Rectification structure and energy storage system

By designing a rectifier structure that increases the surface area of ​​the heat dissipation base and uses a thermally conductive adhesive layer in the energy storage system, the problem of temperature affecting the lifespan and stability of rectifier devices is solved, achieving the effects of reducing temperature, improving durability and stability.

CN224154507UActive Publication Date: 2026-04-21阿特斯储能科技有限公司 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
阿特斯储能科技有限公司
Filing Date
2025-04-11
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

The lifespan and stability of rectifier devices in energy storage systems are greatly affected by temperature. Excessive temperature leads to poor customer satisfaction and increased after-sales maintenance.

Method used

Design a rectification structure including a heat dissipation base and a rectifier device. By increasing the surface area of ​​the heat dissipation base, the heat of the rectifier device is conducted to the heat dissipation base and exchanged with the air through the heat dissipation base. The heat transfer efficiency is improved by using a thermally conductive adhesive layer, and the heat dissipation area and contact area are increased.

Benefits of technology

Lowering the operating temperature of rectifier devices increases their durability and stability, extends their service life, improves customer satisfaction, and reduces maintenance costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a rectification structure and an energy storage system, the rectification structure comprises a heat dissipation base and a rectification device installed on the heat dissipation base, the heat dissipation base comprises a first surface and a second surface which are oppositely arranged, and the bottom surface of the rectification device is in heat conduction connection with the first surface of the heat dissipation base. The heat dissipation base comprises a main body part and a plurality of extension parts extending outwards from the main body part. According to the utility model, the heat on the rectification device is conducted to the heat dissipation base and exchanges heat with air through the heat dissipation base, and the surface area of the heat dissipation base is increased, so that the working temperature of the rectification device can be reduced, the durability and the stability of the rectification device are improved, the service life is prolonged, the customer satisfaction is improved, and the maintenance cost is reduced.
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Description

Technical Field

[0001] This utility model belongs to the field of energy storage equipment technology, specifically relating to a rectifier structure and an energy storage system. Background Technology

[0002] With the rapid development of the energy storage industry, and the trend of high energy density and modular integration in energy storage systems, product structures are becoming increasingly compact, resulting in reduced heat dissipation margins. The lifespan and stability of rectifier devices inside the rectifier structure are greatly affected by temperature. Excessive temperature will affect the lifespan and stability of rectifier devices, leading to poor customer satisfaction and increased after-sales maintenance.

[0003] Therefore, it is necessary to provide a rectification structure and energy storage system to address the aforementioned technical problems.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a rectifier structure and energy storage system that can reduce the operating temperature of rectifier devices, increase durability, and extend service life.

[0006] To achieve the above objectives, the technical solution provided by a specific embodiment of this utility model is as follows:

[0007] A rectification structure includes a heat dissipation base and a rectifier mounted on the heat dissipation base. The heat dissipation base includes a first surface and a second surface disposed opposite to each other. The bottom surface of the rectifier is thermally connected to the first surface of the heat dissipation base. The heat dissipation base includes a main body and a plurality of extensions extending outward from the main body.

[0008] In one or more embodiments of the present invention, the extension includes a first heat dissipation surface facing the rectifier and a second heat dissipation surface away from the rectifier, wherein the first heat dissipation surface and / or the second heat dissipation surface is one or a combination of a plane and a curved surface.

[0009] In one or more embodiments of the present invention, the extension further includes a third heat dissipation surface connecting the first heat dissipation surface and the second heat dissipation surface, wherein the third heat dissipation surface is one or a combination of a plane and a curved surface.

[0010] In one or more embodiments of this utility model, two adjacent extensions are connected by a fourth heat dissipation surface, which is one or a combination of a plane and a curved surface.

[0011] In one or more embodiments of the present invention, the spacing between two adjacent extensions gradually increases at least partially in a direction away from the main body.

[0012] In one or more embodiments of the present invention, the orthographic projection area of ​​the bottom surface of the rectifier onto the first surface is entirely or partially located inside the first surface.

[0013] In one or more embodiments of this utility model, a first thermally conductive adhesive layer is provided between the rectifier and the heat dissipation base.

