Connection structure and electronic equipment

Abstract

The utility model provides a connecting structure and electronic equipment, and relates to the technical field of signal transmission. The connection structure comprises a conductor layer and a target layer, and the conductor layer is provided with a first surface and a second surface which are opposite to each other; the target layer has elasticity, at least one of the first surface and the second surface is provided with the target layer, and the target layer and the conductor layer are insulated.

Description

Technical Field

[0001] This application relates to the field of signal transmission technology, and in particular to a connection structure and electronic device. Background Technology

[0002] The contradiction between the mechanical deformation of flexible circuit boards and signal transmission performance is becoming increasingly prominent. When the equipment structure requires the flexible circuit board to be bent multiple times in a limited space, the physical deformation will cause the impedance continuity of the transmission path to be damaged, which in turn will cause signal reflection, crosstalk to be aggravated and attenuated, affecting signal integrity. Utility Model Content

[0003] To address the aforementioned technical problems, this application provides the following technical solutions:

[0004] The first aspect of this application provides a connection structure including a conductor layer and a target layer. The conductor layer has a first surface and a second surface facing away from each other. The target layer is elastic, and the target layer is provided on at least one of the first surface and the second surface. The target layer and the conductor layer are insulated from each other.

[0005] In some embodiments, the elastic modulus of the target layer on the first surface of the conductor layer is different from that of the target layer on the second surface.

[0006] In some embodiments, a plurality of ceramic particles are embedded in the target layer; and / or, a plurality of pores are spaced apart on the target layer.

[0007] In some embodiments, the connection structure further includes a polyethylene adhesive layer and a shielding layer. The shielding layer is used to shield electromagnetic signals. The shielding layer is stacked with the conductor layer and the shielding layer's orthogonal projection onto the conductor layer covers the conductor layer. The shielding layer is connected to the side of the target layer away from the conductor layer through the polyethylene adhesive layer.

[0008] In some embodiments, the shielding layer has a first coating layer near the conductor layer for isolating electromagnetic signals; and / or, the shielding layer has a second coating layer away from the conductor layer for isolating electromagnetic signals.

[0009] In some embodiments, the connection structure further includes a first insulating layer for electrical isolation; a conductor layer is embedded in the first insulating layer such that both the first surface and the second surface of the conductor layer are located inside the first insulating layer; wherein the first insulating layer has a plurality of holes penetrating the first insulating layer along its thickness direction.

[0010] In some embodiments, the connection structure further includes a second insulating layer for electrical isolation, wherein the second insulating layer is stacked on the first and second surfaces of the conductor layer; wherein the side of the second insulating layer near the conductor layer is provided with a plurality of heat dissipation grooves, and the extending direction of the heat dissipation grooves forms an angle with the extending direction of the conductor of the conductor layer.

[0011] A second aspect of this application provides an electronic device, comprising: a connection structure, the connection structure including: a conductor layer having opposite first and second surfaces; a target layer having elasticity, the target layer being disposed on at least one side of the first and second surfaces, and the target layer and the conductor layer being insulated from each other.

[0012] In some embodiments, the electronic device further includes: a connection body having a connection portion, wherein the conductor layer has an input terminal and an output terminal at both ends along its extension direction, and the input terminal and the output terminal are respectively connected to the connection portions of the two connection bodies; a tin-plated copper foil layer, which is stacked on the side of the shielding layer opposite to the conductor layer and connected to the shielding layer, and the tin-plated copper foil layer has a soldering area; and a lead-out terminal, which is disposed on the connection body and corresponds to and is soldered to the soldering area to ground the shielding layer.

[0013] In some embodiments, the electronic device further includes: a device housing having a receiving cavity and two port portions on both sides of the device housing; a motherboard assembly disposed in the receiving cavity; the motherboard assembly being electrically connected to the two port portions respectively via two connection structures; wherein, the connection body of the input end of the conductor layer is electrically connected to the motherboard assembly, and the connection body of the output end of the conductor layer is electrically connected to the port portion. Attached Figure Description

[0014] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0015] Figure 1 A schematic diagram of a connection structure provided in this application is shown at a first angle.

