Ultrafast laser optical parameter amplifier equipment

Abstract

The utility model provides ultrafast laser optical parameter amplifier equipment, which sequentially comprises a spectroscope, an optical parameter amplifier and an optical parameter amplifier along the propagation direction of an optical path, a frequency doubling crystal; a seed optical crystal; the time delay assembly is used for adjusting the propagation path length of the seed light so as to adjust the propagation time of the seed light; the first dichroscope is used for adjusting the propagation direction of the pump light so that the pump light and the adjusted seed light coincide with each other, and a mixed light beam is obtained; the amplification crystal is used for amplifying the energy of the seed light in the mixed light beam; the second dichroscope is used for separating the pump light in the mixed light beam to obtain seed light after energy amplification; a control assembly; the control assembly is electrically connected with the delay assembly; according to the utility model, automation from time matching of the delay assembly to angle adjustment of the amplification crystal is realized, human intervention is reduced, and operation precision and efficiency are improved; and personal errors are reduced through automatic control, and high repeatability and stability of the experiment are ensured.

Description

Technical Field

[0001] This utility model relates to the field of laser amplifier technology, and more specifically, to an ultrafast laser optical parametric amplifier device. Background Technology

[0002] Domestically produced ultrafast fiber lasers have become increasingly mature, with technical specifications reaching international levels and stable performance. They have been widely used in scientific research fields such as micro-nano structure processing, biophotonics and optogenetics, multiphoton microscopy, two-photon polymerization, terahertz applications, ultrafast spectroscopy, and ultrafast laser amplification.

[0003] Because ultrafast fiber lasers produce lasers with a single wavelength, they cannot meet the wavelength tuning requirements of scientific research. Optical parametric oscillators (OPOs) are the most common laser wavelength tuning method. Compared to OPOs, optical parametric amplifiers (OPA) have higher output energy, a wider tuning range, higher stability, and a wider output bandwidth, and can support shorter femtosecond pulses.

[0004] Optical parametric amplification (OPA) utilizes a nonlinear crystal as a parametric coupling element. A strong, high-frequency laser radiation (pump light) and a weak, low-frequency light wave (signal light) are simultaneously incident into the nonlinear crystal. The signal light is amplified, while the other low-frequency light wave (idler light) is generated. Experimental setups based on OPA are called optical parametric amplifiers (OPA).

[0005] Currently, OPA (Optical Perspective) relies on technicians to manually adjust the crystal angle and optical path matching, and then use a power meter and spectrometer to achieve precise control of the output wavelength. If the wavelength required for the experiment needs to be changed, technicians need to manually adjust the optical path, which results in low experimental efficiency. Furthermore, the readjustment process may also lead to problems such as reduced laser conversion efficiency due to manual adjustments. Utility Model Content

[0006] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an ultrafast laser optical parametric amplifier device to overcome the disadvantages of existing optical parametric amplifiers that require manual adjustment and are inefficient.

[0007] The above-mentioned technical objective of this utility model is achieved through the following technical solution: an ultrafast laser optical parametric amplifier device, comprising, in sequence along the propagation direction of the optical path:

[0008] A beam splitter is used to split an incident femtosecond laser into a first beam and a second beam.

[0009] A frequency doubling crystal is used to receive the first beam and generate pump light;

[0010] A seed light crystal is used to receive the second light beam and generate seed light;

[0011] A delay component is used to adjust the propagation path length of the seed light in order to adjust the propagation time of the seed light;

[0012] The first dichroic mirror is used to adjust the propagation direction of the pump light so that the pump light and the adjusted seed light coincide to obtain a mixed beam.

[0013] A magnifying crystal is used to amplify the energy of the seed light in the mixed beam;

[0014] A second dichroic mirror is used to separate the pump light in the mixed beam to obtain the seed light with amplified energy.

[0015] Control components;

[0016] The control component is electrically connected to the delay component.

[0017] In one embodiment, the delay component includes:

[0018] Translational electric cylinder, slide rail, sliding base, and reflector assembly;

[0019] The reflector assembly is fixedly mounted on the sliding base;

[0020] The sliding base is slidably mounted on the slide rail;

[0021] The drive end of the translational electric cylinder is connected to the sliding base so that the sliding base can slide on the slide rail; the slide rail is parallel to the propagation direction of the seed light.