[0014] In one or more embodiments of this utility model, the thickness of the first thermally conductive adhesive layer ranges from 0.1 μm to 50 μm; and / or,

[0015] The thermal conductivity of the first thermally conductive adhesive layer is 1.0 W / m. · k-5.0W / m · Between k.

[0016] In one or more embodiments of this utility model, multiple extension portions are provided on both opposite sides of the main body; and / or,

[0017] The plurality of the extensions are spaced apart in a direction away from the rectifier.

[0018] In one or more embodiments of this utility model, the rectifier includes a housing and at least one rectifier diode disposed within the housing, the housing being thermally connected to a first surface of the heat dissipation base; and / or,

[0019] The rectification structure also includes a first fastener, which passes through the rectifier and is mounted on the main body of the heat sink base.

[0020] The technical solution provided by another specific embodiment of this utility model is as follows:

[0021] An energy storage system includes a housing and a rectifier structure installed inside the housing, the rectifier structure being the aforementioned rectifier structure, and the second surface of the heat dissipation base being thermally connected to the inner wall of the housing.

[0022] In one or more embodiments of this utility model, a second thermally conductive adhesive layer is provided between the housing and the heat dissipation base.

[0023] In one or more embodiments of this invention, the thickness of the second thermally conductive adhesive layer ranges from 0.1 μm to 50 μm; and / or,

[0024] The thermal conductivity of the second thermally conductive adhesive layer is 1.0 W / m. ·k-5.0W / m · Between k.

[0025] In one or more embodiments of the present invention, the energy storage system further includes a second fastener, which penetrates the housing and is mounted on the main body of the heat dissipation base.

[0026] Compared with the prior art, the rectification structure of this utility model has the following beneficial effects:

[0027] This invention conducts heat from the rectifier to the heat sink base, and then exchanges heat with the air through the heat sink base. By increasing the surface area of ​​the heat sink base, the operating temperature of the rectifier can be reduced, its durability and stability can be increased, thereby extending its service life, improving customer satisfaction, and reducing maintenance costs. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a three-dimensional structural diagram of the rectifier structure in Embodiment 1 of this utility model;

[0030] Figure 2 This is a cross-sectional view of the rectifier structure in Embodiment 1 of this utility model;

[0031] Figure 3 This is a cross-sectional view of the heat dissipation base in Embodiment 1 of this utility model;

[0032] Figure 4 This is a cross-sectional view of the heat dissipation base in Embodiment 2 of this utility model;

[0033] Figure 5 This is a cross-sectional view of the heat dissipation base in Embodiment 3 of this utility model;

[0034] Figure 6 This is a cross-sectional view of the heat dissipation base in Embodiment 4 of this utility model;

[0035] Figure 7 This is a cross-sectional view of the heat dissipation base in Embodiment 5 of this utility model;

[0036] Figure 8 This is a cross-sectional view of the heat dissipation base in Embodiment Six of this utility model;

[0037] Figure 9 This is a cross-sectional view of the heat dissipation base in Embodiment 7 of this utility model;

[0038] Figure 10 This is a three-dimensional structural diagram of the energy storage system in Embodiment 8 of this utility model;

[0039] Figure 11 for Figure 10 Enlarged view of the local structure at point A;

[0040] Figure 12 This is a cross-sectional structural diagram of the energy storage system in Embodiment 8 of this utility model.

[0041] Explanation of key figure labels:

[0042] 1-Heat dissipation base; 11-Main body; 111-First mounting hole; 12-Extension; 101-First surface; 102-Second surface; 121-First heat dissipation surface; 122-Second heat dissipation surface; 123-Third heat dissipation surface; 124-Fourth heat dissipation surface;

[0043] 2-Rectifier; 21-Housing; 22-Rectifier diode; 23-Second mounting hole;

[0044] 3-First thermally conductive adhesive layer;

[0045] 4-First fastener;

[0046] 5- Enclosure; 51- Third mounting hole;

[0047] 6-Second thermally conductive adhesive layer;

[0048] 7-Second fastener. Detailed Implementation

[0049] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0050] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0051] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0052] The technical solution of this utility model will now be described with reference to the accompanying drawings.

