel 10b, the heat dissipation channel 10b includes at least two air inlets, each air inlet is communicated with one of two containing cavities 10a, and the hot air flow in at least two containing cavities 10a is sucked to the heat dissipation channel 10b by the centrifugal fan 30, and the electric device in the multi -way distribution of at least two containing cavities 10a is simultaneously concentrated heat conduction, and is discharged from the heat dissipation hole 10c of the box to the outside, so as to improve the cooling speed of electric device, and the centrifugal fan 30 is arranged at the position of the air inlet of the heat dissipation channel 10b, realizes the air flow of at least two containing cavities 10a is sucked to the heat dissipation channel 10b simultaneously, and the heat dissipation space layout is more compact.

[0035] The utility model discloses a kind of electric equipment including multi -way electric device structure, which can be medical and aesthetic medical equipment, such as radio frequency therapeutic instrument, ultrasonic equipment, laser equipment etc., according to the heat generation power of different kinds of power supply, circuit board etc. structure, the heat generation power required by corresponding axial flow fan and centrifugal fan is calculated, then the model of required fan is selected, which is not limited herein;With radio frequency therapeutic instrument as an example, the treatment head of radio frequency therapeutic instrument generates electromagnetic wave by the radio frequency power supply of multi -way electric device structure, makes the water molecule in tissue high-speed motion with polarity, generates heat (i.e. endogenous heat effect), makes protein coagulation at low temperature, loses activity, finally through the rejection of organism, makes it fall off, so as to achieve the purpose of treatment, to ensure that multi -way electric device structure can safely and stably provide power supply, improve the heat dissipation efficiency of multi -way electric device structure by improving heat dissipation structure.

[0036] Specifically, the box 10 comprising a multi-path electrical device structure, the box 10 is formed with structures for placing electrical devices and / or isolation plates, etc. to divide the internal space of the box 10 into at least two accommodating cavities 10a, the relative positions of any two adjacent accommodating cavities 10a in the box 10 are not limited and can be adaptively set according to the arrangement and distribution of electrical devices capable of generating heat in the multi-path electrical device structure, for example, the at least two accommodating cavities 10a can be arranged at any angle interval along the height, width, length of the box, and the specific arrangement positions of the at least two accommodating cavities 10a are not limited, and the side of the box 10 is provided with a heat dissipation hole 10c, and a heat dissipation channel 10b extends to the heat dissipation hole 10c. A centrifugal fan 30 is arranged in the heat dissipation channel 10b, and the centrifugal fan 30 is configured to guide the hot air flow in the at least two accommodating cavities 10a to the heat dissipation channel 10b, and then the hot air flow is discharged to the heat dissipation hole 10c formed in the side wall of the box 10 through the heat dissipation channel 10b, and finally discharged to the outside of the box 10.

[0037] In some embodiments, the multi-path electrical device structure is provided with a wind guide assembly comprising an axial fan 20 and a centrifugal fan 30, the box 10 is provided with an air inlet hole for external air to flow into the inside of the box 10, and the at least two accommodating cavities 10a comprise a first accommodating cavity 10a and a second accommodating cavity 10a, the top of the box 10 is provided with a first air inlet for communicating with the first accommodating cavity 10a, and the side of the box 10 is provided with a second air inlet for communicating with the second accommodating cavity 10a, the axial fan 20 is arranged between the first accommodating cavity 10a and the first air inlet and is configured to guide the air outside the box 10 to the first accommodating cavity 10a through the first air inlet, and the centrifugal fan 30 is also used to guide the air outside the box 10 to the second accommodating cavity 10a through the second air inlet, and then the hot air flow of the first accommodating cavity 10a and the second accommodating cavity 10a enters the heat dissipation channel 10b and is discharged through the heat dissipation hole 10c, thereby realizing heat exchange between the multi-path electrical device structure and the outside.

