Manual actuator and socket
By thermally bonding the inspected object to a block with uneven surfaces and coupling it to a substrate, the socket achieves space-efficient cooling of inspected objects through enhanced heat transfer and substrate heat dissipation.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- YOKOWO CO LTD
- Filing Date
- 2024-11-26
- Publication Date
- 2026-06-05
AI Technical Summary
Existing sockets with manual actuators face challenges in cooling inspected objects in a space-saving manner due to the requirement for additional heat dissipation structures, which occupy valuable space.
The object and a block with uneven surfaces are thermally bonded, and the block is thermally coupled to a substrate via a probe, allowing for efficient heat transfer without the need for external heat sinks.
This configuration enables effective cooling of inspected objects by increasing the surface area for heat dissipation, facilitating thermal bonding and efficient heat release to the substrate, thus maintaining temperature control in a space-efficient design.
Smart Images
Figure 2026092188000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a manual actuator and a socket.
Background Art
[0002] In recent years, various sockets for inspecting objects to be inspected such as integrated circuits (ICs) have been developed. The socket may include a manual actuator for pressing the object to be inspected.
[0003] Patent Document 1 describes an IC socket. The IC socket includes a pressing plate for pressing the IC. A groove is formed on the lower surface of the pressing plate. A through hole communicating with the groove is formed in the pressing plate. The through hole is opened on the upper surface of the pressing plate.
[0004] Patent Document 2 describes a socket. The socket includes a plurality of contacts, a rectangular holding portion for holding the plurality of contacts, and a heat radiating portion connected to four corners of the holding portion.
Prior Art Documents
Patent Documents
[0005]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0006] In inspections of objects using sockets equipped with manual actuators, cooling of the objects may be necessary due to requirements such as maintaining the object's temperature during high-temperature tests. However, simply attaching a heat dissipation structure such as a heat sink to the socket requires space for the heat dissipation structure, making space saving difficult.
[0007] One example of the object of the present invention is to cool an object under inspection in a space-saving manner when inspecting the object under inspection using a socket equipped with a manual actuator. Other objects of the present invention will become apparent from the description herein. [Means for solving the problem]
[0008] One aspect of the present invention is, Equipped with a block for pressing the object to be inspected, The object to be inspected and the block are thermally bonded to each other. The surface of the aforementioned block is a manual actuator having at least partially uneven surfaces.
[0009] One aspect of the present invention is, A probe electrically connected to the object being inspected, A block for pressing the object to be inspected against the probe, A substrate electrically connected to the object to be inspected via the probe, Equipped with, The object to be inspected and the substrate are thermally bonded to each other via the block, forming a socket.
[0010] According to the above aspect of the present invention, when inspecting an object to be inspected using a socket equipped with a manual actuator, the object to be inspected can be cooled in a space-saving manner. [Brief explanation of the drawing]
[0011] [Figure 1] This is an exploded perspective view of the socket according to the embodiment. [Figure 2] This is a perspective view of the socket according to the embodiment. [Figure 3] This is a cross-sectional view along line AA in Figure 2. [Figure 4] This is a perspective view of the block relating to the modified form. [Modes for carrying out the invention]
[0012] Embodiments and modified examples of the present invention will be described below with reference to the drawings. In all drawings, similar components are denoted by the same reference numerals, and their descriptions are omitted as appropriate.
[0013] Figure 1 is an exploded perspective view of the socket 1 according to the embodiment. Figure 2 is a perspective view of the socket 1 according to the embodiment. Figure 3 is a cross-sectional view along line AA in Figure 2. In Figure 3, for illustrative purposes, a plurality of probes 11 and two springs 25 are schematically shown.
[0014] To explain the directions, we define the X, Y, and Z directions. The Z direction is the height direction of socket 1. The X direction is one of the horizontal directions perpendicular to the Z direction. The Y direction is one of the horizontal directions perpendicular to both the Z and X directions. Hereafter, unless otherwise specified, the +X side refers to the side indicated by the X-axis arrow indicating the X direction, and the -X side refers to the opposite side of the side indicated by the X-axis arrow indicating the X direction. Hereafter, unless otherwise specified, the +Y side refers to the side indicated by the Y-axis arrow indicating the Y direction, and the -Y side refers to the opposite side of the side indicated by the Y-axis arrow indicating the Y direction. Hereafter, unless otherwise specified, the +Z side refers to the side indicated by the Z-axis arrow indicating the Z direction, and the -Z side refers to the opposite side of the side indicated by the Z-axis arrow indicating the Z direction. In Figure 3, the white circle with an X indicating the Y axis indicates that the Y-axis arrow is pointing towards the back of the paper.