[0016] Figure 2 A schematic diagram of a connection structure provided in this application in a bent state is shown.

[0017] Figure 3 A schematic diagram of a connection structure provided in this application from a second angle is shown.

[0018] Figure 4 A schematic diagram of another connection structure provided in this application is shown.

[0019] Figure 5 A top view schematically illustrating a partial structure of a connection structure provided in this application is shown.

[0020] Figure 6 A schematic diagram of a partial structure of an electronic device provided in this application is shown.

[0021] Figure 7 A schematic diagram of the internal structure of an electronic device provided in this application is shown.

[0022] Explanation of icon numbers:

[0023] 1. Conductor layer; 11. First surface; 12. Second surface; 13. Input terminal; 14. Output terminal; 2. Target layer; 21. Ceramic particles; 22. Hole; 3. Polyethylene adhesive layer; 4. Shielding layer; 5. First insulating layer; 6. Second insulating layer; 61. Heat dissipation groove; 7. Connecting body; 71. Connecting part; 72. Lead-out terminal; 8. Tin-plated copper foil layer; 81. Welding area; 9. Equipment housing; 91. Receiving cavity; 10. Main board assembly; 92. Port part; A. Connection structure; A1. Inner arc surface; A2. Outer arc surface. Detailed Implementation

[0024] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0025] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0026] The inventors discovered that when using FFC to connect the ports on both sides of a laptop, the transmission path is long and the FFC needs to be bent inside the device. When the FFC is bent, the shape and position of the conductor layer 1 will change, which will cause changes in the length and shape of the signal path, thereby causing changes in the signal propagation speed and generating signal reflection and attenuation, thus significantly increasing the signal integrity problem.

[0027] To address the aforementioned technical problems, this application provides the following technical solutions:

[0028] The first aspect of this application provides a connection structure A, such as... Figures 1-5 As shown, it includes a conductor layer 1 and a target layer 2. The conductor layer 1 has a first surface 11 and a second surface 12 facing away from each other. The target layer 2 is elastic. The target layer 2 is provided on at least one side of the first surface 11 and the second surface 12. The target layer 2 and the conductor layer 1 are insulated from each other.

[0029] In one possible scenario, this connection structure A can be applied to, but is not limited to, electronic devices such as laptops, tablets, and mobile phones. Figures 1-4As shown, conductor layer 1 can be used for signal transmission and can be made of metals with good conductivity, such as copper, aluminum, and silver, to improve the quality of signal transmission. Conductor layer 1 may include multiple spaced flat conductors or multiple spaced round conductors. Target layer 2 can be made of an elastic material, such as silicone rubber, polyurethane, fluororubber, or other highly elastic polymer materials, which can maintain good elasticity and durability and effectively protect conductor layer 1 from damage during repeated bending. Target layer 2 can be disposed on at least one of the first surface 11 or the second surface 12 of conductor layer 1, or simultaneously on both surfaces of conductor layer 1, to improve the deformation compensation effect. Insulation can be provided between target layer 2 and conductor layer 1 to avoid electrical short circuits. The insulation can be provided in several ways: a thin insulating material (such as polyimide or polyester film, polytetrafluoroethylene, epoxy resin, etc.) can be directly coated or pasted onto the first surface 11 or the second surface 12 of the conductor layer 1, and then the target layer 2 can be provided on it; or an insulating layer, such as polyimide film, polytetrafluoroethylene, epoxy resin, etc., can be sandwiched between the conductor layer 1 and the target layer 2.

[0030] In this application, the target layer 2, stacked with the conductor layer 1, is elastic, allowing it to compress or stretch according to the degree of bending when the connection structure bends. This enables the target layer 2 to effectively absorb and release mechanical stress caused by bending, thereby protecting the internal conductor layer 1 from the effects of stress and allowing it to recover its state after multiple bends. By compensating for this deformation, the target layer 2 maintains signal path consistency, reduces reflection and attenuation, and thus ensures signal integrity.

