Light emitting diode packaging structure with high heat dissipation performance

Abstract

The utility model relates to the technical field of lighting equipment, in particular to a light-emitting diode packaging structure with high heat dissipation performance, which comprises a circuit board. And the heat dissipation assembly comprises a containing frame, the containing frame is arranged on the outer side of the circuit board, an embedding groove is formed in the containing frame, and a ventilation side plate is installed in the embedding groove. According to the light-emitting diode packaging structure with the high heat dissipation performance, by installing the heat dissipation assembly, when an LED works to generate heat, the heat can be conducted into the containing frame and the supporting base through the circuit board, the symmetrically-distributed ventilation side plates are matched with the internal heat dissipation through holes, internal air can be discharged, external air can enter, and the heat dissipation performance of the LED packaging structure is improved. According to the packaging structure, internal and external air circulation is achieved, circulation of air in the packaging interior and the external environment is accelerated, heat is rapidly discharged, meanwhile, a low-resistance path is provided for heat conduction through stable connection of the containing frame and the circuit board, and then the heat dissipation effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of lighting equipment technology, specifically to a light-emitting diode packaging structure with high heat dissipation performance. Background Technology

[0002] Light-emitting diodes (LEDs) are widely used in many fields due to their advantages such as high efficiency and energy saving. However, if a large amount of heat cannot be dissipated in time during operation, it will cause problems such as accelerated light decay, performance degradation, and reduced reliability. Traditional LED packaging has obvious bottlenecks in heat dissipation, such as low thermal conductivity of packaging materials, single heat dissipation path, and insufficient heat dissipation area of ​​miniaturized packaging, which leads to increased chip junction temperature and limits the performance and lifespan of LEDs. Therefore, it is necessary to use a light-emitting diode packaging structure with high heat dissipation performance.

[0003] Traditional packaging has a single heat dissipation path, relying too much on the contact conduction between the substrate and the external heat sink. When facing high-power LEDs or densely integrated application scenarios, this structure cannot meet the requirements for rapid heat dissipation, which can easily cause the chip junction temperature to be too high, leading to problems such as light decay and color temperature drift. Utility Model Content

[0004] The purpose of this invention is to provide a light-emitting diode (LED) packaging structure with high heat dissipation performance, addressing the problem mentioned in the background art that this structure cannot meet the rapid heat dissipation requirements in high-power LED or densely integrated application scenarios, easily causing excessively high chip junction temperatures and leading to light decay, color temperature drift, and other problems. To achieve the above objective, this invention provides the following technical solution: a light-emitting diode (LED) packaging structure with high heat dissipation performance, including a circuit board;

[0005] A heat dissipation assembly includes a receiving frame disposed on the outside of a circuit board. The receiving frame has an internal fitting groove, and a ventilation side plate is installed inside the fitting groove. The ventilation side plate has a heat dissipation through hole inside. A support base is fixedly connected inside the receiving frame. The support base has a splicing hole inside. A splicing screw is threaded inside the circuit board, and the circuit board is mounted on the support base by the splicing screw.

[0006] The encapsulation assembly includes a sealing plate disposed on one side of a receiving frame, and a connector is fixedly disposed on one side of the receiving frame.

[0007] More preferably, the heat dissipation component is disposed on the outside of the circuit board, the encapsulation component is disposed on the outside of the circuit board, the two ventilation side plates are symmetrically distributed on both sides of the receiving frame, and the multiple heat dissipation holes are evenly distributed inside the ventilation side plates. By installing the heat dissipation component, when the LED generates heat during operation, the heat can be conducted through the circuit board to the receiving frame and the support base. The symmetrically distributed ventilation side plates, together with the internal heat dissipation holes, facilitate the exhaust of internal air and the entry of external air, realize the air circulation between the inside and outside, accelerate the circulation of air between the encapsulation and the external environment, and quickly dissipate heat. At the same time, the stable connection between the receiving frame and the circuit board also provides a low-resistance path for heat conduction, thereby improving the heat dissipation effect.