[0015] As shown in Figure 1, the socket 1 according to this embodiment comprises a socket body 10, a manual actuator 20, and a substrate 30. As shown in Figure 1, the socket body 10 has a plurality of probes 11 and a support 12. As shown in Figure 1, the manual actuator 20 has a frame 21, a block 22, two latches 23, two shafts 24, and two springs 25. The substrate 30 is a rigid substrate such as a printed circuit board (PCB). The substrate 30 is arranged substantially perpendicular to the Z direction. A device 2 is being inspected using the socket 1 according to this embodiment. The device 2 is, for example, an integrated circuit (IC). Hereinafter, the device 2 will be described as the object being inspected by the socket 1.
[0016] As shown in Figure 1, when viewed from the Z direction, the multiple probes 11 are arranged in multiple rows and multiple columns in the X and Y directions, respectively. The Z-direction ends of each probe 11 can be biased away from each other by springs (not shown) provided inside each probe 11. The support 12 is positioned substantially perpendicular to the Z direction. In the example shown in Figure 1, when viewed from the Z direction, the support 12 has a substantially rectangular shape with a pair of sides substantially parallel to the X direction and a pair of sides substantially parallel to the Y direction. The shape of the support 12 is not limited to the example shown in Figure 1. With the multiple probes 11 penetrating the support 12 in the Z direction, the support 12 supports each probe 11 substantially parallel to the Z direction. As shown in Figure 3, during inspection of device 2 using socket 1, the +Z end of each probe 11 and electrodes such as bumps (not shown) provided on the -Z side of device 2 are in contact with each other, and the -Z end of each probe 11 and electrodes such as pads (not shown) provided on the +Z side of substrate 30 are in contact with each other, so that device 2 and substrate 30 are electrically connected to each other via the multiple probes 11.
[0017] The frame 21 is made of, for example, metal. As shown in FIG. 1, when viewed from the Z direction, the frame 21 has a substantially rectangular frame shape that defines an opening 211 and has a pair of sides substantially parallel to the X direction and a pair of sides substantially parallel to the Y direction. As shown in FIG. 1, two cutouts 212 are provided on the outer side of the -X side of the frame 21, and two cutouts 212 are provided on the outer side of the +X side of the frame 21. As shown in FIG. 3, a protrusion 213 protrudes outward from the +Z side end of each cutout 212.
[0018] As shown in FIG. 1, the block 22 includes a base block 221, four protruding blocks 222, and a guide block 223. The base block 221, the four protruding blocks 222, and the guide block 223 are, for example, integrally molded metal. The block 22 is a heat conductive material.
[0019] As shown in FIG. 1, when viewed from the Z direction, the base block 221 has a substantially rectangular shape with a pair of sides substantially parallel to the X direction and a pair of sides substantially parallel to the Y direction. The shape of the base block 221 is not limited to the example shown in FIG. 1. As shown in FIGS. 1 and 3, the base block 221 defines two first mounting recesses 224 located on both sides in the X direction with respect to the center of the base block 221 when viewed from the Z direction. As shown in FIGS. 1 and 3, each first mounting recess 224 is open on the +Z side. In the example shown in FIG. 1, when viewed from the Z direction, the opening on the +Z side of each first mounting recess 224 is substantially circular. The shape of the opening on the +Z side of each first mounting recess 224 is not limited to the example shown in FIG. 1.
[0020] As shown in FIG. 1, when viewed from the Z direction, the four protruding blocks 222 are provided at the four corners of the base block 221. As shown in FIG. 1, the +Z side surface of each protruding block 222 protrudes in the +Z direction from the +Z side surface of the base block 221. When viewed from the Z direction, each protruding block 222 has a substantially rectangular shape with a pair of sides substantially parallel to the X direction and a pair of sides substantially parallel to the Y direction. The shape of each protruding block 222 is not limited to the example shown in FIG. 1.