[0038] In an embodiment, please refer to Figure 1 , the wind guide assembly comprises an axial fan 20 and a centrifugal fan 30, the axial fan 20 is arranged in the upper first accommodating cavity 10a, the axial fan 20 is arranged facing the heat dissipation channel 10b, and the centrifugal fan 30 is fixedly arranged at the position of the heat dissipation channel 10b communicating with the two accommodating cavities 10a, please refer to Figure 4 , Figure 4As shown in the airflow direction schematic view of the embodiment of the multi-path electric device structure, when the axial flow fan 20 and the centrifugal fan 30 are both running, the axial flow fan 20 can transmit and guide the airflow in the first accommodating cavity 10a to the centrifugal fan 30, and meanwhile the centrifugal fan 30 can absorb the airflow of the second accommodating cavity 10a, so that at least two airflow paths are formed in the first accommodating cavity 10a and the second accommodating cavity 10a of the box body 10, the two airflow paths converge into the same heat dissipation channel 10b through the centrifugal fan 30 to realize heat transfer, and meanwhile the air inlet area of the heat dissipation channel 10b is increased, so as to improve the heat dissipation efficiency of the multi-path electric device structure. Figure 2 , Figure 2 As shown in the structure explosion view of the embodiment of the multi-path electric device structure, in order to facilitate clear explanation, it is defined that the arrangement direction of the two axial flow fans 20 is the first direction, the arrangement direction of the two centrifugal fans 30 is the second direction, the first direction and the second direction are perpendicular to each other, when the axial flow fan 20 and the centrifugal fan 30 are in the working state, the external air can enter the first accommodating cavity 10a and the second accommodating cavity 10a from the first air inlet and the second air inlet, and then under the action of the centrifugal fan 30, the hot airflow in the first accommodating cavity 10a and the second accommodating cavity 10a enters the heat dissipation channel 10b, in this process, the external air enters from different air inlets of the box body 10 and is divided into at least two paths to enter at least the first accommodating cavity 10a and at least the second accommodating cavity 10a, and meanwhile the multi-path electric device needing heat dissipation is taken away, so as to improve the heat dissipation efficiency of the multi-path electric device structure.

[0039] In an embodiment, the first accommodating cavity 10a and the second accommodating cavity 10a are arranged in the box body 10 in the up-down direction, the first air inlet is located at the top of the box body 10, and the second air inlet is located at the bottom of the box body 10, please refer to Figure 1 , the first accommodating cavity 10a and the second accommodating cavity 10a are arranged in the up-down direction along the height direction of the box body 10 (in this embodiment, the height direction of the box body 10 can refer to Figure 2two accommodating cavities 10a can be mutually isolated or can be in communication with each other, as long as the heat dissipation channel 10b is in communication with the two accommodating cavities 10a. In the two embodiments, the heat dissipation channel 10b is located between the two accommodating cavities 10a, so that the electric devices located in the adjacent accommodating cavities 10a share one heat dissipation channel 10b, and heat transfer is achieved without changing the volume of the accommodating space.

[0040] In another embodiment, the multi-path electric device structure has a wind guide assembly including at least two axial flow fans 20 and a heat exchange pipe (not shown) in communication with each other, wherein the heat exchange pipe is in contact with the electric device to achieve heat exchange, the two axial flow fans 20 and the heat exchange pipe are arranged in the same accommodating cavity 10a, one end of the heat exchange pipe is connected to the axial flow fan 20, the other end is connected to the heat dissipation channel 10b, and is curved to face the heat dissipation hole 10c. In this way, when the two axial flow fans 20 are in working state, the heat flow in the two accommodating cavities 10a can be transferred to the heat dissipation channel 10b through the heat exchange pipe, and then heat exchange with the outside cold air at the heat dissipation hole 10c of the box 10. It can be understood that under the technical concept, the at least two accommodating cavities 10a for accommodating multiple electric devices can be arranged at intervals along the height direction, length direction or width direction of the box, or can be arranged at intervals at an arbitrary angle, and the heat dissipation channel 10b extending from the at least two accommodating cavities 10a to the heat dissipation hole 10c of the box 10 can achieve heat transfer.

