Vacuum adsorption carrier for chip packaging

Abstract

The utility model discloses a vacuum adsorption carrier for chip packaging, which relates to the technical field of chip packaging, and comprises a main frame and a plurality of vacuum tubes which are symmetrically arranged in a surrounding manner, the tops of the vacuum tubes are communicated with suckers, the four sides of the main frame are provided with moving grooves, moving plates are arranged in the moving grooves in a sliding and penetrating manner, and the vacuum tubes are fixedly arranged in the moving plates in a penetrating manner. A plurality of symmetrically-arranged supporting columns are fixedly arranged at the bottom of the main frame, the lower ends of the supporting columns are jointly and fixedly sleeved with a bottom plate, a synchronous adjusting mechanism used for driving the vacuum pipes to transversely move at the same time is arranged between the bottom plate and the vacuum pipes, and a connecting pipe fixedly penetrates through the bottom of the bottom plate. Air guide pipes are arranged between the connecting pipe and the vacuum pipes in a communicating mode. According to the utility model, the adsorption range can be adjusted by changing the positions of the plurality of suckers according to the specifications of chips to be adsorbed, and the chips with various specifications can be stably supported.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to a vacuum adsorption carrier for chip packaging. Background Technology

[0002] In many chip packaging operations, such as pasting, cutting, and bonding, the chip needs to remain absolutely still. Otherwise, the chip may shift position, causing packaging failure or affecting chip performance. In this case, a vacuum adsorption carrier is needed to use the pressure difference between atmospheric pressure and a vacuum area to firmly adsorb the chip.

[0003] Existing adsorption carriers use an adsorption plate with multiple adsorption holes to adsorb chips during adsorption operations, and work in conjunction with external vacuum equipment. However, since the chips to be packaged come in various sizes, while the size of the adsorption plate and the adsorption holes and the adsorption area are fixed, they cannot be used to adsorb and position chips of various sizes, thus reducing the effectiveness of the carrier. Utility Model Content

[0004] In view of the problems existing in the vacuum adsorption carriers for chip packaging, this utility model is proposed.

[0005] Therefore, the purpose of this invention is to provide a vacuum adsorption carrier for chip packaging, which solves the problem that existing adsorption plates cannot adjust the adsorption range for different types of chips.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A vacuum adsorption carrier for chip packaging includes a main frame and a plurality of vacuum tubes symmetrically arranged around it. The top of each vacuum tube is connected to a suction cup. Movable slots are provided on all four sides of the main frame. Movable plates slide through the movable slots. The vacuum tubes are fixedly inserted into the movable plates. A plurality of symmetrically arranged support columns are fixedly provided at the bottom of the main frame. The lower ends of the plurality of support columns are jointly fixedly fitted with a base plate. A synchronous adjustment mechanism for simultaneously driving the plurality of vacuum tubes to move laterally is provided between the base plate and the vacuum tubes.

[0008] A connecting pipe is fixedly inserted through the bottom of the base plate, and a gas guide pipe is provided between the connecting pipe and each of the multiple vacuum tubes.

[0009] Preferably, the synchronous adjustment mechanism includes an adjusting screw, which is rotatably disposed between the main frame and the base plate. A drive plate is threaded onto the wall of the adjusting screw. First support rods are fixedly disposed inside each of the four sides of the drive plate. A sliding hole is provided at the bottom of the moving groove. A vertical rod slides through the sliding hole. The top of the vertical rod is fixedly connected to the moving plate. A second support rod is fixedly disposed at the lower end of the vertical rod. Two symmetrically arranged push plates are rotatably disposed between the two first support rods and the second support rod on the same side.

[0010] Preferably, the drive plate is slidably sleeved on the outside of the plurality of support columns.

[0011] Preferably, an auxiliary support tube is fixedly inserted at the center of the main frame, and a plurality of auxiliary adsorption tubes arranged symmetrically around the upper end of the outer wall of the auxiliary support tube are connected to it.