[0022] The control component is electrically connected to the translational electric cylinder.

[0023] In one embodiment, the mirror assembly specifically includes:

[0024] The bottom of the first reflector and the bottom of the second reflector are both fixedly connected to the sliding base;

[0025] The first reflector and the second reflector are arranged perpendicular to each other;

[0026] The angle between the first reflecting mirror and the incident direction of the seed light is 45°;

[0027] The angle between the second reflector and the direction of the seed light emission is 45°.

[0028] In one embodiment, the device further includes: a rotary motor for adjusting the angle of the magnifying crystal; the magnifying crystal is fixedly mounted on the drive end of the rotary motor; and the rotary motor is electrically connected to the control component.

[0029] In one embodiment, the control component includes: a control unit, a first drive unit, and a second drive unit;

[0030] The first output terminal of the control unit is electrically connected to the control terminal of the first drive unit;

[0031] The second output terminal of the control unit is electrically connected to the control terminal of the second drive unit;

[0032] The output terminal of the first drive unit is electrically connected to the translational electric cylinder;

[0033] The output terminal of the second drive unit is electrically connected to the rotary motor.

[0034] In one embodiment, the first driving unit includes: a first driving chip, a first resistor, a second resistor, a first capacitor, and a second capacitor;

[0035] The second and sixteenth pins of the first driver chip are both electrically connected to the control unit;

[0036] The first pin, the twenty-first pin, the twenty-fourth pin, and the twenty-sixth pin of the first driving chip are all electrically connected to the translational electric cylinder.

[0037] The third and eighteenth pins of the first driver chip are both grounded;

[0038] Pin 15 of the first driver chip is electrically connected to the power supply voltage terminal.

[0039] The 22nd pin of the first driver chip is electrically connected to the 12V voltage terminal, and the 22nd pin of the first driver chip is also grounded through the second capacitor;

[0040] The 23rd pin of the first driver chip is grounded through the second resistor;

[0041] The 27th pin of the first driver chip is grounded through the first resistor;

[0042] The 28th pin of the first driver chip is electrically connected to the 12V voltage terminal, and the 28th pin of the first driver chip is also grounded through the first capacitor.

[0043] In one embodiment, the second driving unit includes: a second driving chip, a third resistor, a fourth resistor, a third capacitor, and a fourth capacitor;

[0044] The second and sixteenth pins of the second driver chip are both electrically connected to the control unit;

[0045] Pins 1, 21, 24, and 26 of the second driver chip are all electrically connected to the rotary motor.

[0046] The third and eighteenth pins of the second driver chip are both grounded;

[0047] The fifteenth pin of the second driver chip is electrically connected to the power supply voltage terminal;

[0048] The 22nd pin of the second driver chip is electrically connected to the 12V voltage terminal, and the 22nd pin of the second driver chip is also grounded through the fourth capacitor;

[0049] The 23rd pin of the second driver chip is grounded through the fourth resistor;

[0050] The 27th pin of the second driver chip is grounded through the third resistor;

[0051] The 28th pin of the second driver chip is electrically connected to the 12V voltage terminal, and the 28th pin of the second driver chip is also grounded through the third capacitor.

[0052] In one embodiment, the control unit includes: a control chip, a crystal oscillator, a fifth capacitor, a sixth capacitor, and a fifth resistor;

[0053] The eleventh pin of the control chip is electrically connected to the second pin of the first driver chip;

[0054] The 12th pin of the control chip is electrically connected to the 16th pin of the first driver chip;

[0055] The nineteenth pin of the control chip is electrically connected to the second pin of the second driver chip;

[0056] The 20th pin of the control chip is electrically connected to the 16th pin of the second driver chip;

[0057] The eighth pin of the control chip is grounded through the fifth capacitor;

[0058] The ninth pin of the control chip is grounded through the sixth capacitor;

[0059] The eighth pin of the control chip is electrically connected to the ninth pin of the control chip via the crystal oscillator; the eighth pin of the control chip is electrically connected to the ninth pin of the control chip via the fifth resistor.

[0060] In one embodiment, the control component further includes:

[0061] A step-down unit used to adjust 5V to 3.3V;

[0062] The step-down unit includes: a step-down chip, a seventh capacitor, an eighth capacitor, a ninth capacitor, and a tenth capacitor;

[0063] The first pin of the step-down chip is connected to the 5V voltage terminal; the first pin of the step-down chip is grounded through the seventh capacitor; the first pin of the step-down chip is grounded through the eighth capacitor.

