Semiconductor carrier plate storage disc

Abstract

The utility model discloses a semiconductor carrier plate storage tray, which belongs to the technical field of semiconductor carrier plate transfer and particularly comprises a compression molding tray main body, and semiconductor carrier plate accommodating grooves are uniformly distributed on the compression molding tray main body. A first adaptive groove pit, a second adaptive groove pit, a first sinking groove and a second sinking groove are integrally formed in the bottom of the semiconductor support plate accommodating groove corresponding to the bottom structure characteristics of the semiconductor support plate main body respectively; side anti-sinking cushion buckles are integrally formed on the edge of the compression molding tray body, and middle anti-sinking cushion buckles are integrally formed on the groove edge of each semiconductor carrier plate containing groove. According to the utility model, the design of the semiconductor carrier plate accommodating grooves with adaptive height is adopted, so that when the double-layer tray is stacked, the semiconductor carrier plate can be effectively supported and fixed, and auxiliary fixation can be implemented without the aid of fillers, so that the transportation cost can be effectively reduced, the solid waste output can be reduced, and the product quality can be improved. And the tightness and the stability between the trays which are stacked up and down can be enhanced.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor carrier transfer technology, specifically relating to a semiconductor carrier storage tray. Background Technology

[0002] Semiconductor substrates are typically injection molded from plastic and play a vital role in electronic products. They are primarily used to provide physical support and fixation for semiconductor devices (such as transistors, diodes, and integrated circuits), ensuring the stability and reliability of the electrical connections of electronic components.

[0003] Because semiconductor substrates are in close contact with electronic components, they must be strictly secured during transportation to prevent damage from static electricity. This is to prevent static electricity generated by vibration and friction. Common methods involve adding bubble wrap, foam pads, or other fillers to the tray to improve clamping and positioning, thus preventing static electricity buildup. However, this method is costly, the filler material deforms after clamping, making it difficult to reuse and generating significant solid waste. Furthermore, adding fillers affects the fit between stacked trays, making stable stacking difficult without external support and increasing the risk of tipping over.

[0004] Therefore, we propose a semiconductor substrate storage disk. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor carrier storage disk to solve the above-mentioned problems existing in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A semiconductor carrier storage tray includes a press-molded tray body. The press-molded tray body has several integrally press-molded semiconductor carrier receiving slots for storing the semiconductor carrier body. The bottom of each semiconductor carrier receiving slot is integrally formed with a first adapter slot, a second adapter slot, a first recess, and a second recess, corresponding to the bottom structural features of the semiconductor carrier body. The bottom of each semiconductor carrier receiving slot forms a concave-convex surface that fits the bottom structure of the semiconductor carrier body through the first and second adapter slots and the first and second recesses. This achieves a high degree of fit between the semiconductor carrier body and the semiconductor carrier receiving slot, changing the traditional flat-bottomed slot design of trays. When trays are stacked, the upper tray can effectively support and fix the semiconductor carrier, eliminating the need for additional filler materials. This not only effectively reduces transportation costs and solid waste generation but also enhances the tightness and stability between stacked trays.

[0008] Furthermore, to prevent the stacked trays from being embedded too deeply during the stacking process, which could lead to difficulties in separating the trays later, side anti-sinking pads are integrally formed along the edge of the stacked tray body, and a central anti-sinking pad is integrally formed along the edge of each semiconductor carrier receiving slot. The side anti-sinking pads and the central anti-sinking pads have the same structure, and both are inverted triangles extending inward toward the inside of the stacked tray body. With the help of the side anti-sinking pads and the central anti-sinking pads, the embedding depth of the stacked trays can be limited, ensuring that the embedding depth of each position of the stacked trays is consistent, and avoiding the stacked trays from being embedded too deeply, which could lead to difficulties in separating the trays later or damage to the semiconductor carrier.

[0009] The side anti-sinking pads and the center anti-sinking pads are both horizontal and of the same height. After the upper molded pallet body is stacked on the lower molded pallet body, the bottom of the side anti-sinking pads and the center anti-sinking pads on the upper molded pallet body are in contact with the top surface of the lower molded pallet body.

[0010] Furthermore, to facilitate the operator's handling of semiconductor substrate products, a semiconductor substrate handling notch is provided on one side of the semiconductor substrate receiving slot.

[0011] Furthermore, the upper and lower stacked molded pallet bodies are semi-embedded with each other. In order to facilitate the separation of the stacked pallets, several pallet separation grooves are integrally formed at equal intervals along the edge of the molded pallet body.

[0012] Furthermore, to facilitate quick stacking of the molded pallets at the correct angle, positioning ears are integrally formed at two adjacent corner positions in the main body of the molded pallet, and the design of the positioning ears can also serve as leverage points when separating the pallets.

