Driving control integrated circuit (IC) and light-emitting diode (LED) integrated packaging lamp bead

Abstract

The utility model relates to a drive control IC (integrated circuit) and LED (light-emitting diode) integrated packaging lamp bead, and relates to the field of display control, in particular to the field of LED display control, the drive control IC and LED integrated packaging lamp bead comprises a first board-to-board connector, a second board-to-board connector and at least one lamp bead body, a GND pin and a VDD pin of each lamp bead body are connected with the first board-to-board connector, and the GND pin and the VDD pin of each lamp bead body are connected with the second board-to-board connector. In every two adjacent front and back lamp bead bodies, the front lamp bead body is connected with the rear lamp bead body, the front lamp bead body is connected with the first board-to-board connector, and the rear lamp bead body is connected with the second board-to-board connector. In the application, through the cooperation of the first board-to-board connector and the second board-to-board connector, the signal is fed back to the controller, further the controller can judge the stability of the system according to the signal feedback, and the control of the driving control IC and the LED integrated packaging lamp bead is realized.

Description

Technical Field

[0001] This application relates to the field of display control, particularly the field of LED display control, and more specifically, to a driver IC integrated with an LED integrated package. Background Technology

[0002] An LED display system consists of several cascaded display units, with signal transmission between these units in series. Various faults may occur in the application of LED display systems, such as damaged signal lines, electrostatic discharge damaging circuits, and unstable voltage, leading to a decrease in the reliability of the entire system. Summary of the Invention

[0003] This application provides a driver IC and LED integrated package lamp bead, including: a first board-to-board connector for connecting to a controller; a second board-to-board connector for connecting to the controller; and at least one lamp bead body arranged sequentially according to a preset arrangement order. Each lamp bead body has a GND pin, a signal input DI pin, a VDD pin, and a signal output DO pin. The GND pin and the VDD pin are connected to the first board-to-board connector. In two adjacent lamp bead bodies, the signal output DO pin of the preceding lamp bead body is connected to the signal input DI pin of the following lamp bead body. In the at least one lamp bead body, the signal input DI pin of the first lamp bead body is connected to the first board-to-board connector, and the signal output DO pin of the last lamp bead body is connected to the second board-to-board connector. The controller is configured to control the signal input from the first board-to-board connector to the at least one lamp bead body via the signal input DI pin in response to a signal input from the signal output DO pin of the at least one lamp bead body to the second board-to-board connector.

[0004] In some technical solutions, a third capacitor is connected in series between the GND pin and the VDD pin of each lamp bead body.

[0005] In some technical solutions, the first board-to-board connector has a second pin, a third pin, and a fourth pin. The second pin is connected to the VDD pin of each of the lamp bodies, the third pin is connected to the signal input DI pin of the first lamp body in the at least one lamp body, and the fourth pin is connected to the GND pin of each of the lamp bodies and grounded.

[0006] In some technical solutions, a first bidirectional breakdown diode is connected in series between the second pin and the fourth pin of the first board-to-board connector.

[0007] In some technical solutions, the second pin of the first board-to-board connector is connected to the first anti-static component, and the first anti-static component is connected to the VDD pin of each of the lamp bodies.

[0008] In some technical solutions, the fourth pin of the first board-to-board connector is connected to the second anti-static component, and the second anti-static component is connected to the GND pin of each of the lamp bodies.

[0009] In some technical solutions, the first and second antistatic components include magnetic beads and / or wire-wound inductors.

[0010] In some technical solutions, the third pin of the first board-to-board connector is connected to a second bidirectional breakdown diode, which is grounded.

[0011] In some technical solutions, a first resistor is connected in series between the second pin of the first board-to-board connector and the signal input DI pin of the first lamp body arranged in the at least one lamp body, and the signal input DI pin of the first lamp body arranged in the at least one lamp body is connected to a second capacitor, which is grounded.

[0012] In some technical solutions, a first capacitor is connected in series between one end of the VDD pin of each of the first anti-static components and one end of the GND pin of each of the lamp bodies connected in the second anti-static component, and a second resistor is connected in series between the DO pin of the last lamp body in the at least one lamp body and the second board-to-board connector.