[0041] Further, please refer to Figure 1In order to increase the heat dissipation area, the multi-path electrical device structure further comprises a heat dissipation member 40 fixedly arranged in the heat dissipation channel 10b and located between the centrifugal fan 30 and the heat dissipation hole 10c. It can be understood that the heat dissipation member 40 can be a combination of a heat absorption plate, a heat dissipation fin and a heat conduction pipe, wherein the heat absorption plate can directly or indirectly contact the electrical device, the heat conduction pipe connects the heat absorption plate and the heat dissipation fin, and the heat dissipation fin is arranged close to the heat dissipation hole 10c. In this way, while increasing the contact area, the heat transfer is accelerated. In an embodiment, the heat dissipation member 40 comprises a plurality of heat dissipation fins arranged at intervals, and a plurality of spaces between any adjacent heat dissipation fins form a part of the heat dissipation channel 10b. The heat dissipation member 40 is arranged in the heat dissipation channel 10b in the direction from the centrifugal fan 30 to the heat dissipation hole 10c, thereby ensuring that the airflow can maximize contact with the heat dissipation member 40 when flowing in the heat dissipation channel 10b, increasing the contact area of the hot airflow with the heat dissipation member 40, thereby improving the heat exchange efficiency. Moreover, since the heat dissipation member 40 extends along the entire heat dissipation channel 10b, the heat can be more evenly distributed to the entire heat dissipation fin, reducing the risk of local overheating. Furthermore, the heat dissipation member 40 is arranged at intervals from the centrifugal fan, which can prevent the centrifugal fan 30 from directly impacting the high-speed airflow on the heat dissipation fin, reducing noise and vibration, while protecting the heat dissipation fin from damage. It can be understood that the heat dissipation fins located at both sides of the heat dissipation member 40 can directly abut the inner wall of the box body 10 or be arranged at intervals, which is not limited herein.

[0042] In an embodiment, referring to Figure 1 and Figure 2 , the multi-path electrical device structure further comprises a heat dissipation sealing member 50 connected to the heat dissipation fin and the box body 10. Specifically, two metal plates arranged at intervals are carried at the end of the heat dissipation member 40 away from the centrifugal fan 30 to form the heat dissipation sealing member 50. Each metal plate is arranged in the direction from the heat dissipation fin to the heat dissipation hole 10c, and the space formed between the two metal plates constitutes a part of the heat dissipation channel 10b. In an embodiment, the space formed between the two metal plates constitutes a part of the heat dissipation channel 10b, which is defined as the heat gathering channel 50a. The end of the heat dissipation sealing member 50 away from the heat dissipation member 40 extends to the side wall of the box body provided with the heat dissipation hole 10c. The hot airflow from the centrifugal fan 30 can enter the heat dissipation sealing member 50 through the heat dissipation member 40 and finally be discharged from the heat dissipation hole 10c. In this way, while ensuring the heat dissipation efficiency, the heat dissipation sealing member 50 can guide the hot airflow to the heat dissipation hole 10c, avoiding airflow turbulence. Furthermore, the height of the heat dissipation hole 10c is higher than the height of the heat dissipation sealing member 50 at the connection position of the heat dissipation member 40, and the heat dissipation sealing member 50 is arranged in an inclined upward manner. In this way, the hot airflow forms a "airflow climbing" phenomenon in the heat gathering channel 50a, thereby enhancing the convection and making the hot airflow flow more uniformly, which helps to avoid the existence of airflow dead angle in the heat gathering channel 50a.

[0043] In an embodiment of the present application, the inner wall of the box 10 is provided with an isolation layer, and the heat dissipation sealing element 50 abuts against the isolation layer, so that the space for air flow of the heat dissipation sealing element 50 is isolated from the accommodating cavity 10, and thus the heat dissipation sealing element 50 and the box form a closed space, the flow of the air flow in the closed space is limited and controlled, the possibility of air flow overflow is reduced, the flow rate and pressure of the air flow are improved, and thus the heat dissipation effect is enhanced; it can be understood that the isolation layer can be a heat insulation sponge, a silica gel pad or other heat insulation materials, which are not limited herein; in another embodiment, the heat dissipation sealing element 50 is composed of a sealing element formed by four plates, the heat dissipation sealing element 50 only has two oppositely arranged opening ends, one opening end is connected with the heat dissipation channel accommodating the heat dissipation element 30, the other opening end is connected with the inner wall of the box 10 provided with the heat dissipation hole 10c, and the other surfaces are closed.

