Semiconductor detection equipment

Abstract

The utility model provides a semiconductor detection device. The semiconductor detection device comprises: a plurality of industrial cameras configured to collect images of a sample to be detected; the plurality of light sources are arranged in one-to-one correspondence with the industrial cameras and are respectively configured to provide illumination for the corresponding industrial cameras; the electron beam imaging device is configured to generate an image of the to-be-detected sample by using an electron beam; and the fixing plate is configured to fix the plurality of industrial cameras and the plurality of light sources, a center hole is formed in the center of the fixing plate, and the electron beam vertically penetrates through the center hole downwards. The semiconductor detection equipment provided by the utility model can provide illumination with different brightness for different industrial cameras, and improves the imaging quality of a plurality of industrial cameras; the brightness of a plurality of light sources can be automatically adjusted, the adjusting precision and stability of the plurality of light sources are effectively improved, and the uncertainty caused by manual control is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a semiconductor testing device. Background Technology

[0002] Semiconductor inspection equipment is used to inspect surface defects or critical dimensions of wafers. Examples include Critical Dimension Scanning Electron Microscope (CD-SEM) equipment and Electron Beam Inspection (EBI) equipment. Semiconductor inspection equipment often incorporates multiple cameras, each with different usage scenarios and light source requirements. The light source has a crucial impact on image quality; abnormal light sources can lead to problems such as excessive shadows, overexposure, or underexposure in the captured images, affecting image accuracy and equipment stability.

[0003] Current camera light sources often use adjustable linear power supply control, which has the following problems: linear power supply modules are large, difficult to install and take up a lot of space; linear power supplies require manual adjustment of parameters, which is inefficient and inconvenient to operate; host computer software cannot obtain the operating parameters of the linear power supply, and cannot collect data and control it in real time; linear power supplies are expensive and have low cost performance; and they have low modularity, with one linear power supply only able to control one light source. Utility Model Content

[0004] One objective of this invention is to provide illumination of varying brightness for different industrial cameras, thereby improving the imaging quality of multiple industrial cameras.

[0005] A further objective of this invention is to improve the adjustment accuracy and stability of multiple light sources and reduce the uncertainty caused by manual control.

[0006] Specifically, this utility model provides a semiconductor testing device, comprising: multiple industrial cameras configured to acquire images of samples to be tested; multiple light sources configured to provide illumination to the corresponding industrial cameras; an electron beam imaging device configured to generate images of the samples to be tested using an electron beam; and a fixing plate configured to fix the multiple industrial cameras and multiple light sources, wherein the fixing plate has a central hole through which the electron beam passes vertically downward.

[0007] Optionally, the plurality of industrial cameras include: a first camera, and the plurality of light sources include: a first light source configured to match the first camera, and the first camera and the first light source are centrally symmetrically arranged relative to the central aperture.

[0008] Optionally, the image acquisition direction of the first camera and the illumination direction of the first light source are both oriented towards the imaging center point of the electron beam.

[0009] Optionally, the plurality of industrial cameras further include: a second camera having an autofocus function and an imaging field of view larger than that of the first camera; the plurality of light sources further include: a second light source matched and configured to match the second camera; and both the second camera and the second light source are configured between the first light source and the central aperture.

[0010] Optionally, the second light source is positioned below the second camera, and the image acquisition direction of the second camera and the illumination direction of the second light source are both vertically downward.

[0011] Optionally, all light sources are LED array light sources, and the power of each light source is set to a range of 0 to 200mW.

[0012] Optionally, the semiconductor testing equipment further includes a control device connected to multiple light sources. The control device includes a display configured to output an interactive interface to obtain externally input light source parameters, which are used to adjust the brightness of the multiple light sources.

[0013] Optionally, the control device further includes: multiple ADC chips, matched with multiple light sources, configured to acquire the voltages of the multiple light sources in order to determine the brightness of the light sources by means of the voltages.

[0014] Optionally, the control device further includes a memory chip configured to store the light source parameters of multiple light sources before the power failure.

[0015] Optionally, the control device communicates with multiple light sources via serial port or CAN.

[0016] The semiconductor testing equipment of this utility model includes: multiple industrial cameras configured to acquire images of samples to be tested; multiple light sources, each corresponding to one of the industrial cameras, configured to provide illumination for the corresponding industrial camera; an electron beam imaging device configured to generate images of the samples to be tested using an electron beam; and a fixing plate configured to fix the multiple industrial cameras and multiple light sources, wherein the fixing plate has a central hole in the center, through which the electron beam passes vertically downward, which can provide illumination of different brightness for different industrial cameras and improve the imaging quality of multiple industrial cameras.

