LED display screen with multi-channel COB arrangement

Abstract

The LED display screen comprises a substrate, a power interface, a driving circuit, etched copper wires, LED chips and a heat dissipation back plate, the left side of the substrate is fixedly connected with the power interface, the driving circuit is welded to the left side of the front face of the substrate, the etched copper wires are arranged on the front face of the substrate at equal intervals, and the LED chips are welded to the etched copper wires. According to the utility model, signal partition independent driving is realized through the multi-channel etching copper wire, and compared with a traditional single-channel structure, the refresh rate is effectively improved to be more than 3840 Hz.

Description

Technical Field

[0001] This utility model relates to a multi-channel COB-arranged LED display screen. Background Technology

[0002] COB (Chip-on-Board) packaged LED displays are a display technology that integrates multiple LED chips directly onto a circuit board. This is achieved by precisely arranging and batch-bonding the bare chips onto the substrate surface, then covering them with a high-transmittance encapsulating colloid to achieve a seamless seal. This packaging method eliminates the need for traditional LED chip brackets and separate packaging steps, resulting in ultra-thin, high-density pixels (capable of micron-level spacing), and a grain-free display. Furthermore, because the chips are in direct contact with the substrate, they offer superior heat dissipation and impact resistance, making them suitable for high-resolution, long-life indoor and outdoor high-end display applications.

[0003] Traditional COB packaged displays suffer from the following drawbacks: 1. Single-channel driving limits the refresh rate; 2. Dense chip arrangement causes heat buildup; 3. Insufficient uniformity of light transmission in the encapsulation colloid. Existing technologies employ improved solutions such as adding heat dissipation holes or partitioned wiring, but problems such as signal crosstalk and poor light efficiency consistency still exist. Utility Model Content

[0004] The purpose of this invention is to provide a multi-channel COB-arranged LED display screen to solve the above-mentioned technical problems.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A multi-channel COB-arranged LED display screen includes a substrate, a power interface, a driving circuit, etched copper wires, LED chips, and a heat dissipation backplate. The power interface is fixedly connected to the left side of the substrate, the driving circuit is soldered to the left side of the front of the substrate, multiple etched copper wires are equidistantly arranged on the front of the substrate, and multiple LED chips are equidistantly soldered to the surface of the etched copper wires.

[0007] Based on the above technical solution, the substrate includes a ceramic substrate layer, a nano-reflective layer, a copper circuit layer, and an insulating dielectric layer. The nano-reflective layer is distributed on top of the ceramic substrate layer, the copper circuit layer is distributed on top of the nano-reflective layer, and the insulating dielectric layer is distributed on the surface of the copper circuit layer.

[0008] Based on the above technical solution, the heat dissipation backplate includes a corrugated heat dissipation plate, a graphene thermal conductive film, and auxiliary heat dissipation holes. The surface of the corrugated heat dissipation plate is covered with a graphene thermal conductive film, and a plurality of the auxiliary heat dissipation holes are equidistantly distributed on the surface of the corrugated heat dissipation plate.

[0009] Compared with the prior art, this utility model has the following advantages: This utility model achieves independent driving of signal partitions through multi-channel etched copper lines, which effectively improves the refresh rate to over 3840Hz compared with the traditional single-channel structure. At the same time, it adopts a composite heat dissipation design of waveform heat sink and graphene thermal conductive film, which reduces the chip junction temperature by 15-20℃. The nano-reflective layer of the substrate improves the uniformity of light output through a nano-alumina coating with 98% reflectivity. Combined with the differential signal trace layout of the copper circuit layer, it suppresses crosstalk between adjacent channels to below -45dB. The insulating dielectric layer uses polyimide material to achieve electrical isolation with a withstand voltage of >3kV / mm. Combined with the chimney effect formed by the auxiliary heat dissipation holes, it comprehensively improves the light efficiency consistency and thermal stability of the display screen. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the appearance and structure of this utility model.

[0011] Figure 2 This is a schematic diagram of the substrate structure of this utility model.

[0012] Figure 3 This is a schematic diagram of the heat dissipation backplate device of this utility model.