[0021] As shown in Figure 1, each protruding block 222 defines a first mounting hole 225 that penetrates the protruding block 222 in the Y direction. As shown in Figure 1, the two first mounting holes 225 of the two protruding blocks 222 on the +X side are located on the same straight line substantially parallel to the Y direction. As shown in Figure 1, the two first mounting holes 225 of the two protruding blocks 222 on the -X side are located on the same straight line substantially parallel to the Y direction.
[0022] As shown in Figures 1 and 3, the guide block 223 protrudes from the -Z side of the base block 221 toward the -Z side. As shown in Figure 3, when the frame 21 and block 22 are assembled together, the guide block 223 fits inside the opening 211. By fitting inside the opening 211, the guide block 223 can be guided to an appropriate position inside the opening 211.
[0023] As shown in Figure 3, the -Z side surface of the guide block 223 defines a guide recess 226 that opens to the -Z side. As shown in Figure 3, when the guide block 223 is inserted into the opening 211, the +Z side surface of the device 2 and the +Z side bottom surface 226a of the guide recess 226 are in contact with each other. As can be seen from Figure 3, when the guide block 223 is inserted into the opening 211, the inner surface 226b located around the Z direction of the bottom surface 226a of the guide recess 226 at least partially surrounds the device 2. By the inner surface 226b of the guide recess 226 at least partially surrounding the device 2, the device 2 can be guided to an appropriate position inside the guide recess 226.
[0024] As shown in Figures 1 to 3, the two latches 23 are provided on both sides of the block 22 in the X direction. The two sides of the frame 21 in the X direction and the two sides of the block 22 in the X direction are attached to each other by the two latches 23. As shown in Figures 1 to 3, the latch 23 on the -X side and the latch 23 on the +X side are arranged symmetrically with respect to an axis that passes through the center of the socket 1 in the X direction in the Y direction.
[0025] The -X-side latch 23 will be described with reference to Figures 1 to 3. As shown in Figure 1, the -X-side latch 23 includes a first leaf 231, a second leaf 232, two projections 233, and two claws 234. The description of the -X-side latch 23 is also applicable to the +X-side latch 23, except that the -X-side latch 23 and the +X-side latch 23 are arranged symmetrically with respect to an axis passing through the center of the socket 1 in the X direction in the Y direction.
[0026] As can be seen from Figures 1 to 3, when the -X side portion of block 22 and the -X side latch 23 are mounted to each other, the -X side first leaf 231 is located between the portions of the two -X side protruding blocks 222 that extend from the +Z side surface of the base block 221 to the +Z side. The -X side first leaf 231 is positioned approximately perpendicular to the Z direction. As shown in Figure 3, the -Z side surface of the -X side first leaf 231 defines a second mounting recess 235 that opens to the -Z side. As shown in Figure 3, the +Z side opening of the -X side first mounting recess 224 and the -Z side opening of the -X side second mounting recess 235 face each other in the Z direction. As shown in Figure 3, the -Z side end of the -X side spring 25 is housed in the -X side first mounting recess 224, and the +Z side end of the -X side spring 25 is housed in the -X side second mounting recess 235.
[0027] As can be seen from Figures 1 to 3, when the -X side portion of block 22 and the -X side latch 23 are attached to each other, the -X side second leaf 232 is located between the portions of the two -X side protruding blocks 222 that extend from the -X side surface of the base block 221. The -X side second leaf 232 is positioned approximately perpendicular to the X direction. As shown in Figures 1 to 3, the -X side end of the -X side first leaf 231 and the +Z side end of the -X side second leaf 232 are connected to each other. As can be seen from Figures 1 to 3, the two -X side projections 233 are aligned in the Y direction and protrude to the -Z side from the -Z side end of the -X side second leaf 232. As can be seen from Figures 1 and 3, the two -X side claws 234 protrude to the +X side from the -Z side ends of the two -X side projections 233.