[0017] Furthermore, the semiconductor testing equipment of this utility model also includes: a control device connected to multiple light sources; the control device includes: a display configured to output an interactive interface to obtain externally input light source parameters, which are used to adjust the brightness of the multiple light sources; the control device also includes: multiple ADC chips matched and configured to acquire the voltage of the multiple light sources to determine the brightness of the light sources through the voltage, thereby enabling automatic adjustment of the brightness of multiple light sources, effectively improving the adjustment accuracy and stability of the multiple light sources, and reducing the uncertainty caused by manual control.

[0018] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0019] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0020] Figure 1 This is a top view of a semiconductor testing device according to an embodiment of the present invention; and

[0021] Figure 2 This is a structural block diagram of a semiconductor testing device according to an embodiment of the present invention. Detailed Implementation

[0022] This embodiment provides a semiconductor inspection device that can provide illumination of different brightness for different industrial cameras, thereby improving the imaging quality of multiple industrial cameras; it can also achieve automatic adjustment of the brightness of multiple light sources, effectively improving the adjustment accuracy and stability of multiple light sources and reducing the uncertainty caused by manual control. Figure 1 This is a top view of a semiconductor testing device 100 according to an embodiment of the present invention. Figure 2 This is a structural block diagram of a semiconductor testing device 100 according to an embodiment of the present invention. Figure 1 and Figure 2 As shown, the semiconductor testing equipment 100 of this embodiment generally includes: multiple industrial cameras, multiple light sources, an electron beam imaging device 130, and a fixing plate 140.

[0023] The system includes multiple industrial cameras configured to acquire images of the samples to be inspected. Multiple light sources are also configured to provide illumination for each industrial camera, one-to-one with the other. By assigning multiple light sources to each industrial camera, different brightness levels can be provided, ensuring that the light source brightness matches the usage scenario of each camera, thereby improving the imaging quality of the multiple cameras and guaranteeing image accuracy.

[0024] Electron beam imaging device 130 is configured to generate an image of a sample to be tested using an electron beam. In one specific embodiment, electron beam imaging device 130 may include components such as an electron gun, an electromagnetic lens, and a detector. The electron gun emits a high-energy electron beam, which is focused and accelerated by the electromagnetic lens to form an electron beam with a certain energy and beam size. This electron beam scans the surface of the sample to be tested, interacts with the sample, and generates various signals, such as secondary electrons and backscattered electrons. These signals are collected and converted by corresponding detectors, ultimately forming an image reflecting information such as the surface morphology, structure, or composition of the sample. It should be noted that multiple industrial cameras acquiring images of the sample to be tested can assist the electron beam in generating the image of the sample.

[0025] The mounting plate 140 is configured to hold multiple industrial cameras and multiple light sources, and a central hole 141 is provided in the center of the mounting plate 140, through which the electron beam passes vertically downward. Specifically, the electron gun can be located at the center of the mounting plate 140, and the central hole 141 is located below the electron gun, so that the electron beam generated by the electron gun passes vertically downward through the central hole 141, effectively avoiding obstruction and affecting electron beam imaging.

[0026] In one specific embodiment, such as Figure 1 As shown, the plurality of industrial cameras may include a first camera 111. The plurality of light sources may include a first light source 121 configured to match the first camera 111. Furthermore, the first camera 111 and the first light source 121 are centrally symmetrically arranged with respect to the central aperture 141. In a preferred embodiment, the image acquisition direction of the first camera 111 and the illumination direction of the first light source 121 are both directed toward the imaging center point of the electron beam.

[0027] Generally, for imaging purposes, the position of the sample to be tested involves adjustments in three directions: the x-axis, y-axis, and z-axis. The x-axis and y-axis are two directions on the horizontal plane, while the z-axis is the vertical direction perpendicular to the horizontal plane. It is important to emphasize that the image of the sample to be tested acquired by the first camera 111 allows adjustment of the sample's position on the z-axis, i.e., its vertical position. Specifically, if the image of the sample to be tested acquired by the first camera 111 is unclear, the position of the sample on the z-axis can be adjusted until the image is clear.