[0031] In some embodiments, the elastic modulus of the target layer 2 on the first surface 11 of the conductor layer 1 is different from that of the target layer 2 on the second surface 12.

[0032] In one possible scenario, the first surface 11 and the second surface 12 of the conductor layer 1 may be provided with target layers 2 of different elastic moduli. A target layer 2 with a higher elastic modulus may be provided on the first surface 11 of the conductor layer 1, while a target layer 2 with a lower elastic modulus may be provided on the second surface 12, or a target layer 2 with a lower elastic modulus may be provided on the first surface 11, while a target layer 2 with a higher elastic modulus may be provided on the second surface 12, depending on actual needs.

[0033] A target layer 2 with a higher elastic modulus is placed on the side closer to the center of curvature. The center of curvature can be the point around which the connecting structure A bends, which can be the geometric center or instantaneous rotation center of the bending arc. "Closer to the center of curvature" means a position relatively close to the center of curvature. When the connecting structure A bends, the portion located on the inner side of the bend is closer to the center of curvature; that is, the inner arc surface A1 of the bent portion of the connecting structure A is closer to the center of curvature, and this portion experiences less elongation or compressive deformation. During bending, the side farther from the center of curvature can refer to the portion farther from the center, located on the outer side of the bent structure; that is, the outer arc surface A2 of the bent portion of the connecting structure A is farther from the center of curvature. On the side closer to the outer arc surface A2, the material needs to extend more to accommodate the bending. A target layer 2 with a higher elastic modulus is placed on the side closer to the center of curvature, i.e., closer to the inner arc surface A1 of the bent portion. A target layer 2 with a lower elastic modulus is placed on the side farther from the center of curvature, i.e., closer to the outer arc surface A2 of the bent portion. During bending, the outer target layer 2 with low elastic modulus can adapt to stretching more flexibly, while the inner target layer 2 with high elastic modulus provides the necessary rigidity and support to prevent wrinkles or accumulation due to excessive compression. The two target layers 2 work together to protect the conductor layer 1 from mechanical damage and reduce the risk of material damage caused by uneven stress distribution, so that the connection structure A can maintain good physical shape and signal transmission performance even after multiple bends.

[0034] In some embodiments, a plurality of ceramic particles 21 are embedded in the target layer 2; and / or, a plurality of holes 22 are spaced apart on the target layer 2.

[0035] In one possible case, such as Figure 1 As shown, multiple ceramic particles 21 can be embedded in the target layer 2. Specifically, ceramic particles 21 can be embedded and bonded to the interior of the target layer 2 through methods such as hot pressing sintering, sol-gel method, or surface modification treatment. The ceramic particles 21 can be small particles made of ceramic materials, and their specific size can be set according to actual needs. They can be nano-sized ceramic particles 21 with a diameter less than 100 nanometers or micro-sized ceramic particles with a diameter between 1 and 100 micrometers. By embedding ceramic particles in the target layer 2, the target layer 2 can possess both excellent thermal conductivity and sufficient flexibility and elasticity.

[0036] Additionally, multiple holes 22 can be spaced apart on the target layer 2. These holes 22 can penetrate the target layer 2 along its thickness direction or only partially penetrate it. The holes 22 can be circular, elliptical, square, or other geometric shapes. Furthermore, using randomly distributed holes 22 in the curved region of the connecting structure A can better disperse stress and avoid localized excessive stretching or compression. In some cases, the target layer 2 includes a first region and a second region with different hole densities. The hole density in the first region can be greater than that in the second region. The first region can be the side of the target layer 2 closer to the center of curvature, i.e., the side of the target layer closer to the inner curved surface A1, and the second region can be the side farther from the center of curvature, i.e., the side of the target layer closer to the outer curved surface A2. The side of the target layer 2 closer to the center of curvature uses denser holes 22 to increase flexibility, while the side farther from the center of curvature maintains fewer holes 22 to maintain necessary rigidity.