[0064] The second pin of the step-down chip is grounded;

[0065] The third pin of the step-down chip is connected to the first pin;

[0066] The fifth pin of the step-down chip is connected to the 3.3V voltage terminal; the fifth pin of the step-down chip is grounded through the ninth capacitor; the fifth pin of the step-down chip is grounded through the tenth capacitor.

[0067] In one embodiment, a boost unit is used to adjust 5V to 12V;

[0068] The boost unit includes: a boost chip, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor, a sixth resistor, a seventh resistor, an eighth resistor, a Schottky diode, and an inductor;

[0069] The first pin of the boost chip is grounded after passing through the sixth resistor and the eleventh capacitor in sequence;

[0070] The second pin of the boost chip is grounded through the eighth resistor; the second pin of the boost chip is electrically connected to the fourth pin of the boost chip through the seventh resistor.

[0071] The third pin of the boost chip is grounded;

[0072] The fourth pin of the boost chip is electrically connected to the anode of the Schottky diode; the cathode of the Schottky diode is connected to the 12V voltage terminal; the cathode of the Schottky diode is also grounded through the twelfth capacitor.

[0073] The fifth pin of the boost chip is electrically connected to the 5V voltage terminal; the fifth pin of the boost chip is grounded through the thirteenth capacitor; the fifth pin of the boost chip is grounded through an inductor.

[0074] The sixth pin of the boost chip is grounded.

[0075] In summary, this invention has the following beneficial effects: An ultrafast laser optical parametric amplifier device, comprising, along the propagation direction of the optical path, the following components in sequence: a beam splitter for splitting an incident femtosecond laser into a first beam and a second beam; a frequency doubling crystal for receiving the first beam and generating pump light; a seed light crystal for receiving the second beam and generating seed light; a delay component for adjusting the propagation path length of the seed light to adjust its propagation time; a first dichroic mirror for adjusting the propagation direction of the pump light so that the pump light and the adjusted seed light coincide to obtain a mixed beam; an amplifying crystal for amplifying the energy of the seed light in the mixed beam; a second dichroic mirror for separating the pump light in the mixed beam to obtain amplified seed light; and a control component; the control component is electrically connected to the delay component. This invention automates everything from time matching of the delay component to angle adjustment of the amplifying crystal, reducing human intervention and improving operational accuracy and efficiency. Automated control reduces human error and ensures high repeatability and stability of the experiment. Attached Figure Description

[0076] Figure 1 This is a schematic diagram of the internal structure of an ultrafast laser optical parametric amplifier device according to the present invention;

[0077] Figure 2 This is a schematic diagram of the control component circuit of this utility model;

[0078] Figure 3 This is a schematic diagram of the step-down unit circuit of this utility model;

[0079] Figure 4 This is a schematic diagram of the boost unit circuit of this utility model.

[0080] In the diagram: 1. Beam splitter; 2. Frequency doubling crystal; 3. Seed crystal; 43. Sliding base; 441. First reflecting mirror; 442. Second reflecting mirror; 5. First dichroic mirror; 6. Magnifying crystal; 7. Second dichroic mirror; 8. Control assembly; 9. Convex lens; 10. Rotary motor; 11. Control unit; 12. First drive unit; 13. Second drive unit. Detailed Implementation

[0081] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0082] In this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. The terms "vertical," "horizontal," "left," "right," "above," "below," and similar expressions are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0083] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0084] Example 1

[0085] To address the aforementioned problems, this invention provides an ultrafast laser optical parametric amplifier device, such as... Figures 1-4As shown, the components along the propagation direction of the optical path sequentially include: a beam splitter 1, used to split the incident femtosecond laser into a first beam and a second beam; a frequency doubling crystal 2, used to receive the first beam and generate pump light; a seed light crystal 3, used to receive the second beam and generate seed light; a delay component, used to adjust the propagation path length of the seed light to adjust the propagation time of the seed light; a first dichroic mirror 5, used to adjust the propagation direction of the pump light so that the pump light and the adjusted seed light coincide to obtain a mixed beam; an amplifying crystal 6, used to amplify the energy of the seed light in the mixed beam; a second dichroic mirror 7, used to separate the pump light in the mixed beam to obtain the amplified seed light; and a control component 8; the control component 8 is electrically connected to the delay component.