[0013] In this application, the first board-to-board connector and the second board-to-board connector are used to generate a signal that is fed back to the controller. This allows the controller to determine the stability of the system based on the signal feedback and to control the driver IC and the integrated LED packaged beads. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the driver IC and the integrated LED package in some embodiments.

[0015] Figure 2 This is a schematic diagram of the structure of the driver IC and the integrated LED package in some embodiments.

[0016] Figure 3 This is a schematic diagram of the structure of the driver IC and the integrated LED package in some embodiments. Detailed Implementation

[0017] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0018] exist Figure 1 The document describes a driver IC integrated with an LED in a packaged form, which may have three parts. Among them,

[0019] In Part One:

[0020] The first board-to-board connector J1 has a first pin, a second pin, a third pin, and a fourth pin. The second pin provides a 5V voltage to ground. The second pin is connected to one end of the first anti-static component FB1, thereby allowing the other end of the first anti-static component FB1 to provide a 5V voltage to ground. The first anti-static component FB1 provides electrostatic discharge (ESD) protection, improving system stability. The other end of the first anti-static component FB1 can be connected to one end of the first capacitor C1, and the other end of the first capacitor C1 is connected to ground. The first capacitor C1 utilizes the energy storage characteristics of a capacitor to absorb instantaneous current changes, providing a stable DC voltage and improving system stability.

[0021] The fourth pin is used for grounding, providing a 5V voltage in conjunction with the second pin. The fourth pin can be connected to one end of the second anti-static component FB2, thus grounding the other end of FB2. FB2 provides electrostatic discharge protection, improving system stability. The other end of FB2 is grounded and connected to the other end of the first capacitor C1. The first capacitor C1 utilizes its energy storage characteristics to absorb transient current changes, providing a stable DC voltage and further improving system stability.

[0022] A first bidirectional breakdown diode D13 is connected between the second and fourth pins. By utilizing the bidirectional conduction and breakdown characteristics of the first bidirectional breakdown diode D13, abnormal voltages are clamped within a safe range, protecting the circuit from surges, reverse connections, and electrostatic discharge (ESD) damage, thereby improving system stability.

[0023] In Part Two:

[0024] The second board-to-board connector J2 has a first pin, a second pin, a third pin, and a fourth pin.

[0025] In Part Three:

[0026] The third pin of the first board-to-board connector J1 can be connected to one end of the second bidirectional breakdown diode D14, and the other end of the second bidirectional breakdown diode D14 is grounded. Utilizing the bidirectional conduction and breakdown characteristics of the second bidirectional breakdown diode D14, abnormal voltages, ESD charges, or high-frequency noise are clamped to a safe range while maintaining the integrity of signal transmission.

[0027] The third pin can be connected to one end of the first resistor R1. The other end of the first resistor R1 can be connected to the signal input DI pin of the LED body D1, and to one end of the second capacitor C2. The other end of the second capacitor C2 is connected to ground. By utilizing the frequency response characteristics of the second capacitor C2, unwanted noise is filtered out, while stabilizing the signal transmission path, protecting the circuit, and improving the stability of the system.

[0028] Lamp bodies D1, D2, and D3 all have GND pins, signal input pins DI and VDD pins, and signal output pins DO pins. The VDD pin is connected to the other end of the first anti-static component FB1, and the GND pin is connected to the other end of the second anti-static component FB2. In lamp body D1, a third capacitor C3 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C3, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In lamp body D2, a fourth capacitor C4 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C4, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In lamp body D3, a fifth capacitor C5 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C5, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability.

[0029] The signal input DI pin of the lamp body D1 is connected to the other end of the first resistor R1. The signal output DO pin of the lamp body D1 is connected to the signal input DI pin of the lamp body D2. The signal output DO pin of the lamp body D2 is connected to the signal input DI pin of the lamp body D3. The signal output DO pin of the lamp body D3 is connected to the third pin of the second board-to-board connector J2.

[0030] Each LED chip body, such as D1, D2, and D3, is controlled by a separate driver IC, causing the light-emitting components in each LED chip body to emit light, producing the three primary colors of red, green, and blue.

[0031] The controller can receive signals through the signal output DO pin of the LED body D3, and control the signal input DI pin of the LED body D1 according to the signal output DO pin. This will control the LED bodies D1, D2, and D3 to emit light, forming regular light and providing users with a visual feast.