[0028] As shown in Figure 1, the latch 23 on the -X side defines a second mounting hole 236 that penetrates in the Y direction through the connection point between the -X side end of the first leaf 231 on the -X side and the +Z side end of the second leaf 232 on the -X side. As can be seen from Figures 1 and 2, the block 22 and the latch 23 on the -X side are mounted to each other with the shaft 24 on the -X side passing through the two first mounting holes 225 of the two protruding blocks 222 on the -X side and the second mounting hole 236 of the latch 23 on the -X side in the Y direction. With the shaft 24 on the -X side passing through the second mounting hole 236 of the latch 23 on the -X side in the Y direction, the latch 23 on the -X side is rotatable around the shaft 24 on the -X side.
[0029] As shown in Figure 3, with the -X side portion of block 22 and the -X side latch 23 mounted to each other, each -X side claw 234 is positioned -Z side relative to each -X side projection 213. The -X side spring 25 is compressed in the Z direction by the -Z side bottom surface of the -X side first mounting recess 224 and the +Z side bottom surface of the -X side second mounting recess 235. The compression of the -X side spring 25 in the Z direction biases the -X side first leaf 231 towards the +Z side by the -X side spring 25. The biasing of the -X side first leaf 231 towards the +Z side by the -X side spring 25 generates a force that, when viewed from the -Y side, attempts to rotate the -X side latch 23 counterclockwise around the -X side axis 24. The force that generates a force that, when viewed from the -Y side, attempts to rotate the -X side latch 23 counterclockwise around the -X side axis 24 biases each -X side claw 234 towards the +X side. Therefore, with each claw 234 on the -X side biased towards the +X side, the -Z side surface of each protrusion 213 on the -X side and the +Z side surface of each claw 234 on the -X side can be brought into contact with each other. By bringing the -Z side surface of each protrusion 213 on the -X side and the +Z side surface of each claw 234 on the -X side into contact with each other while each claw 234 on the -X side is biased towards the +X side, each protrusion 213 on the -X side and each claw 234 on the -X side can be firmly engaged with each other. Therefore, compared to the case where the spring 25 on the -X side is not provided, the engagement between each protrusion 213 on the -X side and each claw 234 on the -X side can be made less likely to be released.
[0030] In this embodiment, with each protrusion 213 on the -X side and each claw 234 on the -X side engaged with each other, and each protrusion 213 on the +X side and each claw 234 on the +X side engaged with each other, the bottom surface 226a of the guide recess 226 can press the device 2 against the plurality of probes 11 of the socket body 10. By pressing the device 2 against the plurality of probes 11 of the socket body 10 with the bottom surface 226a of the guide recess 226, the +Z side end of each probe 11 and an electrode (not shown) provided on the -Z side surface of the device 2 can be reliably brought into contact with each other, and the -Z side end of each probe 11 and an electrode provided on the +Z side of the substrate 30 can be reliably brought into contact with each other. Thus, the device 2 and the substrate 30 can be reliably electrically connected to each other via the plurality of probes 11.
[0031] Next, we will explain how to remove the frame 21 and block 22.
[0032] First, the first leaf 231 of each latch 23 is pushed towards the -Z side. Pushing the first leaf 231 on the -X side towards the -Z side causes the latch 23 on the -X side to rotate clockwise around the axis 24 on the -X side so that, as viewed from the -Y side, the two projections 233 and the two claws 234 on the -X side move away from the two notches 212 on the -X side. Pushing the first leaf 231 on the +X side towards the -Z side causes the latch 23 on the +X side to rotate counterclockwise around the axis 24 on the +X side so that, as viewed from the -Y side, the two projections 233 and the two claws 234 on the +X side move away from the two notches 212 on the +X side. The two projections 233 and the two claws 234 on the -X side move away from the two notches 212 on the -X side, disengaging the two notches 212 and the two claws 234 on the -X side. Similarly, the two projections 233 and the two claws 234 on the +X side separate from the two notches 212 on the +X side, disengaging the two notches 212 and the two claws 234 on the +X side. Thus, the frame 21 and the block 22 can be removed from each other.