[0086] In practical applications, the combination of frequency doubling crystal 2 and seed crystal 3 enables precise control of the pump light and seed light, providing a stable light source for subsequent optical parametric amplification. The introduction of control component 8 enables automatic adjustment of the delay component, improving experimental efficiency and avoiding the instability of manual operation. The seed light energy is amplified by amplifying crystal 6, while a dichroic mirror separates the pump light from the seed light, simplifying subsequent optical path design. In summary, this invention automates everything from time matching of the delay component to angle adjustment of amplifying crystal 6, reducing human intervention and improving operational accuracy and efficiency. Automated control reduces human error, ensuring high repeatability and stability of the experiment.

[0087] In one embodiment, the delay component includes: a translational electric cylinder (not shown in the figure), a slide rail (not shown in the figure), a sliding base 43, and a reflector assembly; the reflector assembly is fixedly mounted on the sliding base 43; the sliding base 43 is slidably mounted on the slide rail; the drive end of the translational electric cylinder is connected to the sliding base 43 so that the sliding base 43 can slide on the slide rail; the slide rail is parallel to the propagation direction of the seed light; and the control component 8 is electrically connected to the translational electric cylinder.

[0088] In practical applications, the actual structure of the slide rail and fixed base can adopt the existing technology, which can drive the sliding base 43 to move in parallel. The translational electric cylinder can convert the rotational motion of the stepper motor into linear motion, thereby driving the sliding base 43 to move in a straight line. Through the drive of the translational electric cylinder, the reflector group can achieve sub-micron level precise position adjustment to meet the time matching requirements of pump light and seed light. The slide rail is parallel to the propagation direction of seed light to ensure the stability of the optical path and avoid unnecessary scattering or directional errors. The sliding base 43 and slide rail structure ensure smooth movement of the reflector and reduce the interference of vibration on the optical path. It is electrically connected and driven by the control component 8. The delay component can be quickly adjusted to shorten the experimental preparation time.

[0089] In one embodiment, the reflector assembly specifically includes: a first reflector 441 and a second reflector 442, the bottom of the first reflector 441 and the bottom of the second reflector 442 being fixedly connected to the sliding base 43; the first reflector 441 and the second reflector 442 are arranged perpendicularly to each other; the angle between the first reflector 441 and the incident direction of the seed light is 45°; the angle between the second reflector 442 and the outgoing direction of the seed light is 45°.

[0090] In practical applications, the two reflectors are set at 45°, so that the seed light can be emitted along a parallel path after two reflections, avoiding the introduction of complex optical paths. The vertical design of the reflector group reduces space occupation and is suitable for integrated optical path systems. By changing the position of the reflector group, the propagation path length of the seed light can be flexibly adjusted to achieve optical path matching between the seed light and the pump light.

[0091] In one embodiment, it further includes: a rotary motor 10 for adjusting the angle of the magnifying crystal 6; the magnifying crystal 6 is fixedly mounted on the drive end of the rotary motor 10; the rotary motor 10 is electrically connected to the control component 8.

[0092] In practical applications, the angle of the amplifying crystal 6 is precisely adjusted by the rotating motor 10 to ensure that the pump light and the seed light meet the phase matching condition in the amplifying crystal 6, thereby improving the conversion efficiency of parametric amplification. It can quickly adapt to different wavelength tuning requirements, meeting the experimental requirements for multiple wavelengths in scientific research; automatic angle adjustment avoids errors that may be caused by manual operation, ensuring high repeatability and accuracy of experimental results.

[0093] Furthermore, such as Figure 1 As shown, a convex lens 9 is placed before and after the seed crystal 3; a convex lens 9 is also placed before and after the frequency doubling crystal 2 to focus the ultrafast laser and prevent excessive divergence that would lead to power reduction. A convex lens 9 is placed before the amplifying crystal 66 to increase the power of the incident laser. The amplifying crystal 6 relies on nonlinear processes (such as optical parametric amplification) to operate, and the intensity of the nonlinear effect is closely related to the light intensity. By placing a convex lens 9 before the amplifying crystal 6, the signal light and pump light can be focused inside the crystal, increasing the light intensity and thus enhancing the efficiency of nonlinear interactions. Secondly, for optical parametric amplification, the pump light and signal light must achieve efficient energy coupling within the crystal. The convex lens 9 can focus the two beams onto the same region of the crystal, thereby optimizing the coupling efficiency. The convex lens 9 not only increases the light intensity but also, through appropriate adjustment, controls the beam size, preventing excessive energy density that could damage the crystal.