[0032] exist Figure 2 The document describes a driver IC integrated with an LED in a packaged form, which may have three parts. Among them,

[0033] In Part One:

[0034] The first board-to-board connector J1 has a first pin, a second pin, a third pin, and a fourth pin.

[0035] The second pin is used to provide a 5V voltage to ground. This second pin is connected to one end of the first anti-static component FB1, allowing the other end of FB1 to provide a 5V voltage to ground. FB1 provides electrostatic discharge (ESD) protection, improving system stability. The other end of FB1 can be connected to one end of the first capacitor C1, which is then connected to ground. Capacitor C1 utilizes its energy storage characteristics to absorb transient current changes, providing a stable DC voltage and further improving system stability.

[0036] The fourth pin is used for grounding, providing a 5V voltage in conjunction with the second pin. The fourth pin can be connected to one end of the second anti-static component FB2, thus grounding the other end of FB2. FB2 provides electrostatic discharge protection, improving system stability. The other end of FB2 is grounded and connected to the other end of the first capacitor C1. The first capacitor C1 utilizes its energy storage characteristics to absorb transient current changes, providing a stable DC voltage and further improving system stability.

[0037] A first bidirectional breakdown diode D13 is connected between the second and fourth pins. By utilizing the bidirectional conduction and breakdown characteristics of the first bidirectional breakdown diode D13, abnormal voltages are clamped within a safe range, protecting the circuit from surges, reverse connections, and electrostatic discharge (ESD) damage, thereby improving system stability.

[0038] The third pin can be connected to one end of the second bidirectional breakdown diode D14, and the other end of the second bidirectional breakdown diode D14 is grounded. Utilizing the bidirectional conduction and breakdown characteristics of the second bidirectional breakdown diode D14, abnormal voltages, ESD charges, or high-frequency noise are clamped to a safe range while maintaining the integrity of signal transmission.

[0039] The third pin can be connected to one end of the first resistor R1. The other end of the first resistor R1 can be connected to the signal input DI pin of the LED body D1, and to one end of the second capacitor C2. The other end of the second capacitor C2 is connected to ground. By utilizing the frequency response characteristics of the second capacitor C2, unwanted noise is filtered out, while stabilizing the signal transmission path, protecting the circuit, and improving the stability of the system.

[0040] In Part Two:

[0041] The second board-to-board connector J2 has a first pin, a second pin, a third pin, and a fourth pin. The third pin is connected to one end of the second resistor R2.

[0042] In Part Three:

[0043] Lamp bodies D1, D2, D3, D4, D5, and D6 all have GND pins, signal input DI pins, VDD pins, and signal output DO pins. The VDD pin is connected to the other end of the first anti-static component FB1, and the GND pin is connected to the other end of the second anti-static component FB2. In lamp body D1, a third capacitor C3 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C3, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In lamp body D2, a fourth capacitor C4 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C4, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In lamp body D3, a fifth capacitor C5 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C5, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In LED chip body D4, a sixth capacitor C6 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C6, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In LED chip body D5, a seventh capacitor C7 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C7, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In LED chip body D6, an eighth capacitor C8 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C8, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability.

[0044] The signal input DI pin of LED body D1 is connected to the other end of the first resistor R1. The signal output DO pin of LED body D1 is connected to the signal input DI pin of LED body D2. The signal output DO pin of LED body D2 is connected to the signal input DI pin of LED body D3. The signal output DO pin of LED body D3 is connected to the signal input DI pin of LED body D4. The signal output DO pin of LED body D4 is connected to the signal input DI pin of LED body D5. The signal output DO pin of LED body D5 is connected to the signal input DI pin of LED body D6. The signal output DO pin of LED body D6 is connected to the other end of the second resistor R2.

[0045] Each of the LED bodies D1, D2, D3, D4, D5, and D6 is controlled by a separate driver IC, causing the light-emitting components in each of these LED bodies to emit light, producing the three primary colors of red, green, and blue.

[0046] The controller can receive signals through the signal output DO pin of the LED body D6, and control the signals input to the signal input DI pin of the LED body D1 according to these signals. This will control the LED bodies D1, D2, D3, D4, D5, and D6 to emit light, forming regular light and providing users with a visual feast.