[0008] Further preferably, the encapsulation assembly also includes an installation slot, which is located inside the receiving frame. A transparent plate is fixedly connected inside the sealing plate. The sealing plate is installed on one side of the receiving frame via the installation slot. An extension block is fixedly connected to one side of the sealing plate. A mounting ring is fixedly connected to the top of the receiving frame. A positioning element is engaged inside the mounting ring. A positioning plate is fixedly connected to the other end of the positioning element. The positioning plate has a positioning hole inside. The positioning element is T-shaped. The receiving frame is installed on the outside of the positioning element via the mounting ring. By installing the encapsulation assembly, the sealing plate can be tightly fitted with the receiving frame via the installation slot, forming a stable sealed space that isolates the LED chip from the external environment. The transparent plate inside is made of a high light transmittance material, which can protect the chip from physical damage and ensure that light can pass through efficiently. The cooperation between the positioning element and the positioning plate provides precise installation positioning for the encapsulation assembly, ensuring that the relative positions of each component are fixed, thereby improving practicality.

[0009] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0010] In this invention, by installing a heat dissipation component, when the LED generates heat during operation, the heat can be conducted through the circuit board to the housing frame and support base. The symmetrically distributed ventilation side plates, together with the internal heat dissipation holes, facilitate the exhaust of internal air and the entry of external air, realizing air circulation between the inside and outside, accelerating the circulation of air between the encapsulation and the external environment, and quickly dissipating heat. At the same time, the stable connection between the housing frame and the circuit board also provides a low-resistance path for heat conduction, thereby improving the heat dissipation effect.

[0011] In this invention, by installing the encapsulation assembly, the sealing plate can be tightly fitted with the receiving frame through the mounting slot to form a stable sealed space, isolating the LED chip from the external environment. The transparent plate inside is made of a high light transmittance material, which can protect the chip from physical damage and ensure that light can pass through efficiently. The cooperation between the positioning component and the positioning plate provides precise installation positioning for the encapsulation assembly, ensuring that the relative positions of each component are fixed, thereby improving practicality. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0013] Figure 2 This is a schematic diagram of the unfolded three-dimensional structure of the present invention;

[0014] Figure 3 This utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0015] Figure 4 This utility model Figure 2 Enlarged structural diagram at point B;

[0016] Figure 5 This is a schematic diagram of the partially unfolded three-dimensional structure of this utility model;

[0017] Figure 6 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 .

[0018] In the diagram: 1. Circuit board; 2. Heat dissipation assembly; 201. Receiving frame; 202. Fitting groove; 203. Ventilation side plate; 204. Heat dissipation through hole; 205. Support base; 206. Splicing hole; 207. Splicing screw; 3. Encapsulation assembly; 301. Sealing plate; 302. Connector; 303. Mounting slot; 304. Transparent plate; 4. Extension block; 5. Mounting ring; 6. Positioning component; 7. Positioning plate; 8. Positioning hole. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figures 1-6 This utility model provides a technical solution: a light-emitting diode packaging structure with high heat dissipation performance, including a circuit board 1;

[0021] The heat dissipation assembly 2 includes a receiving frame 201, which is disposed on the outside of the circuit board 1. A fitting groove 202 is formed inside the receiving frame 201, and a ventilation side plate 203 is installed inside the fitting groove 202. A heat dissipation hole 204 is formed inside the ventilation side plate 203. Heat is conducted through the circuit board 1 to the receiving frame 201 and the support base 205. The symmetrically distributed ventilation side plates 203, together with the internal heat dissipation holes 204, facilitate the exhaust of internal air and the entry of external air, achieving air circulation between the inside and outside. This accelerates the circulation of air between the encapsulation and the external environment, quickly dissipating heat. A support base 205 is fixedly connected inside the housing frame 201. A splicing hole 206 is opened inside the support base 205. A splicing screw 207 is threaded inside the circuit board 1. The stable connection between the housing frame 201 and the circuit board 1 also provides a low-resistance path for heat conduction. The circuit board 1 is mounted on the support base 205 by the splicing screw 207. When the LED generates heat during operation, the heat is conducted through the circuit board 1 to the housing frame 201 and the support base 205.

[0022] The encapsulation component 3 includes a sealing plate 301, which is disposed on one side of the receiving frame 201. The sealing plate 301 is tightly fitted with the receiving frame 201 through the mounting slot 303 to form a stable sealed space, isolating the LED chip from the external environment. A connector 302 is fixedly disposed on one side of the receiving frame 201.

[0023] In this embodiment, as Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation component 2 is disposed on the outside of the circuit board 1, the encapsulation component 3 is disposed on the outside of the circuit board 1, two ventilation side plates 203 are symmetrically distributed on both sides of the receiving frame 201, and multiple heat dissipation through holes 204 are evenly distributed inside the ventilation side plates 203.