[0094] In one embodiment, the control component 8 includes: a control unit 11, a first drive unit 12, and a second drive unit 13; the first output terminal of the control unit 11 is electrically connected to the control terminal of the first drive unit 12; the second output terminal of the control unit 11 is electrically connected to the control terminal of the second drive unit 13; the output terminal of the first drive unit 12 is electrically connected to the translational electric cylinder; and the output terminal of the second drive unit 13 is electrically connected to the rotary motor 10.

[0095] In practical applications, the control unit responds to control signals from the host computer and converts these signals into corresponding PWM pulse signals. Specifically, the host computer typically sends control signals to the microcontroller via communication interfaces such as UART, I2C, SPI, or CAN. The signal content usually includes the following information: target position (e.g., the angle or number of steps the stepper motor needs to rotate), speed (stepping frequency of the stepper motor), direction (clockwise / counterclockwise), and other control commands (such as start, stop, reset, etc.). The control unit receives signals from the communication interface and decodes them. For example, if the host computer sends serial data, the control unit receives the data frame via UART and parses out the specific commands and parameters. Based on the calculation results, the control unit generates a corresponding pulse signal sequence, including: a pulse signal (controlling the stepper motor's stepping frequency) and a direction signal (used to determine the motor's rotation direction, outputting high and low levels via a GPIO). The control unit sends these signals to the first drive unit or the second drive unit. The first drive unit and the second drive unit determine the rotation direction or parallel movement direction of the stepper motor based on the direction signal sent by the microcontroller, so as to control the translational electric cylinder or the stepper motor to move.

[0096] In one embodiment, the first driving unit includes: a first driving chip U2, a first resistor R1, a second resistor R2, a first capacitor C1, and a second capacitor C2; the second and sixteenth pins of the first driving chip U2 are electrically connected to the control unit; the first, twenty-first, twenty-fourth, and twenty-sixth pins of the first driving chip U2 are electrically connected to the translational electric cylinder; the third and eighteenth pins of the first driving chip U2 are grounded; the fifteenth pin of the first driving chip U2 is electrically connected to the power supply voltage terminal; the twenty-second pin of the first driving chip U2 is electrically connected to the 12V voltage terminal, and the twenty-second pin of the first driving chip U2 is also grounded through the second capacitor C2; the twenty-third pin of the first driving chip U2 is grounded through the second resistor R2; the twenty-seventh pin of the first driving chip U2 is grounded through the first resistor R1; the twenty-eighth pin of the first driving chip U2 is electrically connected to the 12V voltage terminal, and the twenty-eighth pin of the first driving chip U2 is also grounded through the first capacitor C1.

[0097] In practical applications, the first driver chip uses a stepper motor driver chip of model A4988SETTR. The first driver chip receives pulse signals from the microcontroller. For each pulse signal received, the translational electric cylinder moves one unit distance. The driver chip controls the motor's speed according to the frequency of the pulse signals.

[0098] In one embodiment, the second drive unit includes: a second drive chip U3, a third resistor R3, a fourth resistor R4, a third capacitor C3, and a fourth capacitor C4; the second and sixteenth pins of the second drive chip U3 are electrically connected to the control unit; the first, twenty-first, twenty-fourth, and twenty-sixth pins of the second drive chip U3 are electrically connected to the rotary motor; the third and eighteenth pins of the second drive chip U3 are grounded; the fifteenth pin of the second drive chip U3 is electrically connected to the power supply voltage terminal; the twenty-second pin of the second drive chip U3 is electrically connected to the 12V voltage terminal, and the twenty-second pin of the second drive chip U3 is also grounded through the fourth capacitor C4; the twenty-third pin of the second drive chip U3 is grounded through the fourth resistor R4; the twenty-seventh pin of the second drive chip U3 is grounded through the third resistor R3; the twenty-eighth pin of the second drive chip U3 is electrically connected to the 12V voltage terminal, and the twenty-eighth pin of the second drive chip U3 is also grounded through the third capacitor C3.