[0047] exist Figure 3 The document describes a driver IC integrated with an LED in a packaged form, which may have three parts. Among them,

[0048] In Part One:

[0049] The first board-to-board connector J1 has a first pin, a second pin, a third pin, and a fourth pin.

[0050] The second pin is used to provide a 5V voltage to ground. This second pin is connected to one end of the first anti-static component FB1, allowing the other end of FB1 to provide a 5V voltage to ground. FB1 provides electrostatic discharge (ESD) protection, improving system stability. The other end of FB1 can be connected to one end of the first capacitor C1, which is then connected to ground. Capacitor C1 utilizes its energy storage characteristics to absorb transient current changes, providing a stable DC voltage and further improving system stability.

[0051] The fourth pin is used for grounding, providing a 5V voltage in conjunction with the second pin. The fourth pin can be connected to one end of the second anti-static component FB2, thus grounding the other end of FB2. FB2 provides electrostatic discharge protection, improving system stability. The other end of FB2 is grounded and connected to the other end of the first capacitor C1. The first capacitor C1 utilizes its energy storage characteristics to absorb transient current changes, providing a stable DC voltage and further improving system stability.

[0052] A first bidirectional breakdown diode D13 is connected between the second and fourth pins. By utilizing the bidirectional conduction and breakdown characteristics of the first bidirectional breakdown diode D13, abnormal voltages are clamped within a safe range, protecting the circuit from surges, reverse connections, and electrostatic discharge (ESD) damage, thereby improving system stability.

[0053] The third pin can be connected to one end of the second bidirectional breakdown diode D14, and the other end of the second bidirectional breakdown diode D14 is grounded. Utilizing the bidirectional conduction and breakdown characteristics of the second bidirectional breakdown diode D14, abnormal voltages, ESD charges, or high-frequency noise are clamped to a safe range while maintaining the integrity of signal transmission.

[0054] In Part Two:

[0055] The second board-to-board connector J2 has a first pin, a second pin, a third pin, and a fourth pin.

[0056] In Part Three:

[0057] Lamp bodies D1, D2, D3, D4, and D5 all have GND pins, signal input DI pins, VDD pins, and signal output DO pins. The VDD pin is connected to the other end of the first anti-static component FB1, and the GND pin is connected to the other end of the second anti-static component FB2. In lamp body D1, a third capacitor C3 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C3, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In lamp body D2, a fourth capacitor C4 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C4, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In lamp body D3, a fifth capacitor C5 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C5, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In the LED chip body D4, a sixth capacitor C6 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C6, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability. In the LED chip body D5, a seventh capacitor C7 is connected in series between the VDD and GND pins. Utilizing the energy storage characteristics of capacitor C7, it absorbs instantaneous current changes, providing a stable DC voltage and improving system stability.

[0058] The signal input DI pin of the LED body D1 is connected to the third pin of the first board-to-board connector J1. The signal output DO pin of the LED body D1 is connected to the signal input DI pin of the LED body D2. The signal output DO pin of the LED body D2 is connected to the signal input DI pin of the LED body D3. The signal output DO pin of the LED body D3 is connected to the signal input DI pin of the LED body D4. The signal output DO pin of the LED body D4 is connected to the signal input DI pin of the LED body D5. The signal output DO pin of the LED body D5 is connected to the third pin of the second board-to-board connector J2.

[0059] Each of the LED bodies D1, D2, D3, D4, and D5 is controlled by a separate driver IC, causing the light-emitting components in each of them to emit light, producing the three primary colors of red, green, and blue.

[0060] The controller can receive signals through the signal output DO pin of the LED body D6, and control the signal input DI pin of the LED body D1 according to the signal output DO pin. This will control the LED bodies D1, D2, D3, D4, and D5 to emit light, forming regular light and providing users with a visual feast.

[0061] Please refer to the following: Figure 1 , Figure 2 and Figure 3 This application describes a driver control IC and LED integrated package lamp bead, wherein the driver control IC and LED integrated package lamp bead includes a first board-to-board connector J1, a second board-to-board connector J2 and at least one lamp bead body (e.g. D1, D2, D3, D4, D5, D6, etc.).