[0037] The target layer 2 can embed multiple ceramic particles 21 or set multiple holes 22 as needed, or set multiple holes 22 while embedding multiple ceramic particles 21.

[0038] In some embodiments, the connection structure A may further include a polyethylene adhesive layer 3 and a shielding layer 4. The shielding layer 4 can be used to shield electromagnetic signals. The shielding layer 4 can be stacked with the conductor layer 1 and the orthogonal projection of the shielding layer 4 onto the conductor layer 1 covers the conductor layer 1. The shielding layer 4 can be connected to the side of the target layer 2 away from the conductor layer 1 through the polyethylene adhesive layer 3.

[0039] In one possible case, such as Figures 1-4As shown, the shielding layer 4 is used to block external electromagnetic waves from interfering with the internal conductor layer 1, thereby improving the stability and reliability of data transmission. Simultaneously, the shielding layer 4 also reduces the leakage of internally generated electromagnetic radiation into the external environment, preventing interference with other electronic devices. The shielding layer 4 is stacked with the conductor layer 1, and its orthographic projection completely covers the conductor layer 1. In some embodiments, the shielding layer 4 can also completely surround all conductor portions to provide comprehensive electromagnetic protection. The shielding layer 4 can be made of materials with good conductivity, such as copper foil or aluminum foil. These materials not only have excellent electromagnetic shielding effects but also possess a certain degree of flexibility, making them suitable for applications requiring bending. The shielding layer 4 may include a PET (polyethylene terephthalate) layer, an aluminum layer, and then be connected to the side of the target layer 2 facing away from the conductor layer 1 by a polyethylene adhesive layer 3. The PET layer serves as the substrate, providing physical support and electrical insulation. The aluminum layer is used for electromagnetic shielding. The use of the polyethylene adhesive layer 3 helps improve electrical performance at high frequencies, as it has a low dielectric constant and low signal transmission loss. In addition, the polyethylene adhesive layer 3 can not only reduce the overall dielectric constant and improve high-frequency performance, but also maintain good adhesion between the shielding layer 4 and the target layer 2, avoiding delamination during bending or use.

[0040] In some embodiments, the shielding layer 4 has a first coating layer near the conductor layer 1 for isolating electromagnetic signals; and / or, the shielding layer 4 has a second coating layer away from the conductor layer 1 for isolating electromagnetic signals.

[0041] In one possible scenario, to further enhance the electromagnetic shielding effect and improve signal integrity and electromagnetic compatibility of the equipment, a first coating layer can be provided on the side of the shielding layer 4 closest to the conductor layer 1, or a second coating layer can be provided on the side of the shielding layer 4 away from the conductor layer 1, or both the first and second coating layers can be provided simultaneously on both sides of the shielding layer 4. The first coating layer can further enhance the electromagnetic protection of the conductor layer 1, preventing external electromagnetic interference from affecting the internal signal transmission. The main function of the second coating layer is to block external electromagnetic signals from interfering with the entire structure, especially when the connection structure A is installed in an area with a complex electromagnetic environment. The first and second coating layers can be made of materials with good conductivity and shielding effectiveness, such as metallized polymers (e.g., silver paste, copper paste, etc.), and can be coated by spraying or screen printing.

[0042] In some embodiments, the connection structure A further includes a first insulating layer 5 for electrical isolation; the conductor layer 1 is embedded in the first insulating layer 5 such that the first surface 11 and the second surface 12 of the conductor layer 1 are both located inside the first insulating layer 5; wherein the first insulating layer 5 is provided with a plurality of holes penetrating the first insulating layer 5 along its thickness direction.

[0043] In one possible case, such as Figure 1 , Figure 2 , Figure 3 As shown, the first insulating layer 5 can be used to provide electrical isolation for the conductor layer 1. The conductor layer 1 can be completely embedded inside the first insulating layer 5, that is, the conductor layer 1 can be completely wrapped inside the first insulating layer 5, so that the first surface 11 and the second surface 12 of the conductor layer 1 are both located inside the first insulating layer 5. This can effectively prevent the conductor layer 1 from delaminating during bending, thereby avoiding impedance fluctuations. The first insulating layer 5 can be made of polyimide, polyester, or other high-performance insulating materials.

