Busbar for power electronic equipment and power electronic equipment
By adopting a PCB stacked busbar structure in power electronic devices, separating current channels and stacking copper layers, the problems of high manufacturing difficulty and parasitic inductance of stacked busbars are solved, realizing low-cost and high-performance power electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINGHUAN JUNENG (XIAN) TECHNOLOGY CO LTD
- Filing Date
- 2025-05-09
- Publication Date
- 2026-04-21
AI Technical Summary
Existing laminated busbars are difficult and costly to manufacture in power electronic equipment, and their parasitic inductance cannot be eliminated, making it impossible to simultaneously meet the requirements for carrying current and load.
The stacked busbar with PCB structure carries the charging and discharging current of the DC bus capacitor with smaller current through the first and second copper clad layers, and carries the current between the power electronic switching devices and the load with larger current through the first and second copper busbars. The structural strength of the PCB is used to support the heavier DC bus capacitor, the thickness of the copper busbar is reduced to simplify the manufacturing process, and the parasitic inductance is reduced through the stacked copper clad layer design.
It reduces the processing difficulty and cost of busbars, reduces parasitic inductance, and improves the performance and reliability of power electronic equipment, making it suitable for high-frequency, high-power power electronic equipment.
Smart Images

Figure CN224153722U_ABST