Chip packaging vacuum defoaming equipment

Abstract

The utility model belongs to the technical field of chip packaging, and particularly relates to chip packaging vacuum defoaming equipment which comprises a vacuum box, a vacuum pump is arranged on the front face of the vacuum box, the input end of the vacuum pump is fixedly communicated with the front face of the vacuum box, and an electric push rod and a band-type brake motor are arranged in the vacuum box. The telescopic end of the electric push rod is provided with a rotating sleeve rod, the power output end of the band-type brake motor is fixedly connected with the right end of the inner ring of the rotating sleeve rod, and the outer surface of the inner ring of the rotating sleeve rod is fixedly connected with a connecting frame. A chip can be placed in the vacuum box after being packaged, the interior of the vacuum box can be vacuumized through the vacuum pump, meanwhile, an ultrasonic effect can be exerted while vacuumizing is conducted in cooperation with the ultrasonic-assisted bubble remover, the vacuum environment promotes gas to be separated out of a packaging material and enables bubbles to be expanded, and movement and breakage of the bubbles are accelerated through ultrasonic waves.

Description

Technical Field

[0001] This utility model belongs to the field of chip packaging technology, and specifically relates to a chip packaging vacuum debubbling device. Background Technology

[0002] In the semiconductor chip packaging process, after the chip and substrate are soldered together, insulating glue needs to be filled between the chip and the substrate to increase the stability of the semiconductor chip. After the insulating glue is filled, in order to prevent air bubbles that enter the insulating glue during the filling process from interfering with the operation of the semiconductor chip, the semiconductor chip needs to be de-bubbled to remove the air bubbles from the insulating glue.

[0003] However, traditional chip packaging vacuum degassing equipment relies solely on the vacuum environment to cause bubbles to expand and be expelled, lacking diversified and effective auxiliary degassing measures. When faced with packaging materials with high viscosity, the movement resistance of bubbles is large. Even in a vacuum environment, it is difficult for bubbles to move and be expelled quickly after expansion. Moreover, for those bubbles that are tightly bound to the packaging material, the pressure difference generated by the vacuum alone is insufficient to break the adhesion between the bubbles and the material, making it difficult for these bubbles to be separated and expelled from the packaging material. Therefore, it is difficult to remove bubbles quickly and thoroughly in these situations by relying solely on the vacuum effect.

[0004] To address the aforementioned issues, this application proposes a vacuum degassing device for chip packaging. Utility Model Content

[0005] To address the aforementioned problems in the existing technology, this utility model provides a chip packaging vacuum degassing device, which has the characteristic of improving the chip packaging vacuum degassing effect.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a chip packaging vacuum degassing device, comprising a vacuum chamber, a vacuum pump disposed on the front of the vacuum chamber, the input end of the vacuum pump being fixedly connected to the front of the vacuum chamber, an electric push rod and a brake motor disposed inside the vacuum chamber, a rotating sleeve rod disposed on the telescopic end of the electric push rod, the output end of the brake motor being fixedly connected to the right end of the inner ring of the rotating sleeve rod, a connecting frame being fixedly connected to the outer surface of the inner ring of the rotating sleeve rod, an ultrasonic-assisted degassing device being fixedly connected to the bottom surface of the connecting frame, a controller being fixedly connected to the upper surface of the vacuum chamber, and a bearing platform being fixedly connected to the inner bottom wall of the vacuum chamber.

[0007] As a preferred embodiment of this utility model, the bottom surface of the vacuum chamber is fixedly connected to two sets of fixing columns, and the bottom surface of each fixing column is fixedly connected to a placement ring.

[0008] As a preferred embodiment of this utility model, a sealing door is movably hinged to the left side of the vacuum chamber, and a handle is fixedly connected to the left side of the sealing door.

[0009] As a preferred embodiment of this utility model, a support plate is fixedly connected to the bottom surface of the vacuum pump, and the back side of the support plate is fixedly connected to the front side of the vacuum chamber.

[0010] As a preferred embodiment of this utility model, a connecting plate is fixedly connected to the top of the electric push rod, and the upper surface of the connecting plate is fixedly connected to the inner top wall of the vacuum chamber.

[0011] As a preferred embodiment of this utility model, the telescopic end of the electric push rod is fixedly connected to a fixed frame, and the inner wall of the fixed frame is fixedly connected to the outer surface of the outer ring of the rotating sleeve rod.

[0012] As a preferred embodiment of this utility model, a fixing seat is fixedly connected to the right side of the fixing frame, and the bottom surface of the fixing seat is fixedly connected to the upper surface of the brake motor.