[0024] In this embodiment, as Figure 2 , Figure 3 and Figure 4As shown, the encapsulation assembly 3 also includes an installation slot 303, which is located inside the receiving frame 201. A transparent plate 304 is fixedly connected inside the sealing plate 301 to isolate the LED chip from the external environment. The transparent plate 304 inside is made of a high light transmittance material, which can protect the chip from physical damage and ensure that light can pass through efficiently. The sealing plate 301 is installed on one side of the receiving frame 201 through the installation slot 303. An extension block 4 is fixedly connected to one side of the sealing plate 301. A mounting ring 5 is fixedly connected to the top of the receiving frame 201. A positioning member 6 is engaged inside the mounting ring 5. A positioning plate 7 is fixedly connected to the other end of the positioning member 6. A positioning hole 8 is opened inside the positioning plate 7. The positioning member 6 is T-shaped. The receiving frame 201 is installed on the outside of the positioning member 6 through the mounting ring 5. The cooperation between the positioning member 6 and the positioning plate 7 provides precise installation positioning for the encapsulation assembly 3, ensuring that the relative positions of each component are fixed.

[0025] The usage and advantages of this utility model: The LED packaging structure with high heat dissipation performance operates as follows:

[0026] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, by first installing the heat dissipation component 2, when the LED generates heat during operation, the heat is conducted through the circuit board 1 to the housing frame 201 and the support base 205. The symmetrically distributed ventilation side plates 203, together with the internal heat dissipation holes 204, facilitate the exhaust of internal air and the entry of external air, realizing air circulation between the inside and outside, accelerating the circulation of air between the encapsulation and the external environment, and quickly dissipating heat. At the same time, the stable connection between the housing frame 201 and the circuit board 1 also provides a low-resistance path for heat conduction. Next, by installing the encapsulation component 3, the sealing plate 301 can be tightly fitted with the housing frame 201 through the mounting slot 303 to form a stable sealed space, isolating the LED chip from the external environment. The transparent plate 304 inside is made of a high light transmittance material, which can protect the chip from physical damage and ensure that light can pass through efficiently. The cooperation between the positioning component 6 and the positioning plate 7 provides precise installation positioning for the encapsulation component 3, ensuring that the relative positions of each component are fixed.

[0027] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A light emitting diode package structure having high heat dissipation performance, characterized by, Includes circuit board (1); A heat dissipation assembly (2) includes a receiving frame (201) disposed on the outside of the circuit board (1). The receiving frame (201) has a fitting groove (202) inside, a ventilation side plate (203) is installed inside the fitting groove (202), and a heat dissipation through hole (204) is opened inside the ventilation side plate (203). A support base (205) is fixedly connected inside the receiving frame (201). A splicing hole (206) is opened inside the support base (205). A splicing screw (207) is threaded inside the circuit board (1). The circuit board (1) is mounted on the support base (205) by the splicing screw (207). The encapsulation component (3) includes a sealing plate (301), which is disposed on one side of the receiving frame (201), and a connector (302) is fixedly disposed on one side of the receiving frame (201).

2. The LED package structure with high heat dissipation according to claim 1, wherein: The heat dissipation component (2) is disposed on the outside of the circuit board (1), and the encapsulation component (3) is disposed on the outside of the circuit board (1).

3. The LED package structure with high heat dissipation capability according to claim 1, wherein: Two ventilation side panels (203) are symmetrically distributed on both sides of the receiving frame (201), and a plurality of heat dissipation holes (204) are evenly distributed inside the ventilation side panels (203).

4. The LED package structure with high heat dissipation capability according to claim 1, wherein: The encapsulation assembly (3) also includes an installation slot (303) which is located inside the receiving frame (201), and a transparent plate (304) is fixedly connected inside the sealing plate (301).

5. The LED package structure with high heat dissipation capability according to claim 1, wherein: The closing plate (301) is installed on one side of the receiving frame (201) via a mounting slot (303), and an extension block (4) is fixedly connected to one side of the closing plate (301).

6. The LED package structure with high heat dissipation capability according to claim 1, wherein: The top of the receiving frame (201) is fixedly connected to a mounting ring (5), and a positioning element (6) is engaged inside the mounting ring (5).

7. The LED package structure with high heat dissipation capability according to claim 6, wherein: The other end of the positioning component (6) is fixedly connected to a positioning plate (7), and the positioning plate (7) has a positioning hole (8) inside.

8. The LED package structure with high heat dissipation capability according to claim 6, wherein: The positioning element (6) is T-shaped, and the receiving frame (201) is installed on the outside of the positioning element (6) by means of a mounting ring (5).

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