[0044] In one of the embodiments, please refer to Figure 2The accommodating space in the box 10 is provided as two accommodating cavities distributed vertically, the two accommodating cavities are communicated with the heat dissipation hole to form a heat dissipation channel 10b, specifically, the multi-path electrical device structure further comprises a radio frequency circuit board 60 and a power supply assembly 70, the radio frequency circuit board 60 and the power supply assembly 70 are respectively arranged in different accommodating cavities, wherein the radio frequency circuit board 60 is located in the upper accommodating cavity of the box 10, the power supply assembly 70 is located in the lower accommodating cavity of the box 10, the radio frequency circuit board 60 and the power supply assembly 70 are fixedly arranged in the accommodating space and divide the accommodating space to form a first accommodating cavity 10a (i.e. the upper cavity of the box), a second accommodating cavity 10a (i.e. the lower cavity of the box) and a heat dissipation channel 10b which is communicated with the first accommodating cavity 10a and the second accommodating cavity 10a and extends from the two to the heat dissipation hole 10c, the box 10 is provided with a first air inlet communicated with the first accommodating cavity 10a and a second air inlet communicated with the second accommodating cavity 10a, specifically, the first accommodating cavity 10a is provided with an axial flow fan 20 near the first air inlet, the axial flow fan 20 is configured to guide the air outside the box 10 to the first accommodating cavity 10a through the first air inlet.The power supply assembly 70 includes a shell, a 24V switching power supply, and a 48V switching power supply. The power supply assembly 70 is arranged below the centrifugal fan 30 or the heat dissipation channel 10b in the second accommodating cavity 10a of the box body 10, and the centrifugal fan 30 is arranged opposite to the power supply assembly 70. The 48V switching power supply supplies power to the main circuit board in the multi-path electrical device structure, and the 24V switching power supply supplies power to other circuit systems in the multi-path electrical device structure. For example, in the radio frequency device, the 48V switching power supply in the multi-path electrical device structure supplies power to the radio frequency circuit board, and the 24V switching power supply supplies power to the protection circuit. In another embodiment, the power supply assembly 70 includes a shell, a BMS (Battery Management System, battery management system), a battery pack, etc., and the specific structure is not limited here. In this way, the axial flow fan 20, the centrifugal fan 30, and the heat dissipation member in the heat dissipation channel 10b and other heat dissipation structures achieve rapid cooling of the electrical device. In another embodiment, the multi-path electrical device structure further includes two spaced-apart radio frequency circuit boards 60 and one power supply assembly 70. At this time, the interior of the box body 10 forms three spaced-apart accommodating cavities 10a. Specifically, the two radio frequency circuit boards 60 and the power supply assembly 70 are spaced apart along the height direction of the box body 10, and the power supply assembly 70 is located at the bottom of the box body 10. In this way, the box body 10 constitutes three accommodating cavities 10a from top to bottom. The upper and middle accommodating cavities 10a are formed by the radio frequency circuit boards 60 and the box body 10, and the lower accommodating cavity 10a is formed by the power supply assembly 70. At this time, a heat dissipation channel 10b is formed between the lower power supply assembly 70 and the circuit board 10a adjacent to it, and a heat dissipation channel 10b is formed between the middle accommodating cavity 10a and the radio frequency circuit board 60 by arranging a partition plate. A centrifugal fan is arranged between the partition plate and the radio frequency circuit board 60. In this way, the axial flow fan, the centrifugal fan, the axial flow fan, and the centrifugal fan are arranged in sequence and spaced apart in one box body, thereby improving the heat dissipation efficiency. As known from the above structure, at least two airflow paths distributed in the upper and lower directions can be formed in the box body 10. When the axial flow fan 20 and the centrifugal fan 30 are both in the working state, external air can enter the first accommodating cavity 10a and the second accommodating cavity 10a through the first air inlet and the second air inlet, respectively. The axial flow fan 20 guides the gas in the first accommodating cavity 10a to the centrifugal fan 30, and the centrifugal fan 30 simultaneously sucks the gas in the second accommodating cavity 10a. Subsequently, the centrifugal fan 30 sends the gas in the first accommodating cavity 10a and the second accommodating cavity 10a to the heat dissipation channel 10b, and finally discharges it from the heat dissipation hole 10c. Because the operation of the axial flow fan 20 and the centrifugal fan 30 makes the air pressure of the first accommodating cavity 10a and the second accommodating cavity 10a as a whole less than the standard atmospheric pressure, external air can continuously enter the corresponding accommodating cavity 10a through the first air inlet and the second air inlet, thereby forming a heat dissipation cycle.

