Crack-triggered micro-strain amplification structure for stress luminescence
By utilizing a mechanical fracture amplification mechanism with a pre-set fracture point, the stress-luminescent material with a double-layer structure achieves high-efficiency luminescence under small strain, solving the problems of high luminescence threshold and signal obstruction in traditional stress-luminescent materials under small strain, thus improving the flexibility and accuracy of monitoring.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-03-31
AI Technical Summary
Traditional stress-luminescent materials struggle to reach the luminescence threshold under minute strains, and the blocked stress points prevent effective signal reception, limiting their application in practical monitoring.
The design employs a dual-layer structure consisting of an upper fracture triggering layer and a lower stress luminescence layer. The upper fracture triggering layer is a PVA-borax hydrogel with pre-set fracture points on its surface, while the lower layer is a PDMS-based composite film doped with stress luminescence material. The film is bonded together at the interface and pre-tensioned to amplify and transfer strain in space.
It significantly reduces the emission threshold, improves the signal-to-noise ratio and data reliability, enables high-precision monitoring under minute strain conditions, solves the problem of obstruction of stressed parts, and enhances flexibility and effectiveness.
Smart Images
Figure CN224060633U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to stress luminescent material technical field especially is related to crack trigger micro -strain amplification structure for stress luminescence. BACKGROUND
[0002] Traditional stress luminescent material film body usually adopts PTFE mould to be prepared into specific shape, and common have square plane, dumbbell structure, circular film etc.. These film body structures are simple, and the preparation process is relatively mature, but lack effective regulation mechanism to stress transmission and concentration, lead to difficult to reach luminescence threshold under small strain, limit its application range in actual monitoring.
[0003] In view of the deficiency of traditional film body, researchers developed topological optimization film body, this method is focused on the material distribution of stress concentration area through the calculation analysis of different stress directions, eliminates the stress concentration part, realizes the reduction of material consumption and the enhancement of partial area stress concentration effect. This method improves the ductility of material, but new problems appear in practical application: the improvement of ductility leads to the rise of luminescence strain threshold, and further deviates from the actual monitoring demand.
[0004] It can be seen that the current stress luminescent material still has the following problems, the luminescence mechanism of stress luminescent material determines that it has a certain strain luminescence threshold. Even if the performance of the current ZnS: Cu luminescence center material is optimal, its luminescence strain threshold is still as high as 10%-20%. And in actual industrial production and structure monitoring, usually only about 1% of small deformation needs to be monitored, and the huge gap seriously restricts the practical application of stress luminescence technology. Under the condition of small strain, the response of traditional stress luminescent film body to different direction stress is small, and it is difficult to distinguish the stress direction, which leads to almost no effective luminescence signal can be received in some small strain directions, limiting its application in directional stress monitoring.
[0005] There is also a fundamental contradiction: the material needs stress to luminesce, but the stress site is usually blocked by the force object, resulting in the luminescence signal being blocked and unable to be effectively received by the sensor. This contradiction that "the place that needs to be seen is blocked, and the place that can be seen does not have enough stress" seriously limits the application effect of stress luminescent material in actual monitoring. In addition, the existing film body structure lacks an effective mechanism to transfer stress from one place to another visible place, and cannot realize the spatial transfer of stress transmission, so it is difficult to meet the signal acquisition demand under complex monitoring environment.
[0006] Therefore, it is a problem to be solved at present to provide a strain amplification structure that can convert small strain into strain exceeding the luminescence threshold of the material. UTILITY MODEL CONTENT
[0007] The utility model discloses a purpose is provided for stress luminescence's crack trigger microstrain amplification structure can convert tiny strain into the strain that exceeds material luminescence threshold value to solve above -mentioned problem.
[0008] In order to realize above -mentioned purpose, the utility model provides a crack trigger microstrain amplification structure for stress luminescence, including upper layer fracture trigger layer and lower layer stress luminescence layer;
[0009] The upper layer fracture trigger layer is PVA-borax hydrogel, and the surface is provided with preset fracture point, and the fracture line is formed by pre-fracture point;
[0010] The lower layer stress luminescence layer is PDMS base composite material membrane body doped with stress luminescence material, and the lower layer stress luminescence layer is closely attached with the upper layer fracture trigger layer;
[0011] The upper layer fracture trigger layer and the lower layer stress luminescence layer are connected through interface adhesion treatment and are in pre-tensioned state.