[0013] Furthermore, the compression-resistant positioning groove is integrally formed on the main body of the compression-molded tray between adjacent semiconductor carrier receiving slots, and the main body of the compression-resistant positioning groove is designed as an inverted frustum of a cone. The setting of the main body of the compression-resistant positioning groove can strengthen the strength of the main body of the compression-molded tray on the one hand, and on the other hand, when the trays are stacked on top of each other, the stability between the upper and lower trays can be enhanced by the main body of the compression-resistant positioning groove.

[0014] Beneficial effects:

[0015] The semiconductor carrier receiving groove used to place and fix the semiconductor carrier body in this utility model adopts a fitting design that is highly adapted to the structural shape of the semiconductor carrier body. It changes the traditional flat-bottomed groove design of the pallet. With the high adaptability of the semiconductor carrier receiving groove, the bottom of the semiconductor carrier can be closely fitted with the semiconductor carrier receiving groove, which can effectively support and fix the semiconductor carrier. When the double-layer pallets are stacked, the bottom of the semiconductor carrier receiving groove in the upper pallet is embedded in the semiconductor carrier receiving groove in the lower pallet, which effectively fixes the semiconductor carrier body. There is no need to use filler for auxiliary fixation. This not only effectively reduces transportation costs and solid waste generation, but also enhances the tightness and stability between the stacked pallets.

[0016] At the same time, the design of the side anti-sinking pads and the middle anti-sinking pads can limit the embedding depth of the stacked trays, ensuring that the embedding depth of each position of the stacked trays is consistent, and avoiding the stacked trays from being embedded too deeply, which would make it difficult to separate the trays later or damage the semiconductor carrier board. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a semiconductor carrier disk structure according to the present invention. Figure 1 ;

[0018] Figure 2 This is a schematic diagram of a semiconductor carrier disk structure according to the present invention. Figure 2 ;

[0019] Figure 3 This is a schematic diagram of the structure of a semiconductor carrier plate storage disk stacked according to the present invention.

[0020] In the diagram: 1. Molded pallet body; 2. Pallet separation buckle groove; 3. Side anti-sinking pad buckle; 4. Positioning ear; 5. Semiconductor carrier board receiving groove; 6. No. 1 adapter slot; 7. No. 2 adapter slot; 8. No. 1 recessed groove; 9. No. 2 recessed groove; 10. Semiconductor carrier board loading and unloading notch; 11. Central anti-compression positioning groove; 12. Central anti-sinking pad buckle; 13. Semiconductor carrier board body. Detailed Implementation

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the present utility model will be briefly introduced below in conjunction with the accompanying drawings and descriptions of the embodiments or the prior art. Obviously, the following description of the structure of the accompanying drawings is only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the description of these embodiments is used to help understand this utility model, but does not constitute a limitation on this utility model.

[0022] Example:

[0023] To address the shortcomings of current semiconductor substrate handling methods, such as high costs, deformation of filler materials after clamping leading to difficulty in reuse and significant solid waste generation, and the difficulty in achieving stable stacking due to filler material limitations, which increases the risk of tipping over, we propose a highly adaptable, one-piece compression-molded semiconductor substrate securing tray. The specific solution is as follows:

[0024] like Figure 1-3 As shown, this embodiment provides a semiconductor carrier storage tray, including a molded tray body 1. The molded tray body 1 has several integrally molded semiconductor carrier receiving slots 5 for storing semiconductor carrier bodies 13. The bottom of each semiconductor carrier receiving slot 5 is integrally formed with a first adapter slot 6, a second adapter slot 7, a first recessed slot 8, and a second recessed slot 9, corresponding to the bottom structural features of the semiconductor carrier body 13. The bottom of the semiconductor carrier receiving slot 5 forms a concave-convex surface that matches the bottom structure of the semiconductor carrier body 13 through the first adapter slot 6, the second adapter slot 7, the first recessed slot 8, and the second recessed slot 9. This achieves a high degree of fit between the semiconductor carrier body 13 and the semiconductor carrier receiving slot 5, changing the traditional flat-bottomed slot design of the tray. When the trays are stacked, the upper tray can effectively support and fix the semiconductor carrier, eliminating the need for additional filler material for fixation. This not only effectively reduces transportation costs and solid waste generation but also enhances the tightness and stability between stacked trays.