[0028] In one specific embodiment, such as Figure 1 As shown, the plurality of industrial cameras may further include a second camera 112, which has an autofocus function and an imaging field of view larger than that of the first camera. The plurality of light sources may further include a second light source 122 configured to match the second camera 112. Furthermore, both the second camera 112 and the second light source 122 are disposed between the first light source 121 and the central aperture 141. That is, the second camera 112 and the second light source 122 are closer to the central aperture 141 than the first light source 121.

[0029] In a preferred embodiment, the second light source 122 is positioned below the second camera 112, and both the image acquisition direction of the second camera 112 and the illumination direction of the second light source 122 are vertically downward. It should be emphasized that, because the second camera 112 can achieve automatic focusing and has a large imaging field of view, the image of the sample to be tested acquired by the second camera 112 can quickly determine the center of the sample, thereby determining the detection point of the sample, which facilitates subsequent electron beam scanning and imaging towards the detection point.

[0030] In summary, the images of the sample to be tested acquired by the first camera 111 and the second camera 112 can assist the electron beam in generating an image of the sample. Specifically, adjusting the position of the sample on the Z-axis using the image acquired by the first camera 111 and determining the detection point of the sample using the image acquired by the second camera 112 can both assist the electron beam in generating an image of the sample. Furthermore, setting a suitable first light source 121 for the first camera 111 and a suitable second light source 122 for the second camera 112 can improve the imaging quality of both cameras, thus providing a good foundation for subsequent electron beam imaging.

[0031] In a preferred embodiment, multiple light sources are all LED array light sources, and the power of each light source is set to a range of 0 to 200mW. LED array light sources have the following advantages: high brightness, good uniformity, high stability, strong customizability, energy saving and environmental protection, fast response speed, and good heat dissipation performance. In particular, the adjustable brightness function is very suitable for the application scenario of this embodiment. Furthermore, the power of the multiple light sources, set to a range of 0 to 200mW, can be controlled by voltage.

[0032] In one specific embodiment, the semiconductor testing device 100 further includes a control device 150. The control device 150 is connected to multiple light sources and includes a display 154 configured to output an interactive interface to acquire externally input light source parameters, which are used to adjust the brightness of the multiple light sources. In a preferred embodiment, the interactive interface may be a user-friendly graphical interface that supports parameter configuration, status monitoring, and other functions, allowing users to easily configure settings according to their actual needs.

[0033] Specifically, light source parameters can be precisely controlled using techniques such as pulse width modulation (PWM). PWM, a technique that controls analog signals by modulating the width of pulses, offers strong anti-interference capabilities, high precision, and high efficiency, thus improving the adjustment accuracy and stability of multiple light sources.

[0034] In a preferred embodiment, the control device 150 further includes: a plurality of ADC chips, matched and configured to acquire the voltages of the plurality of light sources, so as to determine the brightness of the light sources by means of the voltages. Figure 2 As shown, corresponding to the first light source 121 and the second light source 122, the multiple ADC chips of the control device 150 may include a first chip 151 and a second chip 152. The first chip 151 can acquire the voltage of the first light source 121 to determine the brightness of the first light source 121. The second chip 152 can acquire the voltage of the second light source 122 to determine the brightness of the second light source 122.

[0035] An ADC chip, or Analog-to-Digital Converter, converts continuously changing analog signals into discrete digital signals. Specifically, an ADC chip samples the analog signal at fixed time intervals, capturing the instantaneous value; it then converts the sampled analog signal values ​​into digital signals, typically by mapping the signal values ​​to a finite number of predefined numerical ranges; finally, it converts the quantized digital signal into a binary format that is easy to store and process. By acquiring the voltage of multiple light sources using an ADC chip, the brightness of the light sources can be fed back in real time.

[0036] In a preferred embodiment, the control device 150 further includes a storage chip 153 configured to store light source parameters of multiple light sources before a power outage. The control device 150 can also be configured to read the light source parameters stored in the storage chip 153 to adjust the brightness of the multiple light sources. Specifically, initially, the light source parameters of the multiple light sources are default parameters. If unsuitable, these can be modified through an interactive interface, and the modified parameters are saved in the storage chip 153. Even in the event of a power outage, the light source parameters stored in the storage chip 153 can be read subsequently to accurately and automatically adjust the brightness of the multiple light sources.