[0044] In some embodiments, the connection structure A further includes a second insulating layer 6 for electrical isolation, wherein the first surface 11 and the second surface 12 of the conductor layer 1 are respectively stacked with the second insulating layer 6; wherein the side of the second insulating layer 6 near the conductor layer 1 is provided with a plurality of heat dissipation grooves 61, and the extending direction of the heat dissipation grooves 61 forms an angle with the extending direction of the conductor of the conductor layer 1.

[0045] In one possible case, such as Figure 4 As shown, the second insulating layer 6 can be used to provide additional electrical isolation for the conductor layer 1, preventing short circuits and other electrical faults between different conductors. The first surface 11 and the second surface 12 of the conductor layer 1 can each be covered with the second insulating layer 6, forming a double-sided protective structure. Figure 4 , Figure 5 As shown, the second insulating layer 6 near the conductor layer 1 can be provided with multiple heat dissipation grooves 61. The extending direction of the heat dissipation grooves 61 forms a certain angle with the extending direction of the conductor of the conductor layer 1 to optimize airflow and heat dissipation. The angle can be 10°, 20°, 50°, etc. For example, multiple heat dissipation grooves 61 can be provided on the side of the second insulating layer 6 near the conductor layer 1, with a groove width of 0.5 mm and a depth of 0.1 mm. These heat dissipation grooves 61 form a 45-degree angle with the extending direction of the conductor of the conductor layer 1. The heat dissipation grooves 61 increase the surface area of ​​the insulating layer, which helps to dissipate heat more quickly and promotes airflow inside the second insulating layer 6, helping to remove more heat and thus reducing the overall temperature. The lower operating temperature helps to maintain a stable dielectric constant, reduce signal delay and dielectric loss caused by temperature rise, and improve the reliability of high-speed data transmission. The second insulating layer 6 can be made of polyimide, polyester, or other high-performance insulating materials.

[0046] A second aspect of this application provides an electronic device, including: a connection structure A, the connection structure A including: a conductor layer 1 having a first surface 11 and a second surface 12 facing away from each other; a target layer 2 having elasticity, the target layer 2 being disposed on at least one side of the first surface 11 and the second surface 12, and the target layer 2 and the conductor layer 1 being insulated from each other.

[0047] In one possible scenario, the electronic device of this application can be a laptop, mobile phone, or desktop computer, etc. The conductor layer 1 in the connection structure A is the core component of the entire connection structure A and can be used for high-speed data transmission. The connection structure A can be used to connect the interface (such as the TBT port) in an electronic device (such as a laptop) to the motherboard, and multiple connection structures A can be equipped in the electronic device. In this application, the target layer 2, which is stacked with the conductor layer 1, is elastic, allowing it to be compressed or stretched according to the degree of bending when the connection structure A is bent. This enables the target layer 2 to effectively absorb and release the mechanical stress caused by bending, thereby protecting the internal conductor layer 1 from these stresses. This ensures that the conductor layer 1 can return to near its original state after multiple bends, rather than undergoing irreversible plastic deformation. By compensating for this deformation, the elastic layer helps maintain the consistency of the signal path, reduces reflection and attenuation, and thus ensures signal integrity.

[0048] In some embodiments, the electronic device further includes: a connecting body 7 having a connecting portion 71, wherein the conductor layer 1 has an input terminal 13 and an output terminal 14 at both ends along its extension direction, and the input terminal 13 and the output terminal 14 are respectively connected to the connecting portions 71 of the two connecting bodies 7; a tin-plated copper foil layer 8, which is stacked on the side of the shielding layer 4 opposite to the conductor layer 1 and connected to the shielding layer 4, and the tin-plated copper foil layer 8 has a soldering area 81; and a lead-out terminal 72, which is disposed on the connecting body 7 and corresponds to and is soldered to the soldering area 81 to ground the shielding layer 4.