[0099] In practical applications, the second driver chip uses a stepper motor driver chip of model A4988SETTR. The second driver chip receives pulse signals from the microcontroller. For each pulse signal received, the rotary motor rotates by one step angle. The driver chip controls the motor speed according to the frequency of the pulse signals.

[0100] In one embodiment, the control unit includes: a control chip U1, a crystal oscillator Y1, a fifth capacitor C5, a sixth capacitor C6, and a fifth resistor R5; pin 11 of the control chip U1 is electrically connected to pin 2 of the first driver chip U2; pin 12 of the control chip U1 is electrically connected to pin 16 of the first driver chip U2; pin 19 of the control chip U1 is electrically connected to pin 2 of the second driver chip U3; pin 20 of the control chip U1 is electrically connected to pin 16 of the second driver chip U3; pin 8 of the control chip U1 is grounded after passing through the fifth capacitor; pin 9 of the control chip U1 is grounded after passing through the sixth capacitor; pin 8 of the control chip U1 is electrically connected to pin 9 of the control chip U1 after passing through the crystal oscillator Y1; pin 8 of the control chip U1 is electrically connected to pin 9 of the control chip U1 after passing through the fifth resistor R5.

[0101] In practical applications, the control chip U1 uses an STM32G030C8T6 microcontroller chip. Pin 11 of the microcontroller chip is PA0, pin 12 is PA1, pin 19 is PB0, and pin 12 is PB1. These are all programmable pins, which can convert the received control signals into PWM pulse signals according to a predetermined program and output them from the corresponding pins. Specifically, converting the received control signals (such as serial port data) into PWM pulse signals is a conventional method in the prior art and can be adjusted according to actual needs, so it is not described in this application.

[0102] In one embodiment, the control component further includes: a step-down unit for adjusting 5V to 3.3V; the step-down unit includes: a step-down chip U4, a seventh capacitor C7, an eighth capacitor C8, a ninth capacitor C9, and a tenth capacitor C10; the first pin of the step-down chip U4 is connected to the 5V voltage terminal; the first pin of the step-down chip U4 is grounded through the seventh capacitor C7; the first pin of the step-down chip U4 is grounded through the eighth capacitor C8; the second pin of the step-down chip U4 is grounded; the third pin of the step-down chip U4 is connected to the first pin; the fifth pin of the step-down chip U4 is connected to the 3.3V voltage terminal; the fifth pin of the step-down chip U4 is grounded through the ninth capacitor C9; the fifth pin of the step-down chip U4 is grounded through the tenth capacitor C10.

[0103] In practical applications, the step-down chip U4 uses the SPX3819M5-L-3-3 step-down chip, which can step down the 5V voltage to 3.3V to provide the corresponding operating voltage for the driver chip and the control chip.

[0104] In one embodiment, such as Figure 4 As shown, the control component also includes: a boost unit for adjusting 5V to 12V; the boost unit includes: a boost chip U5, an eleventh capacitor C11, a twelfth capacitor C12, a thirteenth capacitor C13, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a Schottky diode D1, and an inductor L1; the first pin of the boost chip U5 is grounded after passing through the sixth resistor R6 and the eleventh capacitor C11; the second pin of the boost chip U5 is grounded after passing through the eighth resistor R8; the second pin of the boost chip U5 is grounded after passing through the seventh resistor R6 and the eleventh capacitor C11. Resistor R7 is electrically connected to pin 4 of boost converter U5; pin 3 of boost converter U5 is grounded; pin 4 of boost converter U5 is electrically connected to the anode of a Schottky diode; the cathode of the Schottky diode is connected to the 12V voltage terminal; the cathode of the Schottky diode is also grounded through the twelfth capacitor C12; pin 5 of boost converter U5 is electrically connected to the 5V voltage terminal; pin 5 of boost converter U5 is grounded through the thirteenth capacitor C13; pin 5 of boost converter U5 is grounded through an inductor; pin 6 of boost converter U5 is grounded.

[0105] In practical applications, the boost chip U5 uses the LM2577SX-ADJ model, which can boost 5V voltage to 12V to drive the stepper motor.

