Novel high-density lead frame stamping device

Abstract

The utility model provides a novel high-density lead frame stamping device, and relates to the field of stamping devices.The novel high-density lead frame stamping device comprises a feeding part, a first stamping assembly, a first rolling assembly, a second stamping assembly and a second rolling assembly, the feeding part is arranged on the front side of the first stamping assembly, the first rolling assembly is arranged on the rear side of the first stamping assembly, and the second stamping assembly is arranged on the rear side of the second rolling assembly; the second stamping assembly is arranged at the rear end of the first stamping assembly, and the second winding assembly is arranged at the rear end of the second stamping assembly. According to the utility model, during use, feeding is carried out through the feeding piece, front side stamping is carried out at the first stamping assembly, winding and feeding treatment is carried out through the winding assembly, back side stamping is carried out at the second stamping assembly, and finally winding treatment is carried out through the second winding assembly, so that a frame subjected to first stamping is turned over and stamped; the directions of the two times of stamping are opposite, internal stress generated by the two times of stamping generates hedging and neutralization, and frame deformation caused by the internal stress is reduced.

Description

Technical Field

[0001] This application relates to the field of stamping apparatus, and more specifically, to a novel high-density lead frame stamping apparatus. Background Technology

[0002] During the manufacturing process of the lead frame, some lead frames require secondary stamping. After the first die stamping, the lead frame is wound up with the functional side facing inwards and the non-functional side facing outwards. During the second die stamping, the lead frame is unwound in the same direction and fed into the die. After completion, the lead frame is wound up in the same direction to complete production. Because the two stamping directions are the same, the resulting internal stress is in the same direction, making the lead frame prone to lateral bending, difficult to correct, and easily deformed. Summary of the Invention

[0003] The purpose of this application is to provide a novel high-density lead frame stamping device that can solve the above-mentioned technical problems.

[0004] This application provides a novel high-density lead frame stamping device, including a feeding component, a first stamping assembly, a first winding assembly, a second stamping assembly, and a second winding assembly. The feeding component is disposed on the front side of the first stamping assembly, the first winding assembly is disposed on the rear side of the first stamping assembly, the second stamping assembly is disposed on the rear end of the first stamping assembly, and the second winding assembly is disposed on the rear end of the second stamping assembly.

[0005] Preferably, both the first stamping assembly and the second stamping assembly include a drive cylinder, a base, an upper die, and a lower die. The lower die is installed in the base. The drive cylinder drives the upper die to move closer to or away from the lower die via an output shaft. Both the upper die and the lower die are provided with stamping protrusions and convexities.

[0006] Preferably, the feeding component, the first winding assembly, and the second winding assembly are all rotating rollers, and the second winding assembly is externally connected to a drive motor.

[0007] Preferably, the shapes of the stamping protrusions and dents of the first stamping assembly and the second stamping assembly are different.

[0008] The beneficial effects of this utility model are:

[0009] This utility model provides a novel high-density lead frame stamping device, comprising a feeding component, a first stamping assembly, a first winding assembly, a second stamping assembly, and a second winding assembly. The feeding component is disposed on the front side of the first stamping assembly, the first winding assembly is disposed on the rear side of the first stamping assembly, the second stamping assembly is disposed on the rear end of the first stamping assembly, and the second winding assembly is disposed on the rear end of the second stamping assembly. In use, the feeding component feeds the lead frame, followed by frontal stamping at the first stamping assembly, then winding and feeding through the winding assembly, followed by reverse stamping at the second stamping assembly, and finally winding through the second winding assembly. This utility model flips the frame after the first stamping and stamps it in opposite directions. The internal stress generated by the two stampings is counteracted and neutralized, reducing frame deformation caused by internal stress. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of this utility model;

[0012] Figure 2 This is a schematic diagram of the lead frame after the first and second stamping of this utility model.

[0013] The reference numerals in the attached figures are as follows:

[0014] 1. Feeding component; 2. First stamping assembly; 3. First winding assembly; 4. Second stamping assembly; 5. Second winding assembly; 6. Drive cylinder; 7. Base; 8. Upper die; 9. Lower die. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0016] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0017] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0018] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0019] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0020] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0021] like Figure 1-2As shown, a novel high-density lead frame stamping device includes a feeding component 1, a first stamping assembly 2, a first winding assembly 3, a second stamping assembly 4, and a second winding assembly 5. The feeding component 1 is located at the front of the first stamping assembly 2, the first winding assembly 3 is located at the rear of the first stamping assembly 2, the second stamping assembly 4 is located at the rear end of the first stamping assembly 2, and the second winding assembly 5 is located at the rear end of the second stamping assembly 4. In this invention, the feeder 1 feeds the lead frame, followed by frontal stamping at the first stamping assembly 2, then winding and feeding the lead frame through the winding assembly, followed by reverse stamping at the second stamping assembly 4, and finally winding through the second winding assembly 5. This invention flips the lead frame after the first stamping and stamps it in opposite directions. The internal stress generated by the two stampings counteracts and neutralizes, reducing the deformation of the lead frame caused by internal stress.

[0022] In this embodiment, both the first stamping assembly 2 and the second stamping assembly 4 include a drive cylinder 6, a base 7, an upper mold 8, and a lower mold 9. The lower mold 9 is installed inside the base 7. The drive cylinder 6 drives the upper mold 8 to move closer to or away from the lower mold 9 through an output shaft. Both the upper mold 8 and the lower mold 9 are provided with stamping protrusions and concave blocks. The shapes of the stamping protrusions and concave blocks of the first stamping assembly 2 and the second stamping assembly 4 are different. After the first stamping, the texture formed in this utility model is then subjected to a second stamping to complete the processing of the high-density lead frame.

[0023] In this embodiment, the feeding component 1, the first winding assembly 3, and the second winding assembly 5 are all rotating rollers, and the second winding assembly 5 is externally connected to a drive motor.

[0024] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A novel high-density lead frame punching device, characterized by: It includes a feeding component, a first stamping assembly, a first winding assembly, a second stamping assembly, and a second winding assembly. The feeding component is located on the front side of the first stamping assembly, the first winding assembly is located on the rear side of the first stamping assembly, the second stamping assembly is located on the rear end of the first stamping assembly, and the second winding assembly is located on the rear end of the second stamping assembly.

2. A novel high-density lead frame stamping device according to claim 1, characterized in that: Both the first stamping assembly and the second stamping assembly include a drive cylinder, a base, an upper die, and a lower die. The lower die is installed in the base. The drive cylinder drives the upper die to move closer to or away from the lower die through an output shaft. Both the upper die and the lower die are provided with stamping protrusions and concave blocks.

3. A novel high-density lead frame stamping device according to claim 1, characterized in that: The feeding component, the first winding assembly, and the second winding assembly are all rotating rollers, and the second winding assembly is externally connected to a drive motor.

4. A novel high-density lead frame stamping device according to claim 2, characterized in that: The shapes of the stamping protrusions and concave blocks of the first stamping assembly and the second stamping assembly are different.

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