[0012] Furthermore, the adjusting screw is internally through-hole and is connected to and rotatably engaged with the auxiliary support pipe and the connecting pipe.

[0013] Preferably, a rotating block is fixedly sleeved on the lower end of the adjusting screw.

[0014] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0015] This invention, through its main frame, movable slot, movable plate, vacuum tube, suction cup, synchronous adjustment mechanism, connecting pipe, and air guide pipe, can adjust the adsorption range according to the specifications of the chip to be adsorbed by changing the position of multiple suction cups. It can stably support chips of various specifications while avoiding the problem of insufficient adsorption strength.

[0016] This invention, through the inclusion of a connecting pipe, a gas guide pipe, an adjusting screw, an auxiliary support pipe, and an auxiliary adsorption pipe, enables mid-section adsorption during chip support, thereby improving adsorption strength and ensuring stability during chip packaging. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 For the present utility model Figure 1 Enlarged schematic diagram of part A;

[0020] Figure 3 It is another perspective of the main frame, the moving plate and the vacuum tube of the utility model.

[0021] Mark for explaining:

[0022] 1, main frame; 2, vacuum tube; 3, suction cup; 4, moving plate; 5, support column; 6, bottom plate; 7, connecting pipe; 8, gas guide pipe; 9, adjusting screw; 10, driving plate; 11, first support rod; 12, vertical rod; 13, second support rod; 14, push plate; 15, auxiliary support pipe; 16, auxiliary suction pipe; 17, rotating block. Specific implementation

[0023] In order to make the technical personnel in the field better understand the technical scheme of the utility model, the utility model will be further introduced in detail below in conjunction with the drawings.

[0024] The utility model discloses a vacuum suction carrier for chip packaging.

[0025] The utility model provides a vacuum suction carrier for chip packaging as Figures 1-3 It includes main frame 1 and multiple vacuum tubes 2 that are symmetrically arranged, the top of vacuum tube 2 is provided with suction cup 3 in communication, the four sides of main frame 1 are all provided with moving groove, moving plate 4 is slidably arranged in moving groove, vacuum tube 2 is fixedly arranged in moving plate 4, the bottom of main frame 1 is fixedly provided with multiple symmetrically arranged support columns 5, the lower end of multiple support columns 5 is commonly fixedly provided with bottom plate 6, synchronous adjusting mechanism for driving multiple vacuum tubes 2 to move horizontally simultaneously is arranged between bottom plate 6 and vacuum tube 2, connecting pipe 7 is fixedly arranged in the bottom of bottom plate 6, and gas guide pipe 8 is arranged in communication between connecting pipe 7 and multiple vacuum tubes 2.

[0026] In order to be able to adjust the position of multiple vacuum tubes 2 and suction cup 3 synchronously, so as to complete the adjustment of suction range, as shown in Figures 1-3 Synchronous adjusting mechanism includes adjusting screw 9, adjusting screw 9 is rotatably arranged between main frame 1 and bottom plate 6, driving plate 10 is threadedly sleeved on the rod wall of adjusting screw 9, rotating block 17 is fixedly sleeved on the lower end of adjusting screw 9, driving plate 10 is slidably sleeved on the outer side of multiple support columns 5, first support rod 11 is fixedly arranged in the inside of the four sides of driving plate 10, sliding hole is formed in the bottom of moving groove, vertical rod 12 is slidably arranged in sliding hole, the top of vertical rod 12 is fixedly connected with moving plate 4, second support rod 13 is fixedly arranged in the lower end of vertical rod 12, and two symmetrically arranged push plates 14 are rotatably sleeved between two first support rods 11 and second support rods 13 on the same side.

[0027] And in order to improve the suction strength of chip, as shown in Figure 1As shown, the inside center of the main frame 1 is fixed with a auxiliary support pipe 15, the outer wall of the auxiliary support pipe 15 is communicated with a plurality of auxiliary adsorption pipes 16 arranged in a ring around the symmetry, the inside of the adjusting screw 9 is arranged in a through manner and is communicated with the auxiliary support pipe 15 and the connecting pipe 7 and is rotationally matched.