[0033] Next, the force pushing the first leaf 231 of each latch 23 towards the -Z side is released. Before the force pushing the first leaf 231 on the -X side towards the -Z side is released, the spring 25 on the -X side is compressed in the Z direction by the bottom surface on the -Z side of the first mounting recess 224 on the -X side and the bottom surface on the +Z side of the second mounting recess 235 on the -X side. Therefore, by releasing the force pushing the first leaf 231 on the -X side towards the -Z side, the first leaf 231 on the -X side is biased towards the +Z side by the spring 25 on the -X side. By biasing the first leaf 231 on the -X side towards the +Z side, the first leaf 231 on the -X side can be moved back to its original position where it was before it was pushed towards the -Z side. Before the force pushing the first leaf 231 on the +X side towards the -Z side is released, the spring 25 on the +X side is compressed in the Z direction by the bottom surface on the -Z side of the first mounting recess 224 on the +X side and the bottom surface on the +Z side of the second mounting recess 235 on the +X side. Therefore, by releasing the force pushing the first leaf 231 on the +X side towards the -Z side, the first leaf 231 on the +X side is biased towards the +Z side by the spring 25 on the +X side. This biasing of the first leaf 231 on the +X side towards the +Z side allows the first leaf 231 on the +X side to move back to its original position where it was before it was pushed towards the -Z side.
[0034] Next, we will describe the cooling of device 2. In socket 1, cooling of device 2 may be necessary due to requirements such as maintaining the temperature of device 2 during high-temperature testing. In the socket 1 according to this embodiment, device 2 can be cooled as follows.
[0035] As shown in Figure 3, during inspection of device 2 using socket 1, the +Z side of device 2 is pressed by the bottom surface 226a of guide recess 226. As shown in Figure 3, when the +Z side of device 2 is pressed by the bottom surface 226a of guide recess 226, the +Z side of device 2 and the bottom surface 226a of guide recess 226 come into contact with each other, and thus the +Z side of device 2 and the bottom surface 226a of guide recess 226 are thermally bonded to each other. Therefore, heat can be conducted from socket 1 to block 22 via the contact surface between the +Z side of device 2 and the bottom surface 226a of guide recess 226. The +Z side of device 2 and the bottom surface 226a of guide recess 226 do not necessarily have to be in direct contact. In one example, a thermal conductive material may be provided between the +Z side of device 2 and the bottom surface 226a of guide recess 226. In this example, the +Z side surface of device 2 and the bottom surface 226a of the guide recess 226 are thermally bondable to each other via a thermal conductive material.
[0036] As shown in Figure 3, during inspection of device 2 using socket 1, the inner surface 226b of the guide recess 226 surrounds device 2 at least partially. Therefore, by bringing the outer surface of device 2 around the Z direction and the inner surface 226b of the guide recess 226 into contact with each other or close to each other, it is possible to facilitate thermal bonding between the outer surface of device 2 around the Z direction and the inner surface 226b of the guide recess 226.
[0037] As shown in Figures 1 and 2, the +Z-side surfaces of the four protruding blocks 222, the region located between the two protruding blocks 222 on the -Y side of the +Z-side surface of the base block 221, and the region located between the two protruding blocks 222 on the +Y side of the +Z-side surface of the base block 221 have irregularities 227. In the example shown in Figures 1 and 2, the irregularities 227 are formed by a plurality of grooves extending in the Y direction and aligned in the X direction. The surface area of the irregularities 227 can be increased. Therefore, the heat conducted from the device 2 to the block 22 can be easily released from the block 22 by the irregularities 227. Thus, compared to the case where a heat dissipation structure such as a heat sink is attached to the block 22, the device 2 can be cooled in a space-saving manner when inspecting the device 2 using the socket 1.
[0038] As shown in Figure 1, the +Z side of block 22 has at least partially an uneven surface including the irregularities 227, formed by the +Z side of the base block 221, the +Z side of each protruding block 222, and the side of each protruding block 222 that is substantially perpendicular to the +Z side of the base block 221. Therefore, compared to the case where the +Z side of block 22 is a flat surface without protruding blocks 222, the surface area of the +Z side of block 22 can be increased, and the heat dissipation of the +Z side of block 22 can be improved. Furthermore, the heat dissipation of the +Z side of block 22 can be improved compared to a simple flat surface with irregularities 227 formed on it.