[0045] In an embodiment, the first accommodating cavity 10a and the second accommodating cavity 10a are arranged in an up-down manner, the first air inlet is located at the top end of the box 10, and the second air inlet is located at the bottom of the box 10, and the first air inlet and the second air inlet are rectangular openings, wherein the first air inlet and the second air inlet are arranged vertically relative to the long side thereof, so that the at least two axial flow fans 20 can be located at the bottom of the first accommodating cavity 10a at the same height in the box 10, and the at least two centrifugal fans 30 are arranged in the heat dissipation channel and arranged vertically relative to the arrangement direction of the at least two axial flow fans 20, when the axial flow fans 20 and the centrifugal fans 30 are in the working state, the external air can enter the first accommodating cavity 10a and the second accommodating cavity 10a from the first air inlet and the second air inlet, and then under the suction of the centrifugal fans 30, the hot air in the first accommodating cavity 10a and the second accommodating cavity 10a enters the heat dissipation channel 10b, in the process, the external air enters the first accommodating cavity 10a and the second accommodating cavity 10a from the first air inlet and the second air inlet of the box 10 respectively, while taking away the heat generated in the process of operation of the electrical devices arranged in the two accommodating cavities, such as the radio frequency circuit board 60 arranged in the first accommodating cavity 10a and the power supply assembly 70 arranged in the second accommodating cavity 10a, thereby improving the multi-path heat dissipation efficiency of the electrical devices.

[0046] Further, referring to Figure 3 , Figure 3 The partial structure explosion diagram of an embodiment of the multi-path electrical device structure provided by the utility model is used to show the positional relationship among the axial flow fan 20, the centrifugal fan 30, the radio frequency circuit board 60 and the power supply assembly 70, the radio frequency circuit board 60 is located in the first accommodating cavity 10a and arranged opposite to the axial flow fan 20, that is, the radio frequency circuit board 60 is located at the air outlet of the axial flow fan 20, and the axial flow fan 20 can suck the air flow outside the box 10 and fully spray on the radio frequency circuit board 60; the power supply assembly 70 is located in the second accommodating cavity 10a and arranged opposite to the centrifugal fan 30, so that the power supply assembly 70 is located at the bottom of the accommodating space and abuts against the heat dissipation piece 40, the heat generated by the power supply assembly 70 is sucked by the air flow from the bottom of the box 10 by the centrifugal fan 30, and is discharged to the heat dissipation channel 10b by the side of the centrifugal fan 30, and meanwhile, the power supply assembly 70 abuts against the heat dissipation piece 40, so that part of the heat can enter the heat dissipation channel 10b through the heat dissipation piece 40, thereby improving the heat dissipation efficiency and reducing the heat transfer path and heat loss.

[0047] In some embodiments, referring to Figure 3, the multi-path electrical device structure further comprises a heat conduction assembly connected to the radio frequency circuit board 60, in one embodiment, the heat conduction assembly comprises an upper support 90 clamping the radio frequency circuit board 60 in the vertical direction (i.e. the third direction in the figure) and a heat conduction sheet 80, and the heat conduction sheet is in contact with the heat dissipation piece 40 of the heat dissipation channel 10b, for quickly transferring the local heat energy generated by the radio frequency circuit board 60 to the heat dissipation sheet 40. In this embodiment, the upper support 90 comprises a first upper support 91 contacting the upper surface of the radio frequency circuit board 60, and the heat conduction sheet 80 comprises a first heat conduction sheet 81 corresponding to the lower surface of the radio frequency circuit board 60, wherein the first heat conduction sheet 81 is in abutment with the heat dissipation piece 40 of the heat dissipation channel 10b to realize heat conduction. In this embodiment, the first upper support 91 and the first heat conduction sheet 81 are connected to each other and adhere to the electronic components (such as the chip) at the local position of the radio frequency circuit board 60 from the top and bottom directions, for quickly transferring the heat generated by the electronic components of the radio frequency circuit board 60 to the heat dissipation sheet 40. In this embodiment, the number of the first heat conduction sheet 81 and the first upper support 91 can be set to be multiple according to the number of electronic components. For example Figure 3 As shown in the figure, the radio frequency circuit board 60 comprises two chips and is arranged along the extension direction of the first upper support 91, so the first upper support 91 is designed to have two small planes abutting the two chips, and the corresponding first heat conduction sheet 81 comprises two, which adhere to the chips of the radio frequency circuit board 60 from the top and bottom directions.