[0053] Example 1:

[0054] Reference Figure 1 , Figure 2 As shown, the rectifier structure in this embodiment includes a heat dissipation base 1 and a rectifier device 2 mounted on the heat dissipation base 1. The heat dissipation base 1 includes a first surface 101 and a second surface 102 disposed opposite to each other. The bottom surface of the rectifier device 2 is thermally connected to the first surface 101 of the heat dissipation base 1. The heat dissipation base 1 includes a main body 11 and a plurality of extensions 12 extending outward from the main body 11. The first surface 101 and the second surface 102 are horizontal planes. By increasing the surface area of ​​the heat dissipation base 1, the heat from the rectifier device 2 is conducted to the heat dissipation base 1 and exchanged with the air through the heat dissipation base 1, thereby reducing the operating temperature of the rectifier device 2, increasing its durability and stability, extending its service life, improving customer satisfaction, and reducing maintenance costs.

[0055] The rectifier device 2 in this embodiment includes a housing 21 thermally connected to the first surface 101 and at least one rectifier diode 22 disposed within the housing 21. Specifically, refer to... Figure 2 As shown, the rectifier 2 in this embodiment is a bridge rectifier composed of four rectifier diodes 22. Of course, in other embodiments, the rectifier 2 can also be a half-wave rectifier composed of a single rectifier diode 22 connected in series in the AC input circuit, or a center-tapped full-wave rectifier composed of two rectifier diodes 22, or a three-phase rectifier composed of six rectifier diodes 22.

[0056] Preferably, in order to increase the heat dissipation area of ​​the heat dissipation base 1 in contact with the air, refer to Figure 2 , Figure 3 As shown, the extension 12 in this embodiment includes a first heat dissipation surface 121 facing the rectifier 2 and a second heat dissipation surface 122 facing away from the rectifier 2. Both the first heat dissipation surface 121 and the second heat dissipation surface 122 are planar. Of course, in other embodiments, one of the first heat dissipation surface 121 and the second heat dissipation surface 122 may be planar.

[0057] Optionally, refer to Figure 3As shown, the extension 12 in this embodiment also includes a third heat dissipation surface 123 connecting the first heat dissipation surface 121 and the second heat dissipation surface 122. The third heat dissipation surface 123 is a curved surface protruding away from the main body 11. This design increases the heat dissipation area of ​​the heat dissipation base 1 in contact with the air and allows for a smooth transition between the first heat dissipation surface 121 and the second heat dissipation surface 122. Of course, in other embodiments, the third heat dissipation surface 123 can also be a plane, a curved surface recessed towards the main body 11, or a combination of a plane and a curved surface.

[0058] Optionally, refer to Figure 3 As shown, in this embodiment, two adjacent extensions 12 are connected by a fourth heat dissipation surface 124, which is a curved surface recessed towards the main body 11. This design increases the heat dissipation area of ​​the heat dissipation base 1 in contact with the air and allows for a smooth transition between two adjacent extensions 12. Of course, in other embodiments, the third connecting surface can also be a plane, a curved surface protruding away from the main body 11, or a combination of a plane and a curved surface.

[0059] Specifically, refer to Figure 3 As shown, in this embodiment, four extension portions 12 are provided on both sides of the main body 11 that are opposite to each other, and the four extension portions 12 are spaced apart in the direction away from the rectifier 2.

[0060] Reference Figure 3 As shown, since the first heat dissipation surface 121 of the uppermost extension 12 is part of the first surface 101 and the second heat dissipation surface 122 of the lowermost extension 12 is part of the second surface 102, the first heat dissipation surface 121 of the uppermost extension 12 is horizontally arranged and the heat dissipation surface 122 of the lowermost extension 12 is horizontally arranged.

[0061] To increase the heat dissipation area of ​​the heat dissipation base 1 in contact with the air and thus improve heat dissipation, the thickness of the extension 12 gradually decreases at least partially in the direction away from the main body 11. The spacing between two adjacent extensions 12 gradually increases at least partially in the direction away from the main body 11. For example, see reference... Figure 3 As shown, in this embodiment, the thickness of the extension 12 gradually decreases in the direction away from the main body 11, and the distance between two adjacent extensions 12 gradually increases in the direction away from the main body 11.