[0037] In a preferred embodiment, the control device 150 communicates with multiple light sources via serial port or CAN communication. Serial port communication offers advantages such as simple hardware and low cost, but limitations in transmission distance and speed must be considered. CAN communication, on the other hand, boasts advantages such as high reliability, strong real-time performance, multi-master architecture, long transmission distance, and high transmission speed. Both serial port and CAN communication are well-suited for the communication scenario between the light sources and the control device 150 in this embodiment.

[0038] The semiconductor testing device 100 of this embodiment includes: multiple industrial cameras configured to acquire images of samples to be tested; multiple light sources configured to provide illumination to the corresponding industrial cameras; an electron beam imaging device 130 configured to generate images of the samples to be tested using an electron beam; and a fixing plate 140 configured to fix the multiple industrial cameras and multiple light sources. The fixing plate 140 has a central hole 141, through which the electron beam passes vertically downward. By providing multiple light sources corresponding to the multiple industrial cameras, different brightness levels of illumination can be provided to different industrial cameras, thereby improving the imaging quality of the multiple industrial cameras.

[0039] Furthermore, the semiconductor testing device 100 of this embodiment also includes: a control device 150 connected to multiple light sources; the control device 150 includes: a display 154 configured to output an interactive interface to obtain externally input light source parameters, which are used to adjust the brightness of the multiple light sources; the control device 150 also includes: multiple ADC chips matched and configured to acquire the voltage of the multiple light sources to determine the brightness of the light sources through the voltage, thereby enabling automatic adjustment of the brightness of multiple light sources, effectively improving the adjustment accuracy and stability of the multiple light sources, and reducing the uncertainty caused by manual control.

[0040] Those skilled in the art should understand that, unless otherwise specified, the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," "clockwise," and "counterclockwise" used to indicate orientation or positional relationships in the embodiments of this utility model are merely for the convenience of describing and understanding the technical solution of this utility model, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0041] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," etc., may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0042] Unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] Furthermore, in the description of this embodiment, "above" or "below" the second feature can include direct contact between the first and second features, or it can include contact between the first and second features through another feature between them. That is, in the description of this embodiment, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "below" of the second feature can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this embodiment, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0045] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A semiconductor inspection apparatus characterized by comprising: include: Multiple industrial cameras are configured to acquire images of the samples to be inspected. Multiple light sources are set up one-to-one with the industrial camera, and each is configured to provide illumination for the corresponding industrial camera. An electron beam imaging device configured to generate an image of the sample to be tested using an electron beam; as well as A fixing plate is configured to fix the plurality of industrial cameras and the plurality of light sources, and a central hole is provided in the center of the fixing plate, through which the electron beam passes vertically downward.

2. The semiconductor testing equipment according to claim 1, characterized in that, The plurality of industrial cameras includes: a first camera, Multiple light sources include: a first light source configured to match the first camera, and The first camera and the first light source are arranged in a centrally symmetrical manner with respect to the central hole.

3. The semiconductor testing equipment according to claim 2, characterized in that, The image acquisition direction of the first camera and the illumination direction of the first light source are both directed toward the imaging center point of the electron beam.

4. The semiconductor testing equipment according to claim 2, characterized in that, The plurality of industrial cameras further includes a second camera, which has an autofocus function and an imaging field of view larger than that of the first camera. The multiple light sources also include: a second light source configured to match the second camera, and The second camera and the second light source are both disposed between the first light source and the central hole.

5. The semiconductor testing equipment according to claim 4, characterized in that, The second light source is positioned below the second camera, and The image acquisition direction of the second camera and the illumination direction of the second light source are both vertically downward.

6. The semiconductor testing equipment according to claim 1, characterized in that, All of the multiple light sources are LED array light sources, and the power of each of the multiple light sources is set to a range of 0 to 200mW.

7. The semiconductor inspection apparatus according to claim 1, characterized by Also includes: A control device, connected to the plurality of light sources, includes a display configured to output an interactive interface for obtaining externally input light source parameters, the light source parameters being used to adjust the brightness of the plurality of light sources.

8. The semiconductor testing equipment according to claim 7, characterized in that, The control device further includes: multiple ADC chips, matched and configured to acquire the voltage of the multiple light sources, so as to determine the brightness of the light source through the voltage.

9. The semiconductor testing equipment according to claim 7, characterized in that, The control device further includes a storage chip configured to store the light source parameters of the plurality of light sources before power failure.

10. The semiconductor testing equipment according to claim 7, characterized in that, The control device communicates with the multiple light sources via serial port or CAN.

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