[0048] In another embodiment, please refer to Figure 3 , the heat conduction assembly further comprises a plurality of heat conduction assemblies clamping the radio frequency circuit board 60 in the vertical direction (i.e. the third direction in the figure), wherein another heat conduction assembly comprises a second upper support 92 contacting the upper surface of the radio frequency circuit board 60, and a second heat conduction sheet 82 contacting the lower surface of the radio frequency circuit board 60, wherein the second heat conduction sheet 82 is in physical contact with the heat dissipation piece 40 of the heat dissipation channel 10b. In this embodiment, the second upper support 92 and the second heat conduction sheet 82 are connected to each other and adhere to the electronic components (such as the inductor) at the local position of the radio frequency circuit board 60 from the top and bottom directions, for quickly transferring the heat energy generated by the electronic components of the radio frequency circuit board 60 to the heat dissipation sheet 40. For example, the number of the second heat conduction sheet 82 and the second upper support 92 can be set to be multiple according to the number of inductor components, for example Figure 3 As shown in the figure, the radio frequency circuit board 60 comprises a plurality of inductors and is arranged along the extension direction of the second upper support 92.

[0049] Further, the first heat-conducting sheet 81 and the second heat-conducting sheet 82 can adopt materials with different thermal conductivities, and the heat-conducting sheet with higher thermal conductivity is used to conduct the heat generated by the high-heat electronic components of the radio frequency circuit board 60. For example, since the heat generated by the inductor is less than that generated by the chip, the first heat-conducting sheet 81 attached to the chip has a material with high thermal conductivity, such as a copper-containing metal plate, and the second heat-conducting sheet 82 attached to the inductor has a material with relatively low thermal conductivity, such as an aluminum-containing metal plate. It can be understood that the materials with different thermal conductivities in the present application are not limited herein, and only need to satisfy the heat conduction of the heat-conducting sheet 80 with high thermal conductivity to the electronic components of the radio frequency circuit board 60 with high heat power.

[0050] In the above embodiments, the material of the heat-conducting assembly can be a heat-conducting metal such as copper or aluminum, which is not limited herein. The heat-conducting assembly includes the first upper support 91 and the second upper support 92 which contact the upper surface of the radio frequency circuit board 60, and the first heat-conducting sheet 81 and the second heat-conducting sheet 82 which are attached to the lower surface of the radio frequency circuit board 60 and abut against the heat-dissipating member 40 of the heat-dissipating channel 10b to realize heat conduction, so as to guide the heat of the radio frequency circuit board 60 to the heat-dissipating channel 10b and further discharge the heat outside the cabinet 10. The first upper support 91, the second upper support 92, the first heat-conducting sheet 81 and the second heat-conducting sheet 82 are fixed to the radio frequency circuit board 60 by screws. In this way, the heat generated by the high-heat electronic components at the local position of the radio frequency circuit board 60 can be quickly transferred to the heat-dissipating member 40, so as to improve the local heat dissipation uniformity of the radio frequency circuit board 60 and further improve the stability and reliability of the multi-path electrical device structure.