[0062] In some technical solutions, the first board-to-board connector J1 is used to connect to the controller. The second board-to-board connector J2 is used to connect to the controller. At least one LED body (e.g., D1, D2, D3, D4, D5, D6, etc.) is arranged sequentially according to a preset arrangement order. Each LED body has a GND pin, a signal input DI pin and a VDD pin, and a signal output DO pin. The GND pin and VDD pin are connected to the first board-to-board connector J1. In two adjacent LED bodies, the signal output DO pin of the preceding LED body is connected to the signal input DI pin of the following LED body. In at least one LED body (e.g., D1, D2, D3, D4, D5, D6, etc.), The signal input DI pin of the first LED chip is connected to the first board-to-board connector J1, and the signal output DO pin of the last LED chip is connected to the second board-to-board connector J2. The controller is configured to control the first board-to-board connector J1 in response to the signal input DO pin of at least one LED chip (e.g., D1, D2, D3, D4, D5, D6, etc.) to the signal input DI pin of at least one LED chip (e.g., D1, D2, D3, D4, D5, D6, etc.) to the signal input DI pin of at least one LED chip (e.g., D1, D2, D3, D4, D5, D6, etc.).

[0063] In some technical solutions, a third capacitor (such as C3, C4, C5, C6, C7, C8, etc.) is connected in series between the GND pin and VDD pin of each LED chip.

[0064] In some technical solutions, the first board-to-board connector J1 has a second pin, a third pin, and a fourth pin. The second pin is connected to the VDD pin of each lamp body, the third pin is connected to the signal input DI pin of the first lamp body (e.g., D1, D2, D3, D4, D5, D6, etc.) in at least one lamp body, and the fourth pin is connected to the GND pin of each lamp body and grounded.

[0065] In some technical solutions, a first bidirectional breakdown diode D13 is connected in series between the second and fourth pins of the first board-to-board connector J1.

[0066] In some technical solutions, the second pin of the first board-to-board connector J1 is connected to the first anti-static component FB1, and the first anti-static component FB1 is connected to the VDD pin of each lamp bead body.

[0067] In some technical solutions, the fourth pin of the first board-to-board connector J1 is connected to the second anti-static component FB2, and the second anti-static component FB2 is connected to the GND pin of each lamp body.

[0068] In some technical solutions, the first antistatic component FB1 and the second antistatic component FB2 include a magnetic bead and / or a wire-wound inductor.

[0069] In some technical solutions, the third pin of the first board-to-board connector J1 is connected to the second bidirectional breakdown diode D14, and the second bidirectional breakdown diode D14 is grounded.

[0070] In some technical solutions, a first resistor is connected in series between the second pin of the first board-to-board connector J1 and the signal input DI pin of the first lamp body (e.g., D1, D2, D3, D4, D5, D6, etc.). The signal input DI pin of the first lamp body (e.g., D1, D2, D3, D4, D5, D6, etc.) is connected to a second capacitor C2, and the second capacitor C2 is grounded.

[0071] In some technical solutions, a first capacitor is connected in series between the first anti-static component FB1, which connects to one end of the VDD pin of each lamp body, and the second anti-static component FB2, which connects to one end of the GND pin of each lamp body. A second resistor R2 is connected in series between the DO pin of the last lamp body in at least one lamp body (e.g., D1, D2, D3, D4, D5, D6, etc.) and the second board-to-board connector J2.

[0072] In some technical solutions, driver ICs and integrated LED chips can be used in gaming scenarios. Each LED chip (e.g., D1, D2, D3, D4, D5, D6, etc.) has an initial address in its driver IC. The controller can control the driver IC and the integrated LED chip based on this initial address. In a gaming scenario, the controller can encode game music to form encoded data, which may include address data and color data. The controller can then perform initial address replacement for each LED chip (e.g., D1, D2, D3, D4, D5, D6, etc.) based on the address data, giving each LED chip (e.g., D1, D2, D3, D4, D5, D6, etc.) an address corresponding to the address data. Furthermore, the controller controls the brightness of the driver IC and the integrated LED package based on address data, and then uses color data to make each LED (e.g., D1, D2, D3, D4, D5, D6, etc.) light up or even blink according to the color data. This allows the driver IC and the integrated LED package to light up, change colors, or blink according to the music in the game scene, thus providing users with a better gaming experience.