[0062] To facilitate increasing the heat dissipation area, refer to Figure 3As shown, in this embodiment, multiple extensions 12 are provided on both sides of the main body 11 that are opposite to each other. Compared with a design where only one side wall of the main body 11 has an extension 12, the design of this embodiment further increases the heat dissipation area of ​​the heat dissipation base 1. The extensions 12 on both side walls can be arranged symmetrically or asymmetrically. Compared with an asymmetrical arrangement, the symmetrical arrangement of the heat dissipation base 1 results in a more stable structure and a longer service life.

[0063] Reference Figure 2 As shown, in order to facilitate the transfer of heat from the rectifier 2 to the heat dissipation base 1, in this embodiment, the entire orthographic projection area of ​​the bottom surface of the rectifier 2 onto the first surface 101 is located inside the first surface 101. Of course, in other embodiments, the orthographic projection area of ​​the bottom surface of the rectifier 2 onto the first surface 101 is partially located inside the first surface 101. Compared to the designs of other embodiments, the design of this embodiment increases the effective contact area between the rectifier 2 and the heat dissipation base 1, which is more conducive to heat dissipation.

[0064] Preferably, refer to Figure 2 As shown, in this embodiment, a first thermally conductive adhesive layer 3 is provided between the rectifier device 2 and the heat dissipation base 1. This design fills the gap between the rectifier device 2 and the heat dissipation base 1, increasing the effective contact area between them, reducing thermal resistance, and thus significantly improving heat transfer efficiency. The first thermally conductive adhesive layer 33 can be thermally conductive silicone, thermal paste, or thermal grease, etc., which will not be elaborated here. In this embodiment, the thickness of the first thermally conductive adhesive layer 3 is between 0.1 μm and 50 μm. The thermal conductivity of the first thermally conductive adhesive layer 3 is between 1.0 W / m·K and 5.0 W / m·K. For example, the thickness of the first thermally conductive adhesive layer 3 is 0.1 μm, or 25 μm, or 50 μm. The thermal conductivity of the first thermally conductive adhesive layer 3 is 1.0 W / m·K, or 2 W / m·K, or 5 W / m·K.

[0065] In order to fix the rectifier 2 on the heat sink base 1, refer to Figure 2 As shown, the rectifier structure in this embodiment also includes a first fastener 4, which passes through the rectifier device 2 and is mounted on the main body 11 of the heat sink base 1. Specifically, the main body 11 in this embodiment is provided with a first mounting hole 111, and the rectifier device 2 is provided with a second mounting hole 23 communicating with the first mounting hole 111. The first fastener 4 passes through the first mounting hole 111 and the second mounting hole 23 so that the rectifier device 2 is fixedly mounted on the main body 11 of the heat sink base 1 by the second fastener 7. The first fastener 4 can be a screw, bolt, screw, etc.

[0066] Example 2:

[0067] The rectifier 2 in this embodiment is roughly the same as the rectifier 2 in embodiment 1, except that the structure of the heat dissipation base 1 is different.

[0068] Specifically, refer to Figure 4 As shown, in this embodiment, the first heat dissipation surface 121 and the second heat dissipation surface 122 are curved surfaces. In this embodiment, the thickness of the extension 12 gradually increases and then gradually decreases in the direction away from the main body 11, and the distance between two adjacent extensions 12 gradually decreases and then gradually increases in the direction away from the main body 11. Of course, in other embodiments, one of the first heat dissipation surface 121 and the second heat dissipation surface 122 may be a curved surface.

[0069] Example 3:

[0070] The rectifier 2 in this embodiment is roughly the same as the rectifier 2 in embodiment 1, except that the structure of the heat dissipation base 1 is different.

[0071] Specifically, refer to Figure 5 As shown, in this embodiment, the first heat dissipation surface 121 and the second heat dissipation surface 122 are a combination of a plane and a curved surface. Specifically, both the first heat dissipation surface 121 and the second heat dissipation surface 122 include a plane disposed near the main body portion 11 and a curved surface disposed away from the main body portion 11, with the plane being parallel to the first surface 101. In this embodiment, the thickness of the extension portion 12 remains constant initially in the direction away from the main body portion 11, and then gradually decreases; the distance between two adjacent extension portions 12 remains constant initially in the direction away from the main body portion 11, and then gradually increases. Of course, in other embodiments, one of the first heat dissipation surface 121 and the second heat dissipation surface 122 may be a combination of a plane and a curved surface.