[0049] In one possible case, such as Figure 6As shown, the connecting body 7 can be a component used to fix and connect the two ends of the conductor layer 1, enabling the conductor layer 1 to reliably connect to external devices or other internal circuits. The connecting body 7 may have a connecting portion 71, which may include multiple signal contacts that correspond one-to-one with and connect to the conductors in the conductor layer. The input end 13 and output end 14 at both ends of the conductor layer 1 along its extension direction can be respectively connected to the connecting portions 71 of the two connecting bodies 7 to ensure stable signal transmission from one port to another. A tin-plated copper foil layer 8 may be provided on the side of the shielding layer 4 opposite to the conductor layer 1. The tin-plated copper foil layer 8 may partially or completely cover the shielding layer 4. It can be connected to the shielding layer 4 by uniformly applying a thin layer of conductive adhesive to the surface of the shielding layer 4 or by mechanically pressing the tin-plated copper foil layer 8 tightly together with the shielding layer 4. The tin-plated copper foil layer 8 may have a soldering area 81 for soldering to the lead-out terminal 72 to ground the shielding layer 4. The lead-out terminal 72 may be a spring contact extending from the connecting body 7. The welding area 81 may include multiple spaced welding points, each corresponding to and welded to a plurality of lead-out terminals 72. The welding points may be spaced along the side of the tin-plated copper foil layer 8 closest to the connecting body 7, and their number can be selected according to actual needs, such as 2, 4, or 5. The shape of each welding point can be arbitrary, such as circular, rectangular, or irregular. The area of ​​the welding point can be set according to actual needs; here, a circular welding point is used as an example, for example, the area of ​​the welding point could be 10 mm². 2 12mm 2 16mm 2 By grounding the shielding layer 4 through multiple solder points, electromagnetic interference can be more effectively dispersed and absorbed, reducing the coupling effect of noise signals in the circuit and helping to maintain signal integrity and purity. In addition, multiple solder points can evenly distribute current, avoiding the risk of overheating or damage caused by a single solder point carrying excessive current. Simultaneously, multiple solder points provide more physical support, enhancing the bonding force between the lead-out terminal 72 and the tin-plated copper foil layer 8.

[0050] In some embodiments, the electronic device further includes: a device housing 9 having a receiving cavity 91, and two port portions 92 on both sides of the device housing 9; a motherboard assembly 10 disposed in the receiving cavity 91; the motherboard assembly 10 being electrically connected to the two port portions 92 respectively via two connection structures A; wherein, the connection body 7 of the input terminal 13 of the conductor layer 1 is electrically connected to the motherboard assembly 10, and the connection body 7 of the output terminal 14 of the conductor layer 1 is electrically connected to the port portion 92.

[0051] In one possible case, such as Figure 7As shown, the device housing 9 provides physical protection for internal components such as the connection structure A, preventing external dust and other impurities from affecting the internal circuitry. The device housing 9 includes, but is not limited to, laptop casings, mobile phone casings, etc. The device housing 9 may have a receiving cavity 91 for housing the connection structure A, motherboard assembly 10, and other internal components. The device housing 9 may have two port sections 92 on both sides for connecting external devices; these ports may be Thunderbolt ports, USB ports, etc. The motherboard assembly 10 is the core component of the electronic device and may contain a processor, memory, storage, and other critical circuits. The motherboard assembly 10 processes and transmits data signals, enabling efficient communication between the ports. The motherboard assembly 10 can be housed within the receiving cavity 91 of the device housing 9, and the motherboard assembly 10 is electrically connected to the ports via the connection structure A. The connection body 7 of the input terminal 13 of the conductor layer 1 can be electrically connected to the motherboard assembly 10. The connection body 7 of the input terminal 13 of the conductor layer 1 can be connected to the motherboard assembly 10 by plugging or soldering. The output terminal 14 is electrically connected to the port 92. The connection body 7 of the output terminal 14 of the conductor layer 1 can be connected to the port by plugging or soldering.