[0073] Of course, in other technical solutions, the controller can also encode based on voice, music, computer lights or other content to further control the driver IC and LED integrated package lamp beads, so that the driver IC and LED integrated package lamp beads can light up the lights, change colors or flash the lights according to voice, music or other content, thereby providing users with a better experience.

[0074] In some technical solutions, the integrated driver IC and LED chip can meet the relevant requirements of EMC (Electromagnetic Compatibility) testing. Specifically, the integrated driver IC and LED chip can meet the relevant EMC testing requirements in terms of operation in electromagnetic environments and interference with other devices. For example, the electromagnetic interference generated by the integrated driver IC and LED chip during operation does not exceed the limits, and the integrated driver IC and LED chip can still operate normally under external electromagnetic interference (such as static electricity, radiation, etc.).

[0075] In some technical solutions, conducted emission (CE) can be used to measure noise transmitted through power lines or signal lines (frequency typically 150kHz-30MHz), and the driver IC and LED integrated package can meet the relevant requirements of EMC testing.

[0076] In some technical solutions, during radiated emission (RE), the electromagnetic waves radiated into space by the measuring device (frequency typically 30MHz-6GHz) can be measured, and the driver IC and LED integrated packaged lamp beads can meet the relevant requirements of EMC testing.

[0077] In some technical solutions, the interference to the power grid can be assessed under harmonic current and flicker conditions, and the integrated package of driver IC and LED chips can meet the relevant requirements of EMC testing.

[0078] In some technical solutions, static electricity from the human body or objects can be simulated during electrostatic discharge (ESD) (e.g., ±4kV~±15kV), and the driver IC and LED integrated packaged lamp beads can meet the relevant requirements of EMC testing.

[0079] In some technical solutions, the stability of the driver IC and the integrated LED package can be verified under radio frequency fields (e.g., 80MHz-6GHz, 3V / m) at the radiated immunity (RS) test. The driver IC and the integrated LED package can meet the relevant requirements of EMC testing.

[0080] In some technical solutions, the tolerance of power lines / signal lines to transient interference can be tested during Fast Transient / Burst (EFT / Burst) events, and the integrated package of driver IC and LED chips can meet the relevant requirements of EMC testing.

[0081] In some technical solutions, high-energy pulses (such as ±1kV~±4kV) caused by lightning strikes or switching operations can be simulated during surges, and the driver IC and LED integrated packaged lamp beads can meet the relevant requirements of EMC testing.

[0082] In some technical solutions, the sensitivity of a cable to radio frequency interference can be evaluated during conducted immunity (CS), and the integrated package of driver IC and LED chips can meet the relevant requirements of EMC testing.

[0083] In some technical solutions, the driver IC and LED integrated package can obtain certifications (such as CE, FCC, CCC) if they meet the relevant requirements of EMC testing.

[0084] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A driving IC integrated LED package lamp bead, characterized in that, The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof.

2. The drive IC and LED integrated package lamp bead of claim 1, wherein, The application relates to a lamp bead body and a controller thereof. 3.The driving IC and LED integrated package lamp bead according to claim 1 or 2, characterized in that, The application relates to a lamp bead body and a controller thereof.

4. The drive IC and LED integrated package lamp pearl of claim 3, wherein, The application relates to a lamp bead body and a controller thereof.

5. The drive IC and LED integrated package lamp bead of claim 4, wherein, The application relates to a lamp bead body and a controller thereof.

6. The drive IC and LED integrated package lamp bead of claim 5, wherein, The application relates to a lamp bead body and a controller thereof.

7. The drive IC and LED integrated package lamp pearl of claim 6, wherein, The application relates to a lamp bead body and a controller thereof.

8. The drive IC and LED integrated package lamp pearl of claim 3, wherein, The application relates to a lamp bead body and a controller thereof.

9. The drive IC and LED integrated package lamp pearl of claim 8, wherein, The application relates to a lamp bead body and a controller thereof.

10. The drive IC and LED integrated package lamp pearl of claim 6, wherein, The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. 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The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead body and a controller thereof. The application relates to a lamp bead

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