[0039] The shape of the irregularities 227 can be any shape as long as it increases the surface area of the block 22. For example, the irregularities 227 can be realized not only by grooves as shown in Figures 1 and 2, but also by structures such as holes and textures. The depth and roughness of the irregularities 227 are also not particularly limited as long as they increase the surface area of the block 22.
[0040] The location of the irregularities 227 is not particularly limited, as long as it increases the surface area of the block 22. For example, in this embodiment, the outer surfaces of the block 22 on both sides in the X direction and on both sides in the Y direction do not have irregularities corresponding to the irregularities 227. If the irregularities 227 are formed by die-cutting in the Z direction, and the outer surface of the block 22 has irregularities corresponding to the irregularities 227, then it is necessary to form the irregularities corresponding to the irregularities 227 on the outer surface of the block 22 after forming the irregularities 227 by die-cutting in the Z direction. Therefore, compared to the case where the irregularities corresponding to the irregularities 227 are formed on the outer surface of the block 22, this embodiment can improve the productivity of forming the block 22 by die-cutting in the Z direction. However, as shown in Figure 4 later, the outer surface of the block 22 may have at least partially the irregularities corresponding to the irregularities 227.
[0041] As shown in Figures 1 and 3, the substrate 30 has a pattern 31 formed on the +Z side of the substrate 30. The pattern 31 is a thermal conductive material, such as a metal pattern such as a conductive pattern. As shown in Figure 3, the +Z side of the pattern 31 and the -Z side of the guide block 223 around the guide recess 226 are in contact with each other. Therefore, the block 22 and the substrate 30 are thermally bonded to each other via the pattern 31. Thus, the device 2 and the substrate 30 are thermally bonded to each other via the block 22 and the pattern 31. Therefore, the heat generated from the device 2 can be released to the substrate 30 through the block 22 and the pattern 31. Therefore, compared to the case where a heat dissipation structure such as a heat sink is attached to the block 22, the device 2 can be cooled in a space-saving manner when inspecting the device 2 using the socket 1.
[0042] The position where pattern 31 is provided is not particularly limited, as long as pattern 31 and block 22 can be thermally bonded to each other. As can be seen from Figures 1 and 3, in this embodiment, when viewed from the Z direction, pattern 31 has a substantially frame shape that surrounds the socket body 10 around the Z direction. As can be seen from Figures 1 and 3, pattern 31 is located on the -Z side with respect to substantially the entire -Z side surface around the guide recess 226 of guide block 223. Therefore, compared to the case where pattern 31 is partially located around the Z direction of socket body 10, the contact area between the +Z side surface of pattern 31 and the -Z side surface around the guide recess 226 of guide block 223 can be increased, making it easier to dissipate heat generated from block 22 to substrate 30. However, when viewed from the Z direction, pattern 31 may be partially located around the Z direction of socket body 10.
[0043] Figure 4 is a perspective view of block 22 according to a modified example.
[0044] As shown in Figure 4, the irregularities 227 may also be formed on the outer surface of the block 22 on the -Y side. Although not visible from the viewpoint shown in Figure 4, the irregularities 227 may also be formed on the outer surface of the block 22 on the +Y side in the same manner as on the outer surface of the block 22 on the -Y side. In the example shown in Figure 4, the irregularities 227 formed on the outer surface of the block 22 on the -Y side are formed by a plurality of grooves extending in the Z direction and aligned in the X direction. The shape of the irregularities 227 formed on the outer surface of the block 22 on the -Y side is not limited to the example shown in Figure 4, as long as the surface area of the block 22 can be increased.
[0045] In the modified example shown in Figure 4, compared to the embodiment shown in Figure 1, the irregularities 227 are formed over a wider area of the block 22, thereby increasing the surface area of the block 22. Therefore, in the modified example shown in Figure 4, the heat dissipation of the block 22 can be further improved compared to the embodiment shown in Figure 1.
[0046] The embodiments and modifications of the present invention have been described above with reference to the drawings, but these are merely examples of the present invention, and various other configurations can also be adopted.