[0013] As a preferred embodiment of this utility model, a reinforcing ring is fixedly connected to the outer surface of the ultrasonic-assisted defoamer, and the upper surface of the reinforcing ring is fixedly connected to the bottom surface of the connecting frame.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: By setting a controller, the equipment can be turned on and off or adjusted in both directions. At the same time, the chip can be placed inside the vacuum chamber after packaging using a carrier platform. The vacuum chamber can be evacuated by a vacuum pump. In conjunction with an ultrasonic-assisted defoamer, ultrasonic waves can be applied while the vacuum is being created. The vacuum environment causes gas to be released from the packaging material and the bubbles to expand. The ultrasonic waves accelerate the movement and collapse of the bubbles, thereby quickly removing them. Then, by using the extension and retraction of the electric push rod in conjunction with the forward or reverse rotation of the brake motor, the height and angle of the ultrasonic-assisted defoamer can be adjusted, so that the ultrasonic waves can act on the bubbles in the material at a suitable angle and direction, further improving the effect of vacuum defoaming in chip packaging. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the vacuum chamber in this utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the electric push rod in this utility model;

[0019] Figure 4 This is a schematic diagram of the rotating sleeve rod in this utility model;

[0020] Figure 5 This is a schematic diagram of the structure of the brake motor in this utility model;

[0021] In the diagram: 1. Vacuum chamber; 2. Fixed column; 3. Placement ring; 4. Sealing door; 5. Handle; 6. Bearing platform; 7. Support plate; 8. Vacuum pump; 9. Connecting plate; 10. Electric push rod; 11. Rotating sleeve rod; 12. Connecting frame; 13. Ultrasonic assisted defoamer; 14. Reinforcing ring; 15. Fixed frame; 16. Brake motor; 17. Fixed base; 18. Controller. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0023] Please see Figure 1-5 This utility model provides the following technical solution: a chip packaging vacuum degassing device, including a vacuum chamber 1, a vacuum pump 8 is provided on the front of the vacuum chamber 1, the input end of the vacuum pump 8 is fixedly connected to the front of the vacuum chamber 1, an electric push rod 10 and a brake motor 16 are respectively provided inside the vacuum chamber 1, a rotating sleeve 11 is provided on the telescopic end of the electric push rod 10, the output end of the brake motor 16 is fixedly connected to the right end of the inner ring of the rotating sleeve 11, a connecting frame 12 is fixedly connected to the outer surface of the inner ring of the rotating sleeve 11, an ultrasonic-assisted degassing device 13 is fixedly connected to the bottom surface of the connecting frame 12, a controller 18 is fixedly connected to the upper surface of the vacuum chamber 1, and a bearing platform 6 is fixedly connected to the inner bottom wall of the vacuum chamber 1. In this embodiment, the controller 18 refers to a master control device that controls the starting, speed adjustment, braking and reversing of the motor by changing the wiring of the main circuit or control circuit and changing the resistance value in the circuit according to a predetermined sequence.

[0024] Specifically, two sets of fixing posts 2 are fixedly connected to the bottom surface of the vacuum chamber 1. Each fixing post 2 has a placement ring 3 fixedly connected to its bottom surface. In this embodiment, the fixing posts 2 can fix the placement ring 3 to the vacuum chamber 1, and the placement ring 3 can be used to support the vacuum chamber 1.

[0025] Specifically, a sealing door 4 is movably hinged to the left side of the vacuum chamber 1, and a handle 5 is fixedly connected to the left side of the sealing door 4. In this embodiment, the vacuum chamber 1 can be opened or closed through the sealing door 4, and the sealing door 4 can be easily opened or closed using the handle 5.

[0026] Specifically, a support plate 7 is fixedly connected to the bottom surface of the vacuum pump 8, and the back of the support plate 7 is fixedly connected to the front of the vacuum chamber 1. In this embodiment, the vacuum pump 8 can be fixedly supported on the vacuum chamber 1 through the support plate 7, so that the vacuum pump 8 can be used stably.

[0027] Specifically, a connecting plate 9 is fixedly connected to the top of the electric push rod 10. The upper surface of the connecting plate 9 is fixedly connected to the inner top wall of the vacuum chamber 1. In this embodiment, the electric push rod 10 can be fixed inside the vacuum chamber 1 through the connecting plate 9, thereby enabling the electric push rod 10 to extend and retract stably.

[0028] Specifically, the telescopic end of the electric push rod 10 is fixedly connected to a fixing frame 15. The inner wall of the fixing frame 15 is fixedly connected to the outer surface of the outer ring of the rotating sleeve rod 11. In this embodiment, the fixing frame 15 can facilitate the connection between the rotating sleeve rod 11 and the electric push rod 10, thereby enabling the electric push rod 10 to drive the rotating sleeve rod 11 to move.

[0029] Specifically, a fixing seat 17 is fixedly connected to the right side of the fixing frame 15. The bottom surface of the fixing seat 17 is fixedly connected to the upper surface of the brake motor 16. In this embodiment, the brake motor 16 can be fixed by the fixing seat 17, and the brake motor 16 has its own brake device.