[0051] The utility model also proposes a kind of electric equipment, electric equipment can be radio frequency therapeutic instrument, ultrasonic equipment, laser equipment etc., according to the heat power of different kinds of battery, radio frequency circuit board 60 etc. structure, the heat power required by corresponding heat power axial flow fan 20 and centrifugal fan 30 is calculated, then the required fan model is selected, the electric equipment includes the multi-path electrical device structure and electric component, electric component can be laser head, treatment head with super power converter etc., electric component is electrically connected with multi-path electrical device structure to realize electrical purpose, and the specific structure of multi-path electrical device structure refers to the above embodiment, since electric equipment adopts all technical solutions of the above all embodiments, at least has all beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0052] The above is only an exemplary embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation made by using the utility model specification and drawing contents or directly / indirectly applied in other related technical fields is included in the patent protection range of the utility model.

Claims

1. A multi-channel electrical device structure, characterized by, The multi-path electrical device structure comprises: a box (10) having a heat dissipation hole (10c); the box (10) has at least two accommodating cavities (10a) and a heat dissipation channel (10b) extending from the two accommodating cavities (10a) to the heat dissipation hole (10c), the heat dissipation channel (10b) being arranged between the at least two accommodating cavities (10a); and a centrifugal fan (30) arranged in the heat dissipation channel (10b), the centrifugal fan (30) being configured to guide air flow in the at least two accommodating cavities (10a) to the heat dissipation channel (10b).

2. The multipath electrical device structure of claim 1, wherein, The multi-path electrical device structure further comprises a heat dissipation member (40) arranged in the heat dissipation channel (10b), the heat dissipation member (40) comprising a plurality of heat dissipation fins arranged at intervals, a plurality of spaces between adjacent heat dissipation fins forming part of the heat dissipation channel (10b).

3. The multipath electrical device structure of claim 2, wherein, The multi-path electrical device structure further comprises a heat dissipation sealing member (50) enclosing the heat dissipation channel (10b) between the heat dissipation member (40) and the heat dissipation hole (10c) and providing an air-tight seal.

4. The multipath electrical device structure of claim 3, wherein, An inner wall of the box (10) is provided with an isolation layer, and the heat dissipation sealing member (50) abuts against the isolation layer.

5. A multipath electrical device structure as claimed in any one of claims 2-4, characterized in that The accommodating cavities (10a) comprise a first accommodating cavity and a second accommodating cavity, and the box (10) is provided with a first air inlet communicating with the first accommodating cavity and a second air inlet communicating with the second accommodating cavity: The multi-path electrical device structure further comprises an axial flow fan (20) arranged between the first accommodating cavity (10a) and the first air inlet and configured to guide air outside the box (10) to the first accommodating cavity (10a) through the first air inlet; The centrifugal fan (30) is further configured to guide air outside the box (10) to the second accommodating cavity (10a) through the second air inlet.

6. The multipath electrical device structure of claim 5, wherein, The first accommodating cavity and the second accommodating cavity are arranged above and below each other, the first air inlet is located at a top end of the box (10), and the second air inlet is located at a bottom of the box (10).

7. The multipath electrical device structure of claim 6, wherein, The multi-path electrical device structure is provided with a radio frequency circuit board (60) and a power supply assembly (70), the radio frequency circuit board (60) being arranged in the first accommodating cavity and opposite to the axial flow fan (20), and the power supply assembly (70) being arranged in the second accommodating cavity and opposite to the centrifugal fan (30).

8. The multipath electrical device structure of claim 7, wherein, The multi-path electrical device structure further comprises a heat conduction assembly connected to the radio frequency circuit board (60), the heat conduction assembly comprising an upper support (90) clamping the radio frequency circuit board (60) in a vertical direction and a heat conduction fin (80), and the heat conduction fin (80) abutting against the heat dissipation member (40) of the heat dissipation channel (10b) and being configured to guide partial heat of the radio frequency circuit board (60) to the heat dissipation channel (10b).

9. The multipath electrical device structure of claim 8, wherein, The heat-conducting sheet (80) further comprises a first heat-conducting sheet (81) and a second heat-conducting sheet (82) made of materials with different heat-conducting coefficients, the first heat-conducting sheet (81) made of material with higher heat-conducting coefficient is used to conduct the heat generated by the high-heat electronic components of the radio frequency circuit board (60) to the heat-dissipating channel (10b).

10. An electric device, characterized by The power consuming device comprises the multi-path electrical device structure according to any one of claims 1 to 9.

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