[0052] In this application, the target layer 2, stacked with the conductor layer 1, is elastic, allowing it to compress or stretch according to the degree of bending when the connection structure A is bent. This enables the target layer 2 to effectively absorb and release the mechanical stress caused by bending, thereby protecting the internal conductor layer 1 from these stresses. This ensures that the conductor layer 1 can recover to near its original state after multiple bends, rather than undergoing irreversible plastic deformation. By compensating for this deformation, the elastic layer helps maintain signal path consistency, reduces reflection and attenuation, and thus guarantees signal integrity. This allows for the placement of a TBT port on each side of the laptop, providing a more flexible interface layout and facilitating simultaneous connection of multiple external devices, such as monitors and storage devices.

[0053] It should be noted that in the description of this specification, the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure; the terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this disclosure can be understood according to the specific circumstances.

[0054] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0055] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A connection structure, characterized in that, include: A conductor layer having a first surface and a second surface opposite to each other; The target layer is elastic, and at least one of the first surface and the second surface is provided with the target layer, and the target layer and the conductor layer are insulated from each other.

2. The connection structure according to claim 1, characterized in that, The elastic modulus of the target layer on the first surface of the conductor layer is different from that of the target layer on the second surface.

3. The connection structure according to claim 1, characterized in that, The target layer contains multiple ceramic particles; and / or, The target layer has multiple holes spaced apart.

4. The connection structure according to claim 1, characterized in that, Also includes: Polyethylene adhesive layer; A shielding layer is used to shield electromagnetic signals. The shielding layer is stacked with the conductor layer and the orthogonal projection of the shielding layer onto the conductor layer covers the conductor layer. The shielding layer is connected to the side of the target layer away from the conductor layer through the polyethylene adhesive layer.

5. The connection structure according to claim 4, characterized in that, The shielding layer has a first coating layer near the conductor layer for isolating electromagnetic signals; and / or, The shielding layer has a second coating layer opposite to the conductor layer for isolating electromagnetic signals.

6. The connection structure according to claim 1, characterized in that, Also includes: The first insulating layer is used for electrical isolation; The conductor layer is embedded in the first insulating layer such that both the first surface and the second surface of the conductor layer are located inside the first insulating layer; The first insulating layer has a plurality of holes that penetrate the first insulating layer along its thickness direction.

7. The connection structure according to claim 1, characterized in that, Also includes: The second insulating layer is used for electrical isolation, and the second insulating layer is respectively stacked on the first surface and the second surface of the conductor layer; The second insulating layer has a plurality of heat dissipation grooves on the side near the conductor layer, and the extending direction of the heat dissipation grooves forms an angle with the extending direction of the conductor of the conductor layer.

8. An electronic device, characterized in that, include: The connection structure includes: A conductor layer having a first surface and a second surface opposite to each other; The target layer is elastic, and at least one of the first surface and the second surface is provided with the target layer, and the target layer and the conductor layer are insulated from each other.

9. The electronic device according to claim 8, characterized in that, Also includes: A connecting body having a connecting portion, wherein the conductor layer has an input end and an output end at both ends along its extension direction, and the input end and the output end are respectively connected to the connecting portion of the two connecting bodies; A tin-plated copper foil layer is stacked on the side of the shielding layer opposite to the conductor layer and connected to the shielding layer, and the tin-plated copper foil layer has a soldering area; A lead-out terminal is provided on the connection body and corresponds to the welding area and is welded to ground the shielding layer.

10. The electronic device according to claim 9, characterized in that, Also includes: The equipment housing has a receiving cavity, and two port portions are provided on both sides of the equipment housing; The motherboard assembly is disposed in the receiving cavity; The motherboard assembly is electrically connected to the two port sections via two connection structures respectively; The input end of the conductor layer is electrically connected to the motherboard assembly, and the output end of the conductor layer is electrically connected to the port portion.

Images