[0106] Example 2

[0107] In this embodiment, a method for calculating the delay between the pump light and the seed light is also provided. The calculation of the delay is essentially to ensure that the two beams of light achieve temporal synchronization (temporal overlap) in the crystal, so as to achieve optimal energy transfer and amplification.

[0108] The delay time Δt can be calculated using the optical path difference:

[0109]

[0110] Among them, L pump L represents the optical path length of the pump light (the path length from the source to the crystal); seed The light path length of the seed light (the path length from the light source to the crystal) is represented by c; the speed of light is represented by n; and the refractive index of the medium is represented by n.

[0111] In this embodiment, a method for calculating the matching angle between light and a crystal is also provided, specifically including:

[0112]

[0113] in, λ represents the wave vector; n represents the refractive index of the medium; λ represents the wavelength of light.

[0114] Based on the refractive index formula for crystalline materials (such as BBO, KTP, etc.), n = f(λ, θ), the refractive index n at different wavelengths can be determined by referring to tables or using the Sellmeier equation. pump ,n seed ,n signal .

[0115] Based on the specific nonlinear process (such as Type I or Type II phase matching), the incident angle θ between the pump light and the seed light is calculated using the phase matching formula:

[0116] n pump cosθ pump =n seed cosθ seed

[0117] The crystal angle is achieved by adjusting the incident angle θ by rotating the crystal to meet the phase matching condition. In this application, the rotation angle of the crystal is controlled by controlling the rotation angle of the stepper motor.

[0118] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0119] The above are merely preferred embodiments of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are within its protection scope. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within its protection scope.

Claims

1. An ultrafast laser optical parametric amplifier device, characterized in that, The light path comprises, in sequence along the propagation direction of the light path: a beam splitter for splitting the incident femtosecond laser into a first light beam and a second light beam; a frequency doubling crystal for receiving the first light beam and generating pump light; a seed light crystal for receiving the second light beam and generating seed light; a time delay component for adjusting the propagation path length of the seed light to adjust the propagation time of the seed light; a first dichroic mirror for adjusting the propagation direction of the pump light to make the pump light and the adjusted seed light coincide with each other to obtain a mixed light beam; an amplification crystal for amplifying the energy of the seed light in the mixed light beam; a second dichroic mirror for separating the pump light in the mixed light beam to obtain the seed light after energy amplification; a control component; The control component is electrically connected with the time delay component.

2. An ultrafast laser optical parametric amplifier device according to claim 1, wherein, The time delay component comprises: a translational electric cylinder, a slide rail, a sliding base, and a mirror group; The mirror group is fixedly arranged on the sliding base; The sliding base is slidingly arranged on the slide rail; The driving end of the translational electric cylinder is in transmission connection with the sliding base, so that the sliding base can slide on the slide rail; the slide rail is parallel to the propagation direction of the seed light; The control component is electrically connected with the translational electric cylinder.

3. An ultrafast laser optical parametric amplifier device according to claim 2, wherein, The mirror group specifically comprises: a first mirror and a second mirror, the bottom of the first mirror and the bottom of the second mirror are fixedly connected with the sliding base; The first mirror and the second mirror are arranged perpendicular to each other; The first mirror forms an angle of 45° with the incident direction of the seed light; The second mirror forms an angle of 45° with the emission direction of the seed light.

4. An ultrafast laser optical parametric amplifier device according to claim 2, wherein, Further comprising: a rotating motor for adjusting the angle of the amplification crystal; the amplification crystal is fixedly arranged on the driving end of the rotating motor; the rotating motor is electrically connected with the control component.

5. An ultrafast laser optical parametric amplifier device according to claim 4, wherein, The control component comprises a control unit, a first driving unit, and a second driving unit; The first output end of the control unit is electrically connected with the control end of the first driving unit; The second output end of the control unit is electrically connected with the control end of the second driving unit; The output end of the first driving unit is electrically connected with the translational electric cylinder; The output end of the second driving unit is electrically connected with the rotating motor.