[0028] Working principle:

[0029] Before the chip is packaged, the carrier is fixed at a specified position, and the connecting pipe 7 is communicated with the vacuum generating device, at this time, under the connection of the plurality of air guide pipes 8, the plurality of vacuum pipes 2 and the suction cups 2 can perform vacuum adsorption on the outside.

[0030] Subsequently, the specification of the suction cup to be packaged is determined, and the rotating block 17 is pushed to drive the adjusting screw 9 to rotate, at this time, the driving plate 10 drives the plurality of first support rods 11 to move longitudinally under the guidance and support of the plurality of support columns 5, so that the first support rods 11 start to push the push plate 14, so that the upper end of the push plate 14 pushes the second support rod 13 and the vertical rod 12 transversely, at this time, the vertical rod 12 slides in the sliding hole and drives the moving plate 4 to move transversely, so that the transverse positions of the plurality of vacuum pipes 2 and the suction cups 2 can be adjusted synchronously and adapted to the size of the chip.

[0031] Subsequently, the chip is placed above the carrier, and the four corners at the bottom are in contact with the four suction cups 3, vacuum adsorption is completed through the vacuum pumping device, at the same time, the plurality of auxiliary adsorption pipes 16 can synchronously strengthen the adsorption at the bottom center of the chip, improve the adsorption strength, and ensure the stability during the chip packaging process.

[0032] The above only describes certain exemplary embodiments of the present application by way of illustration, without doubt, for ordinary skilled in the art, without departing from the spirit and scope of the present application, the described embodiments can be modified in various ways. Therefore, the above drawings and description are illustrative in nature and should not be understood as limiting the scope of protection of the claims of the present application.

Claims

1. A vacuum chuck for chip packaging, comprising a main frame (1) and a plurality of vacuum pipes (2) arranged symmetrically around, characterized in that, The top of the vacuum tube (2) is communicated with a suction cup (3), four sides of the main frame (1) are provided with moving grooves, a moving plate (4) is slidably arranged in the moving grooves, and the vacuum tube (2) is fixedly arranged in the moving plate (4). The bottom of the bottom plate (6) is fixedly provided with a connecting pipe (7), and the connecting pipe (7) is in communication with the plurality of vacuum tubes (2) and is provided with a gas guide pipe (8).

2. The vacuum chuck for a chip package according to claim 1, wherein The synchronous adjusting mechanism comprises an adjusting screw (9), the adjusting screw (9) is rotatably arranged between the main frame (1) and the bottom plate (6), the rod wall of the adjusting screw (9) is threadedly provided with a driving plate (10), the four sides of the driving plate (10) are fixedly provided with first support rods (11), the bottom of the moving groove is provided with a sliding hole, a vertical rod (12) is slidably arranged in the sliding hole, the top of the vertical rod (12) is fixedly connected with the moving plate (4), the lower end of the vertical rod (12) is fixedly provided with a second support rod (13), and two symmetrically arranged push plates (14) are rotatably arranged between the two first support rods (11) and the second support rod (13) on the same side.

3. The vacuum chuck for a chip package according to claim 2, wherein The driving plate (10) is slidably arranged outside the plurality of support columns (5).

4. The vacuum suction carrier for a chip package according to Claim 1, wherein The inside of the main frame (1) is fixedly provided with an auxiliary support pipe (15), and the outer wall of the auxiliary support pipe (15) is provided with a plurality of auxiliary adsorption pipes (16) which are symmetrically arranged in a ring.

5. The vacuum suction carrier for a chip package according to Claim 2, wherein The adjusting screw (9) is arranged in a penetrating manner, and is in communication with the auxiliary support pipe (15) and the connecting pipe (7) and is rotatably connected.

6. The vacuum suction carrier for a chip package according to Claim 2, wherein The lower end of the adjusting screw (9) is fixedly provided with a rotating block (17).

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