[0072] Example 4:

[0073] The rectifier 2 in this embodiment is roughly the same as the rectifier 2 in embodiment 1, except that the structure of the heat dissipation base 1 is different.

[0074] Specifically, refer to Figure 6 As shown, in this embodiment, the first heat dissipation surface 121 and the second heat dissipation surface 122 are directly connected. In this embodiment, the thickness of the extension 12 gradually decreases in the direction away from the main body 11, and the distance between two adjacent extensions 12 gradually increases in the direction away from the main body 11.

[0075] Example 5:

[0076] The rectifier 2 in this embodiment is roughly the same as the rectifier 2 in embodiment 1, except that the structure of the heat dissipation base 1 is different.

[0077] Specifically, refer to Figure 7As shown, in this embodiment, two adjacent extensions 12 are directly connected, and the first heat dissipation surface 121 of one extension 12 is directly connected to the second heat dissipation surface 122 of the adjacent extension 12 without a fourth heat dissipation surface 124. In this embodiment, the thickness of the extension 12 gradually decreases in the direction away from the main body 11, and the distance between two adjacent extensions 12 gradually increases in the direction away from the main body 11.

[0078] Example 6:

[0079] The rectifier 2 in this embodiment is roughly the same as the rectifier 2 in embodiment 1, except that the structure of the heat dissipation base 1 is different.

[0080] Specifically, refer to Figure 8 As shown, in this embodiment, the first heat dissipation surface 121 and the second heat dissipation surface 122 are arranged in parallel, and both the first heat dissipation surface 121 and the second heat dissipation surface 122 are arranged in parallel with the first surface 101 and the second surface 102. In this embodiment, the thickness of the extension 12 remains constant in the direction away from the main body 11 and then gradually decreases, and the distance between two adjacent extensions 12 remains constant in the direction away from the main body 11 and then gradually increases.

[0081] Example 7:

[0082] The rectifier 2 in this embodiment is roughly the same as the rectifier 2 in embodiment 1, except that the structure of the heat dissipation base 1 is different.

[0083] Specifically, refer to Figure 9 As shown, two extension portions 12 are provided in this embodiment. The thickness of the extension portions 12 in this embodiment remains constant initially in the direction away from the main body 11, and then gradually decreases. The distance between two adjacent extension portions 12 remains constant initially in the direction away from the main body 11, and then gradually increases. Of course, this application is not limited to this; in other embodiments, the main body 11 may have three extension portions 12, or more than or equal to five extension portions 12, all of which are within the protection scope of this application.

[0084] Example 8:

[0085] Reference Figures 10-12 As shown, the energy storage system in this embodiment includes a housing 5 and a rectifier structure installed inside the housing 5. The rectifier structure is the same as that in Embodiment 1, and the second surface 102 of the heat dissipation base 1 is thermally connected to the inner wall of the housing 5. According to this design, during the operation of the energy storage system, the rectifier device 2 can dissipate heat through the heat dissipation base 1, thereby reducing its operating temperature, increasing its durability and stability, and thus extending its service life and reducing maintenance costs. Of course, the rectifier structure of the energy storage system in other embodiments can also be the rectifier structure of any of Embodiments 2 to 7.

[0086] Preferably, refer to Figure 12 As shown, in this embodiment, a second thermally conductive adhesive layer 6 is provided between the heat dissipation base 1 and the housing 5. This design fills the gap between the heat dissipation base 1 and the housing 5, increasing the effective contact area between them, reducing thermal resistance, and thus significantly improving heat transfer efficiency. The second thermally conductive adhesive layer 6 can be thermally conductive silicone, thermal paste, or thermal grease, etc., which will not be elaborated here. In this embodiment, the thickness of the second thermally conductive adhesive layer 6 is between 0.1 μm and 50 μm. The thermal conductivity of the second thermally conductive adhesive layer 6 is between 1.0 W / m·K and 5.0 W / m·K. For example, the thickness of the second thermally conductive adhesive layer 6 is 0.1 μm, or 25 μm, or 50 μm. The thermal conductivity of the second thermally conductive adhesive layer 6 is 1.0 W / m·K, or 2 W / m·K, or 5 W / m·K.