[0012] Preferably, in the crack trigger microstrain amplification structure for stress luminescence, the aperture of the fracture point is 100-200 microns, and the spacing between the fracture points is 300-500 microns, which is arranged perpendicular to the monitoring direction and linearly arranged.
[0013] Preferably, in the crack trigger microstrain amplification structure for stress luminescence, the fracture points form a plurality of groups of fracture lines in different directions, and the plurality of groups of fracture lines form a grid or a radial pattern.
[0014] Preferably, in the crack trigger microstrain amplification structure for stress luminescence, the fracture points are made by a laser cutting machine, and the interface adhesion treatment is oxygen plasma treatment.
[0015] Preferably, in the crack trigger microstrain amplification structure for stress luminescence, the double-layer structure formed by the upper layer fracture trigger layer and the lower layer stress luminescence layer is clamped by a special clamp, the special clamp provides uniform pre-tensioning force to the double-layer structure, and the pre-tensioning strain is 5%-10%.
[0016] Therefore, the crack triggering micro-strain amplification structure for stress luminescence has the advantages that the preset breaking point is expanded and broken quickly when external micro-strain acts on the structure, the lower stress luminescence layer experiences a large strain exceeding a threshold value instantaneously, and thus obvious luminescence response is generated. The "mechanical breaking amplification" mechanism significantly expands the application range of the stress luminescence material, so that the stress luminescence material can work effectively under the micro-strain condition meeting the actual industrial monitoring requirement. The sudden large strain generated by the breaking triggering not only makes the material reach the luminescence threshold value, but also generates luminescence intensity which is several times to tens of times stronger than that under conventional conditions in the instant release process. The enhancement effect makes the weak signal which is almost invisible under micro-deformation into a clear and distinguishable strong light signal, and greatly improves the signal-to-noise ratio and data reliability of the detection system, and makes high-precision strain monitoring possible.
[0017] By optimizing the interval, size and distribution mode of the breaking point, the triggering strain threshold value can be accurately controlled to adapt to various monitoring requirements. Regardless of how the triggering threshold value is set, once the triggering condition is reached, the generated strain and luminescence effect are basically constant, ensuring the consistency of the luminescence signal intensity, greatly simplifying the subsequent signal processing and analysis work. The "stress space transfer" is realized. Through careful design of the breaking line layout and the double-layer structure, the stress received at one place can be transmitted and amplified to another position, thereby completely solving the core contradiction that "the stressed place is blocked and there is not enough stress in the visible place" in the traditional stress luminescence system. This enables the system designer to arrange the stress luminescence material at the position most conducive to signal collection, while monitoring the stressed parts that may be blocked or difficult to directly observe, greatly improving the flexibility and effectiveness of practical application. By designing breaking lines of different orientations, the scheme can realize selective response to strain in a specific direction. By designing multiple groups of breaking lines in different directions on the same structure, a grid or radial pattern can be formed to realize directional analysis of a complex stress field, providing an effective means for multi-axis stress monitoring and directional damage warning applications.
[0018] The technical scheme of the utility model will be described in further detail below with reference to the drawings and embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is a schematic diagram of the overall structure of the double-layer structure of the crack triggering micro-strain amplification structure for stress luminescence of the utility model;
[0020] Figure 2 It is a schematic diagram of the breaking point arranged in a grid shape on the breaking triggering layer of the crack triggering micro-strain amplification structure for stress luminescence of the utility model;
[0021] Figure 3 It is the schematic view of the fracture trigger layer of the stress luminescence crack trigger micro-strain amplification structure embodiment of the utility model. DETAILED DESCRIPTION
[0022] In order to better understand the above technical solutions, the above technical solutions will be described in detail in the following combined with the description of the drawings and specific embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.