[0030] Specifically, a reinforcing ring 14 is fixedly connected to the outer surface of the ultrasonic-assisted defoamer 13. The upper surface of the reinforcing ring 14 is fixedly connected to the bottom surface of the connecting frame 12. In this embodiment, the ultrasonic-assisted defoamer 13 can be reinforced to the connecting frame 12 through the reinforcing ring 14, thereby making the ultrasonic-assisted defoamer 13 firm. At the same time, the ultrasonic waves can propagate in the insulating glue and generate mechanical waves with alternating sparse and dense areas. In the sparse area of ​​the waves, the internal pressure of the liquid decreases. When the pressure decreases to a certain level, the tiny bubble nuclei in the liquid will expand rapidly. In the dense area of ​​the waves, the pressure increases, and the bubble nuclei will contract and rupture rapidly.

[0031] The working principle and usage process of this utility model are as follows: First, connect the vacuum pump 8, electric push rod 10, brake motor 16, ultrasonic-assisted defoamer 13, and controller 18 to the power supply. Simultaneously, connect the vacuum pump 8, electric push rod 10, brake motor 16, and ultrasonic-assisted defoamer 13 to the controller 18 via wires. Place the vacuum chamber 1 in a suitable position, supporting it with the fixing column 2 and placement ring 3. When the vacuum chamber 1 is in place and defoaming is required, open the sealing door 4 using the handle 5, place the packaged chip onto the support platform 6, and, depending on the degree of bubble formation, extend and retract the electric push rod 10 via the wires. Simultaneously, the extension and retraction of the electric push rod 10 drives the fixing frame 15, rotating sleeve 11, connecting frame 12, brake motor 16, and ultrasonic-assisted defoamer 13. The height of the defoamer 13 is adjusted, and the controller 18 is activated via a wire to turn the brake motor 16 forward or backward. Simultaneously, the rotation of the brake motor 16 drives the inner ring of the rotating sleeve 11 to rotate, which in turn drives the connecting frame 12 and the ultrasonic-assisted defoamer 13 to adjust to a suitable angle. Then, the sealing door 4 is closed. At the same time, the controller 18 is activated as needed to evacuate the vacuum chamber 1, creating a negative pressure environment inside. This creates a pressure difference between the inside and outside of the bubbles in the packaging material or bonding surface, causing the gas pressure inside the bubbles to increase, expand, and burst. When the predetermined vacuum level is reached, the controller 18 activates the electric push rod 10. Through the operation of the electric push rod 10, the ultrasonic waves act directly on the foam layer, accelerating the foam bursting and thus improving the effect of vacuum defoaming in chip packaging.

[0032] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A chip package vacuum debubbling apparatus, characterized by: The vacuum chamber (1) includes a vacuum pump (8) on its front side. The input end of the vacuum pump (8) is fixedly connected to the front side of the vacuum chamber (1). An electric push rod (10) and a brake motor (16) are respectively installed inside the vacuum chamber (1). A rotating sleeve (11) is installed at the telescopic end of the electric push rod (10). The output end of the brake motor (16) is fixedly connected to the right end of the inner ring of the rotating sleeve (11). A connecting frame (12) is fixedly connected to the outer surface of the inner ring of the rotating sleeve (11). An ultrasonic-assisted defoamer (13) is fixedly connected to the bottom surface of the connecting frame (12). A controller (18) is fixedly connected to the upper surface of the vacuum chamber (1). A bearing platform (6) is fixedly connected to the inner bottom wall of the vacuum chamber (1).

2. The chip package vacuum debubbling apparatus of claim 1, wherein: The bottom surface of the vacuum chamber (1) is fixedly connected to two sets of fixed columns (2), and the bottom surface of each fixed column (2) is fixedly connected to a placement ring (3).

3. The chip package vacuum debubbling apparatus of claim 1, wherein: The vacuum chamber (1) has a sealing door (4) that is hinged to the left side, and a handle (5) is fixedly connected to the left side of the sealing door (4).

4. The chip package vacuum debubbling apparatus of claim 1, wherein: The bottom surface of the vacuum pump (8) is fixedly connected to a support plate (7), and the back side of the support plate (7) is fixedly connected to the front side of the vacuum box (1).

5. The chip package vacuum debubbling apparatus of claim 1, wherein: The top of the electric push rod (10) is fixedly connected to a connecting plate (9), and the upper surface of the connecting plate (9) is fixedly connected to the inner top wall of the vacuum box (1).

6. The chip package vacuum debubbling apparatus of claim 1, wherein: The telescopic end of the electric push rod (10) is fixedly connected to a fixed frame (15), and the inner wall of the fixed frame (15) is fixedly connected to the outer surface of the outer ring of the rotating sleeve rod (11).

7. The chip package vacuum debubbling apparatus of claim 6, wherein: A fixing seat (17) is fixedly connected to the right side of the fixing frame (15), and the bottom surface of the fixing seat (17) is fixedly connected to the upper surface of the brake motor (16).

8. The chip package vacuum debubbling apparatus of claim 1, wherein: The outer surface of the ultrasonic-assisted defoamer (13) is fixedly connected to a reinforcing ring (14), and the upper surface of the reinforcing ring (14) is fixedly connected to the bottom surface of the connecting frame (12).

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