[0087] In order to securely install the heat sink base 1 onto the housing 5, refer to... Figure 12 As shown, the energy storage system in this embodiment also includes a second fastener 7, which penetrates the housing 5 and is installed on the main body 11 of the heat dissipation base 1. Specifically, the main body 11 in this embodiment is provided with a first mounting hole 111, and the housing 5 is provided with a third mounting hole 51 communicating with the first mounting hole 111. The second fastener 7 passes through the third mounting hole 51 and the first mounting hole 111 so that the main body 11 of the heat dissipation base 1 is fixedly installed on the housing 5 by the second fastener 7. The second fastener 7 can be a screw, bolt, screw, etc.

[0088] In the description of the embodiments of this utility model, it should be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0089] In the description of the embodiments of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0090] In the description of the embodiments of this utility model, it should also be noted that the terms "first" and "second" used herein do not specifically refer to any order or sequence, nor are they intended to limit this case; they are merely used to distinguish components or operations described using the same technical terms.

[0091] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0092] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A rectifying structure, characterized by, The rectifier structure includes a heat dissipation base and a rectifier device mounted on the heat dissipation base. The heat dissipation base includes a first surface and a second surface disposed opposite to each other. The bottom surface of the rectifier device is thermally connected to the first surface of the heat dissipation base. The heat dissipation base includes a main body and a plurality of extensions extending outward from the main body.

2. The rectifying structure of claim 1, wherein The extension includes a first heat dissipation surface facing the rectifier and a second heat dissipation surface away from the rectifier, wherein the first heat dissipation surface and / or the second heat dissipation surface is one or a combination of a plane and a curved surface.

3. The rectifying structure of claim 2, wherein, The extension also includes a third heat dissipation surface connecting the first heat dissipation surface and the second heat dissipation surface, wherein the third heat dissipation surface is one or a combination of a plane and a curved surface.

4. The rectifying structure of claim 2, wherein The two adjacent extensions are connected by a fourth heat dissipation surface, which is one or a combination of a plane and a curved surface.

5. The rectifier structure according to any one of claims 1 to 4, characterized in that, The distance between two adjacent extensions gradually increases at least partially in the direction away from the main body.

6. The rectifying structure of claim 1, wherein The area of ​​the bottom surface of the rectifier projected onto the first surface is entirely or partially located inside the first surface.

7. The rectifying structure of claim 1, wherein A first thermally conductive adhesive layer is provided between the rectifier and the heat dissipation base.

8. The rectifying structure of claim 7, wherein, The thickness of the first thermally conductive adhesive layer ranges from 0.1 μm to 50 μm; and / or, The thermal conductivity of the first thermally conductive adhesive layer is 1.0 W / m. · k-5.0W / m · Between k.

9. The rectifying structure of claim 1, wherein The main body has multiple extensions extending from both opposite sides; and / or The plurality of the extensions are spaced apart in a direction away from the rectifier.

10. The rectifying structure of claim 1, wherein The rectifier includes a housing and at least one rectifier diode disposed within the housing, the housing being thermally connected to a first surface of the heat sink base; and / or, The rectification structure also includes a first fastener, which passes through the rectifier and is mounted on the main body of the heat sink base.

11. An energy storage system characterized by, The energy storage system includes a housing and a rectifier structure installed inside the housing. The rectifier structure is the rectifier structure according to any one of claims 1 to 10, and the second surface of the heat dissipation base is thermally connected to the inner wall of the housing.

12. The energy storage system of claim 11, wherein, A second thermally conductive adhesive layer is provided between the housing and the heat dissipation base.

13. The energy storage system of claim 12, wherein, The thickness of the second thermally conductive adhesive layer ranges from 0.1 μm to 50 μm; and / or, The second heat conductive adhesive layer has a thermal conductivity coefficient between 1.0 W / m · k-5.0 W / m · k.

14. The energy storage system of claim 11, wherein, The energy storage system also includes a second fastener, which passes through the housing and is installed on the main body of the heat dissipation base.