[0023] The terms used in the embodiments of the utility model are only for the purpose of describing specific embodiments, and are not intended to limit the utility model. The singular form "a", "said" and "the" used in the embodiments of the utility model and the appended claims are also intended to include plural forms, unless the context clearly indicates otherwise. "Multiple" generally includes at least two.
[0024] It should also be noted that the term "include", "contain" or any other variant thereof is intended to cover non-exclusive inclusion, so that the goods or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or include the elements inherent in such goods or devices. Without more limitation, the element defined by the sentence "including a" does not exclude the existence of other identical elements in the goods or devices including the element.
[0025] EMBODIMENT
[0026] The stress luminescence crack trigger micro-strain amplification structure comprises an upper fracture trigger layer 1 and a lower stress luminescence layer 2.
[0027] The upper fracture trigger layer 1 is PVA-borax hydrogel, and the surface is provided with a preset fracture point 3, and the fracture line is composed of the pre-fracture point 3.
[0028] The lower stress luminescence layer 2 is a PDMS-based composite material film body doped with stress luminescence material, and the lower stress luminescence layer 2 is closely attached to the upper fracture trigger layer 1.
[0029] The upper fracture trigger layer 1 and the lower stress luminescence layer 2 are connected through interface bonding treatment and are in a pre-tensioned state.
[0030] The aperture of the fracture points 3 is 100-200 microns, and the interval between the fracture points 3 is 300-500 microns, which are arranged linearly and perpendicularly to the monitoring direction. The fracture points 3 form multiple groups of fracture lines in different directions, and the multiple groups of fracture lines form a grid or a radial pattern. The fracture points 3 are made by a laser cutting machine, and the interface bonding treatment is an oxygen plasma treatment.
[0031] The double-layer structure formed by the upper fracture trigger layer 1 and the lower stress luminescence layer 2 is clamped by a special clamp, which provides uniform pre-tension to the double-layer structure, and the pre-tension strain is 5%-10%.
[0032] The modular design of the double-layer structure allows the upper fracture trigger layer 1 and the lower stress luminescence layer 2 to be optimized separately and adjusted flexibly according to different application requirements. Various elastic materials can be selected for the upper layer, and different types of stress luminescence materials can be replaced for the lower layer according to monitoring requirements, enhancing the versatility and expandability of the technology. It should be noted that by adjusting the interval, size, and number of fracture points, the stress excitation threshold can be accurately controlled to adapt to different monitoring scene requirements; therefore, the interval, size, and number of fracture points can be adjusted according to application requirements to control the stress excitation threshold.
[0033] In use, a special clamp is used to apply uniform pre-tension (about 5-10% strain) to the double-layer structure to ensure that the fracture points 3 do not trigger prematurely; the double-layer structure in the pre-tension state is carefully fixed on the surface to be measured or the testing device; the direction of the sensing unit is adjusted according to the testing requirements to ensure that the fracture line is perpendicular to the main monitoring strain direction; appropriate optical observation devices are arranged around the sensing unit to capture the luminescence signal.
[0034] Working principle: Based on the "mechanical trigger amplification" mechanism, the effective conversion of micro-strain to strong luminescence signal is realized. The working process is as follows: in the initial state, the whole double-layer structure is in a pre-tension state, and the preset breaking point of the upper layer breaking trigger layer is in a critical state, similar to a tensioned rubber band or a stamp perforation edge. When the monitoring target structure is subjected to a small strain, the strain is transmitted to the double-layer structure, so that the local stress at the preset breaking point rapidly exceeds the critical value. At this time, the breaking point starts to expand along the preset path, and the upper layer breaking trigger layer 1 is broken and opened, like a broken rubber band or a torn stamp perforation. This sudden breaking process drives the lower layer stress luminescence layer 2 to produce significant amplification of strain (10%-20%), which exceeds the luminescence threshold value instantaneously, and generates a stable and bright luminescence signal. The core advantage of this mechanism is to realize the effective amplification of strain and the space transfer of stress, so that the stress luminescence material which originally needs large strain to excite can work reliably under micro-strain, and the actual problem of conflict between stress position and observation position is solved. The characteristics of the breaking trigger also ensure the consistency of the luminescence signal - whether the triggering strain is slightly higher than the threshold value or much higher than the threshold value, the final luminescence intensity is basically the same, greatly simplifying the signal processing and calibration requirements.