[0047] According to this specification, manual actuators and sockets in the following embodiments are provided. (Aspect 1) In Embodiment 1, the manual actuator includes a block for pressing an object to be inspected, the object to be inspected and the block are thermally bonded to each other, and the surface of the block has at least partially irregularities.
[0048] The "object to be inspected" corresponds to the "device" in the above-described embodiment.
[0049] According to the above-described embodiment, the surface area of the block can be increased by the irregularities. Therefore, the heat conducted from the object under inspection to the block can be easily released from the block by the irregularities. Thus, compared to the case where a heat dissipation structure such as a heat sink is attached to the block, the object under inspection can be cooled in a space-saving manner when inspecting the object under inspection using a socket equipped with a manual actuator.
[0050] (Aspect 2) In embodiment 2, the block surrounds the object to be inspected at least partially.
[0051] According to the above-described embodiment, by bringing the object to be inspected and the block into contact with each other or into close proximity, it is possible to facilitate thermal bonding between the object to be inspected and the block.
[0052] (Aspect 3) In embodiment 3, the surface of the block has at least partially an uneven surface including the irregularities.
[0053] According to the above-described embodiment, the heat dissipation of the block can be improved compared to simply having irregularities formed on a flat surface.
[0054] (Aspect 4) In embodiment 4, the block is configured to be thermally coupled to a substrate that is electrically connected to the object under inspection.
[0055] According to the above embodiment, heat generated from the object under inspection can be released onto the substrate. Therefore, compared to the case where a heat dissipation structure such as a heat sink is attached to the block, the device can be cooled in a space-saving manner when inspecting the object under inspection using a socket equipped with a manual actuator.
[0056] (Appendix 5) In embodiment 5, the socket comprises a probe electrically connected to the object to be inspected, a block for pressing the object to be inspected against the probe, and a substrate electrically connected to the object to be inspected via the probe, wherein the object to be inspected and the substrate are thermally bonded to each other via the block.
[0057] The "object to be inspected" corresponds to the "device" in the above-described embodiment.
[0058] According to the above-described embodiment, heat generated from the object under inspection can be released to the substrate through the block. Therefore, compared to the case where a heat dissipation structure such as a heat sink is attached to the block, the device can be cooled in a space-saving manner when inspecting the object under inspection using the socket.
[0059] (Aspect 6) In embodiment 6, the substrate has a thermal conductive material thermally bonded to the block.
[0060] The "thermal conductive material" corresponds to the "pattern" in the above-described embodiment.
[0061] According to the above-described embodiment, heat generated from the object under inspection can be released to the substrate through the block and the thermal conductive material. [Explanation of Symbols]
[0062] 1 Socket, 2 Devices, 10 Socket Body, 11 Probe, 12 Support, 20 Manual Actuator, 21 Frame, 211 Opening, 212 Notch, 213 Overhang, 22 Block, 221 Base Block, 222 Projection Block, 223 Guide Block, 224 First Mounting Recess, 225 First Mounting Hole, 226 Guide Recess, 226a Bottom Surface, 226b Inner Surface, 227 Roughness, 23 Latch, 231 First Leaf, 232 Second Leaf, 233 Projection, 234 Claw, 235 Second Mounting Recess, 236 Second Mounting Hole, 24 Shaft, 25 Spring, 30 Substrate, 31 Pattern
Claims
1. Equipped with a block for pressing the object to be inspected, The object to be inspected and the block are thermally bonded to each other. The surface of the block has at least partially irregularities, a manual actuator.
2. The manual actuator according to claim 1, wherein the block at least partially surrounds the object to be inspected.
3. The manual actuator according to claim 1 or 2, wherein the surface of the block has at least partially an uneven surface including the irregularities.
4. The manual actuator according to claim 1 or 2, wherein the block is configured to be thermally coupled to a substrate electrically connected to the object to be inspected. Inspection device.
5. A probe electrically connected to the object being inspected, A block for pressing the object to be inspected against the probe, A substrate electrically connected to the object to be inspected via the probe, Equipped with, A socket in which the object to be inspected and the substrate are thermally bonded to each other via the block.
6. The socket according to claim 5, wherein the substrate has a thermal conductive material thermally bonded to the block.