6. An ultrafast laser optical parametric amplifier device according to claim 5, wherein, The first driving unit comprises a first driving chip, a first resistor, a second resistor, a first capacitor, and a second capacitor; The second foot and the sixteenth foot of the first driving chip are electrically connected with the control unit; The first foot, the twenty-first foot, the twenty-fourth foot, and the twenty-sixth foot of the first driving chip are electrically connected with the translational electric cylinder; The third foot and the eighteenth foot of the first driving chip are grounded; The fifteenth foot of the first driving chip is electrically connected with the power voltage end; The twenty-second foot of the first driving chip is electrically connected with the 12V voltage end, and the twenty-second foot of the first driving chip is further grounded through the second capacitor; The twenty-third foot of the first driving chip is grounded through the second resistor; The twenty-seventh foot of the first driving chip is grounded through the first resistor; The twenty-eighth pin of the first driving chip is electrically connected with a 12V voltage terminal, and the twenty-eighth pin of the first driving chip is further connected with ground through the first capacitor.

7. An ultrafast laser optical parametric amplifier device according to claim 6, wherein, The second driving unit comprises a second driving chip, a third resistor, a fourth resistor, a third capacitor and a fourth capacitor. The second pin and the sixteenth pin of the second driving chip are electrically connected with the control unit. The first pin, the twenty-first pin, the twenty-fourth pin and the twenty-sixth pin of the second driving chip are electrically connected with the rotary motor. The third pin and the eighteenth pin of the second driving chip are grounded. The fifteenth pin of the second driving chip is electrically connected with a power voltage terminal. The twenty-second pin of the second driving chip is electrically connected with a 12V voltage terminal, and the twenty-second pin of the second driving chip is further connected with ground through the fourth capacitor. The twenty-third pin of the second driving chip is connected with ground through the fourth resistor. The twenty-seventh pin of the second driving chip is connected with ground through the third resistor. The twenty-eighth pin of the second driving chip is electrically connected with a 12V voltage terminal, and the twenty-eighth pin of the second driving chip is further connected with ground through the third capacitor.

8. An ultrafast laser optical parametric amplifier device according to claim 7, wherein, The control unit comprises a control chip, a crystal oscillator, a fifth capacitor, a sixth capacitor and a fifth resistor. The eleventh pin of the control chip is electrically connected with the second pin of the first driving chip. The twelfth pin of the control chip is electrically connected with the sixteenth pin of the first driving chip. The nineteenth pin of the control chip is electrically connected with the second pin of the second driving chip. The twentieth pin of the control chip is electrically connected with the sixteenth pin of the second driving chip. The eighth pin of the control chip is connected with ground through the fifth capacitor. The ninth pin of the control chip is connected with ground through the sixth capacitor. The eighth pin of the control chip is electrically connected with the ninth pin of the control chip through the crystal oscillator, and the eighth pin of the control chip is electrically connected with the ninth pin of the control chip through the fifth resistor.

9. An ultrafast laser optical parametric amplifier device according to claim 5, wherein, The control assembly further comprises: a step-down unit for adjusting 5V to 3.3V; The step-down unit comprises a step-down chip, a seventh capacitor, an eighth capacitor, a ninth capacitor and a tenth capacitor. The first pin of the step-down chip is connected with a 5V voltage terminal, and the first pin of the step-down chip is connected with ground through the seventh capacitor and the eighth capacitor. The second pin of the step-down chip is grounded. The third pin of the step-down chip is connected with the first pin. The fifth pin of the step-down chip is connected with a 3.3V voltage terminal, and the fifth pin of the step-down chip is connected with ground through the ninth capacitor and the tenth capacitor.

10. An ultrafast laser optical parametric amplifier device according to claim 5, wherein, a step-up unit for adjusting 5V to 12V; The step-up unit comprises a step-up chip, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor, a sixth resistor, a seventh resistor, an eighth resistor, a Schottky diode and an inductor. The first pin of the step-up chip is connected with ground through the sixth resistor and the eleventh capacitor in sequence. The second pin of the voltage boosting chip is connected with the fourth pin of the voltage boosting chip through the eighth resistor and grounded; the third pin of the voltage boosting chip is grounded; The third pin of the voltage boosting chip is grounded; The fourth pin of the voltage boosting chip is connected with the anode of the Schottky diode; the cathode of the Schottky diode is connected with the 12V voltage terminal; the cathode of the Schottky diode is also connected with the ground through the twelfth capacitor; The fifth pin of the voltage boosting chip is connected with the 5V voltage terminal; the fifth pin of the voltage boosting chip is connected with the ground through the thirteenth capacitor; the fifth pin of the voltage boosting chip is connected with the ground through the inductor; The sixth pin of the voltage boosting chip is grounded.

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