[0035] Therefore, the crack trigger micro-strain amplification structure for stress luminescence adopts the above structure, through the innovative double-layer structure design, the preset breaking point (similar to stamp perforation) structure is adopted in the upper layer breaking trigger layer, and the fundamental problem of high luminescence threshold value of traditional stress luminescence material is successfully solved. When the external micro-strain acts on the structure, the preset breaking point will rapidly expand and break, driving the lower layer stress luminescence layer to instantaneously experience a large strain exceeding the threshold value, thereby generating a significant luminescence response. This "mechanical breaking amplification" mechanism significantly expands the application range of stress luminescence materials, enabling them to work effectively under micro-strain conditions that meet the actual industrial monitoring requirements. The sudden large strain generated by the breaking trigger not only makes the material reach the luminescence threshold value, but also produces luminescence intensity several to dozens of times stronger than that under conventional conditions in the instantaneous release process. This enhancement effect enables the weak signal that is almost invisible under micro-deformation to be converted into a clear and distinguishable strong light signal, greatly improving the signal-to-noise ratio and data reliability of the detection system, and providing the possibility for high-precision strain monitoring.
[0036] By optimizing the interval, size and distribution pattern of the breaking points, the strain threshold for triggering can be precisely controlled to adapt to various monitoring requirements. Regardless of how the triggering threshold is set, once the triggering condition is met, the resulting strain and luminescence effect are basically constant, ensuring the consistency of the luminescence signal intensity and greatly simplifying the subsequent signal processing and analysis work. The "stress space transfer" is realized. Through the careful design of the breaking line layout and the double-layer structure, the stress received at one place can be transmitted and amplified to another position, thereby completely solving the core contradiction in the traditional stress luminescence system that "the place under stress is blocked and there is not enough stress in the visible place". This enables the system designer to arrange the stress luminescence material at the most advantageous position for signal collection, while monitoring the stress parts that may be blocked or difficult to directly observe, greatly improving the flexibility and effectiveness of practical application. By designing breaking lines of different orientations, the present scheme can realize selective response to strain in a specific direction. By designing multiple groups of breaking lines of different directions on the same structure, a grid or radial pattern can be formed to realize directional analysis of complex stress fields, providing an effective means for multi-axis stress monitoring and directional damage warning applications.
[0037] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, but not to limit it. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that: it can still modify or equivalently replace the technical solutions of the present application, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present application.
Claims
1. A crack-triggered micro-strain amplification structure for stress luminescence, characterized in that: The upper layer fracture trigger layer and the lower layer stress luminescence layer are connected through interface adhesion treatment and are in a pre-tensioned state. The upper layer fracture trigger layer is a PVA-borax hydrogel, and a preset fracture point is arranged on the surface of the upper layer fracture trigger layer. The lower layer stress luminescence layer is a PDMS-based composite material film body doped with a stress luminescence material, and the lower layer stress luminescence layer is closely attached to the upper layer fracture trigger layer. The upper layer fracture trigger layer and the lower layer stress luminescence layer are connected through interface adhesion treatment and are in a pre-tensioned state.
2. The crack-triggered micro-strain amplification structure for stress luminescence according to claim 1, wherein: The pore diameter of the fracture point is 100-200 microns, and the spacing between the fracture points is 300-500 microns, which is arranged vertically to the monitoring direction and linearly arranged.
3. The crack-triggered micro-strain amplification structure for stress luminescence according to claim 2, characterized in that: The fracture points form multiple groups of fracture lines in different directions, and the multiple groups of fracture lines form a grid or a radial pattern.
4. The crack-triggered micro-strain amplification structure for stress luminescence according to claim 1, wherein: The fracture points are made by a laser cutting machine, and the interface adhesion treatment is oxygen plasma treatment.
5. The crack-triggered micro-strain amplification structure for stress luminescence of claim 1, wherein: The pre-tensioned strain of the double-layer structure formed by the upper layer fracture trigger layer and the lower layer stress luminescence layer is 5%-10%.