[0013] In the diagram: 1. Substrate, 2. Power interface, 3. Driver circuit, 4. Etched copper wire, 5. LED chip, 6. Heat sink backplate, 7. Ceramic substrate layer, 8. Nano reflective layer, 9. Copper circuit layer, 10. Insulating dielectric layer, 11. Waveform heat sink, 12. Graphene thermal conductive film, 13. Auxiliary heat dissipation hole. Detailed Implementation

[0014] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0015] like Figure 1-3 As shown, a multi-channel COB-arranged LED display screen includes a substrate 1, a power interface 2, a driving circuit 3, etched copper wires 4, LED chips 5, and a heat dissipation backplate 6. The power interface 2 is fixedly connected to the left side of the substrate 1, the driving circuit 3 is soldered to the left side of the front of the substrate 1, multiple etched copper wires 4 are equidistantly opened on the front of the substrate 1, and multiple LED chips 5 are equidistantly soldered to the surface of the etched copper wires 4.

[0016] The substrate 1 includes a ceramic substrate layer 7, a nano-reflective layer 8, a copper circuit layer 9, and an insulating dielectric layer 10. The nano-reflective layer 8 is distributed on the top of the ceramic substrate layer 7, the copper circuit layer 9 is distributed on the top of the nano-reflective layer 8, and the insulating dielectric layer 10 is distributed on the surface of the copper circuit layer 9.

[0017] The heat dissipation backplate 6 includes a corrugated heat dissipation plate 11, a graphene thermal conductive film 12, and auxiliary heat dissipation holes 13. The surface of the corrugated heat dissipation plate 11 is covered with the graphene thermal conductive film 12, and a plurality of auxiliary heat dissipation holes 13 are equidistantly distributed on the surface of the corrugated heat dissipation plate 11.

[0018] The working principle of this invention is as follows: After power is input into the power interface 2, the drive circuit 3 provides independent control signals to the LED chip 5 through multi-channel etched copper wires 4. The ceramic substrate layer 7 quickly dissipates heat from the chip due to its high thermal conductivity (24W / m·K), and the nano-reflective layer 8 reflects lateral light to the light-emitting surface to improve brightness uniformity. The copper circuit layer 9 uses 0.1mm spacing wiring to achieve multi-channel parallel driving, and the insulating dielectric layer 10 isolates adjacent lines to prevent short circuits. When heat is transferred from the substrate 1 to the heat dissipation backplate 6, the wave-shaped heat dissipation plate 11 increases the heat dissipation area through its wave-shaped structure, and the graphene thermal conductive film 12 diffuses heat laterally with a thermal conductivity of 5300W / m·K. The auxiliary heat dissipation holes 13 form air convection to accelerate heat dissipation, ultimately achieving stable display of the high-density chip 5.

[0019] The above description is a preferred embodiment of the present utility model. For those skilled in the art, any changes, modifications, substitutions and variations made to the implementation methods without departing from the principles and spirit of the present utility model, based on the teachings of the present utility model, still fall within the protection scope of the present utility model.

Claims

1. A multi-channel COB-arranged LED display screen, comprising a substrate (1), a power interface (2), a driving circuit (3), etched copper wires (4), LED chips (5), and a heat dissipation backplate (6), characterized in that: A power interface (2) is fixedly connected to the left side of the substrate (1), the driving circuit (3) is soldered to the left side of the front of the substrate (1), multiple etched copper lines (4) are equally spaced on the front of the substrate (1), and multiple LED chips (5) are equally spaced on the surface of the etched copper lines (4).

2. The LED display screen with multi-channel COB arrangement according to claim 1, characterized in that: The substrate (1) includes a ceramic substrate layer (7), a nano-reflective layer (8), a copper circuit layer (9), and an insulating dielectric layer (10). The nano-reflective layer (8) is distributed on the top of the ceramic substrate layer (7), the copper circuit layer (9) is distributed on the top of the nano-reflective layer (8), and the insulating dielectric layer (10) is distributed on the surface of the copper circuit layer (9).

3. The LED display screen with multi-channel COB arrangement according to claim 1, characterized in that: The heat dissipation backplate (6) includes a wave-shaped heat dissipation plate (11), a graphene thermal conductive film (12), and auxiliary heat dissipation holes (13). The surface of the wave-shaped heat dissipation plate (11) is covered with a graphene thermal conductive film (12), and a plurality of auxiliary heat dissipation holes (13) are equidistantly distributed on the surface of the wave-shaped heat dissipation plate (11).

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