[0025] To prevent excessive embedding depth during the stacking of the compression-molded tray body 1, which could lead to difficulties in separating the trays later, a side anti-sinking pad 3 is integrally formed along the edge of the compression-molded tray body 1, and a central anti-sinking pad 12 is integrally formed along the edge of each semiconductor carrier plate receiving groove 5. The side anti-sinking pad 3 and the central anti-sinking pad 12 have the same structure, and both the side anti-sinking pad 3 and the central anti-sinking pad 12 are inverted triangles extending inward toward the compression-molded tray body 1. With the design of the side anti-sinking pad 3 and the central anti-sinking pad 12, the embedding depth of the stacked trays can be limited, ensuring that the embedding depth of each position of the stacked trays is consistent, and avoiding the stacked trays from embedding too deeply, which could lead to difficulties in separating the trays later or damage to the semiconductor carrier plate.

[0026] It should be noted that the bottom of the side anti-sinking pad 3 and the middle anti-sinking pad are both horizontal structures and have the same height. After the upper molded pallet body 1 is stacked on the lower molded pallet body 1, the bottom of the side anti-sinking pad 3 and the middle anti-sinking pad on the upper molded pallet body 1 contacts the top surface of the lower molded pallet body 1. During the stacking process, the protruding structure formed by the semiconductor carrier plate receiving groove 5 at the bottom of the upper molded pallet body 1 is embedded into the semiconductor carrier plate receiving groove 5 on the lower molded pallet body 1, and its bottom surface just abuts against the upper surface of the semiconductor carrier plate body 13, thus limiting and fixing the semiconductor carrier plate body 13.

[0027] To facilitate the operator's handling of semiconductor substrate products, a semiconductor substrate handling notch 10 is provided on one side of the semiconductor substrate receiving slot 5.

[0028] The upper and lower stacked compression-molded pallet bodies 1 are semi-embedded with each other. In order to facilitate the separation of the stacked pallets, several pallet separation grooves 2 are integrally formed at equal intervals along the edge of the compression-molded pallet body 1.

[0029] To facilitate quick and easy stacking of molded pallets, positioning ears 4 are integrally formed at two adjacent corner positions in the main body 1 of the molded pallet. The design of the positioning ears 4 can also serve as leverage points when separating the pallets.

[0030] Each of the compression-supported tray bodies 1 between adjacent semiconductor carrier receiving slots 5 has an integrally formed central pressure-resistant positioning groove 11, and the central pressure-resistant positioning groove 11 is designed as an inverted frustum of a cone. The central pressure-resistant positioning groove 11 can strengthen the strength of the central structure of the compression-supported tray body 1 on the one hand, and on the other hand, when the trays are stacked on top of each other, the central pressure-resistant positioning groove 11 can be used to enhance the stability between the upper and lower trays.

[0031] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A semiconductor substrate storage tray, comprising a molded tray body (1), wherein the molded tray body (1) is provided with a plurality of integrally molded semiconductor substrate receiving slots (5) for storing semiconductor substrate bodies (13), characterized in that, The bottom of the semiconductor carrier substrate receiving groove (5) is integrally formed with the bottom structural features of the semiconductor carrier substrate body (13) respectively, including the No. 1 adapter groove (6), the No. 2 adapter groove (7), the No. 1 sink groove (8), and the No. 2 sink groove (9). The edge of the compression tray body (1) is integrally formed with a side anti-sinking pad (3), and the edge of each semiconductor carrier receiving groove (5) is integrally formed with a central anti-sinking pad (12).

2. A semiconductor carrier disk according to claim 1, characterized in that, The bottom of the semiconductor carrier receiving groove (5) forms a concave-convex surface that matches the bottom structure of the semiconductor carrier body (13) through the first adapter groove (6) and the second adapter groove (7), as well as the first sink groove (8) and the second sink groove (9).

3. A semiconductor substrate storage disk according to claim 1, characterized in that, The side anti-sinking pad (3) and the middle anti-sinking pad (12) have the same structure, and both the side anti-sinking pad (3) and the middle anti-sinking pad (12) are inverted triangles extending towards the inside of the compression-molded pallet body (1).

4. A semiconductor substrate storage disk according to claim 1, characterized in that, The semiconductor carrier receiving groove (5) is also provided with a semiconductor carrier loading and unloading notch (10) on one side.

5. A semiconductor substrate storage disk according to claim 1, characterized in that, The edge of the compression-molded pallet body (1) is also integrally formed with several pallet separation grooves (2) at equal intervals.

6. A semiconductor substrate storage disk according to claim 1, characterized in that, The two adjacent corner positions of the compression-molded pallet body (1) are integrally formed with positioning ears (4).

7. A semiconductor substrate storage disk according to claim 1, characterized in that, The compression tray body (1) between adjacent semiconductor carrier receiving slots (5) is integrally formed with a central pressure-resistant positioning groove (11), and the central pressure-resistant positioning groove (11) is designed as an inverted truncated cone structure.

Images